Oleaginous Patents (Class 148/25)
  • Patent number: 11117224
    Abstract: Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: September 14, 2021
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tomohisa Kawanago, Takahiro Nishizaki
  • Patent number: 10610981
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 7, 2020
    Assignees: ORIGIN COMPANY, LIMITED, KOKI COMPANY LIMITED
    Inventors: Yukiko Hayashi, Arisa Shiraishi, Naoto Ozawa, Takayuki Suzuki, Takeshi Shirai, Noriyoshi Uchida, Mitsuyasu Furusawa
  • Patent number: 10449638
    Abstract: A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa·s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: October 22, 2019
    Assignee: TAMURA CORPORATION
    Inventors: Daigo Ichikawa, Ryo Izumi, Mitsuru Iwabuchi, Nobuhiro Yamashita, Kenta Fukuda, Satoshi Okumura, Nobuo Tajima
  • Publication number: 20150030837
    Abstract: The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040° C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.
    Type: Application
    Filed: March 27, 2013
    Publication date: January 29, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Publication number: 20140084461
    Abstract: Embodiments of the present disclosure are directed towards flux materials for heated solder placement and associated techniques and configurations. In one embodiment, a method includes depositing a flux material on one or more pads of a package substrate, the flux material including a rosin material and a thixotropic agent and depositing one or more solder balls on the flux material disposed on the one or more pads, wherein depositing the one or more solder balls on the flux material is performed at a temperature greater than 80° C., and wherein the rosin material and the thixotropic agent are configured to resist softening at the temperature greater than 80° C. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventors: Rajen S. Sidhu, Martha A. Dudek, Wei Tan
  • Publication number: 20140060703
    Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 6, 2014
    Inventors: Narahari Pujari, Sanyogita Arora, Siuli Sarkar, Anna Lifton, Rahul Raut, Bawa Singh
  • Publication number: 20130333807
    Abstract: To provide flux for producing solder paste, viscosity of which is prevented from varying. In the flux which is mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which reduces a thixotropic index of the solder paste and enhances viscosity thereof is contained. As the methacrylate polymer, polyalkyl methacrylate having an alkyl group is preferable and it is preferable that an addition amount of polyalkyl methacrylate is 0.5-5.0 mass % thereof. Further, as the thixotropic agent, hardened castor oil is preferably added.
    Type: Application
    Filed: February 28, 2012
    Publication date: December 19, 2013
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Sakie Okada, Motoki Koroki, Hiroaki Iseki, Taro Itoyama
  • Patent number: 8163104
    Abstract: A flux or a flux preparation, which contains complex alkali metal fluorides and additionally includes a water-soluble polymer, preferably polyvinyl alcohol or a polyvinyl alcohol derivative. The water-soluble polymer may be contained in the flux preparation as a granulate or powder or used as a water-soluble package for the flux or flux preparation.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: April 24, 2012
    Assignee: Solvay Fluor GmbH
    Inventors: Hans-Walter Swidersky, Thomas Born
  • Publication number: 20110309132
    Abstract: Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.
    Type: Application
    Filed: June 6, 2011
    Publication date: December 22, 2011
    Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Masumoto
  • Patent number: 8075663
    Abstract: An anti-oxidative agent for molten metal containing at least nonylphenol polyoxyethylene ether, organic amine, phosphoric acid, and phytic acid. A method of preparing the anti-oxidative agent for molten metal, by a) heating an organic amine to between 60 and 100° C., adding a nonylphenol polyoxyethylene ether, and stirring for between 3 and 5 min to yield a mixture; and b) cooling the mixture to between 30 and 100° C., and adding phosphoric acid and phytic acid and stirring for between 10 and 15 min. The anti-oxidative agent for molten metal has no flash point and spreads quickly on the liquid surface, providing high reduction efficiency at lost cost.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: December 13, 2011
    Assignee: Shenzhen Kunqixinhua Technology Co., Ltd.
    Inventor: Yongnong Yan
  • Publication number: 20100252144
    Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.
