Abstract: A method of laminating first and second members to each other includes the steps of applying a resin material to a plurality of regions on the laminating surface of at least one of the first and second members such that an air escape passage extending in a predetermined direction is formed; providing a laminating force to the first and second members along the extending direction of the air escape passage in a state where the first and second members are disposed with their laminating surfaces opposed to each other, so that air is expelled toward the outside through the air escape passage and the applied resin material is made to be continuous so as to form a thin film layer; and then laminating the first and second members to each other.

Abstract: The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.

Abstract: A method of manufacturing a plate-like body formed of first and second members stuck together through liquid includes the steps of (a) applying the liquid on a surface of the first member and (b) feeding gas between the first and second members at an instant of initial contact of the liquid with the second member when the second member is superimposed on the first member.

Abstract: A process for making a disposable wearing article for securing an elastic member to the wearing article without reducing a comfortable feeling of touch with a wearer's skin of the wearing article. A production line of the wearing article includes a step of securing elastic member to a sheet material using an adhesive. The elastic member is coated on its peripheral surface with the adhesive in a pattern of substantially continuous line and then the elastic member secured to sheet material of the wearing article. The continuous line runs in a longitudinal direction of the elastic member so that the curved line undulates on a plane defined by developing the peripheral surface of the elastic member with a height of undulation substantially corresponding to or being larger than a circumferential length A of the elastic member.

Abstract: The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

Abstract: A method of making a three-dimensional film structure having controllable contact properties comprises making separable surface elements on a top portion of a film structure and stretching the film structure to separate the separable surface elements, thereby obtaining a desired surface structure which delivers a certain contact property such as a pressure sensitive adhesive property. The separable surface elements are provided using a cut film surface, a stemmed film, or a layer of particles.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a centering device insertable within a common center hole of the superimposed substrates. The centering device includes at least two contact pins configured to simultaneously contact an inside circumferential edge of the common center hole, where the contact pins retractably extend in substantially opposite directions to press against the inside circumferential edge of the common center hole and align the superimposed substrates. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the adhesive layer between the aligned substrates, the provisional bonding device partially bonding and provisionally fastening the aligned substrates.

Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.

Abstract: A method for manufacturing an inkjet head, which jets, by shear deformation of a partition wall, an ink in an ink flow path. The method includes the steps of: forming a metal electrode on a surface of the partition wall; coating an adhesive agent on the cover board; superposing the cover board onto an upper end surface of the partition wall under a condition wherein the hardness of the adhesive agent is not less than 105 dyne/cm2, so that the ink flow path is formed with the partition wall and the cover plate; and pressing the channel board and the cover board under the hardness condition wherein the hardness of the adhesive agent is not less than 105 dyne/cm2 and not greater than 109 dyne/cm2.

Abstract: An insulating unit for an electrical box for insulating an electrical box. The insulating unit for an electrical box includes a rear portion, a lower portion extending from the rear portion, an upper portion extending from the rear portion opposite of the lower portion, and a side portion extending from the rear portion defining a rectangular cavity for receiving the electrical box within. A cutout may be made within the upper portion, side portion or lower portion for receiving a wire. Sealants are preferably utilized for sealing and securing to a wall stud. The rear portion, lower portion, upper portion and side portion are preferably comprised of an insulating material.

Abstract: A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

Abstract: The present invention provides for a multiple well filter plate and method of producing same, the multiple well filter plate comprising a molded plate and a filter sealed via an adhesive, the method particularly adapted for producing multiple well filter plate having substantial well densities and small volume sample wells.

Abstract: A method for attaching an adhesive tape includes the steps of, disposing the adhesive tape having an adhesive surface on a support body with the adhesive surface down, rolling an attaching roller having adhesive strength on the other not-adhesive surface of the adhesive tape so that the adhesive tape is transferred onto the attaching roller and is come into tight contact therewith, and rolling the attaching roller on a surface of a member to be attached which is located in a predetermined position so that the adhesive tape adhered to the attaching roller is attached onto the surface of the member. Respective adhesive strengths A, B and C are set to have a relation of A<B<C, where A designates adhesive strength between the adhesive surface of the adhesive tape and the support body, B designates adhesive strength between the not-adhesive surface of the adhesive tape and the attaching roller, and C designates adhesive strength between the adhesive surface of the adhesive tape and the member to be attached.

