With Abrading Or Grinding Of Lamina Patents (Class 156/153)
  • Publication number: 20110278463
    Abstract: A radiation detector is disclosed, which in at least one embodiment includes a scintillator with septa for separating scintillator elements arranged alongside one another, and a collimator with webs for forming laterally enclosed radiation channels, wherein the webs are inserted into the septa in order to avoid crosstalk between adjacent scintillator elements. This effectively suppresses crosstalk by light or secondary quanta between adjacent pixels in conjunction with a simple construction and high mechanical stability with the consequence that the spatial resolution and quantum efficiency of the radiation detector can be increased. At least one embodiment additionally relates to a method for producing such a radiation detector.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 17, 2011
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Michael Miess, Stefan Wirth
  • Publication number: 20110281122
    Abstract: This invention pertains to a composite of AlON and a germanate glass, and to a process for bonding AlON to the glass. The composite includes AlON and glass bonded together and having transmission in the visible and mid-infrared wavelength region. The process includes the step of heating them together above the softening temperature of the glass, the composite having excellent, i.e., typically in excess of about 60%, transmission in the 0.4-5 wavelength region.
    Type: Application
    Filed: March 14, 2011
    Publication date: November 17, 2011
    Inventors: Shyam S. Bayya, Jasbinder S. Sanghera, Guillermo Villalobos, Geoffrey Chin, Ishwar D. Aggarwal
  • Publication number: 20110274888
    Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.
    Type: Application
    Filed: October 20, 2009
    Publication date: November 10, 2011
    Inventors: Xinhe Tang, Helmut Hartl
  • Patent number: 8052824
    Abstract: There is provided a film peeling device (100) for peeling a film (3) stuck onto a first portion (121) containing a peripheral portion of a wafer (20) and also stuck onto a second portion (122) located inward with respect to the first portion, comprising: a moving means (61, 62) for relatively moving the first portion and/or second portion so that the film of the first portion of the wafer can be located at a position higher than the film of the second portion; a tape drawing means (142) for drawing out a peeling tape (103) onto the film stuck onto the first and the second portion; and a peeling means (146) for peeling the film from the first and the second portion of the wafer when the peeling tape drawn out from the tape drawing means is pressed against only the first portion film and moved along the first portion. Due to the foregoing, it is possible to prevent the wafer from being damaged at the time of peeling the front surface protection film.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: November 8, 2011
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Masaki Kanazawa
  • Publication number: 20110270067
    Abstract: The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 3, 2011
    Inventors: Boozarjomehr Faraji, Robert J. Greenberg, James S. Little, Jerry Ok, Neil Hamilton Talbot, David Daomin Zhou
  • Publication number: 20110265940
    Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.
    Type: Application
    Filed: April 15, 2011
    Publication date: November 3, 2011
    Applicant: SILTRONIC AG
    Inventors: Hans Oelkrug, Josef Schuster
  • Publication number: 20110262727
    Abstract: The present invention relates to a type of wood section material manufacturing method, especially with respect to soft wood section material and its manufacturing method. It belongs to wood processing field. This invention is achieved by the following technical plans: a type of wood section material manufacturing method includes the following steps: (1) wood preparation; (2) drying; (3) Polishing; (4) Hot pressing, which is to use two hot pressing boards with 140-200° C. to firmly press two surfaces of panel blank material; (5) Pre-carbonization, which pre-carbonize the panel blank material under 160° C. and 200° C.; (6) Carbonization, which carbonize the panel blank material between 200° C. and 225° C.; (7) Cooling; and (8) Moisture content control. This invention is particularly suitable to make wooden floor boards and office furniture.
    Type: Application
    Filed: July 5, 2011
    Publication date: October 27, 2011
    Applicants: ZHEJIANG SHIYOU TIMBER CO. LTD.
    Inventors: Dengyun Tu, Chengfeng Pan, Xin Zhang, Yuezhong Ni, Xueli Yu
  • Publication number: 20110234052
    Abstract: Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 29, 2011
    Inventors: Yoshiaki Amano, Takehiro Takahashi, Shuichi Mizusawa
  • Publication number: 20110223032
    Abstract: A method of manufacturing a rotor blade for a wind turbine and a rotor blade manufactured in accordance with such method are disclosed. The method generally comprises providing a blade blank formed at least partially from a filler material, shaping the blade blank to form a profile of the rotor blade and positioning a skin around an outer perimeter of the shaped blade blank.