    Type: Application
    Filed: November 25, 2008
    Publication date: October 7, 2010
    Applicant: Harima Chemicals, Inc.
    Inventors: Shunsuke Ishikawa, Akira Shinozuka, Masami Aihara
  • Publication number: 20100243717
    Abstract: Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and WA(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and WOH(g), respectively, then AV×WA:OHV×WOH=1:0.4 to 0.6.
    Type: Application
    Filed: November 25, 2008
    Publication date: September 30, 2010
    Applicant: Harima Chemicals, Inc
    Inventors: Shunsuke Ishikawa, Akira Shinozuka, Masami Aihara
  • Patent number: 7740713
    Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: June 22, 2010
    Assignee: International Business Machines Corporation
    Inventors: Eric Duchesne, Michael Gaynes, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson
  • Publication number: 20100143658
    Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a colour-imparting component with an appropriate colour to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The colour-imparting component is utilised to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.
    Type: Application
    Filed: January 22, 2010
    Publication date: June 10, 2010
    Applicant: Henkel Limited
    Inventor: Frank Timothy Lawrence
  • Patent number: 7569164
    Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: August 4, 2009
    Assignee: Harima Chemicals, Inc.
    Inventors: Hitoshi Sakurai, Yoichi Kukimoto
  • Patent number: 7481353
    Abstract: A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic peroxide radical whose oxygen-oxygen bond has been released. Since this organic peroxide radical is active, it abstracts hydrogen from the hydrocarbon compound. The formation of a hydrocarbon compound radical is accelerated by the organic peroxide so that even at a relatively low heating temperature, a sufficient amount of a hydrocarbon compound radical can be formed. As a result, an oxide film can be removed from the metal surface even at a relatively low heating temperature by the reduction caused by a hydrocarbon compound radical.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: January 27, 2009
    Assignee: Denso Corporation
    Inventor: Toshihiro Miyake
  • Patent number: 7303944
    Abstract: Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device with the substrate. Underfill material may be included around the interconnect structure between the microelectronic device and the substrate. The underfill material may include an organic rosin acid moiety derived from an anhydride adduct of a rosin compound that was used as a fluxing agent. Methods of making such microelectronic packages using anhydride adducts of rosin compounds are also disclosed.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: December 4, 2007
    Assignee: Intel Corporation
    Inventors: Tian-An Chen, Daoqiang Lu
  • Patent number: 7026376
    Abstract: An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group of a carboxylic acid attached at an acyl group of the organic rosin acid moiety. In another aspect, the anhydride adduct of the rosin compound contains a plurality of linked organic rosin acid moieties. Methods of using the underfill materials and packages formed by curing the underfill materials are also disclosed.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: April 11, 2006
    Assignee: Intel Corporation
    Inventors: Tian-An Chen, Daoqiang Lu
  • Patent number: 7022266
    Abstract: A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a monomer which is polymerisable to yield a polymer, wherein the polymer is cross-likable under the action of a chemical cross-linking agent, and (d) a chemical cross-linking agent for the polymer, the cross-linking agent having fluxing properties and being unreactive with the polymer without catalysis. The polymer will generally be an epoxy resin and the cross-linking agent will generally be a polyacid. The composition preferably is one in which the metal powder and/or solder powder generates and/or has adhered thereto a catalyst for the cross-linking agent which is liberated on application of heat.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: April 4, 2006
    Assignee: Dow Corning Corporation
    Inventor: Hugh P. Craig
  • Patent number: 6887319
    Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: May 3, 2005
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tadatomo Suga, Keisuke Saito, Rikiya Kato, Sakie Yamagata
  • Publication number: 20040250919
    Abstract: Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.
