Abstract: A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.

Abstract: A suspension adhesive comprised of a matrix material and a particulate filler material is useful for bonding, sealing, repairing, and modifying ceramic, glass, and powdered metal components in a light source. A method for making the suspension adhesive includes the selection of a filler material and a volume percentage of the filler material. Additionally, a matrix material is selected and the filler material is dispersed throughout the matrix material. The suspension adhesive is used to bond and seal components to form, for example, an arc tube for a light source.

Abstract: A method for manufacturing a bonded optical disc includes the steps of coating a solution on a substrate, heating the coated solution and the substrate to thereby form a recording layer on the substrate, and adhering a dummy substrate to the recording layer, wherein the dummy substrate is also heated.

Abstract: A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are aligned and fixed temporarily, then the atmosphere is set at a pressure of 10−3 mbar or lower and the temperature is set at 300° C. or higher, and voltage is applied across the both wafers while pressure is applied to the wafers. When the value of an electric current flowing across the wafers has reached a level of a certain current value or lower, the application of the voltage is stopped and the atmosphere is opened to the atmospheric pressure while reducing the temperature.

Abstract: The method of producing a two-disc laminated optical video disc, includes first forming, on a first substrate, a first reflecting film capable of partially reflecting and partially transmitting a laser beam. Next on a second substrate, a second reflecting film is formed having a reflectance higher than that of the first reflecting film. A liquid ultraviolet-setting resin is applied to the first reflecting film and/or the second reflecting film. The above treated first substrate and the second substrate are bonded together, with a light-transmissible middle layer interposed therebetween. The liquid ultraviolet-setting resin is solidified by means of an ultraviolet light directed from below the first substrate.

Abstract: A self-dispensing fastener for attachment to a substrate by a quick-setting photocuring adhesive has a UV transparent flange for placement against the substrate and UV opaque adhesive reservoir for containing the adhesive in the fastener, and upon pressing the fastener against the substrate the adhesive is expelled into the interface formed between the flange and the substrate for curing by UV radiation.

Abstract: An apparatus and method for manufacturing a core or tube using radio frequency. When using aqueous-based adhesives, application of radio frequency allows for a much more efficient and much quicker method for drying and curing.

Abstract: Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method includes placing an integrated circuit die on the adhesive film of each site. After a plurality of integrated circuit die are individually placed on the substrate, the adhesive films of a plurality of sites are cured simultaneously in a batch process. The curing permanently attaches the die to the substrate. Subsequently, the die are wire bonded to their respective substrate sites and encapsulated. The encapsulated substrate is cut to form individual packages.

Abstract: This invention relates to a labeling system for continuously applying a layer of a radiation curable adhesive, e.g., a UV curable adhesive, to plastic, sheet fed, cut and stack, labels, irradiating the adhesive on the labels to render the adhesive sufficiently tacky to effectively adhere the labels to containers in a commercial labeling machine and thereafter applying the labels to discrete containers through the sufficiently tacky adhesive layer. The plastic labels can be clear, opaque (including metallized) plastic films and can be retained in a dispensing magazine prior to the application of the radiation curable adhesive to the labels.

Abstract: An optical disk is provided by bonding two substrates to each using a radiation-hardening resin, and leveling and hardening the resin. In an optical recording medium manufacturing apparatus including lamps for emitting radiation to two disks attached to each other with a radiation-hardening resin layer sandwiched therebetween, and a rotation arm for supporting and rotating the two disks to allow the disks to traverse the emission area of the lamps, light source centers of the lamps are positioned radially outside a rotation locus of the center of the disks attached to each other, said locus being drawn while the disks are supported by the rotation arm.

Abstract: A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.

Abstract: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.

Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Abstract: A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.

Abstract: A method and system for curing reactive material. The system includes an inlet port adapted to receive radiation from a source, a plurality of emitter ports and transmission means operatively coupling the inlet port to each emitter port. The transmission means is adapted to conduct radiation from the inlet port to the emitter ports and preferably includes a plurality of optical fibre strands. Additionally, the system also preferably includes a housing defining a substantially tubular irradiation chamber. In one embodiment, a method is disclosed for joining the ends of a first optical cable and a second optical cable together. The method includes the steps of abutting the end of the first optical cable to the end of the second optical cable, applying reactive adhesive to the abutted ends, and directing radiation within the absorption spectrum of the reactive adhesive onto the adhesive until the adhesive is sufficiently cured.