    Type: Application
    Filed: December 13, 2010
    Publication date: September 15, 2011
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: James Robert Tobin
  • Patent number: 8012595
    Abstract: An appliance is provided having a panel formed of a magnetizable material and a polyester lamination film adhered to an outer surface of the panel, wherein the polyester lamination film provides a stainless steel appearance to the panel. The polyester lamination film may be a polyester film layer with a backside brushed, a vacuum metallized aluminum layer deposited on the backside of the polyester film layer, and a tinted coating layer provided on a front side of the polyester film layer. The tinted coating layer may be colored to provide a correct color rendition of the metallized aluminum layer as stainless steel, as seen through said polyester lamination film. A strippable film layer may be applied over the polyester lamination film to protect the panel during manufacture. The magnetizable material of the panel may be rolled steel. The panel may have bends in its surface.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: September 6, 2011
    Assignee: Whirlpool Corporation
    Inventors: Kevin R. Leatherwood, Franklin G. Katje, David L. Benefiel, David E. Elsner, David M. Lewis
  • Patent number: 8002943
    Abstract: A floor tile for a raised floor. The floor tile is defined by a shallow upwardly-opening metal pan defining a shallow compartment in which a main preformed one-piece concrete block is secured. The main concrete block is preferably formed from a plurality of one-piece preformed concrete sub-blocks which are adhesively adhered in sideward abutting relationship to define a plan profile corresponding to the main concrete block. The main concrete block is then adhesively secured within the compartment of the metal pan.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: August 23, 2011
    Assignee: Haworth, Inc.
    Inventors: Ronald H. Brown, Anthony McConnell, Randolph Woellper
  • Patent number: 8002923
    Abstract: A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: August 23, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tetsuo Suzuki, Yoshio Kawakami
  • Patent number: 7998296
    Abstract: A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: August 16, 2011
    Assignee: Lam Research Corporation
    Inventors: Tony Ricci, Jim Tappan, Keith Comendant
  • Patent number: 7988807
    Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: August 2, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuki Noda, Masaru Iwasawa
  • Patent number: 7985314
    Abstract: A slip-resistant shock absorbing golf club grip that includes a felt layer, a fabric mesh formed of fibers and a polyurethane coating covering the mesh and felt, the fibers of the mesh defining grooves in the surface of the slip-resistant polyurethane which are engaged by a users' hands, with the polyurethane coating being buffed to partially expose the fibers.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: July 26, 2011
    Inventor: Ben Huang
  • Patent number: 7972681
    Abstract: A multi-layer laminate having a textured surface comprises a thin, flexible, thermoformable polymeric base layer, and a layer of spaced part segments of an ink material screen printed in a pattern on a surface of the polymeric base material. The ink material comprises a UV curable screen printing ink which contains a resinous binder, a hardener, and a fine particulate filler. The ink is pressed through a screen having an emulsion with a thickness from about 40 to 50 microns. The ink segments are dried on the base layer by UV curing to a height and a hardness sufficient to form a heat stable textured surface adhered to the base layer. In one embodiment, the printed ink layer has a print height from about 25 to about 50 microns and resists deformation from subsequent thermoforming and/or injection molding. The ink segments meet automotive hardness and abrasion specification requirements.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: July 5, 2011
    Assignee: Avery Dennison Corporation
    Inventors: John E. Roys, Charles E. Wehmeier
  • Patent number: 7958628
    Abstract: A vacuum bonding tool method for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: June 14, 2011
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Hee-Bong Lee, Hyun-Joon Oh
  • Publication number: 20110134188
    Abstract: A nozzle plate includes: a nozzle plate main body made of metal, the nozzle plate main body having nozzle rows formed of nozzles arranged in parallel and penetrating the nozzle plate main body in a thickness direction, wherein at the outer edge of the nozzles on a droplet discharge surface of the nozzle plate main body, a water-repellent film is provided, and primer treatment is performed on at least part of the periphery of the droplet discharge surface of the nozzle plate main body, the periphery outside the water-repellent film.
