With Abrading Or Grinding Of Lamina Patents (Class 156/153)
  • Patent number: 10416419
    Abstract: The present invention relates to a method for manufacturing optical modules comprising the following steps: i) providing a wafer having one or more substrate layers; ii) dicing said wafer into multiple parallel oriented strips; iii) tilting said multiple parallel oriented strips; iv) grinding at least one surface of said tilted, multiple parallel oriented strips; v) bonding said grinded surface of said tilted, multiple parallel oriented strips to at least one substrate; vi) dicing said at least one substrate into optical modules.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: September 17, 2019
    Assignee: Anteryon Wafer Optics B.V.
    Inventors: Edwin Maria Wolterink, Willem Matthijs Brouwer
  • Patent number: 10322535
    Abstract: There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: June 18, 2019
    Assignees: DAICEL POLYMER LTD., DAICEL CORPORATION
    Inventors: Daiji Ikeda, Yoshihiro Asami
  • Patent number: 10312099
    Abstract: A wafer processing method includes a protective film providing step of providing a protective film on the front side of a wafer, a wafer unit forming step of applying a liquid resin curable by an external stimulus to the front side of the wafer and then curing the liquid resin by applying the external stimulus to form a protective member, thereby forming a wafer unit composed of the wafer, the protective film, and the protective member in the condition where the front side of the wafer is covered with the protective member, a grinding step of holding the protective member on a holding surface of a chuck table and then grinding the back side of the wafer of the wafer unit to thereby reduce the thickness of the wafer, and a peeling step of peeling the protective member and the protective film from the wafer reduced in thickness.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 4, 2019
    Assignee: Disco Corporation
    Inventors: Kazuma Sekiya, Karl Heinz Priewasser
  • Patent number: 10268431
    Abstract: Embodiments herein relate to a printer for printing information on at least one article. The printer receives printing instructions to print information on the at least one article. The printing instructions indicate a remote data provider service from which at least a part of the information to be printed on the at least one article is to be requested. Then, the printer transmits a request to the remote data provider service requesting said at least part of the information from the remote data provider service when printing according to the received printing instructions. Also, the printer prints, on the at least one article, said requested at least part of the information upon receiving said requested at least part of the information from the remote data provider service.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 23, 2019
    Assignee: Dover Europe Sàrl
    Inventor: James Dwan
  • Patent number: 10269668
    Abstract: Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho
  • Patent number: 10240564
    Abstract: Provided is an intake manifold for an internal combustion engine, the intake manifold including an upstream portion, a first downstream portion, and a second downstream portion. The upstream portion includes a first upstream passage and a second upstream passage. The first downstream portion includes a first downstream passage configured to communicate the first upstream passage with an intake port of a first cylinder head. The second downstream portion includes a second downstream passage configured to communicate the second upstream passage with an intake port of a second cylinder head. The upstream portion, the first downstream portion, and the second downstream portion are provided in a separate manner. In the intake manifold, a flange of the first downstream portion is connected to a flange of the upstream portion, and a flange of the second downstream portion is connected to the flange of the upstream portion.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: March 26, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Atsuro Nakamura
  • Patent number: 10217698
    Abstract: A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: February 26, 2019
    Assignee: NXP USA, Inc.
