Direct Application Of Vacuum Or Fluid Pressure During Bonding Patents (Class 156/285)
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Patent number: 9855689Abstract: There is provided a shaped product made of a fiber-reinforced composite material including reinforcing fibers having an average length of 5 mm or more and 100 mm or less and a thermoplastic resin, in which a volume fraction of reinforcing fibers (Vf=100×volume of reinforcing fibers/(volume of reinforcing fibers+volume of thermoplastic resin)) is 5 to 80%, grains are formed on a surface of the shaped product, and a ratio of a reinforcing fiber bundle (A) including the reinforcing fibers of a critical number of single fiber or more, the critical number defined by Formula (1), to the total amount of the reinforcing fibers is 20 Vol % or more and 99 Vol % or less: Critical number of single fiber=600/D??(1) (wherein D is an average fiber diameter (?m) of single reinforcing fiber).Type: GrantFiled: March 6, 2014Date of Patent: January 2, 2018Assignee: Teijin LimitedInventors: Motoomi Arakawa, Toru Sugiyama, Michiharu Taniguchi, Yasunori Nagakura
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Patent number: 9821509Abstract: A device and method for producing an interior covering part with a carrier component of a fiber molding material and a decorative film. The method may be carried out using the device and includes the steps of: in a first press tool with two tool halves, carrying out a first pressing together and forming of a semi-finished product provided for forming the substrate and of a semi-finished product provided for forming the decorative layer subject to forming a texture of a first surface of the decorative layer and because of this forming an intermediate product with a first forming state; cooling down a decorative layer portion of the intermediate product; and in a second press tool, forming a method end product with a second forming state.Type: GrantFiled: July 29, 2013Date of Patent: November 21, 2017Assignee: Faurecia Innenraum Systeme GmbHInventor: Friedhelm Kastell
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Patent number: 9824995Abstract: A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.Type: GrantFiled: September 29, 2014Date of Patent: November 21, 2017Assignee: NXP USA, INC.Inventors: Lakshminarayan Viswanathan, Michael E. Watts
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Patent number: 9809015Abstract: A method of customizing an article with graphics applied using a graphic transfer assembly is disclosed. The method includes a step of creating or selecting a customized graphic to be applied to an article. The article and the customized graphic are placed within the graphic transfer assembly. A deformable membrane may apply the customized graphic to curved portions of the article.Type: GrantFiled: November 9, 2015Date of Patent: November 7, 2017Assignee: NIKE, Inc.Inventors: N. Scot Hull, Elizabeth Langvin
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Patent number: 9802371Abstract: A method and apparatus for shaping, compacting, and supporting a composite material (C) contained between two flexible membranes (G, F) and capable of being stretched over a porous mold (A) are described. The apparatus enables the use of inexpensive mold despite the high pressures used. A counter-mold (M) having the same characteristics as the mold can be used in certain instances. The equipment enables the use of a plurality of molds and counter-molds during one manufacturing cycle.Type: GrantFiled: October 25, 2011Date of Patent: October 31, 2017Assignee: H-PREC SASInventor: Dominique Crassous
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Patent number: 9793152Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.Type: GrantFiled: June 28, 2013Date of Patent: October 17, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Stephan Heimgartner, John A. Vidallon
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Patent number: 9782928Abstract: A system is described for reinforcing a thermoplastic workpiece including a subject surface and an underlying workpiece body volume. At least one substantially linear Z-pin having proximal and distal pin ends longitudinally separated by a pin body is provided. The proximal pin end is in direct contact with the subject surface. An ultrasonic energy source applies ultrasonic energy to the Z-pin to ultrasonically heat the Z-pin and thus locally melt the workpiece material of the subject surface and/or the workpiece body to create a melted workpiece material. The proximal pin end and at least a portion of the pin body of the Z-pin are penetrated into the melted workpiece material to create an inserted Z-pin length. The inserted Z-pin length is maintained in the workpiece body volume by solidified melted workpiece material around the inserted Z-pin length to reinforce the workpiece. A method of reinforcing a workpiece is also provided.Type: GrantFiled: September 2, 2015Date of Patent: October 10, 2017Assignee: Northrop Grumman Systems CorporationInventors: Eric G. Barnes, Sung S. Park, Pedro A. Gonzalez, Anthony Tamayo, Todd Lewis Szallay
