Abstract: Orthomode transducers (OMTs) and methods of fabricating OMTs are disclosed. According to disclosed embodiments, an OMT includes a housing defining an internal waveguide. The housing may be composed of a first cast housing member attached to a second cast housing member. The first housing member may include a first side of the waveguide that is cast into the first housing member. The second housing member may include a second side of the waveguide that is cast into the second housing member. A method of fabricating an OMT may include arranging at least one casting insert in at least one mold, casting the housing in the mold and casting a waveguide in the housing using the at least one casting insert. The disclosed devices and methods provide cost effective solutions for fabricating OMTs of various operating frequencies that share a substantially similar outer housing shape and size.

Abstract: A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Abstract: In one aspect, touch screens are described herein. In some implementations, a touch screen comprises an electrically conductive layer and one or more electrodes electrically connected to the electrically conductive layer, wherein the electrically conductive layer comprises a graphene layer. In some implementations, the electrically conductive layer comprises an electrically conductive coating disposed on an electrically insulating substrate.

Abstract: A reinforced porous metal foil is provided including a porous portion comprising a two-dimensional network structure composed of a metal fiber and a reinforced portion which is substantially non-porous or less porous than the porous portion. The reinforced portion is composed of the same metal the metal fiber and is continuous and integral with the porous portion. Accordingly, it possible to provide a porous metal foil having superior properties at a low cost in a highly productive manner that is also suitable for continuous production.

Abstract: An example method may involve forming, in a first metal layer, a first half of waveguide channels including an input waveguide channel, a plurality of wave-dividing channels, and a plurality of wave-radiating channels. The input waveguide channel may include an input port for receiving electromagnetic waves into the waveguide channels, and the first half of the plurality of wave-radiating channels may include wave-directing members configured to propagate sub-portions of waves from the first metal layer to another metal layer. The method may also involve forming, in a second metal layer, a second half of the waveguide channels. The second half of the wave-radiating channels may include pairs of output ports configured to radiate the sub-portions of waves out of the second metal layer. The method may further involve fastening the first metal layer to the second metal layer so as to substantially align the halves of the waveguide channels.

Abstract: An optical element molding die is designed for molding an optical element having a concave-convex structure. The optical element can be manufactured by a wet system that enables element formation over a large area and a curved surface, without using a lithographic process, and is advantageous in terms of mass production and equipment cost. The optical element molding die includes a substrate having a surface with a negative standard electrode potential in the oxidation reaction and an anodic oxidation layer provided on the substrate. A protective layer with the positive standard electrode potential is provided between the substrate and the anodic oxidation layer.

Abstract: A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract: A method of manufacturing a wiring substrate includes: preparing a laminated plate of a metal layer and an insulating layer; adhering the laminated plate to a first support body facing the metal layer; and forming a first wiring layer with vias extending through the insulating layer and first pads exposed from a first surface of the insulating layer. The method also includes: separating a multilayer structure including the metal, insulating, and first wiring layer from the first support body; adhering the multilayer structure to a second support body facing the first wiring layer; removing the metal layer; forming a plurality of second wiring layers including second pads connected to the vias and exposed from a second surface of the insulating layer opposite the first surface; and separating the insulating, the first wiring, and the plurality of second wiring layers from the second support body, to obtain the wiring substrate.

Abstract: A joint assembly is provided. The joint assembly includes a first component including a first bond surface and a second component including a second bond surface coupled to the first bond surface such that a bond line is defined therebetween. At least one of the first and second components includes a plurality of contrast particles that diffuse across the bond line when a predetermined amount of heat and pressure are applied to the first and second components.

Abstract: A three-dimensional network aluminum porous body which enables to produce an electrode continuously, an electrode using the aluminum porous body, and a method for producing the electrode. A long sheet-shaped three-dimensional network aluminum porous body is provided to be used as a base material in a method for producing an electrode including at least winding off, a thickness adjustment step, a lead welding step, an active material filling step, a drying step, a compressing step, a cutting step and winding-up, wherein the three-dimensional network aluminum porous body has a tensile strength of 0.2 MPa or more and 5 MPa or less.

Abstract: A method of fabricating a plurality of metallic microstructures by LIGA process, the method including a flattening step or a levelling step of the resin layer before the step of electroforming the metallic microstructures permitting the resin layer to have a uniform thickness, which enables molds, and then finished metallic microstructures, to be made with uniform dimensional precision in the plane for the metallic microstructures of the same substrate.