    Inventors: Akhilesh K. Singh, Rama I. Hegde, Nishant Lakhera
  • Patent number: 10214028
    Abstract: Panels having a decorative surface may include a substrate and a top layer, and the top layer may include a paper layer having a printed pattern. A method for manufacturing such panels may involve providing the paper layer with a treatment, and providing the treated paper layer with at least a portion of the printed pattern. Providing the portion of the printed pattern may involve depositing pigment containing inks on the treated paper layer using a digital inkjet printer. The pigments may be color pigments. The digital inkjet printer may include print heads with nozzles for firing droplets of the pigment containing inks onto the treated paper layer. A contact angle at the interface between the droplets of pigment containing ink and the treated paper layer may be between 0° and 90°.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: February 26, 2019
    Assignee: UNILIN, BVBA
    Inventors: Benjamin Clement, Luc De Boe
  • Patent number: 10212812
    Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: February 19, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Timothy J. Tofil
  • Patent number: 10181064
    Abstract: A device, a system, and methods for tracking conductive composite pressurized gaseous storage tanks. The system including anchoring an RFID device in a non-conductive blind boss, wherein the anchor material has a low dielectric and has minimal reflection of RF energy.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 15, 2019
    Assignee: Quantum Fuel Systems LLC
    Inventors: Mark Leavitt, Mark Warner, David Rea, Ketan Patel, Yongkui Wen
  • Patent number: 10181445
    Abstract: A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: January 15, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akihisa Fukumoto, Tetsu Negishi, Kei Yamamoto, Toshiaki Shinohara, Kazuyasu Nishikawa
  • Patent number: 10137669
    Abstract: Provided is a vehicle interior material comprising coating layers formed on both surfaces of a veneer layer; a back layer on the coating layer of one surface of the veneer layer; and a front layer on the coating layer of the other surface of the veneer layer. Provided is a method of manufacturing a vehicle interior material comprising steps of: providing a veneer layer; forming coating layers on both surfaces of the veneer layer by applying and drying water-dispersible polyurethane dispersion or water-dispersible acrylic polyurethane dispersion on the both surfaces; pre-forming a real wood film layer prepared by forming the coating layers on the both surfaces of the veneer layer; forming a back layer on the coating layer of one surface of the veneer layer by primary insert molding; and forming a front layer on the coating layer of the other surface of the veneer layer by secondary insert molding.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: November 27, 2018
    Assignee: LG HAUSYS, LTD.
    Inventors: Heon-Jo Kim, Mu-Seon Ryu, Won-Kook Kim, Chun-Ho Park
  • Patent number: 10124896
    Abstract: A galley module comprises a base galley section and a top galley section, wherein the base galley section comprises a top end adapted for carrying the top galley section. The base galley section comprises a first functional arrangement with a first access direction in a horizontal plane and the top galley section comprises at least one second functional arrangement having a second access direction in the horizontal plane. The first access direction and the second access direction enclose an angle of at least 90° in the horizontal plane.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: November 13, 2018
    Assignee: AIRBUS OPERATIONS GMBH
    Inventors: Martin Sieben, Javier Perez-Torra
  • Patent number: 10100431
    Abstract: This invention provides a method for growing monocrystalline silicon by applying Czochralski method comprising forming a melt of silicon-containing materials in a crucible and pulling the melt for monocrystalline silicon growth, which is characterized by, introducing a gas containing argon during formation of the melt, and, applying a magnetic field during the pulling step. This invention also provides a method for producing a wafer based on the above monocrystalline silicon.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: October 16, 2018
    Assignee: ZING SEMICONDUCTOR CORPORATION
    Inventors: Deyuan Xiao, Richard R. Chang
  • Patent number: 10103110
    Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units which comprise a substrate unit; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures which comprise a semiconductor package structure comprising the substrate unit, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: October 16, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen, Yu-Ying Lee
  • Patent number: 10028394
    Abstract: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: July 17, 2018
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Matthew J Manusharow
  • Patent number: 9969124
    Abstract: A method for welding profiled elements in plastic material, includes the steps of: preparing two profiled elements, arranged with respective zones to be facing one another; making a groove in correspondence to at least one zone, by a removal operation on a peripheral edge of at least one profiled element; heating the zones to be welded; coupling the zones to be welded to one another, pressing the profiled elements one against the other so as to keep the zones to be welded in reciprocal contact. The coupling step includes: melting the zones to be welded into one another in order to define a welding bead; making a containing compartment defined by the groove, the welding bead being made internally of the containing compartment; and arranging a containing presser in correspondence to the containing compartment for preventing exit of the welding bead from the compartment itself.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: May 15, 2018
    Assignee: GRAF SYNERGY S.R.L.