Abstract: The invention relates to a method for laying a floor covering that includes a flexible material containing a thermoplastic wear layer made from, in particular, plasticized PVC. The basic panels that form the covering are glued to the ground and cold welded in between on the site to be covered. After a panel has been positioned and glued to the surface to be covered, a continuous bead of mastic, which is made on the actual site by mixing a hardener and a polyurethane resin in aqueous phase, is applied laterally along the entire depth of the covering. The next panel is positioned on the ground which is covered with adhesive and the lateral edge thereof is pinned against the edge of the preceding panel comprising the bead of mastic, thereby causing the excess material to come to the surface, where it is removed by simply wiping with water.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: A thin film bonding method for bonding a thin film to an target surface by using an adhesive agent includes the steps of: applying the adhesive agent on the target surface and mounting the thin film on the adhesive agent; applying a a fluid pressure on the target surface and the thin film from a central portion to an circumference according to lapse of time, so as to allow the thin film and the target surface to be bonded partially; and hardening the adhesive agent. The compressive force using the fluid having a magnetic force in the thin film bonding proceeds in a spiral form from the central portion to the circumference of the disk according to lapse of time, so that the air trap existing in the adhesive agent can be effectively removed, and thus, the flatness of the disk can be prevented from degradation due to the air trap.

Abstract: This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.

Abstract: A sheetlike article comprising a single-layer homogenous matrix containing at least one active substance such as a crop protection agent, biocide, fertilizer, plant strengthener, cosmetic substance or fragrance, is produced by applying the at least one active substance to at least one of two layers of identical composition, placing the two layers atop one another so as to enclose the at least one active substance, irreversibly joining the layers with the at least one active substance therebetween under pressure to form a laminate and storing the laminate under defined conditions for a duration sufficient to effect migration of the at least one active substance into the base layer and connection of the layers at their interfaces.

Abstract: A process for transferring a coating onto at least one optical surface of a lens blank which comprises:

Abstract: Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the substrates can apply pressure and heat to the thin metallic layer and cause it to be entirely consumed and subsequently transformed into a bonding layer having a melting temperature higher than the melting temperature of the original thin metallic layer. Prior to, during, or after the conductive post is bonded to the conducting structure, the region around the conductive post and between the substrates may be filled with a dielectric material, such as polyimide.

Abstract: For the purpose of fastening cables to the inner wall of a non-accessible waste-water pipe, an internal liner has been developed, which is constructed from at least two layers, the first layer, which rests against the internal wall of the pipe when in the laid condition, having a profile or empty spaces for receiving cables, and a second layer, of envelope-like type, which carries the first layer.

Abstract: A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components.

Abstract: An improved anisotropic bonding system and method connects two conductive surfaces together using an anisotropic material having elastic conductive particles dispersed in an insulating, heat-curable carrier. The system monitors bond resistance in real-time during the bonding process and controls the application of pressure to the bond based on a feedback signal corresponding to the bond resistance. When the bond resistance reaches a predetermined value, the applied pressure is reduced to a holding/clamping level to prevent over-compression as the curing schedule completes curing of the insulating carrier. By monitoring and responding to the bond resistance in real time during the bond compression process, the system prevents bond resistance increases caused by over-compression and conductor damage.

Abstract: In order to avoid the necessity of cropping the pages of a bound volume, uniformly sized printed pages having pre-glued edge surfaces are aligned within a stack and a press then presses the edge of the stack so as to compress the glue and adhere the pages together.

Abstract: A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the substrate to allow the portion of the solder mask formed over a vent hole in the substrate to be substantially raised to an elevated flat surface where a groove is then formed to surround the exit of the vent hole. During a molding process, when the encapsulation material infiltrates to the exit of the vent hole, it can be confined within the groove in the elevated flat surface over the dummy pad, thereby preventing it from flashing to nearby solder-ball pads.

