Abstract: Disclosed is a pressure sensitive adhesive insulation structure for joining two adjacent insulation structures. The pressure sensitive insulation comprises a carrier having a first side and second side. A pressure sensitive adhesive is in communication with the first side and in communication with the second side for adhering an insulation structure, such as those used to insulate piping.

Abstract: Methods of making articles are provided in which a self-supporting structure formed of natural polymer has a self-adherent, moisture resistant thermoplastic film comprising gelatinized starch and a hydroxy-functional polyester on the structure surface. The self-supporting structure preferably is a starch and polyvinyl alcohol blend in an expanded form. The articles typically do not delaminate even when soaked in water, and are biodegradable.

Abstract: The fundamental technique of the method for making cellular cores is to make stacks of components which are configured such that cutting slices off the stacks produces cellular cores and, when needed, components used in stacks used to produce cellular cores. One of the basic components used in the stacks is termed a ribbed ply which is a ply (thin sheet of material such as wood) with a number of ribs (long thin strips of material such as wood) attached to the ply, parallel to each other. If the spaces between the ribs are filled with filler material such as foam plastic, the cells in the cellular core will be filled with the filler material. The filler material is introduced as layers of the material stacked alternately with plies and adhesively attached. Slices of such a stack, sliced parallel to the grain of the plies (if wood) are called ribbed fillers. Stacking ribbed fillers and plies produces a stack having a cross section which, when sliced, produces filled cell cellular cores.

Abstract: A method of forming spacers on a display substrate is described. First, a mould having a plurality of trenches is provided. Spacer are dropped onto the mould. When the mould is vibrated, the spacers fall into the trenches. Then, a display substrate having viscous substance on a surface thereof is pressed onto the spacers in the trenches of the mould, so that the spacers are bonded to the display substrate due to the viscous substance. Finally, the spacers bonded with the display substrate are removed from the trenches of the mould.

Abstract: A laminated film exhibiting excellent interlayer adhesiveness obtained by extrusion-laminating a resin directly on a polyester film without effecting anchor-coating or without treating the molten film of the extrusion-laminated resin with ozone. The laminated film is obtained by extrusion-laminating, onto the polyester film, an ethylene copolymer containing an unsaturated carboxylic acid and a (meth)acrylic acid ester, which may be further blended with a small amount of an ethylene/&agr;-olefin copolymer having a density of 840 to 900 kg/m3, the amount of the unsaturated carboxylic acid component being from 1 to 12% by weight and the amount of the (meth)acrylic acid ester component being from 2 to 25% by weight.

Abstract: Apparatus and methods for manufacturing a folder which has front and back panels with a divider therebetween. The divider front and back panels and divider are taped together along a spine of the folder such that the panels and divider can be turned like the pages of a book. There may be one, two, or three or possibly even more dividers with all of the dividers being secured in place at the spine of the folder. The tape(s) may be pleated so that the panel-to-divider and/or divider-to-divider compartments can expand. This pleating technique can also be employed to give expansibility to the single compartment of a file folder which does not have internal dividers.

Abstract: A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorinating composition to the curable elastomer, contacting the layers and curing the layered article so formed. The resulting multilayer compositions and articles are also disclosed.

Abstract: An anisotropic conductive film (14) and circuit elements (16) are superimposed and disposed on a substrate (10). An isotropic pressing operation is performed by a pressing mold having a flexible layer (22) on the surface to be brought into contact with the circuit elements, and simultaneously heating is performed to bond the circuit elements onto the substrate. Since the flexible layer absorbs differences in thickness of the circuit elements, the plurality of circuit elements can be pressed simultaneously. Further, since the plurality of circuit elements are simultaneously heated, it is unnecessary to consider an influence of heat on unheated adjacent circuit elements in a case where the elements are heated one by one. The isotropic pressing makes it possible to prevent the anisotropic conductive film from protruding sideways. As a result, spaces between the circuit elements can be reduced.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.

Abstract: A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.

Abstract: The strength of wood composites, including hybrid composites comprising wood members bonded to reinforced polyester members, is improved by modifying the polyester components with a polyisocyanate. Wood composites adhesively bonded with polyester resins modified according to this invention are particularly desirable for use in applications where exterior exposure is contemplated.