    Type: Application
    Filed: March 24, 2004
    Publication date: December 16, 2004
    Inventors: Shun Saito, Katsumi Nakasato, Yukihiro Kato, Isao Nakata
  • Patent number: 6736908
    Abstract: A metal treating composition comprising at least a specific type of dissolved and/or dispersed organic resin, a dissolved vanadium compound in which the valence of vanadium is from 3 to 5, and a dissolved compound that contains at least one of the metals Zr, Ti, Mo, W, Mn, and Ce can provide metal surfaces with superior corrosion resistance, alkali resistance, and fingerprint resistance. The composition contains no chromium to cause pollution problems and/or require pollution abatement.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: May 18, 2004
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Ryosuke Sako, Keiichi Ueno, Takumi Honda
  • Patent number: 6726780
    Abstract: There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solder, the delustering of the metallic luster of fillet is realized in order to minimize the probability of generating a dark portion at the area where no defective soldering is existed and instead to increase the area of whitish portion which can be generated through the irregular reflection of beam. Specifically, this invention provides a lead-free solder comprising an Sn—Ag—Cu-based lead-free solder containing a small quantity of Bi and Sb as an element which is capable of generating a delustering component for minimizing metallic luster of the fillet.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: April 27, 2004
    Assignee: Tamura Kaken Corporation
    Inventors: Takao Ono, Mitsuru Iwabuchi, Kenji Fujimori, Hiroaki Koyahara
  • Patent number: 6712262
    Abstract: The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflux comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: March 30, 2004
    Assignee: Tamurakaken Corporation
    Inventors: Shinichi Akaike, Kazutaka Nakanami, Yoshiyuki Takahashi, Takao Ono
  • Publication number: 20040000355
    Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.
    Type: Application
    Filed: April 15, 2003
    Publication date: January 1, 2004
    Inventors: Tadatomo Suga, Keisuke Saito, Rikiya Kato, Sakie Yamagata
  • Patent number: 6659329
    Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: December 9, 2003
    Assignee: Edison Welding Institute, Inc
    Inventor: Peter Hall
  • Patent number: 6648212
    Abstract: Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected against re-oxidation by a non-corrosive, alkali metal fluoroaluminate layer (e.g. a potassium fluoroaluminate layer) which forms simultaneously.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: November 18, 2003
    Assignee: Solvay Pharmaceuticals GmbH
    Inventors: Ulrich Seseke-Koyro, Joachim Frehse, Andreas Becker
  • Publication number: 20030178101
    Abstract: There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solder, the delustering of the metallic luster of fillet is realized in order to minimize the probability of generating a dark portion at the area where no defective soldering is existed and instead to increase the area of whitish portion which can be generated through the irregular reflection of beam. Specifically, this invention provides a lead-free solder comprising an Sn—Ag—Cu-based lead-free solder containing a small quantity of Bi and Sb as an element which is capable of generating a delustering component for minimizing metallic luster of the fillet.
    Type: Application
    Filed: March 10, 2003
    Publication date: September 25, 2003
    Inventors: Takao Ono, Mitsuru Iwabuchi, Kenji Fujimori, Hiroaki Koyahara
  • Patent number: 6592020
    Abstract: The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: July 15, 2003
    Assignee: Henkel Loctite Adhesives Limited
    Inventors: Mark Currie, Angelo Elyassi, Grahame Freeman, Malcolm Warwick, Ian Wilding
  • Publication number: 20030121564
    Abstract: A lead-free solder paste comprises an Sn—Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).
    Type: Application
    Filed: December 3, 2002
    Publication date: July 3, 2003
    Inventors: Toshihiko Taguchi, Kunihito Takaura, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima
  • Patent number: 6579474
    Abstract: A conductive composition, and articles and methods using the conductive composition are disclosed.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: June 17, 2003
    Assignee: Fujitsu Limited
    Inventors: Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert Wong Chan, Yasuhito Takahashi
  • Patent number: 6562147
    Abstract: A connecting material, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 13, 2003
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Koii Kondo, Takashi Kurahashi, Nozomu Okumura, Makoto Takagi
  • Patent number: 6550667
    Abstract: A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: April 22, 2003
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Donald W. Henderson, James Spalik
  • Publication number: 20020195171
    Abstract: A conductive paste (16) for use in making conductive bumps (18) and a method for using the conductive paste to make conductive bumps (18) on a substrate (10). The conductive paste (16) is formed by combining a tin alloy with a flux composition containing an aromatic carboxylic acid fluxing agent and a solvent. The conductive paste (16) is disposed on underbump metallization layers (15) and reflowed to form the conductive bumps (18).
