Abstract: An apparatus and method for controlling radial runout between stacked disk portions (14, 18) and providing a cylindrical pin (20) having at least two diameters (22, 24). The pin is dimensioned and configured to permit the disk portions, which have different center hole dimensions, to be indexed such that a center hole of each disk portion is received by a separate diameter of the pin. The disk portions are maintained in spatial relationship as provided by the pin by spot curing a portion of the adhesive.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.

Abstract: The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates.

Abstract: A fabricating method of a flexible display device includes forming first and second jig substrates that have a first groove and a second groove formed in a lower part of an edge of the first groove; spreading an adhesive over the second groove; fixing first and second flexible substrates to the first groove and the adhesive; fabricating an upper array substrate on the first flexible substrate and a lower array substrate on the second flexible substrate; bonding the upper array substrate to the lower array substrate and injecting a liquid crystal; and peeling the first and second flexible substrates from the first and second jig substrates.

Abstract: Embodiments of the disclosed technology disclose a method for fixing glass substrates and a method for preparing a flexible display device. The method for fixing glass substrates comprises coating an edge portion of a first glass substrate corresponding to a second glass substrate with epoxy resin and screeding the coated epoxy resin layer, adhering the second glass substrate to the first glass substrate, and annealing the two glass substrates. With the technical solution of this disclosed technology, the time period for fixing the adhered glass substrates can be reduced with an improved productivity.

Abstract: An activating treatment method for an optical film includes feeding the optical film along a roll, and subjecting the optical film to the activating treatment from a side of the optical film that is opposite to a side of the optical film at which the roll is located. The activating treatment is conducted while the roll is cooled.

Abstract: A system for producing a pultruded component includes a fixture for providing fibrous reinforcements, a system for providing a polymeric resin, and an impregnation die for coating the fibrous reinforcements with the polymeric resin precursor. The impregnation die includes a first chamber and a second chamber. The fibrous reinforcements include fiber tows made of a plurality of fibers. The system also includes a curing die for forming the pultruded component. The first chamber of the impregnation die is configured for coating exterior surfaces of the fiber tows with the polymeric resin precursor. The second chamber of the impregnation die is configured for coating the plurality of fibers within the fiber tows with the polymeric resin precursor.

Abstract: A photocurable adhesive composition is disclosed herein that has high adhesive strength and optical clarity and which in the cured state is reworkable and exhibits low propensities for exhibiting glow mark and pooling effects. The composition contains a chain transfer agent, an urethane (meth)acrylate having a plurality of ethylenically unsaturated groups, a (meth)acrylate monomer and a photoinitiator. The composition may optionally contain a light stabilizer.

Abstract: An adhesive article is described that is debondable from substrates or adherends with the application of heat.

Abstract: The present invention is an optical bonding layer including an optical film and a liquid optically clear adhesive positioned adjacent the optical film. The optical film is one of an optically clear film adhesive, a stretch releasable optically clear contrast enhancement film and a stretch releasable carrier film. The optical bonding layer has a transmittance of at least about 75%.

Abstract: Provided is a jig having a structure that differs from conventional jigs and enables flat plates to be bonded while suppressing an air bubble formation. A flat-plate bonding jig is provided with the following: a first surface; a second surface that is on the opposite side of the first surface, has a plurality of suction holes for sucking a flat-plate, and is curved outward in a substantially arc shape; a main body connecting the first surface and the second surface; and a communication means that is disposed in the main body and allows the suction holes to communicate with a suction means.

Abstract: An inkjet head including a substrate configured to discharge ink including a supporting surface formed of a resin material and configured to support the substrate, the supporting substrate including a portion continuing to a surface intersecting the supporting surface and forming a corner portion, the portion forming the corner portion including a non surface treated area which is not surface treated, the supporting surface including a portion adjacent to the non surface treated area being surface treated areas which is surface treated, wherein the substrate and the supporting surface are bonded via an adhesive agent disposed in the non surface treated area and the surface treated area.

