Abstract: A method for producing a semiconductor package, capable of effectively suppressing contamination of a chemical liquid and unintended peeling-off of a reinforcing sheet, is provided. This method includes providing a tacky sheet including a substrate sheet, and a soluble tacky layer and a banking tacky layer on at least one surface of the substrate sheet; making a first laminate including a redistribution layer; using the tacky sheet to obtain a second laminate having a second support substrate bonded to a surface on the redistribution layer side of the first laminate with the tacky layer therebetween; peeling off the first support substrate, pretreating the resulting third laminate; mounting a semiconductor chip on a pretreated surface of the redistribution layer; immersing the third laminate in a solution to dissolve or soften the tacky layer; and peeling off the second support substrate in a state where the tacky layer is dissolved or softened.

Abstract: A main object of the present invention is to provide beneficial improvements relating to a method for producing a fiber reinforced plastic product, the method including curing while pressurizing a prepreg preform by using a core having a fusible part as means for pressurizing.

Abstract: A composite material structure manufacturing jig (10) is used when manufacturing a composite material structure by adhering prepreg to a framework structure including a frame component that includes a channel extending along a longitudinal direction of the frame component. The composite material structure manufacturing jig (10) is inserted in the channel of the frame component and used therein. The jig (10) includes a tubular body (11) formed of an elastic material containing a reinforcement fiber, the body (11) including a trapezoidal transverse section that is a cross section orthogonal to a longitudinal direction of the body (11), the trapezoidal transverse section including an upper base and a lower base longer than the upper base. An inner surface of the body (11) is coated with an inner peripheral film (16) serving as a gas barrier layer.

Abstract: A veneer panel may include a face veneer, a first inner layer bonded to the face veneer, a second inner layer bonded to the first inner layer, and a thermally conductive layer bonded to the second inner layer. The first inner layer and the second inner layer are treated with a flame retardant. The first inner layer is disposed between the face veneer and the second inner layer, and the second inner layer is disposed between the first inner layer and the thermally conductive layer.

Abstract: Implementations of a semiconductor device may include a semiconductor die comprising a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and a temporary die support structure coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The thickness may be between 0.1 microns and 125 microns. The warpage of the semiconductor die may be less than 200 microns.

Abstract: A multilayer laminate panel comprising a first layer of a stone-based material and a second layer of a dissimilar material of lower density, which are interposed by one or more layers of resin-impregnated fibers, is provided. The dissimilar material comprises cork or a derivative of cork, and the thickness of the layer of stone-based material is from about 2 mm to about 50 mm. A process for the production of the panel is also provided. The panel finds use as a coating in a variety of interior and exterior applications. A panel comprising fixing means and a process for attaching the fixing means to the panel are also provided.

Abstract: Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Abstract: This invention relates to tufted floorcovering articles, including carpet tiles and broadloom carpet. In particular, this invention relates to tufted floorcovering articles made from the family of polymers known as polyester. Specifically, this invention relates to tufted carpet tile products made from polyester. The polyester carpet tiles meet commercial performance specifications and are fully end-of-life recyclable.

Abstract: A method for manufacturing a high pressure tank includes a step of forming a reinforcing pipe portion including a straight pipe portion and reduced-diameter portions, a step of forming reinforcing dome portions, a step of forming a joined body by joining the reinforcing pipe portion and the reinforcing dome portions, and a step of forming an outer helical layer on an outer face of the joined body. The reinforcing dome portions are disposed with opening ends of the reinforcing dome portions positioned on outer faces of the reduced-diameter portions of the reinforcing pipe portion.

Abstract: An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism (1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.

Abstract: Methods and systems are provided for a coupling device. In one example, the coupling device may be formed of a composite material and positioned between an exhaust system and a vehicle chassis. The composite material may include aluminum particles dispersed in an elastomer matrix to reduce an overall thermal absorptivity of the composite material.

Abstract: The invention relates to a flexible belt comprising a woven fabric. The woven fabric has approximately parallel straight sides and ends, where the ends are releasably or permanently securable to one another to form an endless loop. The woven fabric contains a set of warp yarns and a set of weft yarns. The set of warp warps are in a warp yarn direction and the warp yarns comprise monofilament warp yarns having a first denier. The set of weft yarns are in a weft yarn direction which is approximately perpendicular to the warp yarn direction. The weft yarns are in a repeating pattern of at least one monofilament weft yarn followed by at least one multifilament weft yarn. The monofilament weft yarn has a linear mass density of at least about 2,500 denier and at least about 5 times the denier of the monofilament warp yarn.