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Patent number: 9766012Abstract: The removal of moisture from an object to be sterilized is provided through at least the steps of placing the load in the chamber, reducing the pressure within the chamber to increase the rate of evaporation of moisture from the load, monitoring over a predetermined period of time the increase in the quantity of vapor within the chamber resulting from evaporation of moisture from the load, admitting gas into the chamber and repeating the steps following placing the load into the chamber.Type: GrantFiled: June 19, 2012Date of Patent: September 19, 2017Assignee: Sterilucent, Inc.Inventors: Jami McLaren, Steven J. Olson, Kent Larson
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Patent number: 9757876Abstract: The present disclosure is directed at a method for making an article from a curable material, such as pliable fibre-reinforced polymer. The method includes printing a dissolvable, three dimensional substructure using a substructure material; applying the curable material to the substructure; curing the curable material while it is on the substructure; and dissolving the substructure using a dissolving agent. Using a 3D printer to print the substructure allows for faster and more economical manufacture of composite articles, such as prototype parts, relative to conventional methods that utilize CNC machines.Type: GrantFiled: February 27, 2012Date of Patent: September 12, 2017Assignee: Red River CollegeInventors: Sergei Douglas Broeska, Leon Fainstein
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Patent number: 9744931Abstract: The present invention relates to a crash pad for vehicles and a method for preparing the same, and more specifically, a crash pad for vehicles comprising a skin layer forming the outer surface of the crash pad provided with an air-bag module for vehicles; a foaming layer in intimate contact with the lower surface of the skin layer; and a core layer in intimate contact with the lower surface of the foaming layer to form an inner surface, wherein the skin layer has a tensile strength of about 10 to about 100 kgf/cm2 and an elongation at break of about 50 to about 600% according to JIS K6301 method when it has a layer thickness of about 0.2 mm to about 1.0 mm.Type: GrantFiled: February 26, 2015Date of Patent: August 29, 2017Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Chang Wan Son, Hea Yeon Lee, Yong Chun, Hyeon Don Kim
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Patent number: 9738039Abstract: A composite skin and composite stiffeners are co-cured in an autoclave. Uncured stiffeners are placed in channels of a tool, and an uncured skin is placed on the tool contacting the stiffeners. The vacuum bag is sealed over the tool. Bladders placed in the stiffeners are exposed to autoclave pressure through a manifold system employing vent tubes that pass through the vacuum bag along a side of the tool.Type: GrantFiled: May 9, 2016Date of Patent: August 22, 2017Assignee: THE BOEING COMPANYInventors: Jeffrey Scott Stephens, Steven Douglas Bye, Dan Day
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Patent number: 9694547Abstract: A device for producing fiber preforms including a plurality of unwind stations, a plurality of grippers and at least one first molding tool. Further, a method includes the successive steps of tensioning threads or rovings for a first layer with grippers, draping the first layer over a first molding tool, severing of the threads or rovings of the first layer, tensioning threads or rovings for a second layer with grippers, draping an additional layer over the first forming tool, and severing the threads or rovings of the second layer.Type: GrantFiled: October 8, 2013Date of Patent: July 4, 2017Assignee: Voith Patent GmbHInventors: Marco Göttinger, Michael Kaiser
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Patent number: 9694551Abstract: A process for manufacturing tires for vehicle wheels includes associating at least one reinforcing structure with at least one surface portion of at least one tire component laid on a forming support, wherein associating the at least one reinforcing structure includes bringing, through a handling and deposition member, at least one reinforcing element to the forming support and depositing, through said handling and deposition member, the reinforcing element on a respective deposition part defined on a surface portion of the component. The depositing includes gradually laying the reinforcing element on the deposition part following the profile of the deposition part in a circumferential direction.Type: GrantFiled: November 17, 2011Date of Patent: July 4, 2017Assignee: PIRELLI TYRE S.P.A.Inventors: Maurizio Marchini, Christian De Col
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Patent number: 9679790Abstract: A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.Type: GrantFiled: January 13, 2016Date of Patent: June 13, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu
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Patent number: 9629240Abstract: A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.Type: GrantFiled: December 27, 2012Date of Patent: April 18, 2017Assignee: ZEON CORPORATIONInventors: Yuuki Hayashi, Takashi Iga
