Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

Abstract: An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.

Abstract: In a brazing repair material 3 which is charged into a repairing portion of base material 1 in which a failure such as a crack 2 and corrosion is generated, diffusion heat treatment is carried out, the brazing repair material 3 is integrally bonded to the repairing portion to repair the repairing portion, the brazing repair material 3 comprises a mixture of non-molten alloy powder having a composition similar to that of the base material 1 and molten alloy powder which is melted at a temperature of the diffusion heat treatment, and the molten alloy powder is brazing repairing alloy consisting of 0.001 to 0.05 mass % of C, 2 to 5 mass % of Si, 10 to 25 mass % of Cr, 15 to 25 mass % of Co, 1 to 5 mass % of B, and balance of Ni, and excluding Al. With this configuration, a part having a failure such as a crack can restore original characteristics like the inherent base material.

Abstract: According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

Abstract: A Ti-based brazing filler material comprising in mixture a Zr-containing alloy powder comprising 30 to 90% by mass of one or two of Cu and Ni, the balance being Zr and unavoidable impurities and a Ti-based powder comprising 0 to 50% by mass of one or two of Cu and Ni, the balance being Ti and unavoidable impurities, wherein the weight ratio of the Zr-containing alloy powder to the Ti-based powder is 8:2 to 4:6. This Ti-based brazing filler material can achieve good brazing and can exhibit excellent effects in the production of aerospace instruments, medical instruments, frames of glasses, heat-exchangers made from titanium.

Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than ?40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10?6/K or less of linear thermal expansion coefficient within a temperature range from ?40° C.

Abstract: A brazing product includes a compacted solid and rigid material formed of a brazing flux and a filler metal as a mixture, which has mechanical strength sufficient to make it extrudable under a press with a flux mass proportion from 3 to 20%. The invention also provides a method for manufacturing a brazing product by mixing particles of filler metal and brazing powder in order to form metal particles coated with the flux, and compacting filler metal particles coated with the brazing flux.

Abstract: Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions (fillets); an aluminum-containing member coated with the pasty composition for aluminum brazing; and a method, using the pasty composition for aluminum brazing, for brazing the aluminum-containing members. The pasty composition for aluminum brazing contains an aluminum-containing powder. In a case where on a cumulative grading curve of the aluminum-containing powder, a particle diameter D ?m which corresponds to a Q volume % is indicated as D(Q) ?m, D(50) ?m is greater than or equal to 20 ?m and less than or equal to 150 ?m; and D(90) ?m/D(10) ?m is less than or equal to 5. A mass percentage of particles, in the aluminum-containing powder, which pass through a screen mesh having an opening of 45 ?m is less than or equal to 50%.

Abstract: The invention relates to a method for modifying piece surfaces consisting in bringing pieces into contact with at least one type of a modifying agent in such a way that the modification of the surface is carried out.

Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.

Abstract: A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb).

Abstract: Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and WA(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and WOH(g), respectively, then AV×WA:OHV×WOH=1:0.4 to 0.6.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: The invention relates to a self-fluxing brazing piece. The piece comprises a composite material comprising at least one inorganic material distributed in a metal or metal alloy matrix, the inorganic material forming a flux during brazing to promote the formation of a thermally induced metallic bond. The matrix may be an aluminium silicon brazing alloy and the inorganic material may be a potassium-fluoro-aluminate flux. The piece is made by spray forming.

Abstract: To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 ?m and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another.

Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.

Abstract: The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness. The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond ? electrons and is capable of coordinating with a metal.

Abstract: A highly basic particle flux for submerged arc welding that produces less than 7 ml/100 gr of diffusible hydrogen in the weld metal, which flux comprises a carbon dioxide containing compound with an effective amount of heat releasable carbon dioxide in the range of 0.5-3.5% by weight of the flux over 10% by weight of a low melting point compound and a binder.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.

Abstract: A component and a solder are provided. The solder is used to repair the component including a base material with a directional microstructure. The solder used includes two constituents, a first constituent and a second constituent, including different grain size distributions. The first constituent of the solder includes a composition that corresponds to or is similar to the base material.

Abstract: A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting point temperature and a second metal having a second melting point temperature, the first melting point temperature being greater than the second melting point temperature. The precursor material is heated to a process temperature (Tp) that is greater than the second melting point temperature and less than the first melting point temperature, and the precursor material is isothermally held at the process temperature (Tp) for a preselected holding period so as to form a metal alloy material having a melting point temperature that is greater than the process temperature. The solder material can be used to bond two components together in a device specified for use at an application temperature (Ta), where Ta/Tp>1.

Abstract: A chromium-free welding consumable and a method of welding stainless steel to reduce the presence of chromium emissions. The consumable is made from an alloy that reduces the emission of chromium during a welding process, and include predominantly nickel, with between approximately five and ten weight percent copper, up to approximately two percent by weight of ruthenium and up to five percent non-copper alloying ingredients. Welding consumables made from the alloy are particularly well-suited for welding austenitic stainless steels, such as type 304 stainless steel. The method involves using chromium-free weld filler material with a stainless steel base material.