Abstract: A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150° C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120° C.

Abstract: Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.

Abstract: A system for additive manufacturing of a three-dimensional object, comprising: a controller for identifying a set of planar cross-sectional shapes of the three-dimensional object, the set extending in a sequence from a first end of the three-dimensional object to a second end of the three-dimensional object; a three-dimensional scanner, associated with the controller, configured to scan a prototype of the three-dimensional object to generate a computer-aided design model; at least one cutting station for cutting at least one barbed metal sheet into a plurality of individual planar barbed metal pieces corresponding to the cross-sectional shapes; and for cutting at least one substrate sheet into a plurality of individual planar substrate pieces corresponding to the cross-sectional shapes, wherein the at least one substrate is penetrable by the barbs; and a binding station for receiving and pressing the individual barbed metal pieces and the individual substrate pieces together.

Abstract: A method of layerwise solid freeform fabrication is disclosed. The method comprises, for each of at least a few of the layers, dispensing and hardening at least a first modeling material and a second modeling material to form a core region and one or more envelope regions at least partially surrounding the core region. In some embodiments, the ratio between the elastic moduli of adjacent regions, when hardened, is from about 1 to about 20.

Abstract: A filling method for filling surface imperfections on a surface of a wing comprising a scanning step in which a control unit controls a movement of a scanner past the surface of the wing to scan the surface and transmit the collected data to the control unit, a computation step in which the control unit computes a digitized surface from the data, a determination step in which the control unit determines each surface imperfection by comparing the reference surface and the digitized surface, a generation step in which the control unit generates a digital model of the patch intended to fill the surface imperfection, and a printing step in which the control unit controls the movement of a 3D printer past each surface imperfection and commands the activation of the 3D printer in order to make it print the patch.

Abstract: A display device includes a display module, a first adhesive member including a thermal initiator and directly disposed on a rear surface of the display module, a sensor unit directly disposed on the first adhesive member, and a second adhesive member including a photoinitiator and directly disposed on at least a portion of the first adhesive member and the rear surface of the display module.

Abstract: A wafer level chip scale package (WLCSP) structure and a manufacturing method are disclosed. The WLCSP structure comprises a semiconductor die and a stack. The stack comprises a protective tape and a molding compound. A portion of a first interface surface between the molding compound and the protective tape is curved. The manufacturing method comprises the steps of forming a semiconductor structure; attaching the semiconductor structure on a dummy wafer; performing a first dicing process using a first cutting tool; depositing a molding compound; removing the dummy wafer; performing a second dicing process with a second cutting tool. A first aperture of the first cutting tool is larger than a second aperture of the second cutting tool. The portion of the first interface surface being curved reduces the possibility of generation of cracks in the WLCSP structure.

Abstract: The present invention relates to a method of fabricating an electrode array, in which an underlying handle wafer is removed to provide a planar device having the electrode array. Also provided are wafers including a plurality of planar devices having an electrode array, as well as sensors including such an electrode array.

Abstract: A machine for additive manufacturing positions a film having additive material relative to a substrate. The additive material is melted onto the substrate or previously formed layers of a workpiece using a laser. The substrate/workpiece and/or the film can be positioned in multiple axes so that complex shapes can be formed without extraneous supporting structures. The film-based delivery of the additive material allows deposition in orientations other than horizontal as is required for powder-only additive manufacturing and also avoids the inconvenience of collecting and recycling unused loose powdered metal.

Abstract: A structural component includes at least one wall surrounding a component interior space. The structural component also includes a first cellular structure positioned within the component interior space. The first cellular structure includes a plurality of cells each having a twelve-cornered cross section including twelve sides and twelve corners creating nine internal angles and three external angles.

Abstract: A photosensitive stencil includes a porous stencil carrier that can be a sheet of woven material with crisscrossing filaments. The stencil carrier is coated with a photopolymer emulsion that is water based to form a stencil blank. In use, a light mask is disposed atop the stencil blank. The light mask can be contained on a sheet of paper or a transparent film. Alternatively the stencil blank is fed through an inkjet printer and the light mask is printed directly onto the stencil blank using common inks. The stencil blank is then exposed to light for a few minutes, which cross-links the photopolymer emulsion in unmasked regions. After exposure, the stencil blank is developed by being washed out with water. The water removes emulsion and adhesive, where present, within areas that were masked by the light mask, revealing open or open regions through which ink or paint can be applied.