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Patent number: 9616589Abstract: A resin infusion repair device and method for repairing a wooden boat deck having a repair area that includes voids between the planking of the boat deck and the as built surface under the boat deck planking. A vacuum cover provides an airtight cover of the repair area. A vacuum suction line is inserted into the vacuum cover. A vacuum pump is connected to the vacuum suction line and provides vacuum suction at the repair area. A resin supply line is inserted through the vacuum cover. A resin supply source is connected to the resin supply line. The vacuum pump provides a vacuum suction that draws resin from resin supply source through the resin supply line and into the repair area so that the voids are all filled with the resin. In a preferred embodiment, the wooden boat deck is a teak boat deck.Type: GrantFiled: May 24, 2012Date of Patent: April 11, 2017Inventor: Michael Ray Kimble
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Patent number: 9604418Abstract: A method of repairing an affected area of a component of a fiber-reinforced polymer composite, especially having elongate or continuous reinforcing fibers in a polymer matrix, is disclosed. The method includes: providing a controlled atmosphere around the affected area of the component; heating the component in the affected area within the controlled atmosphere to cause pyrolysis or depolymerization of the polymer matrix in the affected area and thereby to remove the polymer matrix from the affected area; introducing polymer resin into a space left by the pyrolyzed or depolymerized matrix to refill the affected area.Type: GrantFiled: December 4, 2014Date of Patent: March 28, 2017Assignee: Airbus Operations GmbHInventor: Tassilo Witte
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Patent number: 9604415Abstract: A method for producing FRP in which a preform made of a reinforcing fiber base material is disposed in a cavity of a mold, a resin injection path and a suction path that sucks at least air are provided to the mold, and resin from the resin injection path is caused to flow in the direction toward the suction path in the cavity to be impregnated into the preform, wherein a high flow resistance region for partially making the resin flowing in the preform hardly flow is formed in the preform itself, and a flow front of the resin flowing in the direction toward the suction path through the high flow resistance region is controlled to settle within a permitted region that has been predetermined relative to a shape of a product to be molded.Type: GrantFiled: February 21, 2012Date of Patent: March 28, 2017Assignee: Toray Industries, Inc.Inventors: Kohnosuke Yamamoto, Seiji Tsuji, Kazuya Watanabe
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Patent number: 9572254Abstract: An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.Type: GrantFiled: January 17, 2012Date of Patent: February 14, 2017Assignee: XEROX CORPORATIONInventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes
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Patent number: 9550331Abstract: A method for producing a composite molded part from fiber-reinforced plastics material includes providing a prepreg semi-finished product including fibers that are pre-impregnated with a matrix material and encasing the semi-finished product with a flexible sheet material to form an inner arrangement. The flexible sheet material includes a gas-permeable membrane and an inner planar gas-conducting element. The inner arrangement is encased with a first gas-tight casing and positioned on a molding surface of a mold. The inner arrangement and molding surface is encased with a second gas-tight casing. A first negative pressure is applied to the inner planar gas-conducting element and the inside of the first gas-tight casing, and the entire arrangement is heated for a first time at a first temperature. A second negative pressure is applied to an inside of the second gas-tight casing and the entire arrangement is heated for a second time at a second temperature.Type: GrantFiled: April 7, 2011Date of Patent: January 24, 2017Assignees: PREMIUM AEROTEC GMBH, EADS DEUTSCHLAND GMBHInventors: Llorenc Llopart Prieto, Rainer Neumaier, Jochen Scholler, Markus Klug
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Patent number: 9517528Abstract: A tool and method for bonding layers of a shell by the differential pressure bonding process. The tool and method includes a plurality of separable mandrel segments that combine to form a mandrel having a longitudinal axis, an outer surface, an upper end, and at least one substantially continuous inner surface. The inner surface has a substantially axisymmetric shape having complex curvature. In this embodiment, the tool further includes a retort configured to at least partially shroud the outer surface and upper end of the hollow body. The retort includes at least one vacuum port. The tool is configured to facilitate the compression of a plurality of layers of a multi-layer shell having complex curvature as the shell layers and an interdisposed bonding material are heated to an elevated bonding temperature.Type: GrantFiled: October 22, 2013Date of Patent: December 13, 2016Assignee: ROHR, INC.Inventors: Thomas Edward Sommer, Mark Alan Ramsey, David Dwain Rishel
