Metal Foil Lamina Patents (Class 156/233)
  • Patent number: 7459047
    Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: December 2, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
  • Patent number: 7459051
    Abstract: A method and an apparatus for automated application of paint film to bodywork parts (1) and to a paint film composite (5) which is suitable for automation. A paint film composite (5) which is suitable for automation is created and adhesively bonded onto the bodywork part (1) in an accurate position and without any bubbles or creases by means of a robot-controlled application tool that is appropriate for this purpose. To securely hold the film composite (5), which has been picked up from a substrate, the suction grippers (30, 31) which grip the ends are angled in mirror-image form, in order in this way to prevent the ends from becoming detached from the suction grippers. The lower protective strip (9) is then at least partially pulled off, thus exposing the adhesive face of the useful part (6) of the paint film. The film composite (5) is aligned in the correct orientation at a short distance from the bodywork part (1) and the useful part (6) of the paint film is wiped onto the bodywork surface (1).
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: December 2, 2008
    Assignee: Daimler AG
    Inventors: Uwe Habisreitinger, Bernhard Nordmann
  • Publication number: 20080271836
    Abstract: For transferring a coating in the form of a desired image coating from a backing film to a printed sheet, an adhesive layer in the form of the desired image is applied to the printed sheet. The transfer foil comprising the image-type coating is rolled over the printed sheet using contact pressure in a coating unit (2), in such a way that the coating adheres to the adhesive sections, thus forming an image. To improve the flexibility of this application in a printing press, either the coating unit or the adhesive application unit (1) and the coating unit (2) are located in one or more coating modules of a printing press, thus producing a simple, compact film transfer module (F).
    Type: Application
    Filed: April 6, 2005
    Publication date: November 6, 2008
    Applicant: MAN ROLAND DRUCKMASCHINEN AG
    Inventors: Franz-Peter Richter, Jurgen Scholzig
  • Patent number: 7410551
    Abstract: The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect of radiation, a backing layer, and a layer of decoration, the varnish layer being situated between the backing layer and the decoration layer; bringing said multilayer structure into contact with the article; applying pressure and heat to the backing layer at the location where it is desired to transfer the decoration layer onto the article, the varnish layer being such as to be transferred locally onto the article together with the decoration layer; withdrawing the backing layer; and causing the layer of varnish that has been transferred onto the article to harden by exposing it to said radiation.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: August 12, 2008
    Assignee: L'Oreal
    Inventor: Alain Bethune
  • Patent number: 7404869
    Abstract: A method for producing a laminated material, which comprises providing a raw material roll containing a support layer, drawing out a support layer in a web form from the raw material roll, transferring a silver-based thin film layer on an inner face of the inside of the support layer including a zone to be heat-sealed by the high frequency induction heating for the formation of a container, prior to or after the transferring step, laminating a heat-sealable inner layer on the inside of the support layer, printing the design of the container on the outside of the support layer in a long web form, and forming one or more thermoplastic layers of the same type or different types, at the same time or sequentially, on the outside and the inside of the printed support layer in a web form. The method allows a sealing zone to be formed so as to have an antibacterial atmosphere.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: July 29, 2008
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventor: Peter Frisk
  • Publication number: 20080124566
    Abstract: A component that is rigid and three-dimensional and has a relatively low mass. The component has a foil body formed of a metal or metal alloy matrix that is embedded with ultra-hard particles or grit, such as diamond and/or cBN. It can be used in applications where a combination of high rigidity and low mass is required, such as in audio applications, for example.
    Type: Application
    Filed: November 25, 2005
    Publication date: May 29, 2008
    Inventors: Clint Guy Smallman, Geoffrey Alan Scarsbrook, Geoffrey John Davies, John Robert Brandon
  • Patent number: 7192641
    Abstract: An embossing foil (100) for transferring labels (2) to documents of value (1) includes at least a carrier foil (10), a label layer (20) and an adhesion promoter layer (30). The dimensions of the adhesion promoter layer (30) are limited to the contour of the labels (2) to be transferred from the embossing foil (100).
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: March 20, 2007
    Assignee: Giesecke & Devrient GmbH
    Inventor: Lars Hoffmann
  • Patent number: 7141185
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: November 28, 2006
    Assignee: Parelec, Inc.
