Abstract: Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.

Abstract: Proposed is a method of producing an article which is provided on a surface thereof with conductor tracks at least in a region-wise manner, wherein the conductor tracks are first formed on an intermediate carrier and then transferred onto the substrate. In accordance with the method as described, an etching treatment for separation of the conductor tracks from each other is eliminated. An embossing foil of a particular configuration is used as the intermediate carrier with the conductor tracks.

Abstract: A process for coating a polymer sheet with a transparent coating having moisture and oxygen barrier properties. The process starts with a metal substrate made of, or having a surface coating of, a valve metal or valve metal alloy. The metal substrate is anodized to form an anodic film of the valve metal on the metal substrate. The anodic film is made readily detachable from the metal by carrying out the anodization step in the presence of an adhesion-reducing agent, e.g. a fluoride. The polymer sheet, usually in the form of a thin transparent layer, is then attached to the anodic film and the anodic film is detached from the metal. The transferred anodic film forms a thin dense oxide coating on the polymer sheet that acts as a barrier against oxygen and moisture transport. The invention can be used for making packaging sheets suitable for packaging foodstuffs, and the like.

Abstract: A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 .mu.m, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 .mu.m, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm.sup.

Abstract: A method of forming a transferable pattern or image of an inorganic film by coating an embossed substrate with an inorganic layer, that may comprise one or more films, over both recessed and raised surface portions, adhesively laminating a transfer substrate to the inorganic layer coating the raised surface portions of the embossed substrate and separating the embossed substrate and the transfer substrate. The adhesive is selected such that the bond between the transfer substrate and the inorganic film on the raised surface portions is greater than the bond between the inorganic layer on the raised surface portions and the embossed substrate.The embossed substrate resulting after removal of the inorganic layer coating the raised surface portions may be modified to include additional inorganic layers over the recessed surface portions by tinning or electroplating methods such that this thickened inorganic layer may also be transferred from the embossed substrate to a transfer substrate as set forth above.

Abstract: The method involves forming a laminate capable of generating a substantially non-dichroic color by a light interference and absorption phenomenon by depositing a layer of a metal of medium light reflectivity by a vapor deposition technique on a suitable substrate, anodizing a surface of the metal in the presence of fluorine ions to form a detachable film of an oxide of the metal on the surface having a thickness suitable for color generation, and adhering a flexible strip of transparent or translucent material over the oxide film in such a manner that the strength of attachment of the flexible strip to the oxide film exceeds the adhesive strength between the oxide film and said surface of said metal.

Abstract: A method of forming printed circuits on an insulating film comprising the steps of forming a panel plating layer, plating the circuits onto the panel plating layer, applying a film to the plated panel plating layer and chemically removing the panel plating layer. In addition, the printed circuit is impressed into the film so as to form a planar surface and a protective film is placed over the film and impressed circuit. The method of making a thermocouple by this process is also disclosed.

Abstract: A metal film (12) for providing internal electrodes (22) is formed on a back film (11) made of a material such as polyethylene terephthalate by a thin film forming method such as vapor deposition or sputtering. A ceramic green sheet (14) is prepared. Then the metal film (12) is transferred onto the green sheet from the back film (11). In order to form the metal film (12) to be transferred into prescribed patterns, the metal film (12) may be partially removed from the back film (11) to leave only specific parts which are correlative with the prescribed patterns. Alternatively, only specific parts, which are correlative with the prescribed patterns, of the back film (11) may be pressed against the ceramic green sheet (14). A plurality of such ceramic green sheets (14), onto which the parts of the metal films (120 are transferred, have been stacked with each other.

