Copper Containing Patents (Class 148/438)
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Patent number: 6786983Abstract: An aluminum alloy product is provided that includes an ADC12 aluminum alloy, wherein the ADC12 aluminum alloy is cast into the product utilizing a high pressure, slow velocity casting technique.Type: GrantFiled: March 19, 2002Date of Patent: September 7, 2004Assignee: SPX CorporationInventors: Richard Brian Szymanowski, Rathindra DasGupta
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Patent number: 6736947Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 &mgr;m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.Type: GrantFiled: June 23, 2000Date of Patent: May 18, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Koichi Watanabe, Takashi Ishigami
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Patent number: 6723184Abstract: An aluminum alloy which is able to use not only expensive TiC particles, but also inexpensive dispersed reinforcing particles and which is further raised in high temperature strength without requiring an increase in dispersed reinforcing particles, comprised of Sn: 2 to 20 wt %, Cu: 0.1 to 3 wt %, Ca: 0.02 to 1.5 wt %, at least one element selected from the group comprised of Mg, Cr, Zr, Mn, V, Ni, and Fe: not more than 2 wt % in total, at least one type of reinforcing particle selected from the group comprised of TiC particles, ZrC particles, and Al2O3 particles: 0.1 to 5 vol % in total, and the balance of Al and unavoidable impurities; a slide bearing comprised of that aluminum alloy; and a slide bearing comprised of a bearing body made of that aluminum alloy provided on its surface with a resin coating layer comprised of a heat-curing resin and a solid lubricant.Type: GrantFiled: February 25, 2003Date of Patent: April 20, 2004Assignee: Taiho Kogyo Co., Ltd.Inventors: Kazuaki Sato, Yoshio Fuwa, Takashi Tomikawa, Shinichiro Sakamoto
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Patent number: 6712915Abstract: Various articles of manufacture, such as electrosurgical scalpels, razor blades, electronic components and mechanical components having a quasicrystalline AlCuFe alloy film less than about 10,000 Å thick. Such articles of manufacture may be formed by depositing (in sequence) on a substrate through radio frequency sputtering a stoichiometric amount of each respective alloy material and then annealing those layers to form the film through solid state diffusion.Type: GrantFiled: September 21, 2001Date of Patent: March 30, 2004Assignee: University of Utah Research FoundationInventors: Orest G. Symko, Ehab Abdel-Rahman, Wanjun Park, Thierry Klein, David Kieda
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Patent number: 6696175Abstract: The present invention provides aluminum alloys and layers formed in aluminum alloys as well as methods for their manufacture. Aluminum alloys of the present invention are provided with at least one discrete layer of uncrystallized grains formed therein. Alloys of the present invention can be formed, for example, by a process that includes a final partial anneal that permits softening of the material to essentially an O-temper condition. Processes of the present invention recrystallized substantially the entire material by leave a discrete layer of preferably less than 50 microns of the material unrecrystallized. In preferred embodiments, the aluminum material is a core material that is clad on one or both sides and the discrete unrecrystallized layer forms at the boundary between the clad and the core.Type: GrantFiled: January 16, 2003Date of Patent: February 24, 2004Assignee: Pechiney Rolled ProductsInventors: Scott L. Palmer, Zayna Connor, H. Scott Goodrich
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Patent number: 6673309Abstract: An alloy for a sacrificial anode according to a first preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.0005% to about 0.05% of Zr. The balance may be Al and any unavoidable impurities. An alloy according to a second preferred aspect of the present application includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.05% to about 0.3% of Si. The balance may be Al and any unavoidable impurities. An alloy according to a third preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, and about 0.02% to about 0.2% of Ce. The balance may be Al and any unavoidable impurities. An alloy according to a fourth preferred aspect of the present invention includes about 10% to about 50% of Zn, about 0.03% to about 0.6% of In, about 0.005% to about 0.1% of Ti, and about 0.001% to about 0.02% of B. The balance may be Al and any unavoidable impurities.Type: GrantFiled: February 10, 1995Date of Patent: January 6, 2004Assignee: Corrpro Companies, Inc.Inventors: Kunio Watanabe, Shozo Takeya
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Patent number: 6605199Abstract: An aluminum alloy sputter target having a sputter target face for sputtering the sputter target is provided. The sputter target face has a textured-metastable grain structure. The textured-metastable grain structure has a grain orientation ratio of at least 35 percent (200) orientation. The textured-metastable grain structure is stable during sputtering of the sputter target. The textured-metastable grain structure has a grain size of less than 5 &mgr;m. The method forms aluminum alloy sputter targets by first cooling an aluminum alloy target blank to a temperature of less than −50° C. Then deforming the cooled aluminum alloy target blank introduces plastic strain into the target blank and reduces the grain size of the grains to form a textured-metastable grain structure. Finally, finishing the aluminum alloy target blank forms a finished sputter target that maintains the textured-metastable grain structure of the finished sputter target.Type: GrantFiled: November 14, 2001Date of Patent: August 12, 2003Assignee: Praxair S.T. Technology, Inc.Inventors: Andrew C. Perry, Paul S. Gilman, Jaak Van den Sype
