With Electro-deposition Patents (Class 156/150)
  • Patent number: 11367653
    Abstract: Exemplary methods of producing a semiconductor substrate may include characterizing a substrate pattern to identify a zonal distribution of a plurality of vias and a height and a radius of each via of the plurality of vias. The methods may include determining a fill rate for each via within the zonal distribution of the plurality of vias. The methods may include modifying a die pattern to adjust via fill rates between two zones of vias. The methods may also include producing a substrate according to the die pattern.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: June 21, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Paul McHugh, Kwan Wook Roh, Gregory J. Wilson
  • Patent number: 11359298
    Abstract: A titanium foil or a titanium sheet is produced by electrodeposition from molten salt using constant current pulse, the method comprising: forming an electrodeposited titanium film on a surface of a cathode electrode made of glassy carbon, graphite, Mo, and Ni, and separating thereafter the electrodeposited titanium film from the cathode electrode by performing one or both of applying an external force to the electrodeposited titanium film and removing the cathode electrode. This enables the electrodeposited titanium film electrodeposited on the cathode electrode to be peeled from the cathode electrode simply and at low cost.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: June 14, 2022
    Assignees: KYOTO UNIVERSITY, NIPPON STEEL CORPORATION
    Inventors: Tetsuya Uda, Kouhei Funatsu, Akihiro Kishimoto, Kenichi Mori, Hideki Fujii
  • Patent number: 11350520
    Abstract: A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: May 31, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Günther Mayr
  • Patent number: 11177590
    Abstract: Embodiments of the present disclosure provide an apparatus comprising a printed circuit board (PCB) with a connector to electrically connect the PCB with another apparatus. In embodiments, the apparatus may include a PCB having a via that begins on a first surface of the PCB and ends inside the PCB. The apparatus may further include a connector to electrically connect the PCB with another apparatus or another portion of the apparatus. The connector may include a pin to provide connectivity between the PCB and the connector. The pin may be inserted into the via in response to an attachment of the connector to the PCB. The PCB may include a space that extends from an end of the via inside the PCB to a second surface of the PCB opposite the first surface, to accommodate layers for signal routing inside the PCB. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: November 16, 2021
    Assignee: Intel Corporation
    Inventors: Yongcai Zhou, Lu She
  • Patent number: 11136440
    Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.10 mm2 of the vinylidene fluoride resin film.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: October 5, 2021
    Assignee: KUREHA CORPORATION
    Inventors: Nobufumi Sato, Kazuyuki Kanno, Yusuke Sato, Keiko Aita, Hisaaki Terashima
  • Patent number: 11063333
    Abstract: An electromagnetic wave transmission board includes a composite board and a plated metal layer. The composite board has a plurality of inner walls surroundingly defining an elongated channel in an interior of the composite board. The plated metal layer is formed on at least part of the inner walls so as to jointly form an inner channel structure in the channel. The inner channel structure surroundingly defines a predetermined space filled with air, and the inner channel structure has two entrances in air communication with the predetermined space. The predetermined space of the inner channel structure is configured to receive and output an electromagnetic wave signal through the two entrances, respectively, and the electromagnetic wave transmission board is configured to transmit the electromagnetic wave signal by using the air in the predetermined space of the inner channel structure as a conductive medium.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: July 13, 2021
    Assignee: BOARDTEK ELECTRONICS CORPORATION
    Inventors: Wen-Feng Cheng, Chien-Cheng Lee
  • Patent number: 10980130
    Abstract: A method for producing a metal foil comprising depositing metal onto an oxidizable substrate to form a metal film on the substrate; oxidizing the substrate at an interface between the metal film and the substrate; and removing the metal film from the substrate to yield a metal foil. A method for forming a thin metal film comprising pre-polarizing a single-crystal Si substrate by application of a potential which is negative of a potential at which Si oxidizes, which pre-polarization occurs in the presence of metal ions to form metal growth nucleation sites on the substrate, followed by application of a potential at which both oxidation of Si and electrodeposition of the metal occur to grow the metal film and oxidize the Si to SiOx, which potential is more positive than the potential applied in the pre-polarization step.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: April 13, 2021
    Assignee: THE CURATORS OF THE UNIVERSITY OF MISSOURI