Abstract: A clutch plate consists of an annular support plate carrying friction liners adhesively bonded on at least one lateral fastening face of peripheral radial blades of the support plate, by a method including an adhesive applying step which consists in depositing a predetermined quantity of adhesive on, but only on, an adhesion zone located on the lateral fastening face of each successive radial blade. This deposition is performed by an adhesive applicator having an adhesive applying zone of a form corresponding to that of the adhesion zone on the blade. The method is performed in an apparatus having at least one applicator head.

Abstract: The vented cell structure and fabrication method of the present invention provide an efficient and effective honeycomb structure that allows fluids to flow in and out of the honeycomb without any obstructions that may trap gases and/or liquid in the honeycomb cells. First and second honeycomb layers, including first and second cell walls, respectively, that define first and second cells, respectively, are positioned adjacent one another such that the first and second cells are misaligned. The first and second honeycomb layers are connected with adhesive only at intersections of the first and second cell walls to permit fluid to flow between the first and second cells without obstruction. A structural layer defining at least one opening aligned with the first and/or second cells is also applied on opposite sides of the first and second honeycomb layers, to thereby create the vented cell structure.

Abstract: An adhesive agent is applied to both single plates, upper and lower, in which case the formation of bubbles is minimized by using a specified application manner. A method of laminating optical disks (D) comprising the steps of placing a lower disk single sheet (D1) on a turntable (1), applying an adhesive agent (R1) in doughnut form to the lower disk single sheet (D1), placing an upper disk single sheet (D2) on another turntable (2), applying an adhesive agent (R2) in doughnut form to the upper disk single sheet (D2), placing the upper disk single sheet (D2) on the lower disk single sheet (D1), and spreading the adhesive agent (% 2) between the two disk single sheets by rotating the turntables. Since bubbles hardly enter the adhesive agent, the bubble content of the adhesive agent after spreading is very small, and even after the curing subsequent to ultraviolet ray radiation, the air content of the optical disk can be minimized, the quality being high.

Abstract: Disclosed is a method and apparatus for bonding sheets together without trapping bubbles between two adjacent sheets and a procedure for easy detachment of the completed stack of bonded together sheets from the apparatus that constructed it. The present invention is particularly well suited for use with apparatus for construction of three-dimensional objects from a stack of thin sheets bonded together.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a suction device adapted to suction the adhesive layer formed between the first substrate and the second substrate with a predetermined suction force. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the suctioned adhesive layer to partially bond and provisionally fasten the first substrate and the second substrate.

Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate. The manufacturing apparatus and method further include an adhesive supply source adapted to supply the adhesive to the adhesive applying device at a first predetermined temperature and a defoaming tank adapted to remove bubbles from the adhesive at a second predetermined temperature, which is higher than the first predetermined temperature.

Abstract: As an efficient and economical bonding method indispensable for the bonding between dimension-small constituent elements (members, parts) to manufacture a minute (micro) structure, a micromachine, etc. is provided a bonding method using a capillary condensation effect characterized in that in order to bond at least two separated bonding targets (works) at a prescribed joint point, the bonding targets are disposed under an atmosphere comprising a prescribed vapor pressure of adhesive agent, and the adhesive agent is subjected to capillary condensation at the joint point to thereby form uniform meniscus and bond the bonding targets (works) by the adhesive agent constituting the meniscus.

Abstract: A page binding device for binding pages 11 from a printer. The device having a support tray 18 for receiving and stacking printed pages 11 to form a bound document, and an adhesive applicator 16 for applying a two part adhesive to the printed pages. The two part adhesive has a first part and a second part, wherein the first part and the second part must contact eachother to form an adhesive bond. The adhesive applicator 16 applies the first part of the adhesive to one side of the printed pages and the second part to the opposite side of the page 11. The printed pages 11 are stacked in the support tray 18 such that the first part of the adhesive on one page 11 contacts the second part of the adhesive on the adjacent page in the adjacent page in the stack.