    Inventor: Andrea Vaccari
  • Patent number: 9955589
    Abstract: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: April 24, 2018
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Matthew J Manusharow
  • Patent number: 9937575
    Abstract: A method for forming a brazed joint between a first part having a first surface and a second part having a second surface may comprise applying at least two beads of braze filler at either of the first surface and the second surface, and assembling the first surface and the second surface to define a shiplap interface therebetween. The shiplap interface may terminate at a first terminus and a second terminus, and may include a first cavity and a second cavity. One of the beads of braze filler may be localized at the first cavity and the other may be localized at the second cavity. The method may further comprise melting each of the beads of braze filler to a braze liquid, and allowing the braze liquid to flow through the shiplap interface from the first cavity towards the first terminus, and from the second cavity towards the second terminus.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: April 10, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas Ciampa, Matthew S. Verbiscus
  • Patent number: 9926665
    Abstract: A pulp in accordance with a particular embodiment includes crosslinked cellulose fibers. The pulp can have high brightness, reactivity, and intrinsic viscosity. The pulp, therefore, can be well suited for use as a precursor in the production of low-color, high-viscosity cellulose derivatives. A method in accordance with a particular embodiment of the present technology includes forming a pulp from a cellulosic feedstock, bleaching the pulp, crosslinking cellulose fibers within the pulp while the pulp has a high consistency, and drying the pulp. The bleaching process can reduce a lignin content of the pulp to less than or equal to 0.09% by oven-dried weight of the crosslinked cellulose fibers. Crosslinking the cellulose fibers can include exposing the cellulose fibers to a glycidyl ether crosslinker having two or more glycidyl groups and a molecular weight per epoxide within a range from 140 to 175.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: March 27, 2018
    Assignee: INTERNATIONAL PAPER COMPANY
    Inventor: Mengkui Luo
  • Patent number: 9919947
    Abstract: When a GRIN lens fiber is drawn from a preform, control of a fiber diameter is improved in order to increase a production yield of the GRIN lens fiber having a fiber diameter within a desired range. The problem is solved by controlling the drawing speed using a fiber diameter c, which is obtained by correcting a fiber diameter a using the fiber diameter b and a fiber diameter ?. The fiber diameter a is measured using a diameter measuring instrument A that measures an outer diameter of the GRIN lens fiber, which is being elongated inside a heating furnace, the fiber diameter b is measured using a diameter measuring instrument B that measures an outer diameter of the GRIN lens fiber outside the heating furnace, and the fiber diameter ? is a value of the fiber diameter a measured a specified period of time T earlier.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: March 20, 2018
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventor: Toshiaki Fukuda
  • Patent number: 9917045
    Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: March 13, 2018
    Assignee: Corning Incorporated
    Inventors: Satish Chandra Chaparala, Scott Christopher Pollard
  • Patent number: 9892981
    Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cheol-Jun Yoo, Seong-Jae Hong
  • Patent number: 9891391
    Abstract: A boot for an optical connector ferrule is provided with a ribbon fiber insertion portion internally provided with vertical partition portions so as to section ribbon fibers into upper and lower stages and enable to insert the ribbon fibers, and a front opening portion exposing the optical fiber core wires in the respective leading ends of the inserted ribbon fiber groups to a forward outer side, and the boot for the optical connector ferrule is inserted to a boot insertion opening portion formed in a rear end side of the optical connector ferrule. An exposure notch portion is provided in a rear end portion of each of both upper and lower wall surfaces of the ribbon fiber insertion portion for forming a fiber guide of each of the ribbon fibers by making the rear end portion side of the vertical partition portions protrude outward from the ribbon fiber insertion portion.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: February 13, 2018
    Assignee: SANWA DENKI KOGYO CO. LTD.
    Inventor: Yasuhiro Watanabe
  • Patent number: 9764449
    Abstract: An abrasive article in form of an abrasive wheel comprising a core and a bonded abrasive body disposed within an interior recess of a peripheral surface of a core. The core comprises a polymer material and has an HDT at 0.45 MPa of at least about 130° C., and a low shrinkage ratio.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: September 19, 2017
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Boris L. Serebrennikov, Debdutta Roy, John Tunstall, Arup K. Khaund
  • Patent number: 9756892
    Abstract: A sport helmet for protecting a head of a wearer, such as a hockey, lacrosse or football player. The sport helmet has an outer shell with an internal side and an external side and an inner pad mounted to the internal side of the outer shell for absorbing shocks when the sport helmet is impacted. The inner pad has a core of polymeric cellular material with a body of expanded polymeric microspheres and a molded covering being molded onto the core of polymeric cellular material.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: September 12, 2017
    Assignee: BAUER HOCKEY, LLC
    Inventors: Jean-François Laperrière, Thierry Krick, Robert Lavoie, Chin-Te Su, Lin-Yu Lee
  • Patent number: 9738517
    Abstract: A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: August 22, 2017
    Assignees: International Business Machines Corporation, Yale University
    Inventors: Emily R. Kinser, Jan Schroers, Golden Kumar
  • Patent number: 9657719