    Inventors: Brian F. Conaghan, Paul H. Kydd, David L. Richard
  • Patent number: 7077927
    Abstract: A method of applying an edge electrode pattern to a touch screen. The method includes depositing, on a first surface of a decal strip, conductive material in the form of an edge electrode pattern, placing the first surface of the decal strip on one edge of a touch screen, applying heat and pressure to an opposite surface of the decal strip until the edge electrode pattern is transferred from the first surface of the decal strip to the touch screen; and removing the decal strip.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: July 18, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Frank J. Bottari, Andrea C. Marble
  • Patent number: 7025847
    Abstract: The present invention provides a new sheeting article that may suitably include: a carrier having a first major surface and a second major surface; and a plurality of discrete segments of a sheeting (e.g., a retroreflective sheeting), wherein the sheeting has a first major viewing surface and a second major opposing surface, and the first major viewing surface of the sheeting is preferably removably attached to the second major surface of the carrier. Preferably, the first major surface of the carrier comprises a release surface, the second major opposing surface of the sheeting comprises an adhesive, the article is provided in the form of a roll, and the adhesive surface of the sheeting is adjacent the release surface of an adjacent layer of the roll. In a presently preferred embodiment the present invention provides novel easy-to-use truck conspicuity sheeting.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: April 11, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Eugene H. Carlson, James C. Coderre, Christopher L. Harvey, James E. Lasch, David W. Meitz, Colleen C. Nagel
  • Patent number: 6993830
    Abstract: A method of manufacturing a key top for a push-button switch according to the present invention includes forming a hot-melt adhesive layer on a resin key top so as to have a shape corresponding to a display portion for displaying a letter, symbol, or other indicia, and transferring a metallic thin film layer onto the hot-melt adhesive layer. Therefore, the metallic thin film layer is not damaged due to coating of the hot-melt adhesive layer, and positioning of the display portion is unnecessary. Further, when a transfer resin layer is formed on the metallic thin film layer, oxidation of the metallic thin film layer or damages thereto can be prevented.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: February 7, 2006
    Assignee: Polymatech Co., Ltd.
    Inventors: Masanori Shimizu, Kazuo Kikuchi
  • Patent number: 6971167
    Abstract: A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P5p, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: December 6, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Nishikawa, Norihito Tsukahara, Hiroyuki Otani
  • Patent number: 6962641
    Abstract: An arts and crafts material having a foil pattern imprinted thereon. In one embodiment, the arts and crafts material of the present invention includes a sheet of foil substantially uniformly adhered to a corresponding sheet of base material such as foam. Once the foil sheet is secured to the base material, the foil sheet is peeled back to disclose the foil sheet's coating transferred onto the base material. The base material is preferably resiliently compressible. Portions of the sheet of arts and crafts material maybe cut to form particular shapes such as body and tail portions of fishing flies.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 8, 2005
    Inventors: Blane L. Chocklett, Harrison R. Steeves
  • Patent number: 6956098
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 18, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John Donald Summers, Richard Frederich Sutton, Jr., Brian Carl Auman
  • Patent number: 6943447
    Abstract: A thin film multi-layer wiring substrate comprising a plurality of wiring layers, each adjacent pair of wiring layers being separated by an insulating layer, wherein at least one of the wiring layers includes wiring formed by an inner conductor member and a conductor layer surrounding the periphery thereof through an insulating material.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: September 13, 2005
    Assignee: Fujitsu Limited
    Inventors: Yoshikatsu Ishizuki, Nobuyuki Hayashi, Masataka Mizukoshi, Yasuo Yamagishi
  • Patent number: 6899781
    Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 ?m or less, can be prepared that is otherwise difficult to prepare using conventional methods.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: May 31, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Koichi Yomogida, Hidemi Nawafune
  • Patent number: 6866739
    Abstract: In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: March 15, 2005
    Assignees: Kyocera Corporation, Sekisui Chemical Corporation
    Inventors: Akihiko Nishimoto, Katsura Hayashi, Yasuhiko Ohyama, Shigeru Danjo, Kazuhiro Shimomura
  • Publication number: 20040265551
    Abstract: A resinous material, or a composite material obtained by mixing a resin and a powdery functional material is formed into a thin sheet to make a core substrate 1. A patterned thin-film conductor 2 is formed by thin-film forming technology on at least either of the front and rear surfaces of the core substrate 1. Clothless layers 3a to 3d are super-posed on at least that surface of the core substrate 1 on which the thin-film conductor 2 has been formed. Each clothless layer is formed from a resin-coated metal foil obtained by coating one surface of a metal foil with a resinous material, or a composite material obtained by mixing a resin and a powdery functional material. Conductor layers 4a to 4d obtained by patterning the metal foils are formed on the clothless layers 3a to 3d.