Abstract: Imprinting tools that include a female master tool and a male working tool are used to create three-dimensional circuits. The female tool is used to create multiple male tools that are metallized and pressed into a substrate transferring the metallization to the substrate. Metallization on prominences of the male tool can be selectively removed to create vias, blind vias, vertical traces and other selectively non-metallized regions for interconnect circuitry. The process is used to create circuitry that includes narrow, high aspect ratio traces having reduced parasitic capacitance to adjacent circuit features.

Abstract: A gas turbine engine airfoil includes leading and trailing edges, pressure and suction sides extending from airfoil base to airfoil tip, trailing edge cladding made of cladding material bonded to composite core made of composite material, cladding material less brittle than composite material, composite core including central core portion extending downstream from leading edge portion to trailing edge portion of composite core, and trailing edge cladding including wavy wall and trailing edge. Pressure and suction side flanks of trailing edge cladding may be bonded to pressure and suction side surfaces of trailing edge portion. Waves of wavy wall may extend normal to and away from the pressure and suction side surfaces. Trailing edge cladding may include wavy pressure and suction side trailing edge guards including waves of wavy wall. Airfoil may extend outwardly from platform of a blade. Root may include integral dovetail.

Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.

Abstract: An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

Abstract: A cytokine adsorption sheet comprises a nanofiber web formed by electrospinning a spinning solution prepared by mixing an adsorbent material capable of adsorbing cytokine and an electrospinnable polymer material. Thus, the dissolution of the adsorbent material by blood can be prevented.

Abstract: Provided are a current collector for a battery, including: a base material; adhesive layers positioned on the base material; and metal mesh layers positioned on the adhesive layers, in which the metal mesh layer includes a plurality of metal mesh patterns, and holes positioned between the metal mesh patterns, and a method of manufacturing the same. An active material is applied onto the metal mesh layer through the holes of the metal mesh layer, and thus a contact area of the metal mesh layer and the active material is increased, so that it is possible to restrict the active material from being deintercalated from the current collector and improve a cycle lifespan property of a battery.

Abstract: Medical devices and methods for making and using medical devices are disclosed. An example medical device may include a catheter shaft. An expandable balloon may be coupled to the catheter shaft. The balloon may be capable of shifting between a folded configuration and an expanded configuration. A plurality of elongate electrode assemblies may be disposed on the balloon. A cover layer may be deposited on the electrode assemblies. Portions of the electrode assemblies may be free of the cover layer.

Abstract: A method of manufacturing a layered material stack that includes a plasmonic interface between a plasmonic material and optical waveguide material is disclosed. The method includes providing a substrate layer, disposing a layer of plasmonic material on the substrate layer, depositing a metal constituent of an optical waveguide material directly onto the layer of plasmonic material, and anodizing the metal constituent of the optical waveguide material to form an optically transparent oxide of the metal constituent configured to couple light into the layer of plasmonic material, with the optically transparent oxide of the metal constituent forming an optical waveguide structure.

Abstract: The present invention provides a cathode (positive electrode) of a lithium battery and a process for producing this cathode. The electrode comprises a cathode active material-coated graphene sheet and the graphene sheet has two opposed parallel surfaces, wherein at least 50% area (preferably >80%) of one of the two surfaces is coated with a cathode active material coating. The graphene material is in an amount of from 0.1% to 99.5% by weight and the cathode active material is in an amount of at least 0.5% by weight (preferably >80% and more preferably >90%), all based on the total weight of the graphene material and the cathode active material combined. The cathode active material is preferably an inorganic material, an organic or polymeric material, a metal oxide/phosphate/sulfide, or a combination thereof. The invention also provides a lithium battery, including a lithium-ion, lithium-metal, or lithium-sulfur battery.

Abstract: The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.

Abstract: A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

Abstract: There is provided a shield part including: a magnetic laminate formed by laminating a plurality of magnetic layers and having a first surface and a second surface; a coil pattern formed on the first surface; and a first lead part formed at an end portion of a central portion of the coil pattern and a second lead part formed outside of the coil pattern, wherein a portion of the second surface is removed to form a recess, the first lead part is electrically connected to the second lead part by a conductive material disposed in the recess and a first via formed in the magnetic laminate in a lamination direction, and the second lead part is electrically connected to the first lead part by the conductive material disposed in the recess and a second via formed in the magnetic laminate in the lamination direction.

