Abstract: The printed circuit board for mounting electronic parts thereon is obtained by transferring flux from a supporting film to the surface of a printed circuit board, and soldering the electronic parts thereto after the supporting film is removed. The supporting film is first coated with the flux, and the flux is transferred to the printed circuit board through the application of heat and pressure. Hot air can be blown from an oblique direction on the flux-coated surface of the printed circuit board after the flux is transferred thereto and before the electronic parts are soldered thereto.This method can provide a uniform flux coat on the printed circuit board and can eliminate various drawbacks which are encountered in conventional approaches in which the surface of the printed circuit board is coated directly with flux in liquid form.

Abstract: A flux, in the form of a substantially clear solution, having particular utility in soldering battery components, said flux consisting essentially of a water-soluble alkanolamine, a substantially water-insoluble polycarboxylic acid which is partially or fully neutralized by said alkanolamine, and water.

Abstract: Solder flux compositions are prepared by forming a dispersion of a flux material in a liquid in which the flux is substantially insoluble. The composition may be applied to a workpiece by brushing, spraying, or as an unstable foam. A method of tinning circuit boards using such flux compositions is also described.

Abstract: Novel solder composition or solder cream, particularly adapted for soldering components in electronic circuitry, comprising finely divided solder metals such as tin and lead, dispersed in a vehicle containing viscosity controlling agents, organic solvents, and a rosin or rosin derivative as a flux. By employing a narrow range of rosin-containing vehicle, that is between 13 and 14%, and between 86 and 87% of solder metal, by weight of the solder composition, and fine particle size solder metal of from 40 to 70 microns, the formation of solder balls is essentially eliminated, thus avoiding the necessity of removing such solder balls.

Abstract: A solder flux composition comprises a mixture of sarcosine and tartronic or tartaric acid dissolved in water and an aliphatic alcohol. Typically the acid-sarcosine weight ratio lies within the range 90:10 to 30:70 and the solution may contain between 5 and 20 weight percent of solids. The flux is employed for tin/lead soldering of a range of metals and alloys including copper, nickel and nickel-iron. Bidegradation of the flux is inhibited by the inclusion of lead carbonate, phenol or salicylic acid in the composition.

Abstract: A soldering flux comprises a mixture comprising a vehicle which is nonreactive with the portion of an electronic device to be contacted by the flux, an activator having at least one halogen atom and at least one destabilizing constituent and an acid solder surfactant selected from a polybasic carboxylic acid, a hydroxyl substituent thereof, a keto acid and a mixture of any of the foregoing surfactants.

Abstract: This invention relates to joining metallic parts by soldering and in particular to a soldering composition.A soldering composition in accordance with the present invention is solid at ambient temperatures and comprises a particulate soldering alloy or metal or oxide precursor thereof dispersed in a thermoplastic material. Conveniently, the soldering composition also includes one or more fluxes.

Abstract: This invention relates to brazing materials. In particular it is concerned with a novel combination of brazing alloy and flux. Specifically, a brazing material in accordance with the invention comprises a brazing alloy having a coating comprising a brazing flux and an elastomer.

Abstract: A rosin flux with a water soluble rosin derivative replacing the rosin of otherwise a typical rosin flux such that residues of solder flux be completely removable with either a water based or solvent based cleaning substance.

Abstract: Improved soldering or brazing paste compositions comprising a metal alloy powder and a vehicle therefor have been developed. The vehicle comprises hydroxypropyl cellulose blended with glycerine and/or water further blended with a mixture of polyalkoxyalkanols. Said vehicle is totally fugitive, leaving exceptionally low residue and maintains stable viscosity during extended storage.

Abstract: Soft solder in the form of an extruded or cast bar or ingot is provided with a coating which prevents formation of surface oxide during storage of the bar or ingot and which acts as an anti-oxidant surface layer when the bar or ingot is used to form a molten solder bath. The coating may also act as a solder flux so that when a solder bath is formed from the soft solder bar or ingot, the anti-oxidant surface layer formed from the coating also acts as a flux composition hence obviating the necessity of employing a separate solder flux in a soldering operation in which the molten solder bath is used. The coating is formed from a coating material essentially comprising a mixture of a neutral ester of a polyhydric alcohol and an ester derivative of rosin or of a modified rosin.

Abstract: Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F.

Abstract: Copper-manganese alloy brazing pastes can be substantially improved by the inclusion of a minor amount of silicon in the alloy. The brazing alloy can contain by weight between about 0.5% and 3% silicon to provide a brazing composition for brazing at temperatures between about 1650.degree. C. and 1850.degree. C.

Abstract: A process for making metal joining paste, particularly suitable for precision soldering and brazing, which comprises preparing a paste vehicle by mixing together, at an elevated temperature, paste ingredients including solvent, flux and specialized additives, cooling said vehicle, and blending metal powder therewith. Blending preferably is subsequent to cooling, but can be simultaneous with cooling, though without significant exposure of the metal to the vehicle at elevated temperature. Cooling of the vehicle takes place under shock cooling conditions, such as to obtain a fine particle size suspension, and is to a final temperature inhibitive of significant reaction of metal powder with vehicle acidic constituents. The present invention provides increased viscosity control and suspension stability necessary for fine bore automatic dispensing of the paste.