Abstract: A page binding device for binding pages 11 from an inkjet printhead assembly 13. The device has an adhesive applicator 16 for applying adhesive to printed pages 11. The adhesive applicator 16 is adapted to apply adhesive onto the pages 11 as they are fed to the support tray. A page conveyor 12 for sequentially feeding pages 11 from the printhead assembly 13 to the support tray via the adhesive applicator 16. The adhesive applicator 16 is adapted to apply adhesive to a trailing edge of each page, the trailing edge extending transverse to the paper path. By applying the adhesive to the trailing edge of the page, it is not necessary to precisely synchronize the motion of the adhesive applicator with the velocity of the paper fed along the paper path.

Abstract: The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adhesive at a preset location, so that no air is trapped in the adhesive. The adhesive is heated to a second temperature higher than the first temperature in a permanent bonding step to increase its viscosity, whereby any remaining voids are removed with residual adhesive being pushed aside. Having no voids in the adhesive, the resultant electric device is highly reliable in respect of conductivity.

Abstract: A page binding device for binding pages 11 from an inkjet printhead assembly 13. The device has an adhesive applicator 16 for applying adhesive to printed pages 11. The adhesive applicator 16 is adapted to eject adhesive onto the pages 11 as they are fed to the support tray. A page conveyor 12 for sequentially feeding pages 11 from the printhead assembly 13 to the support tray via the adhesive applicator 16. An air flow generator for generating an air flow 14 that prevents the pages 11 from contacting the adhesive applicator 16. Using an air cushion and a non-contact adhesive applicator avoids the paper buckling problems associated with contact adhesive applicators.

Abstract: A plant for the continuous production of polarizing lenses includes a coil polarizing film feeding station; a glass convex lens feeding station; a concave lens feeding station; an under vacuum film shaping station; a deposition and gluing outer convex lens station; a translation station for the pre-glued lenses; a deposition and gluing inner concave lens station; a lens separation and film cutting station; and a palletization station for the finished lenses; and a method.

Abstract: An assembly element (5) to be inserted into a bore (4), with two compensating elements (6, 7) fitting one into the other and having eccentric bores, said assembly element being provided for the transmission of forces to the inner surface of the hole of the bore (4) and for positioning the longitudinal axe of a fastening element (3) within the through-bore (4), is, according to the invention, produced with a smaller radial dimension with respect to at least one exit of the bore (4) in the outer face of the plate (1) for the purpose of forming a slot (11) and can be fastened in this bore (4) by means of a sealing agent (15) filling said slot (11).

Abstract: A method of depositing adhesives or adhesion control agents using ink jet technology. The adhesive may be used in the manufacture of assembled paper products including greeting cards. The adhesion control agents may be deposited on a plastic sheet used in laminated safety glass.

Abstract: Methods for fabricating laminations to form structural elements of predetermined shapes (120, 220, 420, 520, 620) are provided. Laminations include parts (22, 24) fabricated from the tread portion (42) of discarded rubber tires. The parts are typically arranged in layers with various relationships therebetween. The parts are pressed to remove all voids therebetween causing dynamic tension which creates rigidity and then bonded with methods including vulcanization, chemical vulcanization, epoxy and adhesive.

Abstract: A manufacturing method of a printed wiring board. On a conductor plate 1, approximately conical conductor bumps 1a, 1a, . . . are formed, the conductor bumps 1a, 1a, . . . being caused to penetrate through a prepreg 5 to project tip ends of the conductor bumps 1a, 1a, . . . from an opposite side of the prepreg 5. The tip ends of the conductor bumps 1a, 1a, . . . and interconnection patterns 7a and 7b on surfaces of core material 17A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump 1a, 1a, . . . and interconnection patterns 7a and 7b on the surface of the core material are stacked to bond both.