Abstract: A method or technique of preparing or producing distinctive decorative graphic materials. The method utilizes commercially available transfer print foils which are in the form of a thin film including a thin lamination of metallic material which provides the coloration which can transfer to the product. The areas to which coloration is to be applied are delineated such as by embossing paper or other materials or by drawing or printing the areas. Adhesive is then applied to the delineated areas to which coloration is to be applied, and the adhesive is allowed to dry sufficiently to become tacky. A strip of the transfer print foil is then laid over the delineated areas to which adhesive has been applied and is pressed down manually. The strip is then lifted and the coloration provided by the colored metallic lamination releases and transfers to the delineated areas and is held by the adhesive. Iridescence is produced by applying one color over another.

Abstract: A process for producing an electric circuit board comprises utilizing a transfer sheet, bearing an electric circuit pattern composed of a metal foil adhered onto a sheet substrate by means of an adhesive material, and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof.

Abstract: A transfer sheet is here disclosed which is prepared by forming a highly glossy pattern layer of an ink containing a curable resin and silicon resin on the matte surface of a base sheet which is excellent in release characteristics to the thermosetting resin. In addition, a method for the preparation of a thermosetting resin decorative material is also disclosed which comprises the steps of superposing the above-mentioned transfer sheet on a resin-impregnated paper so that the pattern layer on the transfer sheet may be brought into contact with the resin-impregnated paper; then heating and pressing the resulting laminate; and after the curing of the resin in the resin-impregnated paper, releasing the transfer sheet therefrom.

Abstract: A process for producing an information carrier containing recorded audio and/or video information wherein a web of a thermoplastic material is extruded onto the patterned surface of a metal master and pressure is applied to force said thermoplastic material into contact with the metal master. The thermoplastic material is cooled to a temperature below its softening point to form an imaged thermoplastic web which is separated from the metal master. Then a thin film of metal particles is deposited on the imaged surface of the thermoplastic web and said metallized thermoplastic web is laminated with a substrate carrying an uncured coating of a radiation curable resin. The resin is cured and individual information carriers are separated from the web of information carrying laminate. A center hole is placed in the separated individual information carriers, when appropriate.

Abstract: A flexible resin layer, on the surface of which an uneven pattern corresponding to information to be recorded is formed, and a reflection layer formed on the uneven pattern of the resin layer and having light reflectivity are provided to thereby constitute a flexible optical information recording medium. Further, the resin layer is supported by a flexible supporting layer. For manufacturing such a flexible optical information recording medium, a resin liquid, which can be hardened by irradiation of ultraviolet rays or electron rays, is filled between an ultraviolet ray or electron ray transmissible base film serving as the supporting layer and an uneven pattern original block. Ultraviolet rays or electron rays are then irradiated through the base film to harden and give form to the resin liquid on the base film, thereafter to exfoliate it. For another manufacturing method, a resin layer is formed on an ultraviolet ray or electron ray transmissible base film to form a rolled transfer film.

Abstract: A foil loading apparatus (12) includes a foil lift mechanism (14) and a guide plate (20) for advancing foil material (16) along a winding foil flow path. Foil material (16) is raised on lift arm (24) from a lower position up through a confined space between a heated platen (40) and a pressing block (42) to an upper position where the foil material (16) may be accessed and fed through a remaining portion of the foil flow path.

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract: A process for preparing curable, aqueous strippable, polymeric materials for application, in succession, as masks, to a specific area of each of a plurality of printed circuit boards that is to be protected from the stripping and plating processes associated with gold finger plating, during the fabrication thereof, includes forming a coating of substantially identical, uniformly spaced, areas of polymeric material on a continuous length of carrier web, applying a cover coating over the carrier web and the uniformly spaced areas of polymeric material with the cover coating having a width substantially the same as that of the carrier film, and winding up in a roll the continuous length of carrier web and the cover coating with the uniformly spaced polymeric material sandwiched therebetween.

Abstract: The plant comprises a first vacuum plate with openings on which a sheet may be fixed in an exact planar way by suction. A second plate with a slightly arcuated surface and turned towards the first plate is adjustable in height by two compressing cylinders and is pivotingly fixed to the structure. The second plate is also a vacuum plate and may be unrolled on the first plate. During the unrolling motion, the second plate is conducted by means of retractable bolts which are engaged into corresponding openings of the first plate. To compress two sheets, a first sheet is fixed in an exact planar way to the first plate by suction and transferred by an unrolling motion of the second plate thereon, the suction force of the plate being reduced and that of the second plate being correspondingly increased. A second sheet is then fixed to the first plate and cold- or hot-compressed according to the same unrolling process as the first sheet.