    Type: Application
    Filed: August 2, 2002
    Publication date: December 26, 2002
    Inventors: Li Li, Treliant Fang
  • Publication number: 20020187264
    Abstract: A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.
    Type: Application
    Filed: December 21, 2001
    Publication date: December 12, 2002
    Applicant: Enthone, Inc.
    Inventors: Deborah Mallon, Andrew David Price, Leela Josephine Sequeira, Robert Derek Williams
  • Patent number: 6468363
    Abstract: An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: October 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Donald W. Henderson, James Spalik
  • Patent number: 6458472
    Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: October 1, 2002
    Assignee: Henkel Loctite Corporation
    Inventors: Mark M. Konarski, J. Paul Krug
  • Patent number: 6440228
    Abstract: A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 27, 2002
    Assignees: Senju Metal Industry Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiko Taguchi, Kunihito Takaura, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima
  • Patent number: 6387499
    Abstract: Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from 10 ppm to 1000 ppm followed by collection of the spheres and drying. The lubricant is preferably selected from an aliphatic hydrocarbon lubricant, a higher fatty alcohol or acid lubricant, a fatty acid amide lubricant, a metal soap lubricant, a fatty acid ester lubricant, a fluoroplastic lubricant, a silicone lubricant, and a combination thereof.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: May 14, 2002
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Sohma, Takahiro Roppongi
  • Publication number: 20020017337
    Abstract: A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.
    Type: Application
    Filed: April 12, 2001
    Publication date: February 14, 2002
    Inventors: Sanyogita Arora, Bin Mo
  • Patent number: 6342106
    Abstract: The invention relates t a flux-free brazing paste for the brazing of copper and copper alloys. The paste includes a binder consisting of a mixture of polyisobutene with a relative molar mass from 50,000 to 500,000 and paraffin within a melting-range from 40 to 90° C.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: January 29, 2002
    Assignee: Degussa AG
    Inventors: Jürgen Koch, Sandra Wittpahl, Leander Staab
  • Publication number: 20010045244
    Abstract: There is provided a soldering flux for circuit board, which is designed to be employed on an occasion of soldering electronic parts on a circuit board, the soldering flux being free from any organic solvent which may become a cause for contaminating air atmosphere and being capable of providing an excellent insulating property. This soldering flux comprises; a rosin-based modified resin having an acid value of not less than 100, a nondissociative activator formed of a nondissociative halogenide, and an aqueous solvent containing a volatile basic agent. There is also provided a circuit board having a flux film formed from such a soldering flux.
    Type: Application
    Filed: April 23, 2001
    Publication date: November 29, 2001
    Inventors: Shinichi Akaike, Shoichi Saito, Takao Ohno
  • Patent number: 6217671
    Abstract: An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
    Type: Grant
    Filed: December 14, 1999
    Date of Patent: April 17, 2001
    Assignee: International Business Machines Corporation
    Inventors: Donald W. Henderson, James Spalik
  • Patent number: 6203628
    Abstract: A flux composition for brazing aluminum, comprising a fluoride flux, at least one selected from a butyl rubber and a petroleum resin, and a solvent. The novel flux composition has excellent processing properties and provides brazed areas (fillets) with good appearance.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: March 20, 2001
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Haruzo Katoh, Takashi Watsuji, Ken Matsumura
  • Patent number: 6193812
    Abstract: A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proportions of borneol can give the flux tackiness for wave soldering operations. The flux preferably comprises borneol and an organic acid activator that volatilizes during soldering. The flux is applied as a solution of borneol and the organic acid activator in a solvent that substantially evaporates before soldering without leaving any measurable solvent residue.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: February 27, 2001
    Assignee: Delco Electronics Corporation
    Inventors: Samuel Victor Bristol, Mary Beth Young, David Ross Summers