    Inventor: Jay A. Switzer
  • Patent number: 10868348
    Abstract: A passive radiofrequency device includes a core formed by the gluing of multiple parts in direct contact against one another. At least one of the parts includes a housing for glue. At least some of the parts are manufactured individually by additive manufacturing. A conductive metal jacket surrounds the core without separating the parts from one another.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: December 15, 2020
    Assignee: SWISSTO12 SA
    Inventors: Mathieu Billod, Mirko Favre, Emile de Rijk
  • Patent number: 10856376
    Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: December 1, 2020
    Assignee: Lumileds LLC
    Inventors: Zhihua Song, Wouter Soer, Ron Bonne, Yifeng Qiu
  • Patent number: 10813182
    Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 20, 2020
    Assignee: Lumileds LLC
    Inventors: Zhihua Song, Wouter Soer, Ron Bonne, Yifeng Qiu
  • Patent number: 10772191
    Abstract: A printed circuit board includes a substrate having a top surface and a bottom surface. First non-ground nets and a ground net are disposed within a specific region on the top surface. A second non-ground net and a split ground net are disposed on the bottom surface. The second non-ground net is electrically connected to one of the first non-ground nets through a first via hole in the substrate. The second non-ground net is isolated from the split ground net by a gap. An outermost insulating layer on the bottom surface of the substrate covers the second non-ground net and the split ground net. A conductive layer is disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the first non-ground nets.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: September 8, 2020
    Assignee: MediaTek Inc.
    Inventor: Nan-Jang Chen
  • Patent number: 10693142
    Abstract: A manufacturing method for an aluminum nonwoven fiber material includes: a block forming procedure where molten aluminum is extruded into a space through micropores (42a) and, moreover, aluminum fibers formed by extrusion are maked fall on a predetermined support surface (43), thereby forming an aluminum fiber block on the support surface (43); a short fiber removing procedure in which removing treatment on aluminum short fibers shorter than a predetermined length from the aluminum fiber block is performed; and a pressurization procedure in which the aluminum fiber block subjected to the short fiber removing procedure is pressurized to form the aluminum nonwoven fiber material.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: June 23, 2020
    Assignee: I & T New Materials Co., Ltd.
    Inventor: Shunji Hasuo
  • Patent number: 10684178
    Abstract: Exemplary embodiments provide a system and method for measuring the temperature of an object, but without requiring a direct measurement of the object to determine the point at which the object has reached a desired temperature. The exemplary embodiments provide a process where the object can be heated or cooled to a desired temperature without the requirements of temperature probes into the object. The exemplary embodiments allow the process operator to be informed when the heating process has completed, without regard to the size, shape, weight, density, or amount of materials to be prepared. The energy required to maintain the temperature of a medium is compared to the energy required to maintain the temperature once an object has been placed within the medium.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: June 16, 2020
    Assignee: Connectivity Systems Incorporated
    Inventor: John Rankin
  • Patent number: 10651525
    Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: May 12, 2020
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Mathew Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov, Henning Braunisch, Feras Eid, Javier Soto
  • Patent number: 10638616
    Abstract: A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jiun-Yi Wu, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 10433370
    Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: October 1, 2019
    Assignee: Point Engineering Co., Ltd.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 10368445
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: July 30, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin
  • Patent number: 10364823
    Abstract: A fan blade of a gas turbine engine is disclosed which is composed of an airfoil having a leading edge and a trailing edge, and a root with a platform and a blade fixing for engaging a fan hub. The fan blade is composed of a core substrate selected from the group consisting of composites and polymers, and an entirety of the airfoil and the root of the fan blade has a nanocrystalline metal outer layer thereon which forms an outer surface fully enveloping the fan blade. The nanocrystalline metal layer formed of a nanocrystalline metal coating has an average grain size of between 10 nm and 500 nm, and the nanocrystalline metal outer layer forms a structural element of the fan blade.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: July 30, 2019
    Assignee: PRATT & WHITNEY CANADA CORP.