Abstract: A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15).

Abstract: A hologram member is provided which comprises a substrate, and a film in which a volume type phase hologram is recorded. The film is provided peelably on the substrate. The substrate preferably has a light transmittance of 30% or more at a wavelength of from 450 to 800 nm. The film may comprise a vinylcarbazole.

Abstract: A transfer-metallization method in which a metal coating is applied to a top layer of a metallizing film, and the film is then brought into contact with a substrate such that the metal coating is transferred from the top layer to the substrate. The film is a three-layer biaxially-oriented transfer film produced by coextrusion and having a base layer of a polypropylene homopolymer and top layers applied to the two surfaces thereof. The base layer contains an additive depot of migrating monomers in an amount of 0.01 to 2.0 percent by weight, relative to the weight of the polymer constituting the base layer. The top layers are comprised of polypropylene that has a lower viscosity than the polypropylene of the base layer.

Abstract: In that a vulcanized rubber article (8), preferably of sheet or plate form and preferably having a relief pattern, in at least part of its surface, integrated in any surface area, inserted or settled into same, has been provided and vulcanized together with a rubber material (6) in the form of letters, signs, and digits in at least one color deviating from the rubber article (8) color composition, and that the rubber material (6) has a vulcanizing temperature range matching that of the rubber article (8), a hardwearing and washproof as well as distinct marking of the rubber article is obtained. A label to be used for the marking of the rubber article consists of a foil material (10) of a thickness of 10-100 micron upon which using a printing ink (11) of rubber material inverted text, figures and/or pictures have been printed.

Abstract: A metallized laminate and process of manufacture wherein a metallic layer or underlying ink layer appears in a pattern on the laminate. The method in a specific embodiment involves the steps of forming a laminate by coating a heat stable release coat onto a carrier sheet; coating an ink layer in a pattern on the heat stable release coating so that at least portions of the release coat remain uncovered with ink, and applying a metallic layer over the release coat so that at least a portion of the metallic layer is in direct contact with and adheres directly to the release coat. Portions of the metallic layer may be removed by an etchant. A heat activatable adhesive layer is applied over the metallic layer. The laminate so formed is heat transferable from the carrier sheet to an article.

Abstract: Method and apparatus for the metallization of support members, such as paper sheeting and other cellulosic products. A metallic film is transferred to the paper support from a cellulosic carrier and adhered to the paper by a thermoplastic material. The cellulosic carrier, with a releasably adhered film of metal, is brought into contact with a paper support and an intervening thermoplastic adhesive. Pressure and/or heat is applied to the composite which is subsequently cooled and the carrier stripped away to leave the desired metallic layer on the receiving surface of the paper support.This transfer procedure overcomes the objections associated with plastic carriers and is particularly suitable for metallizing support members, like paper, which are otherwise difficult to metallize.

Abstract: A heat-sensitive transfer medium comprising a support, and a transfer layer comprising a protective resin layer, a metal deposition layer and an adhesive layer, said three layers being provided in that order from the supporting side. The transfer layer of the medium can be selectively transferred to a plain paper upon heating with a thermal head to give a transfer image having an excellent metallic luster.

Abstract: A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching.

Abstract: A pattern of conductor runs is formed on a sheet of dielectric material using a carrier foil having a coating material adhered to one main surface thereof. The coating material contains particles of metal. The carrier foil is placed with its coated surface in contact with the sheet. The coating material is detached from the carrier foil over selected areas of its coated surface, and the detached coating material is adhered to the sheet.

