Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.

Abstract: A forming method of spacers in a flat panel display is provided. The method includes the steps of preparing a plurality of spacers in a predetermined shape, preparing a substrate on which the spacers are to be attached in the flat panel display, applying a photosensitive adhesive material on an upper surface of the substrate to a predetermined thickness, aligning the spacers on the substrate to attach the spacers by using the photosensitive adhesive material, radiating light onto the substrate from above the substrate to expose portions of the photosensitive adhesive material without the spacers, and removing the exposed portions of the photosensitive adhesive material. Therefore, the spacers are fixed on the substrate by the photosensitive adhesive material located under the spacers. According to the provided method of forming spacers, the spacers are fixed on the substrate by a mounting process using a jig, a temporary exposing process, and a developing process.

Abstract: An optical disk is manufactured by bonding a resin stamper having, on a principal plane, asperity pits on which a thin film is formed and a second substrate having a thickness of 0.3 mm or less with radiation cured resin such that the asperity pits face to the second substrate. The resin stamper is peeled off after curing the radiation cured resin to form asperity pits on the second substrate. A metal film is formed on the asperity pits on the second substrate to attain an information recording layer on the second substrate. A first substrate having an information recording layer and the second substrate having the formed information recording layer are bonded such that the both information recording layers face each other.

Abstract: In a method for manufacturing a flat display element, a pair of motherboards are prepared, and a display forming portion is formed on each motherboard. A sealant is located on one of the motherboards so as to surround the peripheral edge portion of the display forming portion, and end spacers for maintaining a gap between the two motherboards and a tacker covering the end spacers are located on the end portions of the motherboard. The motherboards are stuck on each other with the sealant, end spacers, and tacker between them, and the stuck motherboards are aligned with each other. After the alignment, the two motherboards are tacked to each other by curing the tacker. Thereafter, the motherboards are finally bonded to each other by curing the sealant. Then, the substrates, stuck on each other with the sealant, are cut out by cutting the motherboards outside the sealant.

Abstract: An adhesive agent is applied to both single plates, upper and lower, in which case the formation of bubbles is minimized by using a specified application manner. A method of laminating optical disks (D) comprising the steps of placing a lower disk single sheet (D1) on a turntable (1), applying an adhesive agent (R1) in doughnut form to the lower disk single sheet (D1), placing an upper disk single sheet (D2) on another turntable (2), applying an adhesive agent (R2) in doughnut form to the upper disk single sheet (D2), placing the upper disk single sheet (D2) on the lower disk single sheet (D1), and spreading the adhesive agent (% 2) between the two disk single sheets by rotating the turntables. Since bubbles hardly enter the adhesive agent, the bubble content of the adhesive agent after spreading is very small, and even after the curing subsequent to ultraviolet ray radiation, the air content of the optical disk can be minimized, the quality being high.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate. The manufacturing apparatus and method further include an adhesive supply source adapted to supply the adhesive to the adhesive applying device at a first predetermined temperature and a defoaming tank adapted to remove bubbles from the adhesive at a second predetermined temperature, which is higher than the first predetermined temperature.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a suction device adapted to suction the adhesive layer formed between the first substrate and the second substrate with a predetermined suction force. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the suctioned adhesive layer to partially bond and provisionally fasten the first substrate and the second substrate.

Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Abstract: Two-component systems are described which are suitable for underlining, adhesive bonding of the crimped fold and sealing of auto body sections, particularly for crimped fold sealing of add-on vehicle parts. The two-component systems attain the requisite grip strength for mounting the add-on parts on the body as well as the requisite strength and dimensional stability for the production process up to and with the CIP passage, within the predetermined cycle time, on the basis of cross-linking of the sealant composition twice. In one embodiment, the surface of the two-component system is pre-cross-linked by a UV-induced reaction and by the cross-linking of the two-component system to the extent of portability. In addition, two-component systems are described which cross-link intentionally only partially up to a consistency that permits a rugged course of the process through cleaning baths and which harden completely only by means of a further hardening process, for instance in the CIP forced circulation oven.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; and a polymerizingly effective amount of a photoinitiator to accelerate the rate of cure is provided.

Abstract: An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction.

Abstract: To provide a simplified method of making a multi-layer circuit board capable of observing a high density surface mounting of electronic parts, a method is provided for making a multi-layer circuit board including a first film (A) and at least two more films, second and third films (B and C), each being made of thermoplastic polymer capable of forming an optically anisotropic melt phase. The first film (A) has a low melting point (Tm1), and the second and third films (B and C) have respective melting points (Tm2B and Tm2C) higher than the melting point (Tm1) of the first film (A). And at least one of the second and the third films have a circuit pattern thereon. The first to third films (A to C) are thermo compressed together with the first film (A) interposed between the second and third films (B and C).