Abstract: Process for the radiation crosslinking of double-sided adhesive tapes, in which a backing material coated on both sides with adhesives is irradiated asymmetrically from both sides with different doses in an irradiation means.

Abstract: A method is presented for maintaining a plate member in a flat state, including the steps of placing the plate member on a surface of a supporting member, the surface of the supporting member being in a flat state and having at least one hole penetrating through the surface, and sucking air from a back side of the surface of the supporting member to generate an airflow flowing from a front side of the surface towards the back side thereof via the hole so as to retain the plate member on the surface of the supporting member. In this manner, the plate member, such as disc substrates adhered together by using an ultraviolet curable composition, can be accurately maintained in a flat state without damaging the surface thereof.

Abstract: This invention concerns a method and apparatus for manufacturing a sheet and a two-dimensional matrix of plastic optical fibers. The fibers may be of the step-index or graded-index type. Co-extrusion through a specially designed die is used to produce a sheet composed of a fiber array. The fiber sheet (ribbon) can be used for transmitting optical signals. These arrays may also be stacked and fused at high temperatures to form the two-dimensional matrix required for many applications such as large area image transfer. In addition, a high-speed, continuous manufacturing method is disclosed to produce a massive two-dimensional matrix of fibers. The method of manufacture permits high quality image transfer at low manufacturing cost in a wide array of geometries.

Abstract: This invention relates to how to obtain an optical recording disc with a good quality, capable of achieving a beautiful outline shape of the inner peripheral part side rim part of the cured ultraviolet ray curing type resin substantially concentrically even in the case there is irregularity of the wettability of both round substrates with respect to the ultraviolet ray curing type resin, and capable of providing an even film thickness of the resin with the film thickness controlled to a predetermined value or less even in the case there are irregularity of the wettability of both round substrates, difficulty in controlling the centrifugal force applied on the resin, irregularity of the plate thickness of both round substrates, or the like.

Abstract: A method of sealing body parts such as an edge fold of a motor vehicle component, for example a door, a rear or front flap or a sliding roof panel, includes a two-step pre-cross-linking of the sealing composition in the rough body part. In a first step the surface of a UV-active sealing composition is pre-cross-linked by UV irradiation, and in a second step immediately following, the edge fold adhesive and the sealing composition are hardened by thermal action. The edge-sealed body parts produced by the method are transportable and are of visually and functionally satisfactory quality after passing through cleaning baths and after thermal hardening in a KTL kiln. Since the sealing is carried out in the rough body part rather than during the coating process, the method provides a substantial potential cost saving.

Abstract: A radiation—and/or heat-curable adhesive with high thermal conductivity includes the following recipe: 19 to 40 wt % of a difunctional acrylated, aromatic polyurethane; 9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate; 1 to 5 wt % of one or more photoinitiators; 35 to 70 wt % of one or more mineral fillers; 0.5 to 3 wt. % of an SiO2-containing thixotropizing agent; and 0.5 to 2 wt % of an organic peroxide.

Abstract: Disclosed is a method of accurately, simply forming a light absorbing layer for improving contrast in a transmission screen including micro glass beads two-dimensionally arranged. A light absorbing layer made from toner is formed on glass beads held in a transparent adhesive layer up to a thickness sufficient to cover the glass beads. The light absorbing layer is irradiated with parallel rays of light in the direction from a transparent substrate, to melt and remove only a portion of the light absorbing layer positioned over a light outgoing portion of each glass bead by the energy of the rays of light converged through the glass bead. By suitably selecting a material of the light absorbing layer, openings can be formed in the light absorbing layer by means of combustion, sublimation or ablation due to the energy of the converged rays of light.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product. The present invention provides a composite sheet for manufacturing a wiring board which is laminated on a wiring layer having a wiring pattern formed on an insulating layer and is thus used, wherein an adherent sheet containing a thermosetting resin is adhered to a porous film or at least a part thereof is impregnated therein.