Abstract: The invention is concerned with a pressure sensitive adhesive sheet comprising a substrate and, superimposed thereon, a pressure sensitive adhesive layer, said substrate exhibiting a maximum value of dynamic viscoelasticity tan &dgr; of at least 0.5 at a temperature ranging from −5 to 80° C. At the time of working of the back of an adherend having a surface whose irregular height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working.

Abstract: The present invention is a machine to perform two or more processes to an bottle wherein registration of the first process to the second process is required. The products produced with such registration have distinct advantages over prior art. These include labeling systems comprising multiple labels that can be incorporated into many useful variants for promotional items. Additionally, novel packaging systems can utilize this technology.

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract: The present invention provides thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. The thin-laminate panels of the present invention may be tested for manufacturing defects, such as short circuits, before further processing of the panels to produce PCBs. “Finishing” methods for shearing sheets of unfinished thin-laminate into the finished thin-laminate panels of the present invention in a manner that does not cause smearing of the conductive material onto the dielectric layer are also provided.

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract: A method of positioning a heat generating component on a header to enhance heat sinking characteristics includes positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface, and positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier's Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

Abstract: The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials (202, 204) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces (206, 208). The process continues by selectively arranging the dielectric pieces on a base plate (302) in accordance with the pattern to form the textured ceramic dielectric substrate.

Abstract: A clutch plate consists of an annular support plate carrying friction liners adhesively bonded on at least one lateral fastening face of peripheral radial blades of the support plate, by a method including an adhesive applying step which consists in depositing a predetermined quantity of adhesive on, but only on, an adhesion zone located on the lateral fastening face of each successive radial blade. This deposition is performed by an adhesive applicator having an adhesive applying zone of a form corresponding to that of the adhesion zone on the blade. The method is performed in an apparatus having at least one applicator head.

Abstract: A method of manufacturing a multi-layer outer panel for a game ball includes three-dimensionally forming a top layer of an outer panel, as well as one or more backing materials disposed underneath the top layer, into a shape substantially corresponding to the surface of the ball. Multi-layer outer panels are then attached to or interconnected to surround an inflatable bladder, thereby producing a game ball while minimizing overstretching of the outer material or the backing material and improving resistance of the outer panels to delamination.

Abstract: A low-stretch, flexible composite, made of one or several sections, particularly useful for making a sail (2), includes first and second polymer films (52, 62) with discontinuous, stretch-resistant segments (16) therebetween. The segments extend generally along the load lines (17) for the sail. The segments have lengths which are substantially shorter than corresponding lengths of the load lines within each section. The ends of the segments are laterally staggered relative to one another. Mats (20) of generally parallel mat elements can be used as the segments. The mat elements typically include discrete multifiber yarns (24, 26) and/or a fiber array (22), typically created by pneumatically laterally spreading apart the fibers of an untwisted multifiber yarn (32). A laminating assembly includes first and second flexible pressure sheets (66, 68), defining a sealable lamination interior (82) containing the material stack (64) to be laminated, housed within an enclosure (90).

Abstract: A shock absorbing material for automobiles, having extremely good shock absorbing properties, capable of absorbing shocks applied to a passenger in a car at the time of a crash, or the like, and reducing the head injury criteria, comprising a rigid polyurethane foam having a compression stress of 3 kg/cm2 or more, with concavities arranged on at least one planar surface. In order to mount the head protecting material to a ceiling material, a trim, a car body, or the like, easily and securely, the head protecting material is mounted to the ceiling material, or the like, with an adhesive sheet comprising a base material made of a foam material with an adhesive layer formed thereon.