  • Patent number: 6170735
    Abstract: A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proportions of borneol can give the flux tackiness for wave soldering operations. The flux preferably comprises borneol and an organic acid activator that volatilizes during soldering. The flux is applied as a solution of borneol and the organic acid activator in a solvent that substantially evaporates before soldering without leaving any measurable solvent residue.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: January 9, 2001
    Assignee: Delco Electronics Corporation
    Inventors: Samuel Victor Bristol, Mary Beth Young, David Ross Summers
  • Patent number: 6156130
    Abstract: These active brazing pastes satisfy the requirements for screen printing or dispensing particularly well and are well suited for brazing one aluminum oxide ceramic body to another one or to a metal body. This can be done by means of respective regions of brazing paste applied by screen printing to the ceramic bodies, with the coverage of one region matching the coverage of the other region or by inserting the metal body into a hole in the ceramic body and using a pad of brazing paste applied to the ceramic body and to the metal body by dispensing. The printable paste comprises as the active brazing material a hydrogenated powder of a Zr/Ni/Ti alloy or a Zr/Fe/Ti/Be alloy and as an organic vehicle poly(butyl-methyl methacrylate) or poly(n-decyl methacrylate) as the polymer and the camphor ketal of 2,2,4-trime-thylpentane-1,3-diol and/or 5-nonyl-methyl ether as the solvent for the polymer.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: December 5, 2000
    Inventors: Frank Hegner, Elke Maria Schmidt, Theophil Eicher, Peter Otschick, Winfried Schaffrath
  • Patent number: 6146470
    Abstract: Methods of brazing and coating and preparing articles for brazing and coating are disclosed. Prior to assembly and brazing, the articles are coated with a coating composition including a hot melt adhesive medium and brazing materials. To coat the articles, the hot melt adhesive medium and brazing materials are first mixed at elevated temperatures to form a liquid coating material, the material is allowed to harden, and the hardened material is then melted onto the articles to form a hard coating. The coated articles are then assembled for brazing. During the brazing process, the articles are first preheated to a sufficient temperature to substantially gasify and remove the hot melt adhesive medium from the articles. This leaves only the brazing materials on the articles for clean and efficient brazing of the articles in a conventional brazing oven. In one embodiment, the hot melt adhesive medium takes the form of a hot melt glue from the chemical family of ethylene-vinyl acetate bases.
    Type: Grant
    Filed: June 25, 1998
    Date of Patent: November 14, 2000
    Assignee: Peerless of America Incorporated
    Inventor: Roger Paulman
  • Patent number: 6059174
    Abstract: A flux composition for brazing of an aluminum material which can feed a proper amount of flux to an area to be joined at the time of brazing and at the same time can improve working environment, and a method for brazing of an aluminum material. The method comprises: coating an aluminum material to be joined with a flux composition comprising 0.5 to 25 parts by weight of a polymeric compound having a number average molecular weight of 50000 to 5000000 and comprising repeating alkylene oxide units, 5 to 30 parts by weight of a fluoride flux, and water added in such an amount as will provide a total amount of the composition of 100 parts by weight; heating the coated area to remove water; heating the coated area to decompose and remove the polymeric compound; and then conducting heating for brazing.
    Type: Grant
    Filed: February 8, 1999
    Date of Patent: May 9, 2000
    Assignees: Showa Aluminum Corporation, Nippon Paint Co., Ltd.
    Inventors: Masahiro Kojima, Futoshi Watanabe, Atsuhiko Tounaka, Kiyotada Yasuhara, Hiroyuki Nojiri, Katsuyoshi Yamasoe
  • Patent number: RE45537
    Abstract: Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from 10 ppm to 1000 ppm followed by collection of the spheres and drying. The lubricant is preferably selected from an aliphatic hydrocarbon lubricant, a higher fatty alcohol or acid lubricant, a fatty acid amide lubricant, a metal soap lubricant, a fatty acid ester lubricant, a fluoroplastic lubricant, a silicone lubricant, and a combination thereof.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: June 2, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Sohma, Takahiro Roppongi