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Patent number: 6579386Abstract: A weld filler wire chemistry has been developed for fusion welding 2195 aluminum-lithium. The weld filler wire chemistry is an aluminum-copper based alloy containing high additions of titanium and zirconium. The additions of titanium and zirconium reduce the crack susceptibility of aluminum alloy welds while producing good weld mechanical properties. The addition of silver further improves the weld properties of the weld filler wire. The reduced weld crack susceptibility enhances the repair weldability, including when planishing is required.Type: GrantFiled: March 15, 2000Date of Patent: June 17, 2003Assignee: Lockheed Martin CorporationInventors: Gerald W. O. Bjorkman, Jr., Alex Cho, Carolyn K. Russell
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Patent number: 6555247Abstract: An aluminum alloy plate for a planographic printing plate capable of being provided with a satisfactory roughed surface by electrolytic etching. The aluminum alloy plate contains 0.1 to 0.6% of Fe, 0.01 to 0.2% of Si, 5 to 150 ppm of Cu, and balance of Al and unavoidable impurities and has a surface layer portion formed of a metastable phase dispersion layer in which metastable phase AlFe-based intermetallic compound particles are dispersed. The metastable intermetallic compound particles each act as a starting point for pits. The alloy plate is formed with a roughed surface which is reduced in unetching and uniformly formed with pits, by electrolytic etching.Type: GrantFiled: July 9, 2001Date of Patent: April 29, 2003Assignee: Mitsubishi Aluminum Kabushiki KaishaInventor: Keitarou Yamaguchi
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Patent number: 6500284Abstract: There is provided a continuous casting and rolling process for continuously producing a deformed fine grain solid metal composition suitable for semi-solid forming. The process is characterized by high throughput, continuity, and precise control of the process parameters, such as solidification rate, rolling temperature and speed and total deformation. The solidification rate is preferred to be in a range of 10 to 150° C./s, and the total deformation is controlled to be larger than a Mises effective strain of 2.3 to obtain a deformed fine grain structure with enough distortion energy. A method combining the continuous casting and rolling process of preparing semi-solid raw material with semi-solid forming of shaped articles is also disclosed.Type: GrantFiled: June 10, 1998Date of Patent: December 31, 2002Assignee: Suraltech, Inc.Inventors: Youdong Zhou, Jian Lu, Navtej Singh Saluja, Alfredo Riviere, V
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Publication number: 20020192105Abstract: Aluminum alloy, which consists of from 2 to 20% by weight of Sn, from 3% by weight or less of Cu, and from 0.3 to 5% by volume of TiC particles, the balance being Al and unavoidable impurities, exhibits improved fatigue resistance at a high temperature region, while maintaining compatibility at low temperature notwithstanding improved fatigue resistance.Type: ApplicationFiled: April 25, 2001Publication date: December 19, 2002Applicant: TAIHO KOGYO CO., LTD.Inventors: Toru Desaki, Soji Kamiya, Kazuaki Sato, Yukio Okouchi, Tetsuya Nukami
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Patent number: 6471794Abstract: An aluminum alloy fin material for brazing which is composed of an aluminum alloy comprising above 0.1 wt % to 3 wt % of Ni, above 1.5 wt % to 2.2 wt % of Fe, and 1.2 wt % or less of Si, and at least one selected from the group consisting of 4 wt % or less of Zn, 0.3 wt % or less of In, and 0.3 wt % or less of Sn, and further comprising, optionally, at least one selected from the group consisting of co, Cr, Zr, Ti, Cu, Mn, and Mg in given amounts, the balance being unavoidable impurities and aluminum, wherein a ratio of the grain length in the right angle direction/the grain length in the parallel direction is 1/30 or less, an electric conductivity is 50 to 55 %IACS, and a tensile strength is 170 to 280 MPa.Type: GrantFiled: May 18, 2001Date of Patent: October 29, 2002Assignees: The Furukawa Electric Co., Ltd., Denso CorporationInventors: Takeyoshi Doko, Akira Kawahara, Sunao Fukuda, Yoshihiko Kamiya, Masaki Shimizu, Kenji Negura
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Publication number: 20020134474Abstract: A process for thermally treating an article made from an alloy comprising at least aluminum and copper. The process comprises solid solution heat treating the article, quenching the article, heating the article to a first temperature of from about 275 to about 340° F. and artificially aging. The article is artificially aged at the first temperature for a duration of at least 30 minutes. The article is artificially aged at a second temperature of from about 325 to about 380° F. for a duration of from about 4 hours to about 36 hours. The second temperature is greater than the first temperature by at least 10° F.Type: ApplicationFiled: October 19, 2001Publication date: September 26, 2002Inventor: Alex Cho