Abstract: The “B” post of an automobile between its front and rear doors is masked before the vehicle is painted by (1) providing a resiliently conformable strip of masking material having a width greater than the maximum distance between the trailing edge of the front door adjacent the “B” post and the leading edge of the rear door adjacent the “B” post and a length at least equal to the length of those edges along the “B” post to be masked, which strip has pressure sensitive adhesive on a surface adjacent a longitudinal edge of the strip; (2) opening the front door; (3) applying the strip to the inner surface of the leading edge of the rear door so that the pressure sensitive adhesive securely adheres the strip to conform with the profile of the leading edge and the strip extends across the “B” post to an extent sufficient to overlap with the trailing edge of the front door when said front door is closed; and (4) closing the front door to abut the overlap an

Abstract: A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such a layer structure where the vapor deposited film surface of the composite film is laminated through an adhesive layer on a vapor deposited film surface of another composite film or a surface of another non-moisture absorbing resin layer, wherein a total number (n) of the deposited films laminated adjacent to the adhesive layer is 2 to 8, and wherein a moisture permeabihty (W; unit: g/m2.day) as measured under conditions of a temperature of 40° C. and a relative humidity of 100% satisfies a relation represented by equation W≦(1/n)×0.20, and a method for producing the moistureproof multilayer film including heat-treating the multilayer film in a hot dry atmosphere having a temperature lower than 140° C. but not lower than 55° C.

Abstract: A laminar “precured” or “replacement” tread for wheeled vehicles operating at night on retreaded tires is made more readily visible when grooves in the tires are provided with elastomeric strips or bands in which are embedded retroreflective elements such as transparent glass or synthetic resinous microspheres (referred to herein as “beads”). Upper surfaces of longitudinal ridges in a flat curing mold lend themselves to supporting the strips which are then precisely positioned in grooves defined by the ridges, when the flat tread is cured.

Abstract: The present invention provides a method for producing a mosaic with a generally planar surface including the steps of providing a base substrate having a first side and a second side, wherein the base substrate has a height, providing at least one additional substrate having a first side and a second side, wherein the additional substrate has a height, and wherein the additional substrate is in the shape of a portion of the mosaic that will contain a more detailed portion of the mosaic, affixing the second side of the additional substrate to the first side of the base substrate in an area of the mosaic that will contain a more detailed portion of the mosaic, affixing relatively thicker pieces of tesserae to the first side of the base substrate, and affixing relatively thinner pieces of tesserae to the first side of the at least one additional substrate.

Abstract: Relative coarse flakes fabricated from used and manufacturing scrap asphalt shingle material are finish processed into ground cover and/or erosion control products. Processing of the flakes include (i) softening the surface of the flakes, (ii) embedding a surface treatment material into the softened surface of the flakes, and either (iii) supplying the flake as loose ground cover, or (iv) compressing the flakes into a portable mat.

Abstract: For the purpose of contact-connecting an electrical component, in particular a semiconductor component, on a substrate having a conductor structure, a joining temperature is chosen in such a way that the substrate, with a pressure being exerted on the electrical component, experiences a plastic deformation, with the result that the electrical component is pressed together with the conductor structure into the substrate in a positively locking manner. In order to produce the connection between the component and the substrate, use is preferably made of a thin diffusion solder layer which can be processed at temperatures lying below the melting point of the substrate.

Abstract: A process for forming a friction plate includes the steps of: adhering a plurality of segments of friction materials to a preheated core plate. Each segment of friction material has a layer of an adhesive material laminated to a bottom surface of the segment such that the adhesive material is in contact with the preheated core plate.

Abstract: A scrubbing sponge is made with indicia by applying a light-transmissive adhesive in a pattern on the sponge, and adhering a plurality of discrete, shaped pellets of light-transmissive synthetic plastic material on the patterned adhesive. The indicia is visible through the pellets and the adhesive and serves as a promotional aid.

Abstract: Apparatus and methods for manufacturing a folder which has front and back panels with a divider therebetween. The divider front and back panels and divider are taped together along a spine of the folder such that the panels and divider can be turned like the pages of a book. There may be one, two, or three or possibly even more dividers with all of the dividers being secured in place at the spine of the folder. The tape(s) may be pleated so that the panel-to-divider and/or divider-to-divider compartments can expand. This pleating technique can also be employed to give expansibility to the single compartment of a file folder which does have internal dividers.