    Type: Application
    Filed: December 8, 2010
    Publication date: June 9, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Katsuji ARAKAWA
  • Patent number: 7955678
    Abstract: A linerless pressure-sensitive label uses a heat-activated, non-tacky dead coat to cover a pressure sensitive substratum. Upon heat activation, the dead coat melts and admixes with an underlying pressure-sensitive adhesive substratum thereby resulting in an exposed pressure-sensitive adhesive. The label can then be applied to packaging or an end product by pressing the adhesive side of the label to the packaging or end product similar to a conventional pressure-sensitive label, however, no silicone-coated release liner is required. The elimination of the silicone-coated release liner results in lower material costs, lower shipping costs and less waste.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 7, 2011
    Assignee: Wausau Coated Products, Inc.
    Inventors: Christopher Paul Stogbauer, William Myles Reif
  • Publication number: 20110126911
    Abstract: This invention provides composite plastic articles and methods of making them. The articles can be fluidic or microfluidic devices having fluidic conduits and, optionally, pneumatic conduits that regulate flow in the fluidic conduits. The articles comprise a first substrate coated with a layer of a material that comprises, or onto which have been introduced, reactive groups. For example, the substrate can be a plastic coated with an oxide or a siloxane onto which hydroxyl groups have been introduced. These articles are covalently bonded with other articles comprising reactive groups on their surfaces, for example, polysiloxanes treated to have silanol groups. Certain articles have specified locations on their surfaces that are not bonded to the other piece. For example, the coating can be removed from these locations before bonding. Such locations can be useful as functional elements of various devices, such as valve seats in valves of microfluidic devices.
    Type: Application
    Filed: November 18, 2010
    Publication date: June 2, 2011
    Applicant: IntegenX Inc., a California Corporation
    Inventors: Boris Kobrin, Iuliu I. Blaga, William Nielsen, Shize D. Qi, Ezra Van Gelder
  • Publication number: 20110120628
    Abstract: A method of fabricating an ultra-high frequency module is disclosed. The method includes providing a top layer; drilling the top layer; milling the top layer; providing a bottom; milling the bottom layer to define a bottom layer cavity; aligning the top layer and the bottom layer; and adhering the top layer to the bottom layer. The present invention also includes an ultra-high frequency module operating at ultra-high speeds having a top layer, the top layer defining a top layer cavity; a bottom layer, the bottom layer defining a bottom layer cavity; and an adhesive adhering both the top layer to the bottom layer, wherein the top layer and the bottom layer are formed from a large area panel of a printed circuit board.
    Type: Application
    Filed: January 4, 2011
    Publication date: May 26, 2011
    Applicant: Georgia Tech Research Corporation
    Inventors: Stephane Pinel, Joy Laskar
  • Publication number: 20110111192
    Abstract: The laminate comprises a porcelain sheet with a thickness of two to three millimetres, adhered to a base or support sheet made of MDF or particleboard or high density foam or polyethylene or polypropylene or ABS or foamed PVC or methacrylate or a metal sheet of aluminium or steel, using as the adhesion means a two-component polyurethane or a PUR adhesive, producing a laminate that encompasses the advantages of the nature of the two materials, the porcelain and the base, as well as saving material, and being lighter, having higher thermal and acoustic insulation levels, improved resistance to bending loads and allowing to add additional layers, such as a metal sheet of thickness from 0.1 to 1 mm in order to obtain a greater flatness, or a combination with rubber or elastomer layers to improve the acoustic insulation level.
    Type: Application
    Filed: February 24, 2010
    Publication date: May 12, 2011
    Inventor: Juan Lloveras Calvo
  • Publication number: 20110079345
    Abstract: When surface grinding finish for decoration or other purposes is performed by applying a film to the front surface of a metal plate that is welded linearly with penetration from the rear surface side thereof. In this manner, the metal plate can be subjected to the surface grinding finish such that an appearance similar to weld marks is not created.