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Publication number: 20020040746Abstract: There is provided an architectural Al alloy material which undergoes minor loss of proof stress even after a baking finish treatment at a high temperature of 260 to 280° C. and which can be subjected to acute-angle bending, as well as, a process for manufacturing the same. This architectural Al alloy material, which is a hot rolled JIS A3003 material, contains a fiber structure and a recrystallized grain structure having an area ratio of 20 % or less after a baking finish treatment at 300° C. or lower, and undergoes a proof stress loss of 10% or less after the baking finish treatment. The Al alloy material is manufactured only by hot rolling which is carried out under control such that the temperature at the end of rolling be in the range of 290 to 340° C.Type: ApplicationFiled: August 8, 2001Publication date: April 11, 2002Inventors: Kiyohiro Kawai, Yoshiro Togami
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Patent number: 6352789Abstract: The invention relates to a brazing sheet with a two-layer structure or a three-layer structure, having a core sheet made of an aluminium alloy core material and on one side or both sides thereof a brazing layer of an aluminium alloy containing silicon as main alloying element, wherein the aluminium alloy of the core sheet has the composition (in weight %) Mn 0.5 to 1.5 Cu 0.5 to 2.0 Si 0.3 to 1.5 Mg <0.05 Fe <0.4 Ti <0.15 Cr <0.35 Zr and/or V <0.35 in total Zn <0.25 balance aluminium and unavoidable impurities, and wherein said brazing sheet has a post-braze 0.2% yield strength of at least 50 MPa and having a corrosion life of more than 12 days in a SWAAT test without perforations in accordance with ASTM G-85, and further to a method of its manufacture.Type: GrantFiled: March 31, 2000Date of Patent: March 5, 2002Assignee: Corus Aluminium Walzprodukte GmbHInventors: Timothy John Hurd, Nicolaas Dirk Adrianus Kooij, Achim Bürger, Klaus Vieregge
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Patent number: 6350532Abstract: The invention relates to a recyclable aluminum foil. The foil is made of an alloy containing 0.2%-0.5% Si, 0.4%-0.8% Fe, 0.1%-0.3% Cu, and 0.05%-0.3% Mn by weight. with the balance aluminum and incidental impurities. The foil contains at least about 2% by weight of strengthening particulates and has at least about 0.1% by weight of the copper and/or manganese retained in solid solution. The invention also relates to a method of manufacturing a sheet of aluminum based on an alloy which involves continuously casting an alloy of the above composition to form a sheet of alloy, coiling said sheet of alloy, cold rolling the sheet of alloy, interannealing the alloy after a first pass of the cold rolling; and further cold rolling the alloy to a final desired gauge. The foil, which is suitable for household use, has improved strength due to a larger quantity of dispersoids fortified by elements in solid solution, and can be recycled with other alloy scrap.Type: GrantFiled: January 18, 2000Date of Patent: February 26, 2002Assignee: Alcan International Ltd.Inventors: Thomas L. Davisson, Luc Montgrain, Daniel Pulliam, Sadashiv Nadkarni
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Publication number: 20020007880Abstract: Described is a high quality sputtering target and method of manufacture which involves application of equal channel angular extrusion.Type: ApplicationFiled: July 24, 2001Publication date: January 24, 2002Inventors: Vladimir Segal, William B. Willett, Stephane Ferrasse
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Patent number: 6334911Abstract: An aluminum alloy having a composition represented by the general formula: AlbalCuaMb or AlbalCuaMbTMc wherein M represents one or two elements selected between Mn and Cr; TM represents at least one element selected from the group consisting of Ti, Zr, V, Fe, Co, and Ni; and a, b and c each represent an atomic percentage of 0<a≦3, 2<b ≦5, and 0<c≦2, containing quasi-crystals in the structure thereof, and having an elongation of at least 10% at room temperature and a Young's modulus of at least 85 GPa. The aluminum alloy exhibits excellent mechanical properties such as high-temperature strength, ductility, impact strength and tensile strength and is provided as a rapidly-solidified material, a heat-treated material obtained by heat-treating the rapidly-solidified material, or a consolidated and compacted material obtained by consolidating and compacting the rapidly-solidified material.Type: GrantFiled: February 19, 1998Date of Patent: January 1, 2002Assignee: YKK CorporationInventors: Kazuhiko Kita, Koji Saito, Koju Tachi, Teruaki Onogi, Kenji Higashi
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Publication number: 20010054457Abstract: Described is a high quality sputtering target and method of manufacture which involves application of equal channel angular extrusion.Type: ApplicationFiled: July 24, 2001Publication date: December 27, 2001Inventors: Vladimir Segal, William B. Willett, Stephane Ferrasse