Abstract: The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit this layer include mechanically adhering the layer to the substrate then removing portions of it to form a pattern. They also include printing adhesive on the substrate and using it to peel a conductive pattern off of the surface of a transfer agent. After depositing the first conductive pattern, the process prints an insulating layer on top of it. The insulating layer has openings through which the next conductive pattern makes electrical contact with the first. Similarly, the process places other conductive layers and prints other insulating layers between them to produce multiple layers of conductive patterns. The multilayer circuit board provided includes a substrate.

Abstract: Gilding or relief-marking process which starts with any typographic, offset or other impression and converts it into relief of variable thickness, by the known thermography principle, but employing a hot-melt powder endowing the film forming the relief with adhesive properties capable, after it has solidified, of transferring and retaining on its surface a marking material.

Abstract: Laminates comprising a film of heat-shrinkable synthetic resin and a metallic foil or metallized plastic film laminated to the resin film through a bonding layer which comprises a discontinuous layer of a synthetic resin which flows at a temperature for heat shrinkage and an adhesive layer which maintains its adhesive strength at that temperature. Upon heat shrinkage, the metallic foil or metallized plastic film will wrinkle at the portions in contact with the synthetic resin which is not highly adhesive at the temperature for heat shrinkage. The heat-shrunk laminate can be formed into a casing or container such as an electromagnetic interference shield, a packaging material, and decorative material.

Abstract: A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising(a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive,(b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and(c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leav

Abstract: A process for the production of padding layers having a high degree of thermal insulation, and particularly suitable for use in clothing and furnishing, comprises the steps of producing, by means of carding machines, a layer or web comprising a mixture of polyester fibres with silicone treated fibers of the same or different nature. This layer or web is then resin coated on one side with a mixture of sticky plastic adhesives which, when polymerized, form a very soft and elastic film; on the other side of the same layer a non-sticky adhesive is sprayed or otherwise applied and the thus treated web is then subjected to a calendering operation at a temperature varying between predetermined limits. Subsequently, a layer of metal particles embedded in synthetic resins is applied to one or both sides of the said layer in such a way as to form a thermal barrier operable to reduce the transmission of heat by radiation and convection through the layer itself.

Abstract: A polyimide film formed by using a symmetrical aromatic meta-substituted primary diamine and a symmetrical aromatic para-substituted primary diamine as raw materials in a specific proportion has excellent heat resistance, electrical properties, flexibility and the like. Such a polyimide film can be bonded to a metal foil not by using any adhesive, but by coating the metal foil with a polyamic acid constituting a precursor of the polyimide and further reacting the polyamic acid to convert it to the polyimide. In this manner, there can be obtained a flexible laminate for printed-circuit board comprising a polyimide film bonded to a metal foil with good adhesion and exhibiting excellent properties as described above.

Abstract: A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.

Abstract: A method for transferring a dielectric mirror prepared on an optical flat replication substrate to a utilization device having a nonflat surface. In order to separate the replication substrate from the mirror after the mirror has been cemented to the device at room temperature and the cement allowed to cure over an extended time period, the composite assembly is inserted into a fixture which provides a buckling force to the center of the replication substrate to cause the replication substrate to be peeled from the mirror.

Abstract: An electrosensitive substrate from which a metallized surface layer is selectively removed using electrosensitive printing to expose a patterned underlayer. The patterned underlayer may be randomly exposed, or exposed in prescribed portions. Tags, labels or the like of this description may be electrically imprinted with unique identification codes, such as serially printed alphanumeric characters. Such tags and labels resist duplication by conventional printing techniques. The patterned underlayer may be imprinted using inks of a variety of surface textures, resulting in an embossed effect in the metallized surface. Alternatively, a lacquer layer may be provided between the patterned layer and the metallized surface to achieve a uniform appearance of the metallized surface.