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: An optical disk of the present invention includes a first substrate having a signal area on a principal plane and a central hole, and a second substrate that is transparent and attached to the first substrate. The second substrate is thinner than the first substrate, and has a central hole whose diameter is larger than that of the first substrate. The first substrate and the second substrate are attached to each other with radiation curable resin (adhesive member) disposed therebetween so as to extend at least from an inner peripheral edge of the second substrate to an outer peripheral edge thereof.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above.

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.

Abstract: A system and a method by which workpieces are bonded to and debond from a manufacturing fixture using a radiation responsive adhesive as a bonding agent. The system includes curing the adhesive agent during loading within seconds, and structurally weakens the adhesive bond during unloading within seconds. During the workpiece loading cycle, an adhesive dispenser deposits radiation responsive adhesive on to a load bearing, light transmittive surface, known as gripper pins. The workpiece is subsequently pushed against the locators, and towards the gripper pins causing the adhesive to interpose between workpiece and gripper pins, curing radiant energy is transmitted through the gripper pins and on to the adhesive to cure adhesive and bond the workpiece to the fixture. Therefore, the bond is structurally weakened or debonded in order to remove the workpiece from the fixture after manufacturing.

Abstract: An IR window frame assembly for use within an aircraft is manufactured at a high temperature with both the window pane and the window frame of the window frame assembly having beveled surfaces. These beveled surfaces are placed in direct contact during manufacture. As a result, the window frame assembly maintains a low radar cross section (RCS) while allowing the window assembly to be small enough to conform with aerodynamic tolerances required in an aircraft.

Abstract: A multi-layer structure includes a layer of a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing electron donor.

Abstract: The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.

Abstract: A slider and suspension of a hard disk drive are joined with a low modulus epoxy adhesive. The slider and suspension are set in a bonding jig while they are moving from process to process or subjected to a thermosetting treatment in a controlled temperature chamber. The slider and suspension must be kept bound together with the bonding jig until the adhesive is cured through a thermal treatment. The low modulus epoxy adhesive is cured with heat from a laser beam. In addition, a resistance value of the head disposed at the slider is measured so as to monitor the temperature of the head, thereby deciding both output and irradiation time of the laser beam for obtaining a desired strength of the bond within a predetermined temperature range.

Abstract: Method and device for heat treatment of a disc, whereby the disc (1) is placed on a carrier (14) after which the disc is irradiated. During the radiation the carrier is kept on a desired temperature. The desired temperature of the carrier is about the temperature of the disc prior to placement on the carrier. The disc comprises two disc elements and an adhesive layer between the disc elements, whereby the adhesive layer is cured by the irradiation with ultraviolet light.

Abstract: A device embodying the invention comprises a pair of members presenting a lower base surface and a member presenting an upper parallel surface when in an operative position. A platen pad material, which converts microwave energy to heat, is provided on one of the surfaces. When in an operative position the two platens provide uniform pressure over the surfaces of a laminating pouch carrying a document. The device is placed in a domestic microwave oven and the oven is operated for a period of time dependent on the rated power of the oven, the size of the document and the energy conversion capability of the platen pad. The platen pad converts the microwave energy to heat energy while applying uniform pressure over the surfaces of the pouch. This produces liquefaction of the adhesive which bonds the film to the document. The device is then removed from the microwave oven, permitted to cool, the lamination removed, and trimmed as may be necessary.

Abstract: The present invention provides a method for producing an organic EL device comprising a step of eliminating a partition wall 3, which has become unnecessary after patterning, from a substrate 1 in a production or an organic electroluminescence device (organic EL device). In particular, it provides a method for producing an organic EL device comprising a step of attaching on the substrate adhesive sheets 6, in particular, an adhesive sheet having an ultraviolet ray curing type pressure sensitive adhesive layer after the patterning, and peeling off the adhesive sheets. According to the method, an organic EL device substantially not containing a partition wall is provided so that the adverse effect of the moisture content and the gas discharged from the partition wall to the device can be prevented, and thus an organic EL device with a long life can be provided.

Abstract: An ink jet recording head has a plurality of discharge energy generating devices for discharging recording liquid, while being provided with a recording element base plate arranged on the face opposite to the surface where the devices are arranged, having a plurality of recording liquid supply ports for supplying recording liquid to the devices, as well as with a supporting member that holds and fixes the recording element base plate. For the supporting member, a plurality of recording liquid supply paths are arranged to supply recording liquid to each of the supply ports of the recording element base plate, respectively, and then, the flow path width of each supply flow path is formed to be smaller than the opening width of inlet portion of each supply port. Further, the steps to be created between the supply flow path and the supply port is buried by the bonding agent forced out from the bonding face of the recording element base plate and the supporting member.

Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.