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Patent number: 9481442Abstract: A first reinforcing fiber layer is formed of reinforcing fibers which are wound around an outer periphery of a mandrel. The reinforcing fibers are aligned in parallel to a direction (+? direction) in which the reinforcing fibers intersect with an annular direction (0° direction) of the mandrel, and seamlessly continue in the annular direction of the mandrel by an amount of at least one rotation.Type: GrantFiled: March 21, 2012Date of Patent: November 1, 2016Assignee: SHIKIBO LTD.Inventors: Tetsuro Hirokawa, Shigeru Nishiyama
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Patent number: 9475266Abstract: A method for stabilizing a honeycomb core for a sandwich-type structural component includes configuring the honeycomb core. A hardenable adhesive layer is applied to at least one exterior surface of the honeycomb core. A semi-permeable membrane is positioned on the at least one exterior surface. The membrane is gas-permeable and liquid-impermeable. Air in the honeycomb core is drawn off through the semi-permeable membrane. The adhesive layer is hardened.Type: GrantFiled: July 10, 2012Date of Patent: October 25, 2016Assignee: PREMIUM AEROTEC GMBHInventors: Julian Kuntz, Juergen Klenner, Ralf Trost, Joseph Micheler
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Patent number: 9440483Abstract: The invention relates to a method for laminating a substrate with a decoration (104), wherein the substrate comprises a first portion (114) and a second portion (116), wherein the method simultaneously comprises membrane lamination and press lamination, wherein the press lamination is carried out in a first region (118) of the decoration (104), and the membrane lamination is carried out in a second region (122) of the decoration (104), wherein the first region (118) directly borders the second region (122), wherein the first region (118) comprises the first portion fully and the second portion partially, and wherein the second region comprises the part of the second portion that is not contained in the first region (118).Type: GrantFiled: May 2, 2012Date of Patent: September 13, 2016Assignee: FAURECIA INNENRAUM SYSTEME GMBHInventors: Christof Oldemeier, Bertram Lohr, Jens Reinert
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Patent number: 9427735Abstract: The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform.Type: GrantFiled: February 29, 2012Date of Patent: August 30, 2016Assignee: Beijing Bohui Innovation Technology Co., Ltd.Inventor: Qi Yang
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Patent number: 9403711Abstract: A cover window manufacturing apparatus includes a plurality of fixed plates, a plurality of moving plates, a plurality of molds and a driver. The plurality of fixed plates is layered and spaced apart at a distance from each other. The plurality of moving plates is layered, spaced apart at a distance from each other and respectively disposed under the plurality of fixed plates. A plurality of connection members integrally connects the plurality of moving plates with each other. The plurality of molds is respectively provided on the plurality of moving plates, and inner spaces for molding the cover window are respectively defined in the plurality of molds. The driver is coupled to one of the plurality of moving plates, and is configured to move the plurality of moving plates towards the plurality of fixed plates such that the plurality of molds are pressed to the plurality of fixed plates.Type: GrantFiled: December 15, 2013Date of Patent: August 2, 2016Assignee: SAMSUNG DISPLAY CO., LTD.Inventor: Moon-Seok Roh
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Patent number: 9373946Abstract: The present invention relates to a busbar adapter having a lower deck and an upper deck that can be interconnected releasably. The deck elements comprise projections and openings that can be brought into engagement with each other, the busbar adapter further comprises a locking device.Type: GrantFiled: September 29, 2014Date of Patent: June 21, 2016Assignee: Klaus Bruchmann GmbHInventor: Klaus Bruchmann
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Patent number: 9358762Abstract: A lamination apparatus, including: a substrate support; an adhesive film support that is disposed so as to be spaced from the substrate support; an air injection head that is disposed on a co-plane with the adhesive film support so as to be spaced apart from the substrate support or disposed so as to be further spaced apart from the substrate support than the adhesive film support; an air pump that supplies air to the air injection head; an air supply pipe that connects the air injection head with the air pump, wherein the air injection head includes an ion generation unit.Type: GrantFiled: March 11, 2013Date of Patent: June 7, 2016Assignee: Samsung Display Co., Ltd.Inventors: Hye-Young Gim, Chul-Hwan Park, Jun Namkung
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Patent number: 9337433Abstract: A method of manufacturing a flexible display device includes a first step of providing a three-dimensional cover window having a flat portion, and a curved portion that is bent in a third direction intersecting a first direction of the flat portion while extending to a second direction intersecting the first direction at both sides of the first direction, and a second step of attaching by a line contact at least one of an adhesive film, a touch panel, and a flexible display panel that are stacked at an inner surface of the cover window.Type: GrantFiled: November 14, 2013Date of Patent: May 10, 2016Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Young-In Lim, Kyu-Ho Jung, Sang-Hee Choi