Abstract: A system includes a nasal cannula having a flexible tube configured to transmit oxygen gas to a user, an optical fiber coupled to the nasal cannula and configured to transmit light having a frequency spectrum range at least including that of light resulting from combustion of the nasal cannula while transmitting the oxygen gas to the user, a detector operatively coupled to the optical fiber and configured to detect the light transmitted through the optical fiber, and a valve. The valve is configured to be actuated to interrupt the transmission of the oxygen gas to the user through the nasal cannula in response to a signal from the detector.

Abstract: A method of manufacturing chip package is disclosed. The method includes providing a wafer having a first surface and a second surface, in which the wafer includes conductive bumps disposed on the first surface; thinning the wafer from the second surface toward the first surface; dicing the wafer to form chips, in which each chip has a third surface and a fourth surface, and at least one of the conductive bumps is disposed on the third surface; disposing the chips on a substrate, such that the conductive bumps are disposed between the substrate and the third surface, in which any two adjacent of the chips are spaced apart by a gap ranging from 50 ?m to 140 ?m; forming an insulating layer filling the gaps and covering the chips; and dicing the insulating layer along each gap to form a plurality of chip packages.

Abstract: A method for forming lenses for a fiber optic connector includes forming a mask on a photosensitive glass, the mask defining a plurality of covered portions of the photosensitive glass and a plurality of open portions of the photosensitive glass that are positioned between the plurality of covered portions, exposing the photosensitive glass and the mask to electromagnetic energy, removing the mask from the photosensitive glass, forming wafer-level lenses at the plurality of covered portions of the photosensitive glass by exposing the photosensitive glass to thermal energy, and applying an anti-reflective coating to an upper surface of the photosensitive glass.

Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).

Abstract: Provided is an electrophotographic photosensitive member that can suppress the generation of both an interference fringe and a streaky uneven part in a circumferential direction on an image. The generation of the interference fringe and the generation of the streaky uneven part in the circumferential direction on the image are suppressed by defining a length of a line-shaped groove of a support in a circumferential direction, and defining roughness parameters of a support in an axial direction.

Abstract: A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

Abstract: In an elastic tube as a driving force source of a fluid pressure actuator that is driven by supplying and discharging fluid such as air or liquid, a wear-resistant flocked layer is provided on an entire outer circumferential surface of the elastic tube, and the wear-resistant flocked layer being formed by an electrostatic flocking process in which short fibers made of synthetic resin are flocked to be perpendicular to the outer circumferential surface, and the wear-resistant flocked layer being further formed by the electrostatic flocking process in which the short fibers made of the synthetic fiber are flocked in a number of strips along an axial direction or in a number of dots on the entire outer circumferential surface.

Abstract: A metal contactless smart card includes a first metal layer having a first slit, a second layer, a radio-frequency integrated circuit chip module, and an inlay having an antenna. A nonconductive insert may be fitted in the slit. The first metal layer may include an inlay recess where the inlay may be received and a through-hole where the chip may be inserted. The second layer of the smart card may be made of metal and may also include a slit.

Abstract: A method for molding a fiber-reinforced plastic member involves disposing a reinforced-fiber base material 2 inside a molding space S, which is created between a mold 1 and a bag film 6, and then depressurizing the inside of the molding space S and curing a resin composition R contained in the reinforced-fiber base material 2, wherein a flat pressure plate 5 made of spring steel is disposed between the reinforced-fiber base material 2 and the bag film 6. The pressure plate 5 elastically deforms along the shape of the reinforced-fiber base material 2 while the inside of the molding space S is being depressurized, and returns to its original flat shape when depressurization is stopped and the bag film 6 is removed after curing of the resin composition R.

Abstract: A method includes forming a release film over a carrier, forming a polymer buffer layer over the release film, forming a metal post on the polymer buffer layer, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, and decomposing a first portion of the release film. A second portion of the release film remains after the decomposing. An opening is formed in the polymer buffer layer to expose the metal post.