Abstract: The present invention provides processes by which a polymeric hydrogel can be securely adhered to a substrate to form a hydrogel laminate with greatly improved delamination resistance. The laminate is formed by casting onto a polymeric adhesive-coated substrate an aqueous solution of hydrophilic polymer, then exposing this composite to ionizing radiation which cross-links the hydrophilic polymer to form a hydrogel and also induces copolymerization of the hydrophilic polymer and the adhesive polymer.

Abstract: In a method for making a hybrid leaf spring at least one layer of composite material is provided and a metal primary leaf. The layer of composite material and metal primary leaf are positioned adjacent one another in a mold having an interior cavity defined by at least one cavity wall. A layer of adhesive material is located between and in engagement with the layer of composite material and the metal primary leaf. The adhesive is cured by controllably heating the metal primary leaf so that energy in the form of heat is conducted therefrom into the adhesive layer bonding said metal primary leaf and layer of composite material together.

Abstract: A method for manufacturing a highly productive key pad with rigid resin key top, wherein the key top adhesion surface 2, 6 of the key pad 1, 5 or a portion thereof is surface altered by at least one method selected from short wavelength UV irradiation treatment, corona discharge treatment, flame treatment and plasma treatment and can be adhered with reactive hardening resin 3, 7 such as urethane base resin, epoxy base resin, amino base resin, acrylic base resin, cyanoacrylate base resin and photo reactive hardening resin, thereby reducing adhesion operation time, without fear of dislocation during the adhesion.

Abstract: A process and an apparatus for producing endless laminated veneer boards from a veneer-panel strand comprising veneer panels laid together in a plurality of layers by means of gluing and compression in a heated, continuously operating press. The veneer-panel strand is run through a preliminary press with a preheating device before it enters the press. The layers of glue applied to the veneer panels and/or the veneer panels for the center or a central-layer strand have a higher moisture content than the layers of glue and/or the veneer panels for the outer layers or the cover-layer strands. The veneer panels are each then assembled to give an upper and a lower cover-layer strand and, if required, a central-layer strand, and are combined to give a veneer-panel strand.

Abstract: Disclosed is a method of accurately, simply forming a light absorbing layer for improving contrast in a transmission screen including micro glass beads two-dimensionally arranged. A light absorbing layer made from toner is formed on glass beads held in a transparent adhesive layer up to a thickness sufficient to cover the glass beads. The light absorbing layer is irradiated with parallel rays of light in the direction from a transparent substrate, to melt and remove only a portion of the light absorbing layer positioned over a light outgoing portion of each glass bead by the energy of the rays of light converged through the glass bead. By suitably selecting a material of the light absorbing layer, openings can be formed in the light absorbing layer by means of combustion, sublimation or ablation due to the energy of the converged rays of light.

Abstract: A photocurable resin composition which comprises (A) a urethane (meth)acrylate oligomer obtained by the reaction of (a) at least one polyol compound preferably selected from the group consisting of polyester polyols and polycarbonate polyols, (b) a polyisocyanate compound, and (c) a hydroxyl group-containing (meth)acrylate compound; (B) a (meth)acrylolylphosphate; (C) a multifunctional (meth)acrylate compound; and (D) a photopolymerization initiator and, optionally, (E) an organosilyl-containing mercapto compound. The composition exhibits a fast cure speed, and the cured products obtained from the composition exhibit superior adhesion under high temperature-high humidity conditions and metal corrosion properties.

Abstract: The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. The process according to the present invention comprises removing unnecessary resist material (3) left behind after dry etching by side wall protection process with a resist pattern (3) present on a semiconductor substrate (2) as a mask and side wall protective film (4) deposited on the side wall (22) of pattern, said process comprising the steps of applying an pressure-sensitive adhesive sheet (1) to said substrate (2), heating the pressure-sensitive adhesive layer (1) under pressure so that the pressure-sensitive adhesive (11) comes in contact with up to the side wall (4) of pattern, and then collectively peeling said pressure-sensitive adhesive sheet (1), said resist material (3) and said side wall protective film (4) off said substrate.