Abstract: A solder includes a soft solder having a melting point less than 450° C. and particles embedded in the soft solder. Each particle has a maximum length greater than 50 ?m. The particles comprise greater than 10 Vol % and less than 60 Vol % of the solder.

Abstract: A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impact strength, good slag detachability, low weld metal hydrogen and nitrogen absorption, and facilitates in the formation of smooth and consistent weld beads.

Abstract: The invention relates to a method for assembling at least one part made of a porous carbon material with at least one part made of a copper-rich metal material, and to an alloy paste used to implement same. The method according to the invention includes a step comprising the use of an alloy based on copper and silicon, having formula I CuxSiy, wherein x and y are atomic percentages with 25?x?60, 40?y?75 and x+y?95%, in order to assemble at least one part made of a porous carbon material with at least one part made of a copper-rich metal material. The invention is particularly suitable for use in the field of thermal engineering.

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract: Oilfield tools, assemblies and methods of manufacturing same are described comprising a modified-soldered electronic component, wherein the modified-solder includes a high-melting metal matrix and from about 0.1 to about 20 weight percent, based on total weight of the modified solder, of a strength-reinforcing additive dispersed in the metal matrix, the additive comprising a polyhedral oligomeric silsesquioxane. Methods of using the oilfield tools and assemblies in oilfield operations are also described.

Abstract: In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a ?? phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

Abstract: In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium and a second nickel base alloy material containing chromium and cobalt, applying the brazing paste to an area of the metal workpiece containing at least one crack, and subjecting the workpiece and the brazing paste to a brazing cycle by heating the brazing paste and the workpiece, preferably to a temperature in the range of from 2000 to 2200 degrees Fahrenheit. During the brazing cycle, the brazing paste flows into and fills the at least one crack and thus repairs the metal workpiece.

Abstract: A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.

Abstract: A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.

Abstract: In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages. By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5-300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn—Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract: A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2 to 10.9 mass percent phosphorous and a balance including copper and any unavoidable impurity. The brazing filler metal can be used in a form of paste by being mixed with an organic binder and an organic solvent. The brazing filler metal and the brazing filler metal can be used for joining members made of copper or copper alloy, such as members of a heat exchanger.

Abstract: Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.

Abstract: A nickel braze alloy composition includes a blend of a first nickel alloy and a second nickel alloy. The first nickel alloy includes about 4.75 wt %-10.5 wt % of chromium, about 5.5 wt %-6.7 wt % of aluminum, up to about 13 wt % cobalt, about 3.75 wt %-9.0 wt % of tantalum, about 1.3 wt %-2.25 wt % of molybdenum, about 3.0 wt %-6.8 wt % of tungsten, about 2.6 wt %-3.25 wt % of rhenium, up to about 0.02 wt % of boron, about 0.05 wt %-2.0 wt % of hafnium, up to about 0.14 wt % of carbon, up to about 0.35 wt % of zirconium, and a balance of nickel. The second nickel alloy includes about 21.25 wt %-22.75 wt % of chromium, about 5.7 wt %-6.3 wt % of aluminum, about 11.5 wt %-12.5 wt % of cobalt, about 5.7 wt %-6.3 wt % of silicon, boron in an amount no greater than 1.0 wt %, and a balance of nickel.

Abstract: The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

Abstract: Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions (fillets); an aluminum-containing member coated with the pasty composition for aluminum brazing; and a method, using the pasty composition for aluminum brazing, for brazing the aluminum-containing members. The pasty composition for aluminum brazing contains an aluminum-containing powder. In a case where on a cumulative grading curve of the aluminum-containing powder, a particle diameter D ?m which corresponds to a Q volume % is indicated as D(Q) ?m, D(50) ?m is greater than or equal to 20 ?m and less than or equal to 150 ?m; and D(90) ?m/D(10) ?m is less than or equal to 5. A mass percentage of particles, in the aluminum-containing powder, which pass through a screen mesh having an opening of 45 ?m is less than or equal to 50%.

Abstract: The present invention relates to a solder paste containing 70 to 90 wt % of a solder powder having the melting point of 100 to 250° C.; 5 to 15 wt % of an ultraviolet curable or degradable photosensitive polymer; 0.5 to 2 wt % of an additive; and 4.5 to 13 wt % of a composite solvent, and a method for forming solder bumps using the solder paste. The solder bumps can be formed so as to have a fine width of a few or a few tens of micrometers, thereby easily achieving miniaturization and increased integration of semiconductor devices. In addition, the process is very simplified to realize an improvement in the process yield and mass production.

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used. A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance.

Abstract: An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure. In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The solder particles 22 are subjected to heating treatment in an oxygen-containing atmosphere before being dispersed in the thermosetting resin 21.

Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.

Abstract: There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.

Abstract: A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux material flows from the core and out of the seam. The length of wire is in the form of a loop having a certain circumference so that when the preform is heated, the flux material disperses uniformly from the circumference of the preform for evenly treating the surface of a component on which the preform is placed. The length of wire may include a silver alloy.