    Type: Application
    Filed: December 10, 2010
    Publication date: April 7, 2011
    Applicant: THE KINKI SHARYO CO., LTD.
    Inventors: Tomonori SUMIKAWA, Katsuji NISHITANI
  • Patent number: 7918952
    Abstract: A process for transforming unused motor vehicle headliner or headliner edges into a bonded composite that can be used in motor vehicles. Unused motor headliner or headliner edges are combined with binder to create a bondable mixture. The bondable mixture is exposed to heat causing the binder to melt to create the bonded composite.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: April 5, 2011
    Inventor: Gary Young
  • Publication number: 20110056955
    Abstract: An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure includes a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil.
    Type: Application
    Filed: November 15, 2010
    Publication date: March 10, 2011
    Applicant: SAMSUNG HEAVY IND. CO., LTD.
    Inventors: Ki-Hun JOH, Sang-Eon Chun, Chang-Seon Bang, Dai-Gil Lee, Byung-Chul Kim, Bu-Gi Kim, Jin-Gyu Kim, Soon-Ho Yoon, Sang-Wook Park, Kwan- Ho Lee, Byoung-Jung Kim, Po-Chul Kim, Ha-Na Yu
  • Publication number: 20110048755
    Abstract: A housing for electronic device, comprising: a metal substrate, the substrate having a bonding surface, a peripheral edge, and a ridge protruding from the peripheral edge and surrounding the bonding surface; a soft layer soft to the touch, the soft layer having an edge; and an adhesive layer located between the bonding surface of the substrate and the soft layer, thereby bonding the soft layer to the substrate, the ridge of the substrate blocking the edge of the soft layer. A method for making the present housing is also provided.
    Type: Application
    Filed: April 26, 2010
    Publication date: March 3, 2011
    Applicant: FIH (HONG KONG) LIMITED
    Inventors: HSIANG-JUNG SU, WEN-TE LAI
  • Publication number: 20110041987
    Abstract: A method for manufacturing a composite substrate according to the present invention includes a formation step of forming a structural element portion on a front surface of a first substrate, a grinding step of fixing the first substrate and grinding a back surface of the first substrate, and a bonding step of bonding a second substrate to the ground back surface with an adhesion layer composed of an adhesive. In such a manner, before forming the adhesion layer, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate, and a supporting substrate which supports the piezoelectric substrate may be used as the second substrate.
    Type: Application
    Filed: August 24, 2010
    Publication date: February 24, 2011
    Applicant: NGK Insulators, Ltd.
    Inventors: Yuji HORI, Hiroki Kobayashi, Yasunori Iwasaki
  • Publication number: 20110030881
    Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an adhesive layer formed on one side of a base film, the adhesive layer having a thickness of 4 to 42 ?m and an elastic modulus at 25° C. of 0.5 to 9 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.
    Type: Application
    Filed: August 6, 2010
    Publication date: February 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi SASAKI, Fumiteru ASAI, Kouji MIZUNO
  • Publication number: 20110030882
    Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 ?m and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 ?m and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.
    Type: Application
    Filed: August 6, 2010
    Publication date: February 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kouji MIZUNO, Fumiteru ASAI, Takatoshi SASAKI
  • Patent number: 7883597
    Abstract: A method is disclosed. The method includes forming a groove in at least one of opposing planar surfaces of a cellular thermoform plastic substrate. The groove is formed at an edge region of the substrate. A stiffener is positioned in the groove, and a fiber matt is laid on the at least one planar surface containing the groove. The stiffener and fiber matt are embedded in a thermoset resin. The thermoset resin is cured to form a fiber reinforced thermoset plastic reinforcement. The substrate is then cross-sectionally cut to form a profile. The profile can be further finished to form a beveled siding for buildings.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: February 8, 2011
    Assignee: Integritect Consulting, Inc.