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Patent number: 9257321Abstract: A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.Type: GrantFiled: June 13, 2013Date of Patent: February 9, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu
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Patent number: 9242393Abstract: A mandrel having an out-of-plane curvature and a corresponding in-plane change in mandrel geometry is used to fabricate substantially wrinkle-free, fiber reinforced stiffeners having an out-of-plane curvature.Type: GrantFiled: July 7, 2014Date of Patent: January 26, 2016Assignee: THE BOEING COMPANYInventor: Jamel R. Bland
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Patent number: 9237970Abstract: There is provided a manufacturing method for a composite body of a continuous sheet associated with an absorbent article, the composite body being manufactured by attaching a single-cut sheet to the continuous sheet at a predetermined attachment pitch.Type: GrantFiled: August 22, 2011Date of Patent: January 19, 2016Assignee: Uni-Charm CorporationInventors: Miwa Iida, Osamu Ishikawa
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Patent number: 9227386Abstract: A method for manufacturing a resin-based composite material includes: a stage in which prepregs are stacked on a jig; a stage in which the stacked prepregs and the jig are covered and pressurized heat treatment is applied thereto to form a first semi-molded article and a second semi-molded article; a stage in which board thicknesses of the first semi-molded article and the second semi-molded article are measured, a stage in which the number of additional plies is determined based on the measured board thicknesses, a desired board thickness of the resin-based composite material, and physical properties of the additional plies; and a stage in which a layered product is formed by stacking the predetermined number of additional plies between the first semi-molded article and the second semi-molded article, the layered product and the jig are covered with a bagging material, and pressurized heat treatment is applied thereto.Type: GrantFiled: June 3, 2011Date of Patent: January 5, 2016Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hidetaka Hattori, Hideki Horizono, Takaaki Sato, Tadashi Yazaki
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Patent number: 9199413Abstract: In this method for producing an ornament (1), wherein an ornamental sheet (3) is bonded/affixed by means of a vacuum-press-bonding method to the convex front surface (21) of a substrate (2) provided with a convex front surface (21) and a concave back surface (22), a work-support base (6) is placed on a work placement surface (121a) formed on the upper surface of the suction chamber (120) of a vacuum-press-bonding device (100), and the substrate (2) is positioned by fitting an engagement protrusion (28) formed on the back surface of the substrate (2) covered by the ornamental sheet (3) to an engagement hole (68) at the work-support surface (61) formed on the upper surface of the work-support base (6). When bonding/affixing the ornamental sheet (3) to the substrate (2) by means of the vacuum-press-bonding device (100), position deviation of the substrate (2) is prevented by the engagement of the engagement hole (68) and the engagement protrusion (28).Type: GrantFiled: October 31, 2011Date of Patent: December 1, 2015Assignee: FUJIGEN INC.Inventors: Eiji Furuya, Kei Komatsu, Kazutaka Ono
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Patent number: 9200891Abstract: Provided is a molding wall thickness recognition apparatus, including a calculation portion that calculates a surface area of each surface that configures a molded article in each wall thickness, based on three-dimensional shape information which illustrates a shape of the molded article having different wall thicknesses, and a determining portion that determines the wall thickness of the surface area that satisfies preset conditions as a basic wall thickness, by comparing each surface area in each wall thickness calculated by the calculation portion.Type: GrantFiled: February 9, 2015Date of Patent: December 1, 2015Assignee: FUJI XEROX CO., LTD.Inventor: Masanori Yoshizuka
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Patent number: 9139273Abstract: Method for manufacturing a membrane material especially for use in the manufacturing of sails for sailboats and the like, where said method comprises the following steps: a) distributing a first material layer on a vacuum table; b) dispensing an adhesively coated yarn from a dispenser in a predefined pattern on said first material layer; c) arranging a second material layer superposed the first material layer and the treads, thereby creating a membrane matrix; d) passing a heating source across the matrix, thereby curing the adhesive applied to the yarn and laminating the membrane; where the first material layer is provided with pin holes distributed across the first material layer, allowing the vacuum to traverse the first material layer.Type: GrantFiled: October 6, 2011Date of Patent: September 22, 2015Assignee: ELVSTROM SAILS A/SInventor: Claus Olsen