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Publication number: 20010047838Abstract: The invention includes a method of forming an aluminum-comprising physical vapor deposition target. An aluminum-comprising mass is deformed by equal channel angular extrusion. The mass is at least 99.99% aluminum and further comprises less than or equal to about 1,000 ppm of one or more dopant materials comprising elements selected from the group consisting of Ac, Ag, As, B, Ba, Be, Bi, C, Ca, Cd, Ce, Co, Cr, Cu, Dy, Er, Eu, Fe, Ga, Gd, Ge, Hf, Ho, In, Ir, La, Lu, Mg, Mn, Mo, N, Nb, Nd, Ni, O, Os, P, Pb, Pd, Pm, Po, Pr, Pt, Pu, Ra, Rf, Rh, Ru, S, Sb, Sc, Se, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tl, Tm, V, W, Y, Yb, Zn and Zr. After the aluminum-comprising mass is deformed, the mass is shaped into at least a portion of a sputtering target.Type: ApplicationFiled: February 13, 2001Publication date: December 6, 2001Inventors: Vladimir M. Segal, Jianxing Li, Frank Alford, Stephane Ferrasse
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Patent number: 6294030Abstract: Various articles of manufacture, such as electrosurgical scalpels, razor blades, and electronic components, comprise a quasicrystalline AlCuFe alloy film less than about 3000 Å thick, formed by depositing in sequence on a substrate through radio frequency sputtering a stoichiometric amount of each respective alloy material and then annealing those layers to form the film through solid state diffusion.Type: GrantFiled: December 15, 1994Date of Patent: September 25, 2001Assignee: University of Utah Research FoundationInventors: Orest G. Symko, Thierry Klein, David Kieda
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Patent number: 6267829Abstract: The present invention is a method for producing an iron-containing hypoeutectic alloy free from primary platelet-shaped beta-phase of the Al5FeSi in the solidified structure by the steps (a) providing an iron-containing aluminum alloy having a composition within the following limits, in weight percent, 6-10% Si, 0.05-1.0% Mn, 0.4-2% Fe, at least one of 1) 0.01-0.8% Ti and/or Zr 2) 0.005-0.5% Sr and/or Na and/or Ba, 0-6.0% Cu, 0-2.0% Cr, 0-2.0% Mg, 0-6.0% Zn, 0-0.Type: GrantFiled: August 27, 1998Date of Patent: July 31, 2001Assignee: Opticast ABInventors: Lennart Bäckerud, Lars Arnberg, Guocai Chai
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Patent number: 6258463Abstract: The invention relates to a process for producing anodic coatings with superior corrosion resistance and other properties on aluminum and aluminum alloy surfaces by cryogenically treating the aluminum prior to anodizing. The invention also relates to the anodic coatings and to the anodically coated articles produced by the process. The anodized coating has a thickness of 0.001 to 0.5 mm and a time to penetration of at least 5 hours for aqueous solutions of HCl.Type: GrantFiled: March 2, 2000Date of Patent: July 10, 2001Assignee: Praxair S.T. Technology, Inc.Inventor: Michael Kevin Corridan
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Publication number: 20010006608Abstract: A bearing and a bearing alloy composition are described, the bearing alloy comprising in weight%: tin 5-10; copper 0.7-1.3; nickel 0.7-1.3; silicon 1.5-3.5; vanadium 0.1-0.3; manganese 0.1-0.3; balance aluminium apart from unavoidable impurities.Type: ApplicationFiled: December 11, 2000Publication date: July 5, 2001Applicant: Dana CorporationInventors: Kenneth Macleod McMeekin, Ian David Massey
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Patent number: 6248453Abstract: A high strength dispersion strengthened aluminum alloy comprising an aluminum solid solution matrix strengthened by a dispersion of particles based on the compound Al3X, where Al3X has an L12 structure, is described. Various alloying elements are employed to modify the lattice parameter of the matrix and/or the particles so that the matrix and particles have similar lattice parameters. The alloy is produced by rapid solidification from the melt.Type: GrantFiled: December 22, 1999Date of Patent: June 19, 2001Assignee: United Technologies CorporationInventor: Thomas J. Watson
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Patent number: 6231809Abstract: An Al—Mg—Si type alloy sheet contains 0.2 to 1.5 wt % of Mg and 0.2 to 1.5 wt % of Si. The sheet has textures in which orientation distribution density of Goss orientation is 3 or lower, orientation distribution density of PP orientation is 3 or lower and orientation distribution density of Brass orientation is 3 or lower. The sheet may contain 0.01 to 1.5 wt % in total weight of one or more elements selected from the group consisting of Mn, Cr, Fe, Zr, V and Ti. The sheet may further contain 0.01 to 1.5 wt % in total weight of one or more elements selected from the group consisting of Cu, Ag, Zn and Sn. Thus, ridging marks is restrained in the aluminum alloy sheet.Type: GrantFiled: August 17, 1999Date of Patent: May 15, 2001Assignees: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Alcoa Transporation Products Ltd.Inventors: Katsushi Matsumoto, Masahiro Yanagawa, Yasuo Takaki