Abstract: To prevent the growth of aquatic animals and plants on the surfaces of underwater structures, the surfaces are covered with a protective adhesive sheet comprised of a copper-nickel alloy plate having a weight ratio of copper:nickel in the range of 100:0 to 80:20, a primer layer formed on the alloy plate, and a pressure-sensitive adhesive layer formed on the primer layer. Prior to applied the adhesive sheet, the surface to be protected is preferably cleaned and coated with a primer of the same composition as that of the primer layer of the adhesive sheet.

Abstract: Method of selectively forming an aluminum evaporation film on a surface such as the surface of a container made of plastic film, paper, or glass and of stamping the aluminum evaporation film, by building up the aluminum evaporation film, effecting the stamping work on the aluminum evaporation film or providing the aluminum evaporation film on the surface of a container such as a glass bottle, such as by forming the aluminum evaporation film on one of two films or sheets, applying a hardenable or curable bonding agent meeting or in registry with letters and/or patterns provided on the other of the two films or sheets, then pasting up or joining the two films or sheets together, and thereafter when the bonding agent has hardened, separating the two films or sheets from each other and shifting the aluminum evaporation film to the bonding agent side containing film or sheet.

Abstract: Method and apparatus for the metallization of support members, such as paper sheeting and other cellulosic products. A metallic film is transferred to a preheated paper support from a plastic sheet carrier and adhered to the paper by a thermoplastic material. The carrier is typically of stabilized plastic with a releasably adhered film of metal. Separate metallic films may be transferred simultaneously from opposite sides of a preheated plastic sheet carrier to separate, preheated paper supports. Pressure is applied to the composite which is cooled, desirably by chilling, and the carrier stripped away to leave the desired metallic layer on the receiving surface of the paper support.This transfer procedure overcomes the objections associated with metal foil laminates and is particularly suitable for metallizing support members, like paper, which are difficult to metallize directly because they release significant amounts of vapor during conventional vacuum metallization.

Abstract: A process for producing an information carrier containing recorded audio and/or video information wherein a web of a thermoplastic material is extruded onto the patterned surface of a metal master and pressure is applied to force said thermoplastic material into contact with the metal master. The thermpolastic material is cooled to a temperature below its softening point to form an imaged thermpolastic web which is separated from the metal master. Then a thin film of metal particles is deposited on the imaged surface of the thermoplastic web and said metallized thermpolastic web is laminated with a substrate carrying an uncured coating of a radiation curable resin. The resin is cured and individual information carriers are separated from the web of information carrying laminate. A center hole is placed in the separated individual information carriers, when appropriate.

Abstract: A thin metal layer with a thickness of 1 to 5 .mu. is formed electrolytically (S2) on an electrically conductive single-plate substrate having a predetermined roughness, a resist mask is formed (S3) on the surface of the thin metal layer, and a conductor circuit is then electroformed thereon (S4) using copper. After the surface of the conductor circuit is roughened (S5), the conductor circuit, along with the single plate and the interposed thin metal layer, is stacked on an insulating substrate for lamination, and the individual layers are adhered integrally to one another by the application of heat and pressure (S7). Then, the single plate only is peeled off (S8), and the exposed thin metal layer is removed by etching (S9). The thin metal layer and the conductor circuit are electroplated under high-speed conditions including a solution contact speed of 2.6 to 20 m/sec and a current density of 0.15 to 4.0 A/cm.sup.

Abstract: A method is provided to bond strain gauges 6 to various materials. First, a tape 9 with an adhesive backing 10 is placed across the inside of fixture frame 8. Strain gauge 6 is flatly placed against adhesive backing 10 and coated with a thin, uniform layer of adhesive 5. Tape 9 is then removed from fixture frame 8 and placed, strain gauge side down, on the material to be tested. If the material is a high reluctance material 12, induction heating source 20 is placed upon tape 9. If the material is a low reluctance material 13, a plate 23 with a ferric side 21 and a rubber side 22 is placed, ferric side down, onto tape 9. Induction heating source 20 is then placed upon rubber side 22. If the material is an insulator material 14, a ferric plate 7 is placed on tape 9. Induction heating source 20 is then placed on ferric plate 7.