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Patent number: 9108395Abstract: A method of attaching a composite member to a structure. The method including forming a laminate of fabric impregnated with resin; applying heat at a first temperature to the impregnated laminate; applying vacuum at a first pressure to the impregnated laminate to degas the resin and form a degassed, impregnated laminate; positioning the degassed, impregnated laminate on a structure; and curing the degassed, impregnated laminate on the substrate by applying heat at a second temperature and by applying vacuum at a second pressure.Type: GrantFiled: June 17, 2014Date of Patent: August 18, 2015Assignee: BELL HELICOPTER TEXTRON INC.Inventors: Denver Whitworth, Anthony Bergerson, Michael Marvin
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Patent number: 9102104Abstract: An electrical charge is placed on a tool used to cure a composite resin part layup. The charged tool produces an electrostatic force that attracts entrapped gases in the resin to the surface of the tool, thereby reducing porosities in the cured part.Type: GrantFiled: June 5, 2012Date of Patent: August 11, 2015Assignee: THE BOEING COMPANYInventor: David Thomas Misciagna
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Patent number: 9095944Abstract: A work setting apparatus includes a lower table 15, an upper table 17, and a work holding unit 19 provided with a plurality of work holders 25 each having an adhesive to hold a work. A work setting method sets a second work W2 held by the work holders 25 onto a first work W1 set on the lower table 17. A work holder removing method removes the work holders 25 from the second work W2 set on the first work W1 by vibrating the first and second works W1 and W2 on the lower table 15.Type: GrantFiled: November 30, 2012Date of Patent: August 4, 2015Assignee: Toshiba Kikai Kabushiki KaishaInventors: Mitsunori Kokubo, Yuki Sugiura, Toru Suzuki, Hidetoshi Kitahara
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Patent number: 9090028Abstract: A method is provided for forming a composite part contoured along its length and having at least one leg. The method includes forming a stack of fiber reinforced, pre-preg plies by laying down individual segments of unidirectional fibers in each ply. Each of the segments is placed in a preselected orientation related to the contour of the part. The leg is formed by bending a portion of the stack over a tool.Type: GrantFiled: April 17, 2008Date of Patent: July 28, 2015Assignee: The Boeing CompanyInventors: Douglas A. McCarville, Patrick B. Stickler, Juan C. Guzman, Jennifer S. Noel, Joseph L. Sweetin
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Patent number: 9079352Abstract: The present invention provides a duct molding method by which it is possible to improve the adhesion of a sheet. In the duct molding method of the present invention, a molten thermoplastic resin sheet is positioned between molds. Subsequently, the thermoplastic resin sheet (P) is absorbed onto cavity surfaces of the molds and the molds are closed. Thereby, a duct is molded.Type: GrantFiled: September 12, 2011Date of Patent: July 14, 2015Assignee: KYORAKU CO., LTD.Inventors: Takehiko Sumi, Tadatoshi Tanji, Masaaki Onodera, Tatsuya Fukuda, Sho Nakajima
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Patent number: 9066461Abstract: A base member includes a mounting area where an electronic component can be mounted and a ring-shaped sealing surface surrounding the area as the area is viewed in a plan view. A sealing member is fixed on the sealing surface. A through-hole portion which is a recess partitioned by a wall surface of the sealing member and which connects the mounting area and an outer peripheral side of the sealing surface as viewed in a plan view is provided on the sealing surface. A manufacturing method for an electronic device using this base member is also provided.Type: GrantFiled: February 22, 2013Date of Patent: June 23, 2015Assignee: SEIKO EPSON CORPORATIONInventor: Masaru Mikami
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Publication number: 20150144737Abstract: An integrated composite trailing edge and its method of manufacturing. The trailing edge comprises an integrated main structure having an upper cover, lower flanges, and a set of ribs extending between the upper cover and the lower flanges, with a set of sandwich type lower panels attachable to the lower flanges of the integrated main structure. The method comprises the steps of providing a set of prepreg laminated preforms over a set of tool modules having a hollow so that each laminated configures a double C-shaped laminated preform having an upper section with a recess, two primary and secondary flanges, the upper section partly forming the upper cover, the two primary flanges partly forming the ribs and the two secondary flanges forming the lower flanges.Type: ApplicationFiled: November 24, 2014Publication date: May 28, 2015Inventors: Diego Garcia Martin, Julio Nunez Delgado, Lara Barroso Fernandez