    Abstract: A ventilation arrangement for a wind turbine includes a manhole cover for covering a manhole of a rotor hub. The rotor hub is contained within the nose cone and spaced therefrom to form an internal space between an inner surface of the nose cone and an outer surface of the rotor hub. The manhole cover provides a vent opening for venting hot air from an interior space of the rotor hub into the internal space. A pipe extends from a forward internal space through the manhole cover and into the rotor hub. The pipe establishes fluid communication between the forward internal space and the interior space. A fan is mounted to the pipe, and draws air from the forward internal space. An exhaust, fluidly connected with the pipe, is located in the rotor hub and away from the manhole cover by 50% to 90% of a rotor hub axial length.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: May 23, 2017
    Assignee: GENERAL ELECTRIC COMPANY
    Inventor: Joseph Lawrence Chacon
  • Patent number: 9605120
    Abstract: The invention provides a decorative sheet including at least a surface protective layer on a substrate, in which the surface protective layer includes a cured material of an ionizing radiation curable resin composition at least containing a polycarbonate(meth)acrylate (A) and a multi-functional (meth)acrylate (B) in a mass ratio (A)/(B) of (98/2)-(70/30). The invention also provides a decorative sheet including at least a surface protective layer on a substrate, in which the surface protective layer includes a cured material of an ionizing radiation curable resin composition at least containing an acrylic silicone (meth)acrylate (C) and a multi-functional (meth)acrylate (B) in a mass ratio (C)/(B) of (50/50)-(95/5). The present invention provides a decorative sheet with a surface protective layer having scratch resistance as well as three-dimensional formability.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: March 28, 2017
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Nobuo Saitou, Emi Harigae
  • Patent number: 9580013
    Abstract: A vision system for a vehicle includes a rear camera disposed at a rear portion of the vehicle and having an exterior field of view rearward of the vehicle. The rear camera includes an imaging array and a lens system for imaging external sources of light at the imaging array. The lens system includes at least one asymmetric anamorphic lens optic. The asymmetric anamorphic lens optic may include a longitudinally truncated conical-shaped lens optic. The longitudinal axis of the longitudinally truncated conical-shaped lens optic may be generally vertical when the rear camera is disposed at the rear portion of the vehicle, with a smaller diameter portion at an upper region of the optic and a larger diameter portion at a lower region of the optic.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: February 28, 2017
    Assignee: MAGNA ELECTRONICS INC.
    Inventor: Thomas Wierich
  • Patent number: 9573330
    Abstract: The subject invention includes methods and apparatus for joining treads. Such methods include the step of providing a first tread portion and a second tread portion for forming a joined tread, each tread portion comprising a section of tire tread extending lengthwise from a terminal end. Additional steps include providing a first fixture configured to retain the first tread portion and a second fixture configured to retain the second tread portion and securing the first tread portion into the first fixture and securing the second tread portion into the second fixture, each of the first and second fixtures being arranged within the first and second fixtures such that the terminal end of each tread portion is in communication with a joining side of each fixture. The methods further include directing the terminal ends towards each other and into forceful engagement with an elastomeric joining material arranged between the terminal ends.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: February 21, 2017
    Assignees: Compagnie Generale des Etablissements Michelin, Michelin Recherche et Technique S.A.
    Inventors: Chinglin Pan, David Chan Wah Lung, Michael D. Petrovich
  • Patent number: 9472479
    Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: October 18, 2016
    Assignee: Corning Incorporated
    Inventors: Satish Chandra Chaparala, Scott Christopher Pollard
  • Patent number: 9440413
    Abstract: A panel for absorbing mechanical impact energy includes a substrate and a multiplicity of fibers attached, by one of their ends, to the substrate with their other ends extending away from the substrate. The panel may include a thin, porous covering layer that overlies the free ends of the fibers. The porosity of the cover and the fiber density of the fibers may allow for breathability of the panel. The panels may be flexible and may be used in body protection devices such as helmets, body armor as well as in other environments. Panels may be configured in a variety of energy absorbing arrangements for differing applications.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: September 13, 2016
    Assignee: University of Massachusetts
    Inventors: Armand F. Lewis, Yong K. Kim
  • Patent number: 9352366
    Abstract: A plastic bottle processing apparatus includes: an apparatus body having a conveying path section in which a plastic bottle is conveyed; and a label separating unit arranged in a middle of the conveying path section so as to separate a label from the plastic bottle. The label separating unit includes: a label cutting member that cuts the label of the plastic bottle, which is conveyed in the conveying path section along the axial direction of the plastic bottle; a heating member that heats the label cut by the label cutting member; and a brush member disposed so as to be able to make contact with the label heated by the heating member and remove the label from the plastic bottle body by making contact with the label.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: May 31, 2016
    Inventor: Susumu Yamada
  • Patent number: 9352540