Abstract: Systems and methods for improving tire uniformity, for instance to reduce cavity noise and other effects caused by localized tire surface anomalies are provided. The localized tire surface anomaly can be manifested as a local peak of radial nm out or other uniformity parameter (e.g. radial force variation) for the tire. The local peak of radial run out can be within uniformity tolerances for radial run out, but can still contribute to cavity noise through the high harmonic effects caused by the local peak. According to aspects of the present disclosure, the location and/or other identifiable characteristics of a localized tire surface anomaly can be identified. An ablation device can be used on the tread of the tire to remove tire material at an azimuthal location associated with the localized tire surface anomaly to improve the uniformity of the tire.

Abstract: A method of fabricating a vacuum barrier system includes fabricating a soluble forming mandrel, laying up composite material over the soluble forming mandrel, and applying a forming mandrel vacuum bag over the composite material and curing the composite tooling material to form a cured composite bag carrier. The method also includes de-bagging and trimming the cured composite bag carrier.

Abstract: Layers of build and support material on an intermediate transfer surface are exposed to a solvent using a solvent application station to make the build material tacky, without affecting the support material. Then, the intermediate transfer surface moves past a transfuse station (the transfuse station is positioned to receive the layers after exposure to the solvent) and a platen moves relative to the intermediate transfer surface to contact the platen to one of the layers on the intermediate transfer surface. The intermediate transfer surface transfers a layer of the build material and the support material to the platen each time the platen contacts the layers on the intermediate transfer surface at the transfuse station to successively form a freestanding stack of the layers of build and support material on the platen.

Abstract: A method of making a core-stiffened structure includes the steps of providing a honeycomb core having an adhesive disposed on first and second surfaces thereof, providing a first skin and a second skin, and assembling the first skin, the second skin, and the honeycomb core to form the core-stiffened structure. The method further includes the steps of curing the core-stiffened structure and inhibiting at least one of the first skin and the second skin from protruding into at least one cell of the honeycomb core during the step of curing the core-stiffened structure.

Abstract: A sports shaft having an elongated body having a perimeter defined by a plurality of main walls with adjacent ones of the main walls being interconnected through a corresponding one of a plurality of edge walls, the edge walls being spaced apart around the perimeter. A respective bumper extends along at least part of length of at least one of the edge walls. The main and edge walls without the respective bumper have a first stiffness along a longitudinal direction of the shaft, and a combination of the respective bumper with the at least one of the edge walls has a stiffness along the longitudinal direction greater than the first stiffness. A method of making a sports shaft is also discussed.

Abstract: An accommodating intraocular lens comprises a first lens component, a second lens component, and an adhesive between portions of the two lens components. The cured adhesive bonds the lens components to form a fluid chamber. The lens components are bonded to one another along a seam which extends circumferentially along at least a portion of the lens components. The lens components may comprise the same polymer material. The cured adhesive also comprises the polymer or a prepolymer of the polymer to provide increased strength. The polymer is hydratable such that the lens components and the cured adhesive therebetween can swell together to inhibit stresses between the lens components and the cured adhesive.

Abstract: A manufactured wood-based panel for furniture and interior construction. Particle sized foreign materials are irregularly distributed under a protective layer over one or both of the surfaces of the wood-based panel, covering more than 10% of the panel surface. The foreign materials, preferably natural materials such as cork or hemp shives, but also plastics, metal particles, or recycled material are incorporated so that they either protrude from the panel surface to form a relief pattern or are embedded in the wood-based material to form a uniform, smooth panel surface.

Abstract: An eco-wood formulation finds new uses as construction materials. A rigid polymer material sheet for use in building construction comprises a polymer mixture of ultrafine particles of polyvinylchloride (PVC) impact modifier, plant fiber, coupling agent, smoke suppressant, activated clay, lubricant, an activator, environmentally friendly flame retardant, heat stabilizers, odorless crosslinking agent, foaming agent, desmopressin agent. Alternatively, the rigid polymer material sheet is composed of: a polymer mixture of PVC, plasticizer, nitrile rubber, PCC, stearate, zinc oxide, retardant heat, heat stabilizers, crosslinking agent, vesicant; whereby said rigid polymer material sheet provides enhanced thermal resistance and sound attenuation properties for use in building construction, aviation and marine industries.

Abstract: A method of producing a veneered element, the method including providing a substrate, applying a sub-layer on a surface of the substrate, applying a veneer layer on the sub-layer, and applying pressure to the veneer layer and/or the substrate, such that at least a portion of the sub-layer permeates through the veneer layer. Also, such a veneered element.