Abstract: The method of attaching one or more plastic parts made from polypropylene to a glass container by means of an adhesive includes, prior to applying the adhesive over a portion of a surface of the one or more plastic parts in order to attach the plastic part or parts to the glass container, activating at least that portion of the surface, either by treating that portion of the surface with a low pressure plasma, preferably generated in a natural gas/air mixture at from 10 to 500 Pa, or by treating that portion of the surface with a flame from a gas burner. The one or more glass parts include a plastic handle and/or plastic lip member with a circumferential groove engageable with the upper edge of the glass container, especially a coffee container.

Abstract: A method for manufacturing an ink jet head by bonding with liquid-like adhesive a member at least having a discharge port for discharging ink, and a substrate having energy generating elements to generate energy for discharging ink comprises the steps of coating the liquid-like adhesive on the member or the substrate, the liquid-like adhesive containing at least ultraviolet curing cation polymeric starter and epoxy resin; irradiating ultraviolet rays to the liquid-like adhesive to activate the ultraviolet curing cation polymeric starter; positioning the member and the substrate without heating process; and heating in a state of the member and the substrate being positioned to cure the activated liquid-like adhesive.

Abstract: A method for bonding two DVD halves (23, 24) which are so held at a distance as to form a gap therebetween, includes introducing into the gap an adhesive (36) and spreading the adhesive across both disc halves. The invention is characterized by introducing the adhesive via a central opening of the DVD by means of e.g. L-shaped metering needles (63) which are pivotally guided in a central pin that engages the central opening, or flexible plastic needles which are slidably guided in a guide tube. Through introduction of the adhesive via the central opening enables a flow to the outside, without interference from the metering needles, when the DVD halves (23, 24) rotate. There is no buildup of adhesive in front of the metering needle. The bonding process can be carried out without interruption of the application of adhesive until the spin-off has concluded.

Abstract: A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectively formed on the surface of the supporting substrate, except cover the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the above supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding method whereby the sealing between the supporting substrate and the semiconductor bare chip is simultaneously conducted.

Abstract: In a system for the application of a decorative layer made of a beam-curable coating mass, in particular out of lacquer, glue, adhesive or a mixture of some or all thereof (lacquer and glue, lacquer and adhesive, glue and adhesive, or lacquer, glue and adhesive), on a carrier-plate and/or a web-formed substrate, where the decorative-layer will be treated so long with high-energy radiation particularly UV-radiation, x-ray-radiation, laser-radiation and/or electron radiation, under the maintenance of a certain temperature at normal pressure, so that it will be crosslinked and/or polymerized until the decorative-layer has reached a desired hardness, it is provided, that the decorative layer, which has to be cured, as a shield against the influence of oxygen on one side, it will be covered by the from the substrate formed carrier-plate and on the other side, it will be covered by a foil, for example by a carrier foil, that the radiation of the decorative layer with high-energy, take place in an inert gas-free atm

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

Abstract: A process and an apparatus for producing endless laminated veneer boards from a veneer-panel strand comprising veneer panels laid together in a plurality of layers by means of gluing and compression in a heated, continuously operating press. The veneer-panel strand is run through a preliminary press with a preheating device before it enters the press. The preliminary press comprises a high-frequency or microwave-energy preheating device, the preheating device being adapted to focus energy and a reflection of said energy in a central region of veneer-panel strand.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above.

Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.

Abstract: A method and a device for glueing together two disc elements. The two disc elements are brought together coaxially against each other to form a gap between the disc elements. In an inner area of the gap a liquid adhesive is applied so that it comes essentially simultaneously into contact with facing sides of the two disc elements. The two disc elements are then brought towards each other to achieve a uniform adhesive layer between the disc elements. The disc comprises lower and upper holders for respective disc elements and a unit for applying liquid adhesive in an inner area of the gap.