    Inventors: George Guglielmin, Joe Lanzino, Enzo Macchia, Barry Barnett, Andreas Eleftheriou, Thomas McDonough
  • Patent number: 10355241
    Abstract: A method of manufacturing a display apparatus includes forming a plurality of display units including bending areas on a mother substrate. Each of the plurality of display units include a bending area configured to be bent about a bending axis. A protection film is attached to a lower surface of the mother substrate. The protection film includes a protection film base and an adhesive layer. An opening or a groove is formed corresponding to the bending area of each of the plurality of display units by removing at least a portion of the protection film. The mother substrate and the protection film are cut to separate the plurality of display units from each other. The mother substrate is bent about the bending axis. The removing of the at least a portion of the protection film is performed by a laser beam.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jooseob Ahn, Seongchae Jeong, Inae Han, Hyojin Kim, Jekil Ryu, Jaeseok Park, Gyoowan Han
  • Patent number: 10306778
    Abstract: A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 28, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-Ean Lee, Jee-Soo Mok, Young-Gwan Ko, Soon-Oh Jung, Kyung-Hwan Ko, Yong-Ho Baek
  • Patent number: 10299375
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 21, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10283778
    Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 mum or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 mum.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: May 7, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Dae-Young Kim, Byoung-Kwang Lee, Seung-Jun Choi
  • Patent number: 10254902
    Abstract: A touch sensor device includes first touch electrodes and second touch electrodes disposed on a substrate, and a polymer layer including a polymer material disposed on the first and second touch electrodes and on a substantially entire area of the substrate, in which the polymer layer includes conductive and non-conductive regions.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: April 9, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Byeong-Jin Lee, Sung Ku Kang, Jung-Yun Kim, Joo-Han Bae, Dong Eun Lee, In Nam Lee
  • Patent number: 10234630
    Abstract: Embodiments described herein generally relate to a wave guide and a method of creating a wave guide. In one embodiment, a method of forming a wave guide is disclosed herein. An inverse master substrate having a plurality of projections extending therefrom is formed. A high refractive index material is formed on a top surface of the inverse master substrate. A glass layer is positioned on a top surface of the high refractive index material. The inverse master substrate is removed from the high refractive index material.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 19, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rutger Meyer Timmerman Thijssen, Steven Verhaverbeke, Joseph R. Johnson
  • Patent number: 10218075
    Abstract: An example method may involve forming, in a first metal layer, a first half of waveguide channels including an input waveguide channel, a plurality of wave-dividing channels, and a plurality of wave-radiating channels. The input waveguide channel may include an input port for receiving electromagnetic waves into the waveguide channels, and the first half of the plurality of wave-radiating channels may include wave-directing members configured to propagate sub-portions of waves from the first metal layer to another metal layer. The method may also involve forming, in a second metal layer, a second half of the waveguide channels. The second half of the wave-radiating channels may include pairs of output ports configured to radiate the sub-portions of waves out of the second metal layer. The method may further involve fastening the first metal layer to the second metal layer so as to substantially align the halves of the waveguide channels.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: February 26, 2019
    Assignee: Waymo LLC
    Inventor: Russell Leigh Smith
  • Patent number: 10197708