    Type: Application
    Filed: April 22, 2004
    Publication date: December 30, 2004
    Applicant: TDK CORPORATION
    Inventors: Minoru Takaya, Toshikazu Endo
  • Publication number: 20040265549
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Application
    Filed: March 17, 2004
    Publication date: December 30, 2004
    Inventor: Paul H. Kydd
  • Publication number: 20040231782
    Abstract: A counterfeit-proof metal foil is textured in at least a given partial area of its surface, this partial area having a radiation refraction value which is different compared to the remaining surface area. The metal foil is suitable as a packaging material, among others for medications. The manufacturer or the consumer can check based on the given surface structure which is intended as an identification sign whether he has acquired an uncounterfeited product. If texturing takes place on most of the surface of the metal foil, this is identical to the appearance of a printed picture so that the metal foil as claimed in the invention is likewise used as a decorative foil or an advertizing medium.
    Type: Application
    Filed: June 2, 2004
    Publication date: November 25, 2004
    Inventors: Engelbert Scharner, Helmut Kloss, Adolf Schedl, Wilhelm Zuser, Lambert Nekula
  • Patent number: 6808578
    Abstract: A method for manufacturing a ceramic circuit substrates having a high-density conductive pattern, as its internal conductor, formed by a film-intaglio-transfer-printing method is provided. The conductive pattern is temporarily transfer-printed on a heat-resistant substrate coated with an adhesive layer. An un-sintered ceramic green sheet is stacked on a surface of the conductive patterns of the heat-resistant substrate, and then, the conductive pattern is transfer-printed again onto the un-sintered ceramic green sheet like being embedded by heat-pressing. Consequently, the conductive pattern is formed on the green sheet. This then has a binder removed and is sintered, and provides the ceramic circuit substrate having the fine, high-density conductive patterns, as the internal conductor, formed by the film-intaglio-transfer-printing method.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: October 26, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Akira Hashimoto
  • Publication number: 20040202829
    Abstract: This and other objects are achieved by providing a security image on a substrate. The security image is formed by first stamping or otherwise transferring a first foil section on a substrate wherein the first foil section has a first sheen. A second and optionally subsequent foils are stamped or otherwise transferred over the first foil section in the form of an image or pattern. The second or subsequent foils are of a different sheen than the first foil.
    Type: Application
    Filed: May 3, 2002
    Publication date: October 14, 2004
    Inventor: John Michael Zercher
  • Publication number: 20040185275
    Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Inventor: Gordon C. Smith
  • Patent number: 6780267
    Abstract: A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: August 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Kuramitsu, Atsuo Nagai, Yoshiya Sakaguchi
  • Patent number: 6776864
    Abstract: A process, which comprises forming a metal micro-pattern on the surface of an inorganic substrate, surface-treating the surface of the metal micro-pattern and the surface of the plastic substrate to make it chemically reactive, and bringing the metal micro-pattern into contact with the surface of the plastic substrate to transfer the metal micro-pattern from the surface of the inorganic substrate to the surface of the plastic substrate, can be easily and simply carried out using conventional equipments to produce one or more metal pattern fixed on a plastic material.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: August 17, 2004
    Assignee: Postech Foundation
    Inventors: Jong Hoon Hahn, Yong Min Park, Young Chan Kim, Bong Chu Shim
  • Publication number: 20040144479
    Abstract: A technique is disclosed for transferring images from a hot stamping foil or other physical transfer elements to a substrate wherein the adhesive used to attach the foil to the substrate is a solid, radiation-curable resin which is cured by radiation to form a tenaciously adhered bond between the substrate and the information transferred. The resulting bond is resistant to solvents, chemicals, detergents, heat and mechanical stresses likely to be encountered in the use of substrates.