Abstract: A film-forming composition comprising an organic flux base material; and a carboxylic acid anhydride and/or aldehyde; and a process for using are provided.

Abstract: A soldering flux is disclosed. The soldering flux comprises a mixture comprising rosin, an activator having at least one halogen atom and at least one destabilizing substituent and an acid solder surfactant selected from the polybasic carboxylic acid, a hydroxyl substituent thereof, a keto acid and a mixture of any of the foregoing surfactants.

Abstract: Water soluble soldering flux compositions, and methods of making same are provided. The compositions contain, as the fluxing agent, an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a water-soluble ester of phosphoric acid.

Abstract: A soldering flux is disclosed. The soldering flux comprises a mixture comprising rosin, an activator having at least one halogen atom and at least one destabilizing substituent and an acid solder surfactant selected from a polybasic carboxylic acid, a hydroxyl substituent thereof, a keto acid and a mixture of any of the foregoing surfactants.

Abstract: Soldering fluxes and methods of using same for soldering metals with solders which are molten below 400.degree. C. wherein the flux functions efficiently but with an absence or minimum of spattering of particulate solder or reaction products between the solder and flux. Soldering fluxes according to this invention can be utilized in any soldering application and by any method of soldering where it is desirable to eliminate or reduce spattering.A few examples of common soldering compositions in this category are tin, tin and antimony, tin and lead. One example of the use of such fluxes is in the soldering of tinplate can bodies whereby it is possible to minimize or substantially eliminate the contamination of the can body by the lead component of the solder when lead bearing solders are used.

Abstract: Water-soluble or readily water-dispersible fluxes for use in connection with soldering operations in plumbing and related or other environments, particularly for use in connection with the soldering of water lines made from copper or copper-base alloys. The said water-soluble or readily water-dispersible fluxes are produced in the form of pastes in which the paste-forming ingredients are water-soluble surfactants or mixtures of surfactants, especially those of nonionic character, with or without water, but especially where water is present in amounts of at least several percent by weight of the finished flux composition, said paste flux compositions also containing water-soluble amine hydrochlorides, and, advantageously, ammonium chloride, with or without various supplemental ingredients which, when used, are employed in small proportions.

Abstract: An improved welding electrode for producing weld metal having low amounts of hydrogen therein so that hydrogen-assisted cracking in the weld zone is minimized. This is especially beneficial for welding high strength steels having tensile strengths of about 70,000 psi and above. The electrode has a filler wire core and a flux covering of predetermined constituents and low moisture levels such as below about 0.6 percent. The flux is bound together with a binder of hydrolyzed organic silicate (silica) which makes no substantial contribution to the moisture level of the covering and which also makes the covering resistant to hygroscopic moisture pickup before the electrode is used for welding. Thus, this binder minimizes the amount of hydrogen from any moisture in the covering which may be introduced into the weld metal during welding. Additionally, the flux covering contains a source of barium or cesium in an amount effective to reduce the slag/metal reaction temperature during welding.

Abstract: Directed to a welding flux and covered welding electrodes, and, more particularly, to covered electrodes having a nickel-chromium-iron alloy core and a special flux coating or covering, which electrode is capable of joining similar and dissimilar metals and which produces, in all positions, sound welds free from cracking and porosity and deposits having excellent corrosion resistance.

Abstract: Low-fuming fluxes are provided which contain up to about 18% by weight of a dust-free large-particle source of ammonium chloride.

Abstract: The invention relates to a novel non-corrosive rosin oil flux and a novel method of soldering which comprises the use of said flux.

Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble product obtained by first reacting an aliphatic hydrocarbon-substituted succinic acid or derivative thereof which is capable of forming carboximide bonds with an alkylene polyamine to form a carboximide and then reacting said carboximide with an alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Abstract: Dimerised and trimerised unsaturated aliphatic monocarboxylic acids having at least 10 carbon atoms are advantageous in or as fluxes for soldering of tin plate. Especially valuable novel fluxes for this purpose comprise, in free acid or ammonium or amine salt form, (1) at least one compound selected from the group consisting of C.sub.7.sub.-11 aliphatic monocarboxylic acids and acid organic phosphates and (2) at least one substance selected from the group consisting of dimerised and trimerised unsaturated aliphatic monocarboxylic acids having at least 10 carbon atoms, saturated C.sub.12.sub.-36 aliphatic monocarboxylic acids and rosin.

Abstract: A method, compositions and articles are described for the direct addition of alloying metal to a molten metal to be alloyed, which provide more rapid dissolution of the alloying metal in the molten metal than has been possible heretofore. The alloying metal is added to the molten metal to be alloyed in finely particulate form in intimate admixture with a flux suitable for the purpose and finely particulate phenolic resin. The phenolic resin, in particle form, and preferably in the form of low density microballoons, is employed in an amount such that the ratio of the volume of the metalflux mixture to the volume of the microballoons is in the range from about 2:1 to about 12:1. The flux-alloying metal mixture contains about 3 to about 10% flux and about 90 to about 97% alloying metal, by weight of the flux-metal mixture. The compositions may be added to the molten metal bath in powder or lump form or may be incorporated in articles such as bags or briquettes containing the compositions.