Abstract: The present disclosure provides a microlens laminate having a protected surface and exhibiting excellent appearance. The microlens laminate is capable of providing a composite image that floats above, in the plane of and/or below the laminate. The microlens laminate includes (a) a microlens sheeting comprising a microlens layer composed of a plurality of microlenses, the microlens layer having first and second sides, and a light-sensitive material layer disposed adjacent the first side of the microlens layer; and (b) a transparent material layer disposed at the second side of the microlens layer in the microlens sheeting.

Abstract: In a method of manufacturing an optical waveguide using a flat die having a groove therein, the method includes: (a) forming a first cladding sheet on a base substrate; (b) placing the first cladding sheet and the base substrate on the flat die such that the first cladding sheet faces the groove of the flat die; (c) filling the groove with a liquid resin and then curing the liquid resin, thereby forming a mirror support on the first cladding sheet; (d) removing the flat die from the first cladding sheet; (e) forming a metal reflection film on the mirror support; (f) forming a core sheet on the first cladding sheet such that the core sheet covers the mirror support that is formed with the metal reflection film; (g) forming a second cladding sheet on the core sheet; and (h) removing the base substrate from the first cladding sheet.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body.

Abstract: A system is disclosed for printing, activating and applying a flow of linerless activatable labels to a flow of items to be labeled. An activatable adhesive is formulated to readily absorb energy from a given radiation source, an activatable adhesive linerless label incorporates such the activatable adhesive. Related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.

Abstract: The method of manufacturing shoes of the present invention comprises a pre-step of heating a following reactive hot-melt adhesive to melt it and providing the melted adhesive on a joining surface of at least one adherend, an ultraviolet treating step of irradiating the adhesive with ultraviolet light having irradiation energy more than 100 mJ/cm2 and less than 1200 mJ/cm2 to polymerize a polyurethane prepolymer, and a joining step of overlaying a joining surface of another adherend on the adhesive to bond both adherends together. The reactive hot-melt adhesive contains a polyurethane prepolymer having an (meth)acryloyl group and an isocyanate group at the end of a molecule, and a photopolymerization initiator. The polyurethane prepolymer includes a non-crystalline polyol and a crystalline polyol, wherein the non-crystalline polyol is contained from 20% by mass to 90% by mass with respect to the whole polyols. The viscosity of the reactive hot-melt adhesive at 80° C. is 300 Pa·s or less.

Abstract: A manufacturing method of a hermetic container, comprises: an assembling step of aligning a first glass substrate and a second substrate through a circumferential sealing material having plural straight line portions and plural coupling portions, so as to define an internal space between these substrates; and a sealing step of sealing the first glass substrate and the second glass substrate to each other, by performing a scanning step of performing scanning with local heating light, wherein the sealing step is performed in a state that local force is applied, thereby improving airtightness of the hermetic container.

Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.

Abstract: A transparent laminate is produced by preparing a pair of transparent substrates, forming a sealing portion along the periphery on one of the transparent substrates for sealing a curable resin composition, supplying the curable resin composition in a region on the transparent substrate surrounded by the sealing portion, overlaying the other transparent substrate on the supplied curable resin composition in a reduced pressure atmosphere so that the curable resin composition is sealed as it is sandwiched between the pair of transparent substrates, and subsequently curing the curable resin composition in an atmosphere having a higher pressure than the pressure of the atmosphere in which the composition is sandwiched, to produce the transparent laminate.

Abstract: According to one embodiment, a method of manufacturing a three-dimensional image display device includes, supplying an adhesive member to a lens plate, and a display panel configured to display an image in a frame shape including a discontinuous part in such a manner that an aperture is formed in a state where the lens plate and the display panel are adhered together, adhering the lens plate, and the display panel together through the adhesive member with the lenticular lens directed to the display panel, and sealing the aperture by supplying an adhesive to the aperture in a reduced pressure atmosphere in the state where the lens plate and the display panel are adhered together, the pressure of the reduced pressure atmosphere being raised after the sealing.