    Type: Application
    Filed: January 23, 2003
    Publication date: July 29, 2004
    Inventor: Peter Cueli
  • Patent number: 6752891
    Abstract: A glass panel having a simulated metal strip applied thereto in a decorative pattern, and a method for making a glass panel having a simulated metal strip applied thereto in a decorative pattern, including a flat panel of glass, a raised bead of air-curable acrylic resin applied in a prescribed pattern to at least one surface of the flat panel of glass, and a metal film overlying the bead of acrylic resin.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: June 22, 2004
    Assignee: Glass Unlimited of High Point, Inc.
    Inventor: Keith L. Eichhorn
  • Patent number: 6743320
    Abstract: An optical disk is manufactured by bonding a resin stamper having, on a principal plane, asperity pits on which a thin film is formed and a second substrate having a thickness of 0.3 mm or less with radiation cured resin such that the asperity pits face to the second substrate. The resin stamper is peeled off after curing the radiation cured resin to form asperity pits on the second substrate. A metal film is formed on the asperity pits on the second substrate to attain an information recording layer on the second substrate. A first substrate having an information recording layer and the second substrate having the formed information recording layer are bonded such that the both information recording layers face each other.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: June 1, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuya Hisada, Kazuhiro Hayashi, Eiji Ohno
  • Patent number: 6743319
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: June 1, 2004
    Assignee: Paralec Inc.
    Inventor: Paul H. Kydd
  • Patent number: 6703565
    Abstract: A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: March 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
  • Patent number: 6702916
    Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: March 9, 2004
    Assignee: Honeywell International Inc.
    Inventor: Gordon C. Smith
  • Publication number: 20040040645
    Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.
    Type: Application
    Filed: May 9, 2003
    Publication date: March 4, 2004
    Applicant: 3M Innovative Properties Company
    Inventor: Frank J. Bottari
  • Patent number: 6694602
    Abstract: A method is presented for manufacturing laminate tile metal pole pieces for an MRI. Each laminate tile has a trapezoidal or annular sector shape. The trapezoidal shape allows the tiles to be attached side by side to form a multiple concentric annular array pole piece without using oddly shaped edge filler tiles needed to fill a circular pole piece with square tiles. The pole piece is made by placing a plurality of tiles into a mold and filling the mold with an adhesive substance to bind the plurality of tiles into a unitary tile body. The unitary tile body is then removed from the mold and attached to a pole piece base to form the pole piece. The mold cavity surface preferably has a non-uniform contour. The bottom surface of the unitary tile body forms a substantially inverse contour of the mold cavity surface contour.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: February 24, 2004
    Assignee: General Electric Company
    Inventors: Evangelos T. Laskaris, William D. Barber, Bulent Aksel, Paul S. Thompson, Michele D. Ogle
  • Patent number: 6696677
    Abstract: A method for providing a microwave-shield on the cover member of a microwavable food tray having different foods therein requiring different degrees of microwave irradiation is provided. The method includes providing an adhesive label directly to a cover member of the food tray in register with one of the food products in the tray. The cover member is provided on the food tray from a sheet of cover material having a plurality of microwave shields pre-applied thereto at discrete intervals.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: February 24, 2004
    Assignee: Rock Ridge Technologies, Co.
    Inventor: Michael Kennedy
  • Patent number: 6679968
    Abstract: A laser laminar structure is formed by coating each side of a thin substrate with a bonding resin layer, and then coating each bonding resin layer with a molding resin layer; attaching a transparent laser film provided with fine grooves of a laser image presenting figure, characters or logos to an outer surface of each molding resin layer, so that each molding resin layer is formed at superficial portion with fine lines corresponding to the fine grooves of the laser image on the laser film; baking the molding resin layers at high temperature to harden the fine lines formed thereon; and releasing the transparent laser films from the molding resin layers to provide a thermostable laser laminar structure.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: January 20, 2004
    Assignee: K Laser Technology, Inc.