Abstract: The present patent application relates to a wafer support arrangement, comprising a wafer (1), a support layer system (5, 6) and a separating layer (4), which is arranged between the support layer system (5, 6) and the wafer (1), wherein the support layer system (5, 6) (i) comprises a support layer (6) and (ii) a layer (5) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers and wherein the separating layer (4) (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system (5, 6) and the separating layer (4), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer (1) and the separating layer (4).

Abstract: A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a second receiving hole. The second receiving hole and the first receiving hole cooperatively form a receiving cavity. The first adhesive sheet includes a supporting surface. The electronic device is received in the receiving cavity, and includes two electrodes. The second adhesive sheet is adjacent to the second wiring layer, and includes a bottom surface. The third wiring layer is formed on the supporting surface and contacts with the two electrodes. The fourth wiring layer is formed on the bottom surface.

Abstract: A method of making a coated polymer-matrix composite (PMC) having high-temperature oxidation protection includes bonding a first surface of a flexible sublayer that is free of water to a first surface of a dry PMC substrate having a first coefficient of thermal expansion. The flexible sublayer includes an electrically conductive material in an effective amount to enable electrical conductivity of the flexible sublayer, and includes a low-modulus-of-elasticity material. The method includes heating the bonded flexible sublayer and the PMC substrate, and bonding a first surface of an oxygen-impervious, dense barrier-coating layer to a second surface of the flexible sublayer to form the coated PMC having high-temperature oxidation protection.

Abstract: Various embodiments herein include utilities for generating embosser drums that are used to pre-format optical media such as optical tape with a pattern of nanostructures such as wobbled grooves. One utility includes generating a plurality of replicas from an embossing master and bonding the replicas together to form a bonded replica structure having a surface with the nanostructure pattern imprinted therein and a surface area that is approximately the same as an outer embossing surface of the embosser drum to be formed. Advantageously, a single, one-piece metallic shim can subsequently be generated, appropriately shaped and welded at a single seam to form the embosser drum outer embossing surface.

Abstract: A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract: A circuit board material includes an electrical resistance material layer having a preselected resistivity adhered to the support layer, and a barrier layer adhered to the electrical resistive layer, and a conductive layer adhered to the barrier layer, wherein the barrier layer is plated on the conductive material such that the resistance of the subsequently applied resistive layer does not vary substantially during exposure to printed circuit board processing chemistries. The process for making the material is directed to adjusting the electro deposition of the barrier layer by using the time for etching the resistive layer of the circuit board material in a standard etching bath.

Abstract: The invention relates to a bicycle component, for example a rim, comprising a body made from aluminium and a body made from composite material coupled with a first surface portion of the body made from aluminium. Such a first surface portion has been subjected to a deoxidation surface treatment. An adhesive substance has been then applied on at least part of said first surface portion for gluing the body made from aluminium to the body made from composite material. A second surface portion of the body made from aluminium has been subjected to an oxidation surface treatment with subsequent fixing of the oxide.

Abstract: An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and patterned following deposition or may be patterned during deposition. A dielectric sheet having patterned metal may be shaped into a desired shape using molding equipment or other equipment that applies heat and pressure to the dielectric sheet and patterned metal. Metal on a dielectric sheet may also be patterned after the dielectric sheet is formed into a desired shape. Metal may be formed on opposing sides of the dielectric sheet.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof.

Abstract: A flexible battery jacket adapted to combine two or more batteries for forming a low profile power-pack assembly. The battery jacket folds about the two or more batteries and connects respective positive and negative terminals of the batteries at one or more contacts of the battery jacket. The contacts are coupled to conductors which communicate the power to a positive and a negative supply terminal, respectively, on a single portion of the battery jacket assembly. In this regard, the flexible battery jacket combines two or more batteries in parallel or series configuration and provides supply terminals on a single substrate surface for easily connecting with an electronic device.

Abstract: This invention discloses a printed circuit board manufacturing method capable of manufacturing circuits with at least two different thicknesses on a same PCB substrate. In the printed circuit board manufacturing method, a circuit trench is formed on a first PCB substrate having a copper clad circuit layer of a smaller thickness and exposed from the bottom of a groove on another side of the copper clad layer, and then a thick copper is filled into the circuit trench by a copper electroplating method, and then a printed circuit board manufacturing flow is adopted to manufacture the printed circuit board having the circuits with at least two different thicknesses on the first PCB substrate, so as to achieve the effect of saving material costs, avoiding a waste of high priced metals, and reducing pollution sources.