Abstract: The invention relates to a method for laying a floor covering that includes a flexible material containing a thermoplastic wear layer made from, in particular, plasticised PVC. The basic panels that form the covering are glued to the ground and cold welded in between on the site to be covered. After a panel has been positioned and glued to the surface to be covered, a continuous bead of mastic, which is made on the actual site by mixing a hardener and a polyurethane resin in aqueous phase, is applied laterally along the entire depth of the covering. The next panel is positioned on the ground which is covered with adhesive and the lateral edge thereof is pinned against the edge of the preceding panel comprising the bead of mastic, thereby causing the excess material to come to the surface, where it is removed by simply wiping with water.

Abstract: A method and apparatus comprising combining ballistic and fragment resistant fabrics in multiple layers with a central geometrically shaped composite core in a resin forming a composite armor panel, wherein the multiple layers present a fragment projectile with alternating tougher and softer resistances to penetration to enhance the stopping power of the composite armor while retaining a lightweight configuration is disclosed. The panel allows the fabric layers and geometric core to interact in such a manner as to function as a drumskin, flexing and elastically deforming to absorb and attenuate the energy of a forced entry attack.

Abstract: A two piece, metal and plastic, retaining ring used for chemical mechanical polishing of semiconductor substrates. In one embodiment, the plastic is selected from polyphenylene sulfide (PPS), polyethylene terephthalate, polyetheretherketone, polybutylene terephthalate, Ertalyte TX, PEEK, Torlon, Delrin, PET, Vespel, or Duratrol, and the plastic is assembled to a stainless steel ring with a urethane adhesive at room temperature. In another embodiment, the plastic is assembled to the metal portion with an acrylic adhesive at room temperature.

Abstract: A method of joining fabric sheets is disclosed, wherein a thermoplastic joiner is impregnated into a fabric sheet. The molten adhesive is applied to the fabric and may be made to impregnate the fibres by a combination of a roller (16), and infrared source (7), and an ultrasound head (5). The method enables otherwise non-containable fibres (2) to he contained, thereby providing a strong, leakproof seam. In another embodiment, the roller is shaped in order to provide a self locating bead profile, to improve the alignment process.

Abstract: A printed circuit board (7) is electrically connected to an electroluminescent display by applying the circuit board (7) to the display so that metal tracks (8) on the underside of the circuit bard (7) make electrical contact with conductive tracks (6) on the display. While the tracks (6, 8) are in electrical contact and electrically insulating adhesive (10) is applied between the lower surface of the circuit board (7) and the upper surface of the display to bond the circuit board (7) to the display. The thickness of the tracks (6, 8) spaces the circuit board (7) from the display to define a void to receive the adhesive (10). The connection method has the advantage that the operation of the assembled circuit board (7) and display can be tested before the adhesive is applied.

Abstract: A laminating apparatus includes: applying means for applying a resin material onto laminating surfaces of a device substrate; and laminating means for laminating a sealing glass onto the device substrate to which the resin material has been applied. The applying means is capable of applying the resin material to a plurality of portions on the laminating surfaces such that an air escape passage is formed between the device substrate and the sealing glass. The laminating means is capable of expelling the air toward outside through the air escape passage when the laminating force is applied between the device substrate and the sealing glass along the air escape passage, and of laminating the sealing glass such that the applied resin material becomes continuous so as to form a thin film layer.

Abstract: A method for sealing graphite plates formed from mechanically processed graphite sheets of exfoliated graphite particles is provided. The graphites sheets are infused with a sealant to fill about 90 volume percent of the pores contained in the sheet. Upon curing the sealant, a substantially gas impermeable graphite plate is provides. Such a plate is useful in fuel cell construction.

Abstract: A method for bonding a sensor carrier plate having an adhesive layer to a vehicle window includes heating the adhesive layer by a heating device and pressing the carrier plate against the vehicle window for a predetermined time by a contact-pressure device. To reduce the risk of air inclusions between the adhesive layer and the vehicle window, the contact-pressure device initially brings the carrier plate with its adhesive layer into point or linear contact with the vehicle window and then, immediately after this, into extended-area contact with the vehicle window until full contact is achieved.