Abstract: A page binding device for binding pages 11 from an inkjet printhead assembly 13. The device has an adhesive applicator 16 for applying adhesive to printed pages 11. The adhesive applicator 16 is adapted to eject adhesive onto the pages 11 as they are fed to the support tray. A page conveyor 12 for sequentially feeding pages 11 from the printhead assembly 13 to the support tray via the adhesive applicator 16. An air flow generator for generating an air flow 14 that prevents the pages 11 from contacting the adhesive applicator 16. Using an air cushion and a non-contact adhesive applicator avoids the paper buckling problems associated with contact adhesive applicators.

Abstract: A page binding device for binding pages 11 from a printer. The device having a support tray 18 for receiving and stacking printed pages 11 to form a bound document, and an adhesive applicator 16 for applying a two part adhesive to the printed pages. The two part adhesive has a first part and a second part, wherein the first part and the second part must contact eachother to form an adhesive bond. The adhesive applicator 16 applies the first part of the adhesive to one side of the printed pages and the second part to the opposite side of the page 11. The printed pages 11 are stacked in the support tray 18 such that the first part of the adhesive on one page 11 contacts the second part of the adhesive on the adjacent page in the adjacent page in the stack.

Abstract: A method of forming a reinforced polymer film structure is disclosed that includes the steps of slitting a biaxially oriented polymer film web having a top face and a bottom face into a first portion and a second portion, identifying the first portion and the second portion, and placing the first portion atop the second portion, such that the bottom face of the first portion is adjacent the top face of the second portion. This structure provides an impact and tear resistant laminate. Also disclosed is a method of forming a polymer film structure by identifying a molecular orientation direction profile of two portions of biaxially oriented polymer film and layering the two portions such that a molecular orientation direction profile of one does not coincide with a molecular orientation direction profile of the other.

Abstract: Cards may be singly fed along a primary lane so that a batch of cards is fed along the primary lane. One or more cards may be selectively diverted from the primary lane to a secondary lane such that only some of the batch of cards are diverted. The cards from the batch in the primary lane and the secondary lane are then affixed to a carrier so that each card of the batch is affixed to the carrier. The diversion may be achieved by a reciprocating gate between the primary lane and the secondary lane and a conveyor running on a bias between the primary lane and the secondary lane at the downstream location of the gate.

Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.

Abstract: The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.

Abstract: A multilayer optical body having improved dimensional stability is disclosed. The optical body includes an optical film, such as an oriented multilayer optical film, and a dimensionally stable layer, such as a transparent polycarbonate layer. In addition, in specific implementations, the invention includes an intermediate layer between the optical film and the dimensionally stable layer. Methods of making the optical body are also disclosed.

Abstract: A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.

Abstract: Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.

Abstract: The “B” post of an automobile between its front and rear doors is masked before the vehicle is painted by (1) providing a resiliently conformable strip of masking material having a width greater than the maximum distance between the trailing edge of the front door adjacent the “B” post and the leading edge of the rear door adjacent the “B” post and a length at least equal to the length of those edges along the “B” post to be masked, which strip has pressure sensitive adhesive on a surface adjacent a longitudinal edge of the strip; (2) opening the front door; (3) applying the strip to the inner surface of the leading edge of the rear door so that the pressure sensitive adhesive securely adheres the strip to conform with the profile of the leading edge and the strip extends across the “B” post to an extent sufficient to overlap with the trailing edge of the front door when said front door is closed; and (4) closing the front door to abut the overlap an

Abstract: Durable self-adhesive laminates for use as supports for labeling comprising: (a) a thermoplastic resin film having (A) a label-receiving side and (B) an adhesive side, the label-receiving side consisting of a controlled-release surface without making use of a coated release substance and adapted to support a removable label attachable thereto by means comprising attraction forces between the resin film and a label; and (b) an adhesive having an ultimate release energy level greater than the attraction forces between the resin film and a removable label or labels.

Abstract: A method and apparatus for automatically labeling and stacking a plurality of flower pot covers. The apparatus has a first conveyor and a second conveyor. The first conveyor has a plurality of spatially disposed support assemblies connected thereto, each of the support assemblies selectively movable between a retracted position and an extended position and the second conveyor has a plurality of spatially disposed chutes supported thereon, each of the chutes having an object receiving space formed therein adapted to receive a plurality of flower pot covers, at least a portion of the second conveyor spatially disposed above the first conveyor such that a portion of the travel path of the second conveyor overlaps a portion of the travel path of the first conveyor so that the support assemblies on the first conveyor are aligned with the chutes on the second conveyor.