    Abstract: Methods of manufacturing a structure having at least one plated region and at least one unplated region. The method includes plating a metal on a polymer structure having a first region accepting the metal and a second region unreceptive to the metal plating. The first region may include fully-cured polymer optical waveguides and the second region may include partially-cured polymer optical waveguides. The first region may include a first polymer composition and the second region may include a second polymer composition different than the first polymer composition.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: February 5, 2019
    Assignee: HRL Laboratories, LLC
    Inventors: Jacob M. Hundley, Zak C. Eckel, Sophia S. Yang, Alan J. Jacobsen, William Carter
  • Patent number: 10193235
    Abstract: The radar system include a plurality of radiating elements arranged in a linear array configured to radiate electromagnetic energy. The radar system also includes a waveguide configured to guide electromagnetic energy between (i) each of the plurality of radiating elements and (ii) a waveguide feed. The radiating elements are coupled to a first side of the waveguide. The radar system additionally includes a waveguide feed configured to couple the electromagnetic energy between the waveguide and a component external to the waveguide. The waveguide feed is coupled to the second side of the waveguide at a position between two of the radiating elements. Further, the radar system includes a power dividing network defined by the waveguide and configured to divide the electromagnetic energy injected by the waveguide feed based on a taper profile.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: January 29, 2019
    Assignee: Waymo LLC
    Inventors: Jamal Izadian, Russell Smith
  • Patent number: 10131754
    Abstract: A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: November 20, 2018
    Assignees: Lawrence Livermore National Security, LLC, General Atomics
    Inventors: Michael Stadermann, Salmaan H. Baxamusa, William C. Floyd, III, Philip E. Miller, Tayyab I. Suratwala, Anatolios A. Tambazidis, Kelly Patricia Youngblood, Chantel Aracne-Ruddle, Art J. Nelson, Maverick Chea, Shuali Li
  • Patent number: 10099462
    Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: October 16, 2018
    Assignee: Toray Plastics (America), Inc.
    Inventor: Jan Moritz
  • Patent number: 10087632
    Abstract: The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: October 2, 2018
    Assignee: Newtonoid Technologies, L.L.C.
    Inventors: Fielding B. Staton, David Strumpf
  • Patent number: 10066490
    Abstract: A fan rotor blade includes a blade body made from a composite material of a resin and fibers, and having a pressure surface and a suction surface. A dovetail capable of being fitted into a fitting groove in a fan disk is provided in a base end of the blade body. The blade body is provided with a sheath. The sheath is more rigid than the blade body and is fixed to the blade body in a state where the sheath covers a leading edge portion of the blade body and the vicinity thereof. The sheath extends in the longitudinal direction of the blade body from a blade root side to a tip end side of the blade body, and a base end portion of the sheath located on the blade root side of the blade body extends to the dovetail.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: September 4, 2018
    Assignee: IHI Corporation
    Inventors: Hiroyuki Yagi, Hiroshi Kuroki, Kenro Obuchi
  • Patent number: 10038315
    Abstract: Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: July 31, 2018
    Assignees: Sumitomo Wiring Systems, Ltd., AutoNetworks Technologies, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Tatsuya Sumida
  • Patent number: 10017133
    Abstract: An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: July 10, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Mitsunori Tsunoda, Gaku Ito, Tomoaki Sasaki, Shuji Kimura, Taku Furuta, Shoichi Nomura
  • Patent number: 10020126
    Abstract: A three-dimensional network aluminum porous body which enables to produce an electrode continuously, an electrode using the aluminum porous body, and a method for producing the electrode is disclosed. A long sheet-shaped three-dimensional network aluminum porous body is provided to be used as a base material in a method for producing an electrode including at least winding off, a thickness adjustment step, a lead welding step, an active material filling step, a drying step, a compressing step, a cutting step and winding-up, wherein the three-dimensional network aluminum porous body has a tensile strength of 0.2 MPa or more and 5 MPa or less.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: July 10, 2018
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC TOYAMA CO., LTD.