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Patent number: 6228186Abstract: Improved targets for use in DC_magnetron sputtering of aluminum or like metals are disclosed for forming metallization films having low defect densities. Methods for manufacturing and using such targets are also disclosed. Conductivity anomalies such as those composed of metal oxide inclusions can induce arcing between the target surface and the plasma. The arcing can lead to production of excessive deposition material in the form of splats or blobs. Reducing the content of conductivity anomalies and strengthening the to-be-deposited material is seen to reduce production of such splats or blobs. Other splat limiting steps include smooth finishing of the target surface and low-stress ramp up of the plasma.Type: GrantFiled: October 14, 1999Date of Patent: May 8, 2001Assignee: Applied Materials, Inc.Inventors: Vikram Pavate, Keith J. Hansen, Glen Mori, Murali Narasimhan, Seshadri Ramaswami, Jaim Nulman
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Patent number: 6183887Abstract: A composite structure including a substrate and a heat protection element on the substrate, wherein the heat protection element includes a quasicrystalline aluminium alloy of one or a number of quasicrystalline phases which are either quasicrystalline phases in the strict sense, or approximating phases, wherein the quasicrystalline phases exhibit a thermal diffusivity, measured at ambient temperature, lower than 2.5×10−6 m2/s, and a thermal diffusivity measured in the temperature range 650-750° C.Type: GrantFiled: January 19, 1999Date of Patent: February 6, 2001Assignee: Centre National de la Recherche ScientifiqueInventors: Jean-Marie Dubois, Pierre Archambault, Bernard Colleret
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Patent number: 6153025Abstract: A corrosion-resistant and high tensile strength aluminum-based alloy consisting of, by weight, about 0.06-0.25% iron, 0.05-0.15% silicon, 0.03-0.08% manganese, 0.10-0.18% titanium, 0.10-0.18% chromium, up to 0.50% copper, up to 0.70% zinc, up to 0.02% incidental impurities, and the balance aluminum.Type: GrantFiled: July 16, 1998Date of Patent: November 28, 2000Assignee: Norsk Hydro A.S.Inventors: Lars Auran, Trond Furu
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Patent number: 6149737Abstract: An aluminum alloy is industrially producible and has higher strength and toughness than the prior art alloys. The high-strength high-toughness aluminum alloy includes a first phase of .alpha.-aluminum consisting of crystal grains whose mean crystal grain size is within the range of 60 to 1000 nm and a second phase of at least two different of intermetallic compounds consisting of crystal grains whose mean crystal grain sizes are within the range of 20 to 2000 nm. The crystal grains of the intermetallic compounds are dispersed so that they are only intermittently, and not continuously, linked throughout the alloy material.Type: GrantFiled: May 8, 1998Date of Patent: November 21, 2000Assignees: Sumitomo Electric Industries Ltd., Japan Science and Technology CorporationInventors: Hisao Hattori, Toshihiko Kaji, Manabu Hashikura, Yoshishige Takano
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Patent number: 6113850Abstract: An A-rated, aluminum alloy suitable for machining, said alloy consisting essentially of: about 4-5.75 wt. % copper, about 0.2-0.9 wt. % bismuth, about 0.12-1.0 wt. % tin, the ratio of bismuth to tin ranging from about 0.8:1 to 5:1, up to about 0.7 wt. % iron, up to about 0.4 wt. % silicon, up to about 0.3 wt. % zinc, the balance aluminum, incidental elements and impurities. On a preferred basis, this alloy contains about 4.4-5.0 wt. % copper, about 0.4-0.75 wt. % bismuth, about 0.2-0.5 wt. % tin, the ratio of bismuth to tin ranging from about 1:1 to 3:1, about 0.2 wt. % or less iron and about 0.2 wt. % or less silicon. The alloy is substantially lead-free, cadmium-free and thallium-free. There is further disclosed an improved method for making screw machine stock or wire, rod and bar product from this alloy by casting, preheating, extruding, solution heat treating, cold finishing and aging the same.Type: GrantFiled: August 9, 1994Date of Patent: September 5, 2000Assignee: Aluminum Company of AmericaInventors: Charles W. Bartges, Gerald D. Scott, Thomas J. Klemp, M. Elise Hyland, James A. Brock, Colleen Spillard
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Patent number: 6110829Abstract: An aluminum fill process for sub-0.25 .mu.m technology integrated circuits that has a reflow temperature less than 400.degree. C. that has low alloy resistivity and excellent electromigration characteristics. The aluminum allow is composed of Al-1% Ge-1% Cu.Type: GrantFiled: October 23, 1997Date of Patent: August 29, 2000Assignee: Advanced Micro Devices, Inc.Inventors: Paul Raymond Besser, Robin W. Cheung, Guarionex Morales
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Patent number: 6074498Abstract: A dual aging treatment of aluminum-copper-lithium-scandium alloys allows preparation of alloys exhibiting superior physical properties as compared to the same alloys subjected to only a single aging. In particular, the difference between yield strength and ultimate tensile strength is markedly increased. The alloys are characterized by an array of fine T1 phase precipitates within the aluminum grain, leaving a substantially T1 phase precipitate-free zone along the grain boundaries, and an array of coarse .theta.' and .delta.' phase precipitates throughout the grains with little or no .theta.' and .delta.' phase-free zones.Type: GrantFiled: October 28, 1997Date of Patent: June 13, 2000Assignee: McDonnell Douglas CorporationInventors: Douglas J. Waldron, William F. Bozich