    Inventor: James Blahut
  • Publication number: 20110017395
    Abstract: The composite resin tile system is essentially an inner sleeve formed from tiles that is applied to the inner walls of a Flue Gas Desulfurization scrubber/absorber system that forms part of an emission system in a plant that generates corrosive gases as a by-product of its process (such as a power plant), in order to provide chemical corrosion resistance and abrasion resistance. In a preferred embodiment, the novel corrosion and abrasion resistant material is formed from either vinyl ester resin or epoxy resin (about 60% to about 75% by weight) and aluminum oxide (about 25% to about 40% by weight). The instant material may be formed into interlocking tiles that are applied to the inner surfaces of Flue Gas Desulfurization components. This tile system is particularly useful in areas within the scrubber/absorber system where aqueous reagents and liquid waste are contained, transported, or used in the scrubbing/absorbing process.
    Type: Application
    Filed: July 21, 2009
    Publication date: January 27, 2011
    Inventors: Joseph Loyd Vandiver, Harold Raymond Waynick, III
  • Publication number: 20110018952
    Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression:: Ra?loge(T2)/(3×106)+6.5×10?6.
    Type: Application
    Filed: June 10, 2010
    Publication date: January 27, 2011
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 7875141
    Abstract: A method of restoring a section of a composite having a honeycomb bonded to a perforated skin includes the steps of separating a first honeycomb from the perforated skin to expose a portion of the perforated skin, inserting pins through perforations in the perforated skin, extending the pins through a repair material, attaching the repair material to the exposed portion of the perforated skin, and attaching a second honeycomb to the repair material. The method may include removing material from the exposed portion of the perforated skin, prior to inserting pins through the perforations, to create a more even bonding surface for attaching the repair material.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: January 25, 2011
    Assignee: United Technologies Corporation
    Inventors: Wiliam F. Bogue, John M. Robertson
  • Publication number: 20110005662
    Abstract: A method for fabricating a plurality of touch sensor panels is disclosed. In one embodiment, the method includes forming a plurality of touch substrate units having a plurality of drive lines and sense lines on at least one of first and second surfaces of a touch substrate mother sheet; forming an adhesive layer on the first surface of the touch substrate mother sheet covering at least part of each of the plurality of touch substrate units; affixing a cover glass mother sheet having a plurality of cover glass units to the adhesive layer of the touch substrate mother sheet to form a laminate; and separating the laminate into a plurality of panels, each panel including a touch substrate unit laminated to a cover glass unit.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 13, 2011
    Inventor: Kuo-Hua SUNG
  • Patent number: 7867419
    Abstract: The present invention provides a method of manufacturing a golf ball having a solid core formed of a rubber composition and a cover of at least one layer encasing the core, which method includes the steps of treating a surface of the core with a solution containing a halogenated isocyanuric acid and/or a metal salt thereof, and covering the treated core with a cover material. The invention also provides a golf ball obtained by such a method. Golf balls obtained by this method have a good feel and a good scuff resistance, and also have a high durability to impact.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: January 11, 2011
    Assignee: Bridgestone Sports Co., Ltd.
    Inventors: Takashi Ohira, Shinichi Hinomoto, Junji Umezawa, Hideo Watanabe
  • Patent number: 7861402
    Abstract: A method is disclosed for producing a pole face of a metal closing elements of a solenoid, especially for electromechanical switchgear. In at least one embodiment, the method includes machining the surface of a crude stamped part of the closing element to give the pole face. A corresponding armature, yoke, solenoid and switchgear are also disclosed.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: January 4, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Peter Eckl, Johann Hofrichter
  • Patent number: 7833368
    Abstract: In a method for making a window covering the user selects a first segment of cellular material in which there is a top cell having a top surface, at least one glue line on the top surface and a strip of fabric on the at least one glue line. The strip of fabric and at least a portion of the glue line are removed from the top surface of the top cell. and a second glue line is applied to that top surface. A second segment of cellular material is place over the second glue line on the top surface of the top cell of the first segment. The glue line cures and bonds the second segment of cellular material to the first segment of cellular material. If the cellular material has tabbed cells the processes can be used to join the tabs of the two segments together.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: November 16, 2010
    Inventors: Ren Judkins, John D. Rupel
  • Patent number: 7807008
    Abstract: A three layer coated fabric has a bottom backing layer, a top coating layer and a middle coating layer that contains recycled coated fabric material. All of the constituent parts of coated fabrics being recycled are included in the middle layer. The middle layer also sometimes contains other materials that can blend with the recycled coated fabrics or other recycled post-consumer materials. The three layer coated fabric is manufactured by transforming the recycled coated fabrics and other materials into a form that can be used to create the middle layer.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: October 5, 2010
    Assignee: Laminating Services, Inc.