    Abstract: The invention relates to a device for tensioning the fabric of a device for restoring a removable panel, characterized in that it comprises at least one structure, a thermal chamber arranged inside said structure and able to heat said flexible fabric, an internal frame elastically secured to said thermal chamber, and at least one actuator secured to the structure and able to move the thermal chamber so that, on the one hand, the thermal chamber is moved between a “fabric at rest” position and a “fabric stretched” position and, on the other hand, to move the internal frame between a “fabric at rest” position and an intermediate position located between said “fabric at rest” and “fabric stretched” positions, the flexible fabric resting on part of the thermal chamber and being held by its peripheral edge between the internal frame and the structure. The invention also proposes a method for coating a removable panel that uses the tensioning device.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: May 31, 2016
    Inventors: Jean-Marc Scherrer, Mario Maheux
  • Patent number: 9333704
    Abstract: The described embodiments relate generally to ultrasonic welding and more particularly to performing an ultrasonic welding operation while rotating one part relative to a mating part. A non-uniform energy director can be disposed along a mating surface of a first part. The energy director can maintain a constant cross-sectional area while having a smaller height near a pivot point for the rotation and a larger height away from the pivot point. The varying height of the energy director can allow the tip of the energy director to come in contact with a second part rotating relative to the first part at approximately the same time during the ultrasonic welding process.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 10, 2016
    Assignee: Apple Inc.
    Inventors: Gerardo Salas Bolanos, Simon R. Lancaster-Larocque, Dominic E. Dolci, Cesar Lozano, James G. Smeenge
  • Patent number: 9322283
    Abstract: An airfoil includes an airfoil body made of a first metal with a leading edge, a trailing edge, pressure side and suction side; a sheath with first and second flanks made of a second metal; a first layer of non-conductive material adhesively bonded between a portion of the end of the first flank and the airfoil body and extending beyond the end of the first flank on the pressure side; and a second layer of non-conductive material adhesively between a portion of the end of the second flank and the airfoil body and extending beyond the end of the second flank on the suction side.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 26, 2016
    Assignee: United Technologies Corporation
    Inventors: Michael Parkin, Mark Quinn, Leland Wiegman, Brandon A. Gates
  • Patent number: 9312162
    Abstract: A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 ?m. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G? at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 ?m and a diameter of 15 ?m at a pitch of 40 ?m having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 ?m or less of the electrode.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: April 12, 2016
    Assignee: LINTEC Corporation
    Inventors: Yosuke Sato, Michio Kanai, Hayato Nakanishi
  • Patent number: 9272910
    Abstract: Methods of delaminating a graphene film (60) from a metal substrate (50) are disclosed that substantially preserve the metal substrate. The methods include forming a support layer (80) on the graphene film and then performing an electrochemical process in an electrochemical apparatus (10). The electrochemical process creates gas bubbles (36) at the metal-film interface (64), thereby causing the delamination. The graphene film and support layer form a structure (86) that is collected by a take-up roller (120). The support layer and graphene structure are then separated to obtain the graphene film.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: March 1, 2016
    Assignee: National University of Singapore
    Inventors: Kian Ping Loh, Yu Wang
  • Patent number: 9252042
    Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: February 2, 2016
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
  • Patent number: 9228115
    Abstract: A method of fabricating a flexible substrate structure includes the following steps. A supporting carrier is provided, and a release layer is formed on the supporting carrier, where the release layer includes a photo-sensitive adhesive layer. A local modification process is performed to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer. The local modification process includes performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: January 5, 2016
    Assignee: AU Optronics Corp.
    Inventors: Keh-Long Hwu, Pin-Fan Wang, Chih-Jen Hu
  • Patent number: 9209068
    Abstract: A method for treating at least one first material layer including siloxane bonds, wherein at least one surface can be interlocked with a surface of a second material layer by direct bonding, the method including: at least one forced diffusion at a temperature greater than or equal to 30° C., at least in the first material layer, of chemical species including at least one pair of free electrons and at least one labile proton; and converting at least one portion of the siloxane bonds into silanol bonds in at least one portion of the first material layer extending from the surface to a depth greater than or equal to approximately 10 nm.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: December 8, 2015
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Hubert Moriceau, Franck Fournel, Christophe Morales, Caroline Rauer
  • Patent number: 9193013
    Abstract: Methods for assembling fiberglass reinforced plastic sucker rods include transporting fiberglass reinforced plastic sucker rod sections from an off-site location to an assembly facility at or near a point of use, and providing a sufficient number of metallic end fittings to connect respective ends of the plurality of sucker rod sections in series at the assembly facility. Systems for assembly of sucker rods from sucker rod sections transported from off-site location to or near a point of use are also described.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: November 24, 2015
    Assignee: CENTRAX INTERNATIONAL CORP.