Abstract: Methods and apparatuses for adhering optoelectronic components in optical, electronic or optoelectronic devices are disclosed. A UV-active adhesive is applied to an alignment sensitive component of the device. A first, relatively low dose of UV radiation sufficient to solidify an outer layer of the adhesive is applied to the adhesive. A second, relatively high dose of UV radiation sufficient to solidify the remaining thickness of the adhesive is then applied. The methods and apparatuses of the present invention advantageously reduce or eliminate changes in the position of a component during the adhesive curing process. The present method and apparatus allow for shorter total time for solidifying the adhesive, provide stable positioning during the adhesive solidification process, and enable increased manufacturing output and decreased waste.

Abstract: Methods of attaching a polycrystalline diamond compact (PDC) element to a substrate include maintaining a gap between the PDC element and an adjacent substrate, and at least substantially filling the gap with a deposition process. Methods of forming a cutting element for an earth-boring tool include forming a PDC element by pressing diamond crystals together, forming a substrate including a particulate carbide material and a matrix material, leaving a gap between at least portions of the PDC element and the substrate, masking surfaces of the PDC element and of the substrate that do not face the gap, and forming an adhesion material on surfaces of the PDC element and of the substrate that face the gap. Cutting elements for earth-boring tools include a PDC element attached to a substrate with at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material.

Abstract: A method is provided for laminating a flexible material layer having an upper face and a lower face onto a dimensionally stable substrate having a three-dimensional surface contour. The method comprises providing the dimensionally stable substrate, placing the lower face of the flexible material layer onto the surface contour of the dimensionally stable substrate, wherein a thermally activatable adhesive is applied to the lower face of the flexible material layer and/or the surface contour of the dimensionally stable substrate, irradiating the upper face of the applied flexible material layer with NIR radiation to activate the adhesive, and pressing the flexible material layer and the dimensionally stable substrate together after and/or during the activation of the adhesive. A device is provided for carrying out the method.

Abstract: An optical fiber connection method for connecting an optical fiber to an optical waveguide on a circuit board, including arranging an end portion of the optical fiber along a groove such that an end face of the optical fiber contacts with a core end face of the optical waveguide, the groove being formed on the circuit board and extending to the core end face of the optical waveguide, wherein an extended portion of the optical fiber extending out of the groove is arranged being inclined at a predetermined inclination angle with respect to the circuit board, pressing an optical fiber hold-down member against the circuit board by a pressing member, the optical fiber hold-down member being arranged on the circuit board via an adhesive so as to cover the end portion of the optical fiber, and curing the adhesive while pressing the optical fiber hold-down member against the circuit board.

Abstract: Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.

Abstract: A method for manufacturing a structural component includes a first step of attaching at least one conductive member to a surface of a base material made of a composite material and a second step of forming the base material by conducting electricity to part or the whole of the conductive member to generate heat and/or making an assembly of the structural component by conducting electricity to part or the whole of the conductive member to generate heat. Part or the whole of the conductive member contained in the structural component produced in the first and second steps serves as a member giving to the aircraft at least one of a lightning strike protection function, an anti-icing and deicing function and an electromagnetic interference shielding function.

Abstract: A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Abstract: To provide a microchip for a nucleic acid amplification reaction which allows high-precision analysis by a simple method. There is provided a microchip A for a nucleic acid amplification reaction including an entrance through which a liquid enters from the outside, a plurality of wells configured to function as reaction sites of nucleic acid amplification reaction, and flow channels through which the liquid entered from the entrance is fed into each of the wells, in which a plurality of reagents needed for the reaction are laminated and anchored in a prescribed order in each well.

Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.