    Inventors: John W. Nethers, II, John D. Serafano, Edward M. Ernst
  • Publication number: 20100236696
    Abstract: Disclosed is a method of manufacturing a glasses frame using a polyetherimide resin, through injection molding and cutting, in order to realize excellent properties of the polyetherimide resin. The method of manufacturing a glasses frame made of a polyetherimide resin includes subjecting a polyetherimide resin to injection molding, thus producing a preformed sheet, inputting designs for various glasses models to the preformed sheet, cutting the preformed sheet into the glasses frame according to the input design through laser cutting or CNC cutting, forming lens grooves and hinge grooves in the cut glasses frame, subjecting the rough surface of the glasses frame, having the grooves, to surface treatment through tumbling or polishing, and subjecting the glasses frame, having been subjected to surface treatment, to thermal molding and then to pressing using a mold, thus forming the shape of glasses, and attaching hinges to the formed glasses frame.
    Type: Application
    Filed: October 30, 2007
    Publication date: September 23, 2010
    Inventor: Joung-Soon KIM
  • Publication number: 20100230035
    Abstract: A process for making a fiber reinforced cementitious product such as a panel which hardens to an ultra-high compressive strength composite for use in making panels with ballistic and blast resistant properties. The panel has a continuous phase resulting from curing an aqueous mixture, in the absence of silica flour, of inorganic cement binder, inorganic mineral filler having a particle size of about 150-450 microns, pozzolanic mineral filler, and polycarboxylate based superplasticizer self-leveling agent, and water. The mixture may also include alkanolamine and acid or acid salt. The continuous phase may be reinforced with fiber distributed in the continuous phase before curing to form a panel. The panel may be reinforced with a fiber reinforced skin attached to at least one surface of the core, e.g., by lamination with an adhesive, e.g., epoxy, to form a ballistic and blast resistant cementitious armor panel.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 16, 2010
    Applicant: United States Gypsum Company
    Inventors: William A. FRANK, Ashish Dubey
  • Publication number: 20100230142
    Abstract: Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing.
    Type: Application
    Filed: October 23, 2008
    Publication date: September 16, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Keita Bamba, Tadahiro Yokozawa, Hideaki Watanabe
  • Publication number: 20100212942
    Abstract: A fully reflective and highly thermoconductive electronic module includes a metal bottom layer, a transparent ceramic layer and a patterned metal wiring layer. The metal bottom layer has a lower reflective surface. The transparent ceramic layer has an upper surface and a lower surface. The lower surface of the transparent ceramic layer is bonded to the lower reflective surface of the metal bottom layer. The metal wiring layer is bonded to the upper surface of the transparent ceramic layer. The lower reflective surface reflects a first light ray, transmitting through the transparent ceramic layer, to the upper surface of the transparent ceramic layer. A method of manufacturing the fully reflective and highly thermoconductive electronic module is also disclosed.
    Type: Application
    Filed: April 29, 2010
    Publication date: August 26, 2010
    Inventors: Wei-Hsing Tuan, Shao-Kuan Lee
  • Publication number: 20100206464
    Abstract: Provided are a steel plate for a refrigerator door and a method for manufacturing the steel plate. The steel plate includes a stainless steel plate provided on and forming an exterior of a refrigerator door with a vertical length of 1250 mm or more. The stainless steel plate surface is processed to form a finished texture oriented in a horizontal direction with respect to the refrigerator door. The method includes cutting a section from a rolled stainless steel plate base material corresponding in length to a length of a refrigerator door, rotating the cut section by a 90° angle, and surface processing through grinding a surface of the cut section in a direction perpendicular to a rolled direction thereof.