Abstract: A method for assembling a flat panel display is disclosed whereby the conductive layers disposed on the inside surfaces of the two panels to be laminated are connected or laminated together with a pressure-sensitive adhesive or a latent-cure adhesive. Protective insulating layers on the conductive layers disposed on the inside surfaces of the panels have been eliminated. The adhesive connecting the opposing conductive layers serves as a suitable insulating layer. An improved flat panel display whereby the conductive layers on opposing panels is connected with either a latent-cure adhesive or a pressure-sensitive adhesive is also disclosed. Methods of laminating panels of EL displays and methods of laminating substrates of optoelectronic devices are also disclosed.

Abstract: Adhesive systems are useful for bonding wrap-around labels using an overlap adhesive in their application to blown plastic containers, more particularly plastic bottles. The adhesive system includes reactive contact adhesives based on multifunctional macromonomer compounds curable in steps by different reaction mechanisms, which may also be present mixed with one-stage reactive mixture components.

Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.

Abstract: Disclosed herein is a variable lamination manufacturing process and apparatus. The method comprises the step of coating strip-shaped material with an adhesive while the strip-shaped material is fed. Thereafter, the strip-shaped material being fed is cut into material pieces of a variable width, variable inclinations and a variable length in accordance with the three-dimensional computer aided design data of a three-dimensional product using a linear heat source. The cut material pieces are stacked on a moving table to be positioned in the corresponding positions of the three-dimensional product. Finally, the stacked cut material pieces are pushed to bond one piece to anther.

Abstract: A structure and a method for mounting an ink jet head assembly to an ink jet printer are disclosed. The assembly includes a plurality of ink jet heads each being filled with ink of particular color. Intermediate members are positioned between each head and a head holder. The intermediate members are fixed to the head by adhesive and also fixed to the head holder by the adhesive.

Abstract: A system and method for forming a composite structure involves providing at least two polymeric sheets as outer layers such that a cavity is formed therebetween, adhesively bonding fibrous layers to the polymeric layers to hold the fibrous layers in place during processing, and injecting into the cavity a polymeric core material capable of exhibiting a foamed character and a resinous character. The cavity is evacuated during filling with the core material, and a blowing agent of the core material is activated upon exposure to the evacuated cavity. The core material contacting the fibrous layers is reconverted to its resinous character and forms a relative dense, resinous interface between the core and fibrous layers. Upon filling the region of the cavity between the fibrous layers, a catalytic reaction is initiated in the core.

Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.

Abstract: Adhesive systems comprised of one or more photoinitiators and one or more adhesives capable of radiation-induced reaction are useful in one-step or multi-step perfect binding of books and other printed articles. The adhesive may be a low viscosity mixture of a monomer and/or polymer which is cross-linkable by UV or stronger electromagnetic radiation.

Abstract: Embodiments of optical discs and methods for making the same are disclosed. In one embodiment, the optical disc comprises: at least two plastic substrates comprising a bonding layer and a data layer disposed therebetween, wherein at least one of the substrates is a read side substrate comprising greater than or equal to about 0.05 wt % colorant, based upon the total weight of the read side substrate, and wherein the read side substrate has a UV Bonding Index of greater than or equal to about 0.5. One method for making the optical disc comprises: forming a first plastic substrate comprising greater than or equal to about 0.05 wt % colorant, based upon the total weight of the first plastic substrate, wherein a UV Bonding Index of the first plastic substrate is controlled to be greater than or equal to about 0.5, disposing a data layer between the first plastic substrate and a second substrate, bonding the first plastic substrate to the second plastic substrate with a bonding layer, and curing the bonding layer.

Abstract: An upper surface layer 2 and a nonwoven fabric sound absorption layer 3 are integrally secured via an air permeable adhesive resin layer 4 formed by melting thermoplastic resin powder, and the air permeability of the thickness direction of the entire carpet 1 falls within the range of 1 to 50 cm3/cm2·second. This effectively absorbs noise from the upper side entering via a roof, doors and windows as well as noise from the lower side. The carpet can be manufactured by scattering thermoplastic resin powder on an upper surface member, heating the thermoplastic resin powder into melted thermoplastic resin, placing a nonwoven fabric on the upper surface member via the melted thermoplastic resin, and pressing the nonwoven fabric and the upper surface member in a laminated state. It is preferable that powder of particle size of 90 to 10,000 &mgr;m is scattered in the amount of 5 to 500 g/m2.

Abstract: A method for fastening a flat strip lamella (10) to the surface of a building component (12). According to the inventive method, the face (14) of the flat strip lamella (10) is pressed against the surface of the building using an adhesive coating (16) consisting of a reaction resin applied in a paste-like consistency (16) and hardened to form an adhesive joint. The flat strip lamella (10) comprises a plurality of carbon fibers which are embedded in a binder matrix (28) and placed parallel to each other in a longitudinal direction. In order to increase the speed at which the adhesive coating hardens, the invention provides that an electrical current flows through least one part of the carbon fibers (26), heating the flat strip lamella (10) which in turn heats the adhesive coating (16).