Abstract: A display panel includes: a first substrate; light-emitting elements on a region of the first substrate; a second substrate facing the first substrate with the light-emitting elements therebetween; a glass frit between the first substrate and the second substrate so as to surround the region of the first substrate in which the light-emitting elements are disposed, the glass frit providing a hermetic seal between the first substrate and the second substrate; and a light-shielding part formed on one of the first substrate and the second substrate so as to extend along the glass frit, the light-shielding part shielding light. The light-shielding part has a lower light-shielding property in a region corresponding to the outer region of the glass frit than in a region corresponding to the inner region of the glass frit. The glass frit has been irradiated with light through the light-shielding part.

Abstract: The invention relates to a process that makes it possible to improve the mechanical strength of bonds between substrates when these bonds are produced by means of an adhesive that comprises a resin that can be cured by chain polymerization, and in particular a resin that can be cured under the effect of ionizing or light radiation. This process is characterized in that it comprises the grafting of groups capable of acting as chain transfer agents during the polymerization of said resin to the surface of the substrates, before the latter are brought into contact with the adhesive. Applications: assembling of structural, engine, passenger compartment or bodywork parts in the aeronautical, space, railway, ship-building and automotive industries.

Abstract: A description is given of an aqueous polymer dispersion comprising at least one polyurethane, dispersed in aqueous phase and having one or more uretdione groups, and at least one solid polyamine with a deactivated surface, said dispersion being useful as an adhesive, coating material or sealant or for producing adhesive, coating or sealing compositions. The compositions can be activated thermally or by electromagnetic radiation.

Abstract: Techniques for optically activating thermally activated adhesives are disclosed. In one embodiment, a laser can be used to activate thermally activated adhesive. In one implementation, a laser output can be directed through a structural component being coupled to another structural component through use of the thermally activated adhesive. As a result, the structural components to be adhered together can, first, be placed in the appropriate position with the adhesive in a non-active state, and second, a laser can provide the laser output to activate the adhesive (whereby the adhesive transitions from the non-active state to an active state).

Abstract: A flat panel display apparatus having improved encapsulating characteristics comprises: a substrate; a display unit on the substrate; a sealing substrate disposed facing the display unit; a sealing member between the substrate and the sealing substrate and surrounding the display unit; a wiring unit between the substrate and the sealing substrate and overlapping at least the sealing member, and including wiring members separated from each other; and an inlet unit electrically connected to a power source and the wiring unit for applying voltage to the wiring unit, and including an edge parallel with an outermost wiring member of the wiring unit. A mother substrate for the display apparatus comprises a substrate, a plurality of display units, a sealing substrate, a sealing member, wiring units, a connection unit, and an inlet unit. Methods of manufacturing the display apparatus and the mother substrate are also disclosed.

Abstract: A component composite, in particular for motor vehicle applications, including a first component having a first contact surface, the first contact surface having a surface structure which has a microstructure overlaid by a nanostructure, and including at least one second component having a second contact surface. A medium, in particular an adhesive layer, is situated for integral connection between the two contact surfaces of the two components.

Abstract: A method for adhering an electronic assembly to a bottom cover sheet in the manufacture of an electronic device is presented. According to the method, the electronic assembly is attached to the bottom overlay using a modified ultra violet (“UV”) cured adhesive.

Abstract: A method for the local initial application of a thermal barrier coating layer (3), or for the local repair of coating defects and/or deteriorations of components (1) in the hot gas path of a gas turbine engine, which components are coated with a thermal barrier coating layer, includes at least the following steps: (I) in the case of repair, normally overall inspection of the whole component (1) for the determination of the location of defect/deterioration, as well as of corresponding type of defect/deterioration of each place for a multitude of locations of the component (1); (II) if needed, preparation of the surface in at least one location; (III) local application of a ceramic tissue together with a wet chemical thermal barrier coating layer deposition material for the formation of a patch (5) of ceramic matrix composite; (IV)a intermediate inspection of the patch and/or the surface; (IV)b in the case of a repetitive and/or multi-step repair method, subsequent layer application of a ceramic tissue togethe

Abstract: Embodiments related to making an optic comprising a cladding are disclosed. One example embodiment comprises forming a wedge-shaped light guide having opposing first and second faces and comprising a material having a first refractive index. The embodiment further comprises applying a cladding layer to the first face, and, applying an interface layer to the cladding layer. In this embodiment, the cladding layer has a second refractive index less than the first refractive index, and the interface layer has a third refractive index matched to the first refractive index.

Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Abstract: Elastomeric grip tape embodiments are presented including: an elastomeric layer, where the elastomeric layer is a low-abrasion layer having a hardness in a range of approximately 30 to 120 Shore A, and where the elastomeric layer includes a top surface formed having a first texture with a peak-valley depth in a range of approximately 0.000 to 0.500 inches; a pressure sensitive adhesive (PSA) layer formed along a bottom surface of the elastomeric layer. In some embodiments, elastomeric grip tapes further include an underlayer bonded with the bottom surface of the elastomeric layer where the PSA layer is formed along a bottom surface of the underlayer.

Abstract: A covering device for covering an area of an organic substrate, with a connecting zone between a closure cap and the substrate. It is proposed that the connecting zone includes, at least in certain areas, a heating element for heating the connecting zone during the creation of a connection between the closure cap and the substrate. Also provided is an organic substrate with a covering device and a production method for producing a covering device.

Abstract: In order to fasten a silicon block on a support for improved further handling, fiber material is introduced into an adhesive joint between the silicon block and the support. The fiber material is impregnated with adhesive and consists of glass fibers. The silicon block is then positioned on the support. The fiber material assures that the adhesive joint is not pressed together too far and is more stable.

Abstract: A method of manufacturing a bonded body is provided. The method comprising: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member with the aid of the liquid repellency of the liquid repellent region; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in the vicinity of a surface of the bonding film by applying energy thereto to thereby obtain the bonded body.

Abstract: A jointing apparatus includes a first laser head which emits a laser beam for adhesive heating and a second laser head which emits a laser beam for welding. In jointing components of a work with a thermosetting adhesive agent, the defocused laser beam is applied to an adhered part for a short time. Thereupon, the adhesive agent is primarily cured so that the components are tacked together. In spot-welding the components, the laser beam for welding that is converged by the second laser head is applied to a spot-welded joint.

Abstract: A method for producing a composite material having a carbon nanotube array, includes the steps of: (a) providing the carbon nanotube array, the carbon nanotube array has a first end surface and a second end surface opposite to the first end surface; (b) providing a first board and a second board, fixing the first end surface of the carbon nanotube array on the first board, fixing the second end surface of the carbon nanotube array on the second board; (c) packaging the first board and the second board to form an apparatus having an entrance; (d) providing a liquid polymer precursor, applying the liquid polymer precursor from the entrance to the apparatus until the liquid polymer precursor submerge carbon nanotube array; and (e) solidifying the liquid polymer precursor.

Abstract: A method for forming gas barriers on electronic devices is provided. The fabrication method includes: providing a first substrate having at least one electronic device thereon; providing a second substrate and forming a gas barrier over the second substrate; disposing the second substrate over the first substrate, wherein the gas barrier faces the electronic device; providing an electromagnetic wave light source over the second substrate; and irradiating the second substrate by the electromagnetic wave light source to transfer the gas barrier to the electronic device and cover the electronic device.

Abstract: The present invention is a method of manufacturing a joined structure formed by joining two joining materials. The method includes a joining medium layer forming step and a joining step. In the joining medium layer step, a joining medium layer is formed on a joining surface of at least one of the two joining materials. The joining medium layer includes one or more of elements selected from a group consisting of hydrogen gas, steam gas, alcohol gas, hydrogen peroxide gas, organometallic compound, and silane coupling agent. In the joining step, the two joining materials arranged one over the other via the joining medium layer are heated and/or irradiated by electromagnetic waves.