Abstract: “The manufacturing of an optical device substrate is achieved by anodizing the surface of a metal plate, coating an insulative liquid bonding agent, having a viscosity which can permeate into an anodized film of the metal plate, on the metal plate, and alternately layering, pressing, and heat treating the metal plate coated with the liquid bonding agent and an insulative film bonding agent before the liquid bonding agent becomes solid so that bonding force between the metal plate and an insulation layer is strengthened, bubbles formation in the liquid bonding agent is inhibited, the fragile nature of the liquid bonding agent after the solidification is reduced producing an optical device substrate with improved mechanical strength and an insulation layer of precisely controlled thickness.

Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.

Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.

Abstract: This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.

Abstract: To provide a space image forming element realizing higher reflectance and larger area by making aperture ratio and transmittance higher and a method of manufacturing the same, thereby realizing high reflectance and, as a result, formation of an image having high brightness in the air. In a space image forming element of the present invention, a light transmission region is configured by a transparent pattern formed by exposure process using a transparent resist. By forming a metal layer between adjacent transparent patterns, a mirror-face region is formed in the interface between a side wall of the transparent pattern and the metal layer. The metal layer has a two-layer structure. The second metal layer is formed by electroplating using the metal in the first layer as an electrode.

Abstract: A manufacturing method of a circuit board is provided. In the manufacturing method, an electrically insulating layer and at least one electrically insulating material are formed on a plane of a thermally conductive plate, and a metal pattern layer located on the electrically insulating layer is formed. The electrically insulating layer partially covers the plane, and the electrically insulating material covers the plane where is not covered by the electrically insulating layer. The electrically insulating material touches the thermally conductive plate. A thermal conductivity of the electrically insulating material is larger than that of the electrically insulating layer.

Abstract: Systems and methods for protection of cosmetic surfaces on electronic devices and adhesive overflow prevention are provided. In particular, an assembly for protecting a cosmetic surface can include a heat activated adhesive, such as a heat active film adhesive (“HAF”), which can be used to secure a mesh to the cosmetic surface. In some embodiments, a protective layer having a center layer laminated between two layers of heat activated adhesive can be used to protect the cosmetic surface from scratches caused by the mesh. In some embodiments, one or more hot shoes can be used to cross-link the heat activated adhesives to the mesh and the cosmetic surface. Because the shape of a shoe can influence the flow of heat activated adhesives during cross-linking, different shoes can be selected in order to minimize overflow in certain locations in the assembly.

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Abstract: The invention relates to a cased electrical component comprising a carrier substrate (10), a spring device (20), which is arranged on the carrier substrate (10), a chip (30), which on a first side (31) of the chip is coupled to the spring device (20), and a cover element (100), which is arranged on the carrier substrate (10). The cover element (100) is arranged over the chip (20) such that the cover element (100) is in contact with the chip (30) at least on a second side (32) of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Abstract: The invention relates to a method for promoting the adhesion of a surface of a titanium material (5). In order to enable improved, in particular environmentally friendly, adhesion promotion of the surface, an adhesion promoting layer is applied, which comprises nanotubes (13) that include titanium dioxide (TiO2) and have diameters of 10 to 300 nm. The method also comprises applying an organic material to the adhesion promoting layer (11) with good adhesion.

Abstract: Provided is a method of manufacturing a lithium battery. The method of manufacturing the lithium battery includes providing a anode part including a anode collector, a anode layer, and a anode electrolyte layer which are successively stacked on a first pouch film, providing a cathode part including a cathode collector, a cathode layer, and a cathode electrolyte layer which are successively stacked on a second pouch film, and sealing the first and second pouch films to couple the anode part to the cathode part.

Abstract: A mask assembly, a deposition apparatus for flat panel displays including the same, and associated methods, the mask assembly including an open mask having a plurality of first openings, and a pattern mask coupled to the open mask, the pattern mask having a plurality of second openings disposed within an area bounded by the first openings, wherein the open mask is formed of a material having a thermal expansion coefficient that is lower than a thermal expansion coefficient of the pattern mask.