    Inventor: Cheng-Hsiu Chen
  • Patent number: 6666943
    Abstract: A device is formed by transferring a film onto a substrate when the film requires but the substrate is not adapted to a high temperature heat treatment process. The film having layers and formed on a first substrate having layers is transferred onto a second substrate having layers. The method of transferring the film comprises a first step of forming a lift-off layer and the film to be transferred on the first substrate, a second step of bonding the film to be transferred to the second substrate and a third step of separating the film to be transferred from the first substrate by etching the lift-off layer and transferring it onto the second substrate.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: December 23, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takatsugu Wada, Hidetoshi Nojiri, Masatake Akaike, Takehiko Kawasaki, Rei Kurashima, Satoshi Nozu, Kozo Hokayama
  • Patent number: 6663935
    Abstract: The present invention relates to a multi-layered disc-shaped information recording medium having a plurality of signal recording layers each carrying information signals. In preparing the recording medium, a first substrate obtained on punching a sheet obtained in turn by having a signal recording pattern transcribed on it from a first stamper and by forming a semi-transparent film on a signal surface is bonded to a second substrate obtained on injection molding a synthetic resin material. The second substrate is prepared by having transcribed to it a signal recording pattern formed on a second stamper provided on an injection molding device. A reflective film is formed on a signal surface having the transcribed second substrate. The first and second substrates are bonded together on their signal recording layers by a transparent adherent layer.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: December 16, 2003
    Assignee: Sony Corporation
    Inventors: Toshiyuki Kashiwagi, Takeshi Yamasaki, Motohiro Furuki, Tomomi Yukumoto
  • Patent number: 6652697
    Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: November 25, 2003
    Assignee: Pioneer Technology Engineering Co., Ltd.
    Inventor: Chien-Hsin Ko
  • Patent number: 6627021
    Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tsuyoshi Tatsukawa, Hiromichi Tokuda
  • Patent number: 6605174
    Abstract: A method for producing a printed image having a region that is foil printed comprising: printing at least one region of the image with a toner; printing the region of the image to be foil printed with a foiling adhesive that sticks to a foil on a printing foil, which adhesive has a melting temperature lower than the melting temperature of the toner, and pressing the printing foil to the image and heating the printing foil to a temperature greater than the melting temperature of the foiling adhesive and less than the melting temperature of the toner.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: August 12, 2003
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Benzion Landa, Ishaiau Lior, Itzhak Ashkenazi, Peretz Ben Avraham
  • Patent number: 6565694
    Abstract: Laminating a pre-press proof (200) onto a coated metal plate (340), consisting of the steps of: laminating a pre-laminate sheet (240) to a coated metal plate (340). Removing the first support layer (150) forming a pre-laminated receiver stock (230). Creating an imaged receiver sheet (140) laminating the imaged receiver sheet (140) to the pre-laminated receiver stock (230) thereby encapsulating the representative image (290) and removing the second support layer (170) forming a pre-press proof (200) onto a coated metal plate (340).
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: May 20, 2003
    Assignee: Eastman Kodak Company
    Inventors: Roger S. Kerr, David A. Niemeyer, Larry R. Gartz
  • Patent number: 6562172
    Abstract: A method for decorating a vitreous substrate with a radiation curable ink composition, comprising applying an ink composition comprised of an N-vinyl lactam to the glass in a predetermined design, the ink being operable when cured to bond to the vitreous substrate, curing the ink on the vitreous substrate by exposing it to the radiation by which it is curable, thereby bonding the ink composition to the substrate; and a method for decorating a vitreous substrate with hot stamping foil comprising applying an ink composition comprised of an N-vinyl lactam to the glass in a predetermined design, the ink being operable when cured to bond to the vitreous substrate, curing the ink on the vitreous substrate by exposing it to the radiation by which it is curable, thereby bonding the ink composition to the substrate, pressing a sheet of hot stamping foil against the substrate with a die heated to a temperature sufficient to cause a portion of the hot stamping foil to adhere to the heated, cured, ink design but not to t
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: May 13, 2003
    Assignee: Deco Patents, Inc.