    Inventors: Donald Mike Johnson, Stephen Morris
  • Patent number: 9044898
    Abstract: An electronic device may have electronic components enclosed within a plastic housing. The plastic housing may include housing members that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip of metal that is placed along a joint between the housing members. The temperature of the metal strip and associated layers of the thermoset polymer film may be raised by applying current to the metal strip using an external tool or the electronic components within the housing. Heat activated thermoset polymer film may be heated using a reactive multilayer metal foil. Heat sink layers of metal may be interposed between the reactive multilayer metal foil and the thermoset polymer film. A heated metal ring or a heated edge portion of a plastic housing member may also be used to heat the thermoset polymer film.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: June 2, 2015
    Assignee: Apple Inc.
    Inventor: Cesar Lozano Villarreal
  • Patent number: 9039886
    Abstract: A method of transferring graphene includes depositing graphene on a side of at least one metal substrate to provide a metal substrate-graphene layer, stacking a target substrate on a side of the metal substrate-graphene layer to provide a stacked structure in which a side of the target substrate faces the graphene layer, and exposing the stacked structure to an electrolysis bath to remove the metal substrate and transfer the graphene onto the side of the target substrate.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: May 26, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kuanping Gong, Lijie Ci, Sung-Hee Ahn, Jin-Seong Park, Byeong-Yeol Kim
  • Patent number: 9011623
    Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: April 21, 2015
    Assignee: Apple Inc.
    Inventors: Kevin M. Kenney, Peter N. Russell-Clarke
  • Patent number: 9006579
    Abstract: A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles ?1 and ?2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1): 30°??1 and ?2?150°??(1).
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: April 14, 2015
    Assignee: Fujikura Ltd.
    Inventors: Masatoshi Inaba, Hiroshi Miyata, Hirohito Watanabe
  • Patent number: 8986485
    Abstract: A fabrication method of a touch panel is provided. In the fabrication method, the two substrates are provided, and a plurality of touch units are formed on each of the substrates. A sealant and a plurality of first spacers are provided between the substrates, and the substrates are bonded through the sealant, so that the touch units are sealed between the substrates. The touch units and the first spacers are surrounded by the sealant. The substrates are thinned. The thinned substrates are cut into a plurality of sub-mounts separated from one another. Each of the sub-mounts has one of the touch units thereon.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: March 24, 2015
    Assignee: Au Optronics Corporation
    Inventors: Sheng-Chin Fan, Tun-Chun Yang, Seok-Lyul Lee, Wei-Ming Huang
  • Publication number: 20150080155
    Abstract: The invention is directed toward a soccer ball and a method of making a soccer ball. The method comprises the steps of forming a pair of molded semi-hemispheric core halves from an elastomer material, connecting the edges of the core halves together, permanently affixing the edges of the core halves together to form one sphere, applying adhesive to the surface of the sphere, cutting a surface material to a desired shape, applying adhesive to the back side of the surface material, applying the back of the surface material to the surface of the sphere, and allowing the adhesive to cure until the surface material is permanently affixed to the sphere. The synthetic material is cut into a predetermined shape to match the shape of a predetermined template prior to affixing the surface material to the core.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 19, 2015
    Applicant: Zwyxis HongKong Co., Ltd.
    Inventor: Roy Bulfin
  • Publication number: 20150075701
    Abstract: A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member (1) for forming a metallic surface layer (5) of a cavity mold in a mold for thermoplastic resin molding and a cavity mold main body member (9) for forming the cavity mold, forming a heat-insulating layer (10?) on a bonding surface of the member (9), bonding the two members to each other, and subsequently eliminating an unnecessary part (3, 12) of the metallic surface layer member to form the metallic surface layer (5); a heat-insulating cavity mold; and a mold for thermoplastic resin molding which employs the cavity mold.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 19, 2015
    Inventor: Hiroyuki Iwami