Abstract: Method and apparatus for manufacturing an optical disc having a light-transmitting layer of a uniform thickness over the entire surface of a substrate is provided whereon a recording and/or a reproducing of information signals is carried out by a light input through the light-transmitting layer.

Abstract: A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.

Abstract: A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces electrically connected to the first conductor track plane, and second contact faces opposite the first sides. The method furthermore includes providing a second substrate which has a second conductor track plane with contact points, securing electrically conductive balls to the contact points of the second conductor track plane using an electrically conductive, flexible adhesive, applying an electrically conductive, flexible adhesive to the second contact faces of the plurality of semiconductor chips, and joining the first substrate and the second substrate together.

Abstract: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.

Abstract: A method and system of manufacturing an air bag cover assembly utilizing infrared radiation is disclosed. The assembly includes a front panel, a back plate, a switch and infrared-absorbing material. Initially, the front panel and the back plate are positioned so that inner surfaces of the front panel and the back plate define a switch pocket therebetween. Then the switch is positioned in the switch pocket. Thereafter, infrared radiation is directed at the infrared-absorbing material for a time sufficient to heat the infrared-absorbing material to a desired temperature. The amount of heat applied to the infrared-absorbing material by the infrared radiation is controlled by a controller. Finally, the heated material cools to fixedly secures the back plate to the front panel. The heated material may be forced to flow prior to cooling.

Abstract: A laminated product is provided including a carrier sheet, a polymeric film ply, a polymeric card ply, and a radiation-curable laminating adhesive. The polymeric film ply is secured to the carrier sheet and extends over a cut-out portion formed in the carrier sheet. The polymeric card ply is positioned within the cut-out portion. Either the film ply, the card ply, or both, are transparent to electromagnetic radiation. The radiation-curable laminating adhesive is positioned to secure the polymeric card ply to the exposed ply portion and comprises a bonding agent, a monomer, an oligomer, a tackifier, and a photocatalyst. The bonding agent is present in a quantity sufficient to improve the bonding characteristics of the adhesive composition. The monomer is present in a quantity sufficient to (i) increase the flexibility of the adhesive composition, and (ii) increase the tendency of the adhesive composition to release substantially cleanly from a surface to which it is bonded.

Abstract: A method of making a pressure sensitive adhesive article includes depositing a layer of liquid adhesive material onto a substrate, and depositing a layer of non-adhesive liquid material onto the liquid adhesive material, wherein the non-adhesive liquid material covers only a portion of the liquid adhesive layer. The liquid layers can be cured which allows winding the article onto a spool. The pressure sensitive adhesive article includes a substrate with a liquid adhesive layer deposited onto the substrate. At least one liquid non-adhesive structure is deposited onto a portion of the liquid adhesive layer, and the structure can have a theoretical angle of contact with the adhesive layer which is greater than 0°.

Abstract: An adhesive curing apparatus and method utilizes the end of a tube or optical fiber extending from a UV light source. The tube end is inserted into the mounting hole in the side of a pivot assembly. The tube projects concentrated UV light into the interior of the assembly for curing the adhesive used to bond the bearings to the shaft and the housing. The tip at the end of the tube has beam splitting mirrors or prisms to distribute the UV light more effectively. The interior of the assembly, including the outer surface of the shaft and the inner surface of the housing are smooth, polished metal to further enhance the intensity of the light incident on the adhesive.

Abstract: This invention relates to a UV curable system of the type for continuously applying a UV curable adhesive to labels, at least partially curing the adhesive on the labels to render the adhesive tacky and thereafter applying the labels to discrete containers through the tacky adhesive layer. Most preferably the labels are cut and stack labels retained in a dispensing magazine prior to the application of the UV adhesive to the labels, and most preferably both the labels and the UV curable (and cured) adhesive are clear, and the clear labels with the clear tacky adhesive thereon preferably are adhered to clear glass containers, e.g. soda bottles, beer bottles and the like.

Abstract: A method of forming a film laminate uses an adhesive containing at least three components A, B and C. The method includes providing a radiation curable adhesive that contains a) a compound bearing at least one epoxy group, b) a compound with at least three OH groups and a molecular weight below 400 and c) a photoinitiator which initiates a polymerization of components a) and b) after exposure to light with a wavelength of 100 to 600 nm.

Abstract: A fastening device, which will facilitate the assembly of associated parts or manufactured articles, and electromagnetically absorptive component for absorbing electromagnetic waves and converting wave energy to heat; an expansive component, which expands upon exposure to heat emanating from the target material; matrix material, which will become adhesively active and effect the adherence of the associated parts upon exposure to heat emanating from the target material, and a stiffening component.

Abstract: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.