    Inventors: Akihisa Hosoe, Kazuki Okuno, Hajime Ota, Koutarou Kimura, Kengo Goto, Junichi Nishimura, Hideaki Sakaida
  • Patent number: 10012238
    Abstract: A fan blade capable of dissipating a buildup of electrostatic charge configured for operation within the fan assembly of a gas turbine engine. The fan blade has a fan blade body covered in a static dissipative coating. A conductive ground tab is attached to the front face of an airfoil root of the fan blade. Connected to the ground tab, a conductive flow path travels up the neck portion of the airfoil and along a lower portion of the fan blade. As static charge builds up on the fan blade, the electrostatic charge migrates down the fan blade and into the conductive flow path. Traveling along the conductive flow path the buildup of electrostatic charge accumulates on the conductive ground tab and exits the fan blade through contact with a disc rotor covering touching the conductive ground tab.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: July 3, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas J. Robertson, James O. Hansen, Mark Quinn
  • Patent number: 9957821
    Abstract: An airfoil for a gas turbine engine includes first pressure and suction side layers forming a cavity and terminating in ends near a trailing edge. The first and second suction side layers are constructed from a composite material. A bridge is wrapped about the ends.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: May 1, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Shelton O. Duelm, Michael G. McCaffrey
  • Patent number: 9903211
    Abstract: The present application relates to a blade of a rectifier of a low pressure compressor of an axial turbomachine. The blade can also be a rotor and/or turbine blade. The blade includes a composite material with a matrix and a reinforcement comprising a mesh with rods. The rods of the reinforcement are connected to each other and are distributed throughout the volume between the pressure side surface and the suction side surface of the blade. The mesh forms a three-dimensional structure extending over the majority of the thickness of the blade between the pressure side surface and the suction side surface and/or the majority of the length of the blade between the leading edge and the trailing edge. The present application also relates to an iterative method for manufacturing a blade composite where the reinforcement is formed by additive layer manufacturing based on titanium powder and then placed in an injection mold.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: February 27, 2018
    Assignee: SAFRAN AERO BOOSTERS SA
    Inventor: Rafael Perez
  • Patent number: 9907178
    Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: February 27, 2018
    Assignee: Sunasic Technologies, Inc.
    Inventor: Chi-Chou Lin
  • Patent number: 9895706
    Abstract: Systems and methods in which the flow of fluid is electrically driven, including electrospinning and electrospraying systems and methods, are generally described.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: February 20, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Luis Fernando Velásquez-García, Philip James Ponce De Leon, Frances Ann Hill
  • Patent number: 9900978
    Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: February 20, 2018
    Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder PCB Development Co., Ltd., Chongqing Founder Hi-Tech Electronic Inc.
    Inventors: Xinhong Su, George Dudnikov, Jr., Shuhan Shi
  • Patent number: 9892935
    Abstract: An electronic package includes a carrier, semiconductor chip, a lid, and a lid-ring. The carrier includes a top surface and a bottom surface configured to be electrically connected to a system board. The semiconductor chip is electrically connected to the top surface. The lid is attached to the top surface enclosing semiconductor chip and includes a perimeter recess. The lid-ring is juxtaposed within the perimeter recess. The lid-ring exerts a reverse bending moment upon the lid to limit warpage of the electronic package.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: February 13, 2018
    Assignee: International Business Machines Corporation
    Inventor: Shidong Li
  • Patent number: 9849650
    Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: December 26, 2017
    Assignee: Apple Inc.