Abstract: Method for forming a foamed product integral with trim cover assembly, in which, at first, a foam padding piece and a surface cover piece are temporarily secured or bonded with each other, at the local points thereof, to thereby provide a temporarily secured cover section unit. A plurality of such cover section units are sewn together to form a three-dimensional body of the trim cover assembly. A liquid foaming material is injected and cured in the inside of the sewn trim cover assembly, and subsequent thereto, the temporarily secured local points of each surface cover piece are removed from the corresponding local points of each foam padding piece, whereby a foamed product integral with the trim cover assembly is obtained, with both surface cover pieces and foam padding pieces being stretched uniformly therein.

Abstract: In a method of forming a composite web structure that is finishable to form a disposable absorbent garment, a topsheet assembly is formed having a pair of longitudinally-extending, elasticized leg cuffs. The topsheet assembly is then applied on a core assembly to create a first web structure assembly. A backsheet assembly is also formed which includes a backsheet material, and this backsheet assembly is applied on the first web structure assembly to form a second web structure assembly. Then, the second web structure assembly is cut at one or more locations to form the finishable composite web structure. The step of forming a topsheet assembly generally includes providing two webs of topsheet material and two webs of elastic material; applying each web of elastic material onto one of the webs of topsheet material to form two subsequent webs; and folding each of the subsequent webs about the elastic material to create an assembly having elasticized leg cuffs.

Abstract: The present invention relates to an apparatus for applying discrete portions (10) of a web material onto a receiving web (7) comprising: a primary axis of rotation and an attachment zone to an average radial distance, R1, from the primary axis of rotation; transfer elements (6) rotatable about the axis, the transfer elements receiving a second web (2) at a radial distance, R2, from the primary axis wherein the radial distance R1, is greater than the radial distance R2; a means for displacing the transfer elements (6) so that the second web (2) is moved immediately adjacent to the attachment zone; and an attachment surface (10) rotatable about the primary axis and through the attachment zone, for transporting the receiving web (7) about the primary axis, whereby discrete portions (10) of the second web (2) are attached to the receiving web (7) in the attachment zone, forming a composite web comprising the receiving web (7) and discrete portions (10) of the second web (2).

Abstract: A composition veneer that is extremely flexible, foldable and moldable, is provided by impregnating a wood veneer with a plastic film. The veneer has a smooth protective polymer surface without separate and distinguishable layers. As a result, the composition veneers of this invention exhibit moldability and shapeability properties similar to plastic sheeting, but contain natural wood and have the appearance of natural wood.

Abstract: Mass production of integrated subsystems may be realized by aligning first and second plurality of dies. The aligned dies are then treated to secure them together. The secured dies are then separated to form a secured pair of dies containing at least one lithographically formed element, thus forming an integrated subsystem. A bonding material may be provided over at least part of each first die, over an entire surface of the wafer or around the perimeter of each first die. Either one of the first or second dies may be provided on a wafer. Either die may contain active elements, e.g., a laser or a detector. The lithographic elements may be formed in the die or may be of a different material than that of the die.

Abstract: By including nitric acid and hydroxylamine in a manganese phosphating composition and controlling the ratio of nitric to phosphoric acids and the ratio of Total Acid to Free Acid within a specified range, satisfactory manganese phosphate conversion coatings can be obtained within a reasonable time at temperatures much lower than has previously been thought necessary for operating a manganese phosphating composition with no other metal cations (except possibly for iron).

Abstract: A method of making a roll of adhesive tape that comprises providing a length of tape having a leading end, a trailing end, a first side, and a second side opposite the first side, wherein the second side of the tape is at least partially covered with pressure sensitive adhesive and providing a tab having first and second opposite ends having a length between them, a first side, and a second side, wherein at least a portion of the second side of the tab is covered with pressure sensitive adhesive. The method further comprises advancing the length of tape along a tape path, positioning the leading tape end about a central tape roll axis, and circumferentially winding the length of tape about the axis until a penultimate tape layer having a circumference is wound.