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Patent number: 6056802Abstract: A high-strength aluminum-based alloy consisting essentially of a composition represented by the general formula: Al.sub.bal Mn.sub.a M.sub.b or Al.sub.bal Mn.sub.a M.sub.b TM.sub.c wherein M represents one or more members selected from the group consisting of Ni, Co, Fe and Cu, TM represents one or more members selected from the group consisting of Ti, V, Cr, Y, Zr, La, Ce and Mm and a, b and c each represent an atomic percent (at %) in the range of 2.ltoreq.a.ltoreq.5, 2.ltoreq.b.ltoreq.6 and 0<c.ltoreq.2 and containing monoclinic crystals of an intermetallic compound of an Al.sub.9 Co.sub.2 -type structure in the structure thereof. The Al-based alloy has excellent mechanical properties including a high hardness, high strength and high elongation.Type: GrantFiled: July 9, 1997Date of Patent: May 2, 2000Assignee: YKK CorporationInventors: Kazuhiko Kita, Koji Saito
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Patent number: 6056836Abstract: Sheet for welded constructions having an ultimate tensile strength R.sub.m >275 MPa, elongation A>22% and a product A.times.R.sub.m >7000, having the composition, in % by weight:______________________________________ Mg: 4.2-4.7; Mn: 0.20-0.40; Zn: <0.20; Fe: 0.20-0.45; Si <0.25; Cr <0.15; Cu <0.25; Ti <0.10; Zr <0.10; ______________________________________other elements <0.05 each and <0.20 in total,balance Al.Type: GrantFiled: February 23, 1998Date of Patent: May 2, 2000Assignee: Pechiney RhenaluInventors: Jean-Luc Hoffman, Guy-Michel Raynaud, Martin-Peter Schmidt, Herve Ribes
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Patent number: 6053997Abstract: In carrying out of a thixocasting process, a material in a semi-molten state is produced by heating an aluminum alloy material which has a thermal characteristic that a first angled endothermic section generated by the melting of a eutectic crystal and a second angled endothermic section generated by the melting of a component having a melting point higher than an eutectic point exist in a differential calorimetric curve. A start point of a primary pressing stage is established at a point when the temperature T of the material is in a range of T.sub.1 <T.ltoreq.T.sub.4 in the relationship between the temperature T.sub.1 of a rise-start point in the first angled endothermic section and the temperature T.sub.4 of a peak of the second angled endothermic section. At the primary pressing stage, the charging of the material into the cavity in a casting mold is completed. A start point of a secondary pressing stage is established at a point when the temperature T of the material is in a range of T.sub.1 <T.Type: GrantFiled: October 22, 1997Date of Patent: April 25, 2000Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Takeyoshi Nakamura, Nobuhiro Saito, Kazuo Kikawa, Takeshi Sugawara
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Patent number: 6017403Abstract: An aluminum-based alloy having the general formula Al.sub.x L.sub.y M.sub.z (wherein L is Mn or Cr; M is Ni, Co, and/or Cu; and x, y, and z, representing a composition ratio in atomic percentages, satisfy the relationships x+y+z=100, 75.ltoreq.x.ltoreq.95, 2.ltoreq.y.ltoreq.15, and 0.5.ltoreq.z.ltoreq.10) having a metallographic structure comprising a quasi-crystalline phase possesses high strength and high rigidity. In order to enhance the ductility and toughness of the aluminum-based alloy, the atomic percentage of M may be further limited to 0.5.ltoreq.z.ltoreq.4, and more preferably to 0.5.ltoreq.z.ltoreq.3. The aluminum-based alloy is useful as a structural material for aircraft, vehicles and ships, and for engine parts; as material for sashes, roofing materials, and exterior materials for use in construction; or as materials for use in marine equipment, nuclear reactors, and the like.Type: GrantFiled: February 15, 1996Date of Patent: January 25, 2000Assignees: Yamaha Corporation, Isuyoshi Masumoto, Akihisa InoueInventors: Tsuyoshi Masumoto, Akihisa Inoue, Yuma Horio
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Patent number: 5980657Abstract: An integrated circuit alloy is described which reduces the alloy melting temperature for improved coverage of high aspect ratio features with a reduced deposition pressure. The alloy is used to fabricate metal contacts and interconnects in integrated circuits, such as memory devices. The contacts and interconnects can be high aspect ratio features formed using a dual damascene process. An aluminum interconnect alloy is described for use in an integrated circuit which includes Al, Cu, Si. Ge and Mg can also be provided in the alloy. The composition of Si+Ge+Mg provides a melting temperature of the aluminum interconnect alloy which is between 500 and 550.degree. C.Type: GrantFiled: March 10, 1998Date of Patent: November 9, 1999Assignee: Micron Technology, Inc.Inventors: Paul A. Farrar, John H. Givens