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Publication number: 20150145289Abstract: A vehicle roof structure includes a solar cell unit including a plurality of solar cells arranged in a planar form, a plate-like roof panel made of a resin having transparency and disposed to cover the solar cell unit from above, and a plurality of reinforcements each being implemented by a metallic member and disposed to support the solar cell unit from below and to extend in a vehicle longitudinal direction and/or a vehicle width direction. The vehicle roof can be reduced in weight.Type: ApplicationFiled: November 25, 2014Publication date: May 28, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Hirotaka INABA, Hideaki TERAI
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Patent number: 9038264Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.Type: GrantFiled: February 28, 2011Date of Patent: May 26, 2015Assignees: SanDisk Semiconductor (Shanghai) Co., Ltd., SanDisk Information Technology (Shanghai) Co., Ltd.Inventors: Pradeep Kumar Rai, Kim Lee Bock, Li Wang, JinXiang Huang, EnYong Tai, JianHua Wang, King Hoo Ong
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In-situ, multi-stage debulk, compaction, and single stage curing of thick composite repair laminates
Patent number: 9034137Abstract: A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a bonding material to the exposed surface and forming an uncured ply stack assembly on the bonding material. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The ply stack assembly and bonding material are then cured.Type: GrantFiled: November 26, 2008Date of Patent: May 19, 2015Assignee: Textron Innovations Inc.Inventors: Denver R. Whitworth, Vance N. Cribb, Dumitru R. Jitariu -
Patent number: 9034131Abstract: A method includes steps of: carrying an air-permeable web while holding the first surface of the web on a carrying surface; dispensing powder particles onto the second surface of the web; drawing the first air from a plurality of suction holes in the carrying surface through the web, thereby holding the powder particles in a predetermined pattern on the second surface of the web; and giving at least a part of the first air flow components flowing in directions along the second surface of the web by means of an airflow deflector opposing the second surface of the web, thereby moving powder particles on non-suction areas between the suction holes on the web, thus arranging the powder particles in a predetermined pattern on the web.Type: GrantFiled: February 2, 2012Date of Patent: May 19, 2015Assignee: ZUIKO CORPORATIONInventors: Yoshio Tsujimoto, Masaki Nakakado
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Patent number: 9034130Abstract: A method includes steps of carrying an air-permeable web while holding the first surface of the web on a carrying surface; dispensing powder particles onto the second surface of the web; and while drawing the first air from a plurality of suction holes in the carrying surface through the web, thereby holding the powder particles in a predetermined pattern on the second surface of the web, discharging the second air toward the web through a discharge hole open in a non-suction area, whereby the powder particles on non-suction areas are blown away by the second air, thus arranging the powder particles in a predetermined pattern on the web.Type: GrantFiled: February 2, 2012Date of Patent: May 19, 2015Assignee: ZUIKO CORPORATIONInventors: Yoshio Tsujimoto, Masaki Nakakado
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Publication number: 20150122413Abstract: A vacuum bag (18) is placed around the inner forming surface (IML) of an inner mandrel with radially retractable sectors (11a, 11b) having parallel longitudinal slots (17) with composite stringers (30) in the slots (17). An inner support (31) in each stringer is covered by an impermeable tubular bag (32). A composite skin (37) is laminated around the stringers (30), the coated supports (31, 32) and the inner forming surface (IML). An outer curing tool (50, 51) closes around the skin (37) defining an fuselage barrel outer forming surface (OML), leaving an annular gap (G) between the skin outer surface (37) and the outer forming surface (OML). Vacuum is applied between the vacuum bag (18) and the outer tool (50, 51), enlarges the uncured barrel diameter, releasing the barrel from the inner mandrel (10) and bringing the skin outer surface (37) into contact with the outer tool inner surface (IML).Type: ApplicationFiled: April 12, 2013Publication date: May 7, 2015Inventors: Sabato Inserra Imparato, Pietrantonio Cerreta
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Publication number: 20150122414Abstract: A wafer bonding system and method using a combination of heat and a pneumatic force to bond two wafers held together in alignment. The wafers are heated via a non-contact, gaseous interface, thermal path between heating elements and the wafers. The pneumatic force is created by a pressure differential between a first pressure surrounding the two wafers and a second pressure, which is less than the first pressure, maintained between the two wafers.Type: ApplicationFiled: October 21, 2014Publication date: May 7, 2015Inventor: Alton H. PHILLIPS