    Inventors: Melvin Edwin Kamen, Ming Hu
  • Patent number: 6551433
    Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: April 22, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Fujio Kuwako, Tomohiro Ishino
  • Publication number: 20030070747
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 17, 2003
    Inventor: Paul H. Kydd
  • Patent number: 6543130
    Abstract: The invention relates to a method and device for producing printed circuit boards and electric conductors. The inventive device comprises a station where a conductive layer is fixed to a support material, a cutting station, connected to the first station so that the conductive layer can be cut to form a conductor and a station where cuttings are removed.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: April 8, 2003
    Assignee: Schober GmbH
    Inventor: Klaus Wittmaier
  • Patent number: 6544369
    Abstract: Thin film-like material that has printability, that can have unique surface patterns of various kinds, and that can have a design having an effect that has been never produced, and process of producing it are provided. The thin film-like material has a laminated structure in which an adhesive layer and a metal thin layer are laid in this order on the entire surface or parts of the surface of one or each of opposite sides of a base material A surface of the metal thin layer is formed by transfer process as a smooth surface having a mirror pattern, a surface having a mat pattern, a surface having a hairline pattern, a surface having an embossed pattern, a surface having a hologram pattern or a surface having two or more of those patterns combined appropriately.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: April 8, 2003
    Assignees: Japan Tobacco Inc., JT Prosprint Co., Ltd.
    Inventors: Yoshinori Kitamura, Shigenobu Matsumoto
  • Patent number: 6531016
    Abstract: Described is a process for the region-wise transfer of a decorative layer of a transfer foil, which includes an activatable adhesive layer from a carrier film onto a substrate, wherein the adhesive layer of the transfer foil is partially activated before the actual stamping operation, more specifically in such a way that the adhesive layer experiences activation only in the surface regions in which the decorative layer is to be transferred onto the substrate. A transfer foil which is particularly suitable for that process has an absorption layer in the surface regions of the decorative layer, which are to be transferred onto the substrate, which absorption layer absorbs the radiation energy causing activation of the adhesive layer and activates the adhesive layer under the action of the absorbed radiation energy.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: March 11, 2003
    Assignee: Leonhard Kurz GmbH & Co.
    Inventors: Klaus Weber, Ludwig Brehm
  • Patent number: 6524418
    Abstract: A method of production of a multilayer optical recording medium capable of avoiding difficulties in separating a stamper and forming a semi-transparent film on a thin flexible film and a production method thereof, comprising steps of forming a first optical recording layer on a substrate formed with a pattern of irregularities for a first optical recording layer on a surface thereof, forming a transfer substrate comprised of an acrylic resin formed with a pattern of irregularities on a surface thereof, forming a second optical recording layer on the pattern of irregularities of the transfer substrate, adhering a flexible film at the upper portion of the second optical recording layer by an adhesive layer, separating the second optical recording layer and the transfer substrate at their boundary to transfer the second optical recording layer to the flexible film, and bonding together the first optical recording layer and the second optical recording layer with them facing each other.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Sony Corporation
    Inventors: Takeshi Yamasaki, Tomomi Yukumoto, Toshiyuki Kashiwagi, Yuji Akiyama, Eijiro Kikuno
  • Patent number: 6521068
    Abstract: For the purpose of producing a method for detaching a segment—disposed on a carrier—from a material layer extending in a layer plane and having a specific layer thickness, by means of a laser pulse passing through the carrier in such a way as to detach segments from a material layer with as little thermal stress and as few thermal secondary effects as possible, it is proposed that the laser pulse within a segment layer-component volume butting against the carrier, the said layer-component volume lying in the plane of the layer within an extent of the beam cross-section of the laser pulse and extending transversely to the layer plane via a part of the layer thickness, produces superheated matter of a density similar to the solid state in a state of thermodynamic non-equilibrium and in particular at a temperature above the critical temperature, and that a cohesive, solid partial layer remains in the segment on the side of the layer-component volume opposite to the carrier, the said partial layer bei
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: February 18, 2003
    Inventors: Arnd Menschig, Ralf Baehnisch, Bernd Huettner
  • Patent number: 6514365
    Abstract: A process for forming a light-reflecting bar code on an end disc of photographic film spool is performed by the steps of placing on the end disc of photographic film spool a hot-stamp film comprising, in order, an adhesive layer, a light-reflecting metal layer, a transparent protective layer, a releasing layer, a support film, and a stain-shielding layer formed of material inhibiting migration of a compound having a low molecular weight from the support film (e.g., compound having a siloxane bonding or deposited inorganic oxide) in such manner that the adhesive layer is brought into contact with the end disc, and pressing for 0.1 to 2.0 seconds a stamper having a heated bar code-stamping die, so as to transfer the light-reflecting metal layer onto the end disc in the form of the bar code.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: February 4, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akira Tomita, Takao Uchida