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Patent number: 5968292Abstract: A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article; the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet; the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heat applied to the billet at a heat-up rate greater than 30.degree. C. per minute to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of the aluminum alloy; the billet in the globular structure or non-dendritic structure and in the semi-solid condition having the ability to be formed into the shaped aluminum article.Type: GrantFiled: September 2, 1997Date of Patent: October 19, 1999Assignee: Northwest AluminumInventor: S. Craig Bergsma
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Patent number: 5916390Abstract: The invention relates to a cylinder liner sealed into a reciprocating piston engine comprising a supereutectic aluminum/silicon alloy which is free of mixed-in particles of hard material and which is composed in such a way that fine silicon primary crystals and intermetallic particles automatically form from the melt as hard particles. A blank is allowed to grow from finely sprayed melt droplets by spray compaction, with a fine distribution of hard particles being produced by setting the spray for small melt droplets. The blank can then be formed by cold extrusion to create a shape approximating the cylinder lining. After premachining, the surface is fine machined, honed in at least one stage and then the hard particles lying at the surface are mechanically exposed, is forming plateau areas of hard particles which project above the remaining surface of the base microstructure of the alloy.Type: GrantFiled: November 10, 1997Date of Patent: June 29, 1999Assignee: Mercedes-Benz AGInventors: Franz Ruckert, Peter Stocker, Roland Biedermann
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Patent number: 5900210Abstract: A high-strength and high-ductility aluminum-base alloy consisting of a composition of general formula: Al.sub.ba1 Mn.sub.a Si.sub.b or Al.sub.ba1 Mn.sub.a Si.sub.b TM.sub.c (wherein TM is one or more elements selected from the group consisting of Ti, V, Cr, Fe, Co, Ni, Cu, Y, Zr, La, Ce and Mm; and a, b and c are, in atomic percentages, 2.ltoreq.a.ltoreq.8, 0.5.ltoreq.b.ltoreq.6, 0<c.ltoreq.4, and a.gtoreq.b), wherein the alloy contains quasi-crystals. The an aluminum-base alloy have superior mechanical properties such as high hardness, high strength and high ductility.Type: GrantFiled: March 7, 1997Date of Patent: May 4, 1999Assignee: YKK CorporationInventors: Erik Buchler, Kazuhiko Kita
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Patent number: 5888661Abstract: A composite structure including a substrate and a heat protection element on the substrate, wherein the heat protection element includes a quasicrystalline aluminum alloy of one or a number of quasicrystalline phases which are either quasicrystalline phases in the strict sense, or approximating phases, wherein the quasicrystalline phases exhibit a thermal diffusivity, measured at ambient temperature, lower than 2.5.times.10.sup.-6 m.sup.2 /s, and a thermal diffusivity measured in the temperature range 650.degree.-750.degree. C. which does not exceed the thermal diffusivity measured at ambient temperature by more than a factor of 3, and wherein the quasicrystalline aluminum alloy comprises Al.sub.a Pd.sub.b Mn.sub.c X.sub.d Y.sub.e T.sub.f I.sub.Type: GrantFiled: April 1, 1997Date of Patent: March 30, 1999Assignee: Centre National de la Recherche ScientifiqueInventors: Jean-Marie Dubois, Pierre Archambault, Bernard Colleret
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Patent number: 5879478Abstract: The invention relates to an aluminum alloy for thixoforming with the composition (by weight): Si: 5%-7.2% Cu: 1%-5% Mg<1% Zn<3% Fe<1.5% other elements<1% each and<3% in total, with % Si<7.5-% Cu/3, which, when reheated to the semisolid state to the point at which a liquid fraction ratio between 35 and 55% is obtained, has an absence of non-remelted polyhedral silicon crystals.Type: GrantFiled: February 26, 1997Date of Patent: March 9, 1999Assignee: Aluminium PechineyInventors: Willem Loue, Michel Garat
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Patent number: 5865914Abstract: There is claimed a lower wing structure for a commercial jet aircraft which includes a substantially unrecrystallized rolled plate member made from an aluminum alloy consisting essentially of about 3.6 to 4.0 wt. % copper, about 1.0 to 1.6 wt. % magnesium, about 0.3 to 0.7 wt. % manganese, about 0.05 to 0.25 wt. % zirconium, the balance aluminum and incidental elements and impurities. On a preferred basis, the alloy products of this invention include very low levels of both iron and silicon, typically on the order of less than 0.1 wt. % each, and more preferably about 0.05 wt. % or less iron and about 0.03 wt. % or less silicon. This alloy composition may be rolled to form lower wing skin plates and extruded or rolled to form wing box stringers therefrom.Type: GrantFiled: August 11, 1997Date of Patent: February 2, 1999Assignee: Aluminum Company of AmericaInventors: Lynette M. Karabin, John Liu, Allison S. Warren, Gary H. Bray
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Patent number: 5865911Abstract: Rolled plate products up to 6 inches thick or more and other products in an aluminum alloy consisting essentially of about 5.2 to 6.8% zinc, 1.7 to 2.4% copper, 1.6 to 2% magnesium, 0.03 to 0.3% zirconium, balance substantially aluminum and incidental elements and impurities, are useful in making structural members for commercial airplanes especially by machining or shaping such members from the plate. Such members include lower wing skins and wing spars and other members. The plate is made by operations comprising homogenization, hot rolling, solution heat treatment, stretching and artificial aging. Alternatively, the plate is shaped after stretching, which may include machining, and is then artificially aged.Type: GrantFiled: May 26, 1995Date of Patent: February 2, 1999Assignee: Aluminum Company of AmericaInventors: Shelly M. Miyasato, Gary H. Bray, John Liu, James T. Staley