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: There is provided an adhesive article including (a) a radiation curable adhesive layer comprising an acrylic pressure sensitive adhesive and, optionally, an acrylated urethane polymer; and (b) a transparent carrier layer. The adhesive article may contain a radiation curable epoxy layer between the radiation curable adhesive layer and the transparent carrier layer. This adhesive article is particularly useful in preparing protective coatings on color filters for use in a liquid-crystal display panel structure. The radiation curable epoxy layer and radiation curable pressure sensitive adhesive are applied to the color filter and then exposed to UV radiation. The UV radiation exposure transforms the pressure sensitive adhesive from a removable adhesive to a permanent adhesive. The color filter with the UV cured adhesive layer is then baked to fully cure the adhesive layer and to transform the adhesive further into a near structural adhesive.

Abstract: A method for manufacturing an optical fiber array by connecting bare fibers to connection elements in a facing arrangement, comprising a step of aligning a plurality of bare fibers using a bare-fiber guide; a step of bringing a flat member into contact with the aligned bare fibers, tacking the bare fibers onto the flat member by direct or indirect bonding means while keeping the bare fibers sandwiched between the bare-fiber guide and the flat member, and separating the bare fibers and the bare-fiber guide thereafter; and a step of forming a coating of uncured material on the external peripheral surfaces of the tacked bare fibers and on the flat member exposed between the bare fibers, curing this material, and bonding the bare fibers to the flat member. This method dispenses with the need to provide a bare fiber guide member and allows manufacturing costs to be reduced.

Abstract: A device and a method for separately transporting substances are provided. The device and method according to the invention can especially be used in connection with an unit for producing DVDs. Preferably, the device according to the invention has for each substrate an input station, a processing station and an output station, which stations are arranged on the circular arc at given distances &agr;. Furthermore, grippers are provided, which are arranged on said circular arc at given distances &agr; and can be simultaneously rotated around an axis through the center of said circle through an angle &bgr;. Each gripper transports one substrate to the processing and output stations in a rotational movement. It is the advantage of the invention that the mixing-up of substrates is avoided.

Abstract: The present invention is a method for joining thermoplastic composite sandwich panels with thermoplastic welds (fusion bonds) made without autoclave processing of the joint. The preferred joint is a double interleaf staggered joint with supporting titanium doublers providing a tensile strength of at least 12,000 lb/in. The joint is particularly suited for joining sections of a cryogenic tank for spacecraft.

Abstract: The invention provides an adhesive formulation for tacking and holding a nozzle plate in alignment on a semiconductor chip for an ink jet pen of an ink jet printer. The adhesive formulation includes a multifunctional epoxy material, a difunctional epoxy material, a fumed silica viscosity control agent, an imidazole-based thermal initiator and a mixed aryl sulfonium salt photoinitiator. Use of the adhesive formulation enables a nozzle plate to be assembled to a semiconductor chip with while substantially maintaining critical alignment between the nozzle plate and semiconductor chip.

Abstract: A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

Abstract: A method and apparatus for the lamination of two lens blanks to form an ophthalmic lens comprise: a) providing a first ophthalmic lens blanks having two major surfaces thereon; b) applying a hardenable liquid adhesive to less than an entire one of said at least two major surfaces of said first ophthalmic lens blank; c) placing a second ophthalmic lens blank into contact with the hardenable liquid adhesive, forming an association of two lens blanks with the hardenable liquid adhesive between the two lens blanks; d) rotating said association of two lens blanks to assist in spreading the hardenable liquid adhesive; and e) after at least some of said hardenable liquid adhesive has spread, hardening said hardenable liquid adhesive to laminate the two lens blanks into a laminated ophthalmic lens. This method provides a relatively automated process and apparatus for performing that automated process for the lamination of ophthalmic lenses.

Abstract: A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.

Abstract: Solvent-free and water-free radiation-curable primers based on hydroxy-functional prepolymers and cycloaliphatic epoxides or based on hydroxy-functional prepolymers and olefinically unsaturated compounds or based on epoxides and vinyl ethers together with cationic or free-radical initiators may be applied in the same manner as conventional commercial solvent-free laminating adhesives and, for many coatings, allow subsequent in-line coating without there being any need to evaporate solvent or water from the primer coating.