    Type: Application
    Filed: March 31, 2008
    Publication date: August 19, 2010
    Applicant: LG Electronics Inc
    Inventors: Dong-Soo Heo, Jae-Woong Yun, Kang-Ug Lee, Sang-Ho Park
  • Publication number: 20100183761
    Abstract: A process for producing a heat-insulating cavity mold, characterized by producing two members, i.e., a metallic surface layer member (1) for forming a metallic surface layer (5) of a cavity mold in a mold for thermoplastic resin molding and a cavity mold main body member (9) for forming the cavity mold, forming a heat-insulating layer (10?) on a bonding surface of the member (9), bonding the two members to each other, and subsequently eliminating an unnecessary part (3, 12) of the metallic surface layer member to form the metallic surface layer (5); a heat-insulating cavity mold; and a mold for thermoplastic resin molding which employs the cavity mold.
    Type: Application
    Filed: May 2, 2007
    Publication date: July 22, 2010
    Inventor: Hiroyuki Iwami
  • Patent number: 7757741
    Abstract: In a peeling tape attaching apparatus for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with the surface protective film up and the peeling tape is supplied on the surface protective film of the wafer. The movable table is moved in such a manner that an end (28) of the wafer is located under a peeling tape attaching unit (46), and pressure is exerted by pressing the peeling tape attaching unit against the surface protective film of the wafer via the peeling tape. After that, the movable table is moved toward the other end (29) of the wafer, and upon movement of the movable table, by a predetermined distance, from the peeling tape attaching unit, the pressure is canceled.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: July 20, 2010
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Minoru Ametani
  • Publication number: 20100163160
    Abstract: The invention relates to a method for producing a cladding element (10) with a base board (12) that is provided with a paper ply (14, 18) impregnated with resin on a surface (12a, 12b). According to the invention in a first step (BID, BIR) the resin is applied to the surface (12a, 12b) of the base board (12), in a second step (DS, RS) the paper ply (14, 18) is applied to the surface (12a, 12b) of the base board (12), and in a third step (HP) the base board (12) provided on the surface (12a, 12b) with resin and the paper ply (14, 18) are pressed to one another.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 1, 2010
    Inventor: Herbert Ruhdorfer
  • Publication number: 20100157219
    Abstract: A display panel and a manufacturing method are disclosed. The method is to thin the thickness of a pair of transparent substrates for the display panel by grinding or lapping only, or grinding with simplified polishing, so that at least one of the outer surface of the transparent substrates has Haze substantially less than 90% and a profile arithmetic mean roughness ranged from about 0.02 ?m to about 0.66 ?m.
    Type: Application
    Filed: March 3, 2010
    Publication date: June 24, 2010
    Applicant: AU Optronics Corp.
    Inventors: Jong-wen Chwu, Yu-chen Liu
  • Patent number: 7740726
    Abstract: An elastomer fishing lure skirt comprising a silicone based elastomer substrate having a rough side wherein the substrate is separated into a plurality of filaments. The lure skirt further comprises an adhesive such as Chemlock 697, RTV adhesive, Lock Tight, or combinations thereof. The lure skirt further comprises a biaxially-oriented polyethylene terephthalate polyester film having a metalized foil, colored foil, holographic film, or combinations thereof bonded to its surface. Additionally, the lure skirt includes a means for semi-permanently binding the filaments together to form said lure skirt.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: June 22, 2010
    Inventors: Michael T. Shelton, Daryl W. Greene, Van Truong
  • Publication number: 20100147075
    Abstract: Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.
    Type: Application
    Filed: December 11, 2008
    Publication date: June 17, 2010
    Applicant: Honeywell International Inc.
    Inventors: Galen Magendanz, Mark Eskridge, Matt Loesch
  • Publication number: 20100142863
    Abstract: The present invention is related to easy-to-open packaging (1) comprising an easy tearable multilayer laminate (2), said laminate comprising at least two polymer layer wherein at least one of said polymer layer comprises a scratched surface (6, 6?) forming a scratched polymer layer (11), said scratched surface comprising a multitude of scratched lines parallel to the extrusion direction (2) of said scratched polymer layer, the scratched lines creating a predetermined tear direction of the packaging.
    Type: Application
    Filed: August 16, 2006
    Publication date: June 10, 2010
    Applicant: Amcor Flexibles A/S
    Inventors: Mauricio Bunge, Helmar Utz