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Patent number: 5851317Abstract: A composite material comprises an aluminum or aluminum alloy matrix having generally spherical, atomized quasicrystalline aluminum-transition metal alloy reinforcement particles disposed in the matrix to improve mechanical properties. A composite article can be made by consolidating generally spherical, atomized quaiscrystalline aluminum-transition metal alloy particles and aluminum or aluminum alloy particles to form a body that is cold and/or hot reduced to form composite products, such as composite plate or sheet, with interfacial bonding between the quasicrystalline particles and the aluminum or aluminum alloy matrix without damage (e.g. cracking or shape change) of the reinforcement particles. The cold and/or hot worked compositehibits substantially improved yield strength, tensile strength, Young's modulus (stiffness).Type: GrantFiled: January 31, 1997Date of Patent: December 22, 1998Assignee: Iowa State University Research Foundation, Inc.Inventors: Suleyman B. Biner, Daniel J. Sordelet, Barbara K. Lograsso, Iver E. Anderson
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Patent number: 5837388Abstract: The present invention relates to an Al alloy solder material comprising a composition containing Si in an amount of more than 7.0 to 12.0% or less by weight, Cu in an amount of more than 0.4 to 8.0% or less by weight, Zn in an amount of more than 0.5 to 6.0% or less by weight, Mn in an amount of more than 0.05 to 1.2% or less by weight and Fe in an amount of more than 0.05 to 0.5% or less by weight, or at need, further one or both of In and Sn respectively in an amount of 0.3% or less by weight, with the remainder being Al and inevitable impurities. A brazing sheet clad with the solder material and used for various members of the heat exchanger enables satisfactory brazing at a temperature as low as 570.degree. to 580.degree. C. and is excellent in corrosion resistance. Since the brazing sheet is brazed at a low temperature, a high-strength material having a low melting point is used for a core material of a fin, a tube or the like.Type: GrantFiled: August 5, 1996Date of Patent: November 17, 1998Assignee: The Furukawa Electric Co., Ltd.Inventors: Takeyoshi Doko, Koji Okada
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Patent number: 5779824Abstract: An aluminum alloy support for a planographic printing plate is disclosed, which is an aluminum alloy plate comprising 0<Fe.ltoreq.0.20 wt %, 0.ltoreq.Si.ltoreq.0.13 wt %, Al.gtoreq.99.7 wt % and the balance of inevitable impurity elements, wherein the number of intermetallic compounds present in the arbitrary thickness direction with in 10 .mu.m from the plate surface is from 100 to 3,000 per mm.sup.2 and the intermetallic compound has an average particle size of from 0.5 to 8 .mu.m, with the intermetallic compounds having a particle size of 10 .mu.m or more being in a proportion by number of 2% or less. Also disclosed is a method for producing the above-described aluminum alloy support.Type: GrantFiled: July 20, 1995Date of Patent: July 14, 1998Assignee: Fuji Photo Film Co., Ltd.Inventors: Hirokazu Sawada, Hirokazu Sakaki, Tsutomu Kakei, Akio Uesugi, Masaya Matsuki
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Patent number: 5714018Abstract: A high-strength and high-toughness aluminum-based alloy having a composition represented by the general formula: Al.sub.a Ni.sub.b X.sub.c M.sub.d Q.sub.e, wherein X is at least one element selected from the group consisting of La, Ce, Mm, Ti and Zr; M is at least one element selected from the group consisting of V, Cr, Mn, Fe, Co, Y, Nb, Mo, Hf, Ta and W; Q is at least one element selected from the group consisting of Mg, Si, Cu and Zn; and a, b, c, d and e are, in atomic percentage, 83.ltoreq.a.ltoreq.94,3, 5.ltoreq.b.ltoreq.10, 0.5.ltoreq.c.ltoreq.3, 0.1.ltoreq.d.ltoreq.2, and 0.1.ltoreq.e.ltoreq.2. The aluminum-based alloy has a high strength and an excellent toughness and can maintain the excellent characteristics provided by a quench solidification process even when subjected to thermal influence at the time of working. In addition, it can provide an alloy material having a high specific strength by virtue of minimized amounts of elements having a high specific gravity to be added to the alloy.Type: GrantFiled: October 27, 1992Date of Patent: February 3, 1998Assignee: YKK CorporationInventors: Kazuhiko Kita, Hidenobu Nagahama, Takeshi Terabayashi, Makoto Kawanishi
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Patent number: 5667600Abstract: Disclosed is a practical aluminum-based alloy containing 1 to 99 weight percent beryllium and improved methods for the investment casting of net shape aluminum-beryllium alloy parts.Type: GrantFiled: March 31, 1994Date of Patent: September 16, 1997Assignee: Brush Wellman, Inc.Inventors: Fritz C. Grensing, James M. Marder, Jere H. Brophy