Abstract: A method of manufacturing a light scanning apparatus, including: forming an optical box having a plurality of protrusions arranged along a longitudinal direction of a reflection mirror and provided at positions corresponding to one end side and the other end side of the reflection mirror in the longitudinal direction, respectively; processing protrusions except protrusions that are used for supporting the reflection mirror so that the protrusions except the protrusions that are used for supporting the reflection mirror on the one end side and on the other end side of the reflection mirror are out of contact with the reflection mirror; placing the reflection mirror on the protrusions that have not been processed in the processing; and fixing the reflection mirror, which has been placed on the protrusions that have not been processed in the placing, to the optical box.

Abstract: Embodiments of the provided technology relate to methods, devices, and systems that drive a transfer of the digital profile of residual limb contours to a thermoplastic article such as a prosthetic socket strut. A method of reforming a thermoplastic article to assume a desired shape, such as a contour that replicates or is complementary to the contour of a body portion, may include heating a thermoplastic article to render the article malleable. The method may further include placing the thermoplastic article against a molding surface having a desired shape that replicates the portion of the body part. Next, the thermoplastic article may be pressed against the molding surface with a compliant molding press to reform at least a portion of the article into the desired shape. The reformed thermoplastic article may then be removed from the molding surface, the article retaining the desired shape after removal.

Abstract: A respiratory apparatus may employ ultrasonic welds. The ultrasonic welding may be used to join a variety of headgear, mask and accessory components. This process may enhance comfort, fit and/or performance of the joined components and/or overall mask assembly. A component may be a single layer component such as a textile or fabric, or a composite or multiple layer component such as fabric and foam composites, or outer fabric layers and inner spacer fabrics. Further, a component may be a strap, some other headgear component, a mask component, an accessory component or the like.

Abstract: A rigid polymer porous material sheet is produced by feeding a slurry of polymer mixture comprising ultrafine polyvinylchloride particle, non-phthalate plasticizer, foaming agent and thermal stabilizer, polymer chips, fillers and fire retardant chemicals into a heated mold and pressing the mixture with high applied pressure. The temperature of the mold is below 190° C. to soften the polymer mixture and decompose the foaming agent forming the closed cell polyvinylchloride foam with 10 to 40% density with closed air cells. The thermal resistance of the rigid polymer porous sheet and sound attenuation properties are significantly improved. The rigid polymer porous sheet can be bent at sharp angles without crack formation facilitating its use as wall boards. The sheets produced may be embossed or molded to produce decoration boards, advertising boards, cabinet doors and furniture with decorative features. They can also be used in aeronautical applications as acoustic thermal insulation systems.

Abstract: A method for manufacturing decorative surfaces includes the steps of inkjet printing a color pattern with one or more aqueous inkjet inks including a polyurethane based latex binder; impregnating a paper substrate with a thermosetting resin; and heat pressing the thermosetting resin impregnated paper substrate carrying the inkjet printed color pattern into a decorative surface.

Abstract: The invention relates to a method of producing three-dimensional structural surfaces based on synthetic resin-impregnated materials applied to the surface, in particular of wood-based panels. The method is characterized in that before the impregnation, at the stage of pattern printing, a mixture is applied to the decor paper, consisting of printing ink, whether with pigment or not, and a swelling agent in the form of microspheres, being encapsulated gas bubbles of sizes ranging from 2 pm to 180 pm, increasing its volume under the influence of rising temperature, wherein the mixture of the ink and the swelling agent contains from 0.3% to 45% by weight of the swelling agent, and after exiting the printing press and after the impregnation, the decor paper with the formed final pattern with a coded three-dimensional structure is pressed onto the surface, in particular of a wood-based panel, using a heated press plate with any working surface.

Abstract: The invention relates to a cross seam joining device for a flexible packaging having at least one ultrasonic applicator (13a-13c), which is rotatably mounted on a shaft (13d) and can be rotated about an axis (13e) of the shaft (13d) arranged longitudinally to the cross seam (110, 111). The ultrasonic applicator (13a-13c) is designed to produce and bundle ultrasounds in a frequency range of 0.1 MHz-0.5 MHz, preferably from 0.5 MHz-2 MHz.

Abstract: The invention relates to a method for joining a sealing seam of a tubular bag packaging by means of an ultrasonic applicator (10), characterized in that said ultrasonic applicator (10) generates ultrasonic waves at a frequency of between 0.1 MHz and 5 MHz, preferably between 0.5 MHz and 2 MHz. The invention also relates to a longitudinal seal joining device of a tubular bag machine for use with said claimed method.