Abstract: Laminates comprising a film of heat-shrinkable synthetic resin and a metallic foil laminated to the resin film through a bonding layer which comprises a discontinuous layer of a synthetic resin which flows at a temperature for heat shrinkage and an adhesive layer which maintains its adhesive strength at that temperature. Upon heat shrinkage, the metallic foil will wrinkle at the portions in contact with the synthetic resin which is not highly adhesive at the temperature for heat shrinkage. The heat-shrunk laminate can be formed into a casing or container such as an electromagentic interference shield, a packaging material, and decorative material.

Abstract: A photoetching method for processing a thin metal sheet to produce apertured shadow masks. The disclosed method utilizes a supporting layer for supporting a metal sheet. A photoresist layer is formed on the metal sheet for defining pattern images. An etching solution is supplied to metal sheet surfaces exposed through voids of the photoresist layer defining the pattern images to etch the metal surfaces. Then the photoresist layer is removed from the metal sheet, and the metal sheet is removed from the supporting sheet. The resulting metal sheet constitutes a shadow mask having a multiplicity of apertures. Productivity may be doubled by applying two metal sheets to opposite faces of the supporting sheet, respectively, and processing both metal sheets simultaneously.

Abstract: An improved procedure for manufacture of optical replication products comprising the use of a thin amorphous coating of carbon as a protective coating which also facilitates release during replication, between master and replication members. Particular attention is given to controlling the compressive forces of the carbon layer to provide good mechanical coatings on suitable optical surfaces. Thereafter, the replicated members may themselves be coated with the carbon as a protective coating only or for further use as a release-promoting "submasters".

Abstract: A process which provides a three-dimensional, light-diffracting pattern comprising a hologram on a surface of a transparent material layer which may be extremely thin and non-self-supporting, and which secures this layer to a document or like substrate, with the pattern-bearing surface facing downwardly (i.e., not exposed), by an adhesive bond having a shear strength greater than that of the transparent layer so that the layer cannot be removed from the surface without being destroyed.

Abstract: The present invention is directed to a method for selectively transferring metallic foil and xerographic images on a receiving substrate such as paper. The method generally comprises providing a transfer sheet (including a metallic film) and a receiving substrate (including xerographic images disposed thereon.) The receiving substrate is placed in face-to-face contact with the transfer sheet to form a sandwich with the xerographic images on the inside. the sandwich is then fed through an apparatus, where heat and pressure are applied, causing the xerographic images to tackify and causing the metal film from the transfer sheet to selectively adhere to the xerographic images.

Abstract: The present invention describes an improved reverse lamination process for reparing printed circuits with resistors, conductor strips and/or contacts integrated in the circuit. A separating layer is applied on a metallic intermediate carrier. The intermediate carrier thus coated is then printed with a conductive paste in a desired. mirror-inverted layout to provide the resistors, conductor strips and/or contacts. This is followed by the lamination which is carried out under temperature effect and under pressure, the thus laminated package comprising the intermediate carrier, an intermediate layer and the final substrate. The intermediate carrier is subsequently removed, and the separating layer is etched off. The separating layer acts as a parting agent to permit easy mechanical separation and reuse of the metallic intermediate carrier.

Abstract: A method for the preparation of selectively decorated resin films comprises applying a first primer coat to the entire area of the base film, then applying either a masking coat alone or one or more color coats followed by the masking coat, the masking coat applied to an area of the base film that will define the final selective decoration. The masking coated surface is thereafter metalized and the resulting composite is joined to a mask-removing film bearing a pressure-sensitive adhesive having a limited peel strength known as "soft peel". The process is completed by the separation of the respective films, with the mask removing film withdrawing from the base film the unwanted portions of the metal coat and its underlying masking coat, to leave a crisp, patterned decoration.The present process requires no solvents and is therefore environmentally preferred.

Abstract: Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.

Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester of anhydride of such acid. The epoxy resin composition can also contain a bisphenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.