    Inventors: Douglas Weber, Christopher Prest, David Pakula, Stephen Paul Zadesky
  • Patent number: 9830031
    Abstract: A touch screen panel includes a substrate, touch electrodes disposed on a touch area of the substrate and configured to sense a touch, and a connection line disposed on the touch area, the connection line including a first end connected a touch electrode of the touch electrodes and a second end connected to a pad, the pad including a first conductive layer disposed on the substrate, a second conductive layer disposed on the first conductive layer, and a first protective conductive layer disposed on the second conductive layer, in which the touch electrode includes the first conductive layer, and the first protective conductive layer.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: November 28, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae Neung Kim, Jong Hyun Choi, Jeong-Hwan Kim, Won Baek Lee, Ki-Hyun Cho, Kyung Seop Kim, Cheol Kyu Kim, Sung Kyun Park, Sun Haeng Cho
  • Patent number: 9816381
    Abstract: The present application relates to a blade of low pressure rectifier axial turbomachine. The blade can also be a rotor blade and/or a turbine blade. The blade includes a composite material with a matrix and a reinforcement that includes a mesh forming a three dimensional structure with a plurality of rods that describe a three-dimensional mesh based on polyhedrons. The three-dimensional structure extends over the majority of the thickness of the blade between the pressure side surface and the suction side surface and/or the majority of the length of the blade between the leading edge and the trailing edge. The rods of the reinforcement are bonded to each other and are distributed throughout the volume between the pressure side surface and the suction side surface of the blade. The rods form a three-dimensional mesh occupying the entire blade. The present application also relates to an iterative method for manufacturing a blade by additional layer manufacturing.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: November 14, 2017
    Assignee: SAFRAN AERO BOOSTERS SA
    Inventor: Jean-François Cortequisse
  • Patent number: 9753348
    Abstract: Multi-layer devices comprising a layer of an electrochromic lithium nickel oxide composition on a first substrate, the lithium nickel oxide composition comprising lithium, nickel and a Group 5 metal selected from niobium, tantalum and a combination thereof.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: September 5, 2017
    Assignee: Kinestral Technologies, Inc.
    Inventors: Hye Jin Choi, Mark Bailey, John David Bass, Stephen Winthrop von Kugelgen, Eric Lachman, Howard W. Turner
  • Patent number: 9745851
    Abstract: A composite blade includes a composite airfoil section having airfoil pressure and suction sides extending chordwise between airfoil leading and trailing edges, a dovetail root attached to airfoil section and a blade shank therebetween, and a metallic leading edge shield covering an axially extending portion of airfoil section including at least a portion of airfoil leading edge and a radially and chordwise extending portion of a leading edge portion of the blade shank. Leading edge portion may be cut back from airfoil leading edge and a shank leading edge aft or downstream of airfoil leading edge. A nose may extend along a shield leading edge of the metallic leading edge shield with pressure and suction side legs extending aftwardly from nose along airfoil pressure and suction sides. Light weight insert may be located between nose and airfoil leading edges.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: August 29, 2017
    Assignee: General Electric Company
    Inventors: Qiang Li, Nicholas Joseph Kray
  • Patent number: 9698124
    Abstract: An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to locations of the components forms a first solid stack containing cavities accommodating the components and associated wires. In one embodiment the layers are fiberglass layers and the layers are cured in the presence of a resin to form a solid body. In another embodiment the layers are thermoplastic layers.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: July 4, 2017
    Assignee: Microsemi Semiconductor Limited
    Inventors: Piers Tremlett, Richard Birch
  • Patent number: 9680194
    Abstract: Orthomode transducers (OMTs) and methods of fabricating OMTs are disclosed. According to disclosed embodiments, an OMT includes a housing defining an internal waveguide. The housing may be composed of a first cast housing member attached to a second cast housing member. The first housing member may include a first side of the waveguide that is cast into the first housing member. The second housing member may include a second side of the waveguide that is cast into the second housing member. A method of fabricating an OMT may include arranging at least one casting insert in at least one mold, casting the housing in the mold and casting a waveguide in the housing using the at least one casting insert. The disclosed devices and methods provide cost effective solutions for fabricating OMTs of various operating frequencies that share a substantially similar outer housing shape and size.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: June 13, 2017
    Assignee: Alcatel-Lucent Shanghai Bell Co., Ltd
    Inventors: Yin-Shing Chong, Peter Casey, Yunchi Zhang
  • Patent number: 9674969
    Abstract: A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 6, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang-Jae Lee, Tae-Ho Ko, Jun-Ho Kang
  • Patent number: 9639189
    Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: May 2, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroshi Yamazaki, Yoshimi Igarashi