Embedding Of Laminae Within Face Of Additional Laminae Patents (Class 156/298)
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Patent number: 8313594Abstract: A pallet is made from thermoformed polymeric sheets with an attached communications device. A further aspect of the present invention includes a radio frequency identification device attached to an apparatus. In still another aspect of the present invention, a communications device is incorporated into one or more sheets of a pallet or other container prior to forming. Methods of making and using a thermoformed pallet and container having a communications device are also provided.Type: GrantFiled: September 22, 2010Date of Patent: November 20, 2012Assignee: Nextreme, LLCInventor: Scott Arthur William Muirhead
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Patent number: 8308887Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.Type: GrantFiled: July 14, 2011Date of Patent: November 13, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Kazuhiro Isebo, Norio Sakai, Kenji Kawakami, Nobuaki Ogawa
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Patent number: 8287991Abstract: Disclosed are laminated articles comprising a first polymer layer and a second polymer layer having an inclusion embedded between the layers, wherein at least one layer comprises a branching agent to improve dimensional stability during the lamination process. Disclosed are laminated articles comprising a first polymer layer and a second polymer layer having an inclusion embedded between the layers, wherein at least one layer comprises a copolyester comprising a branching agent to improve dimensional stability during the lamination process. Also disclosed are methods of laminating a first layer and a second layer with an inclusion between the layers to form a laminated article with an embedded inclusion, wherein at least one layer comprises a copolyester comprising a branching agent.Type: GrantFiled: July 13, 2007Date of Patent: October 16, 2012Assignee: Eastman Chemical CompanyInventors: Michael Eugene Donelson, Ryan Thomas Neill, James Collins Maine, Bryan Steven Bishop, Robert Erik Young
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Patent number: 8262840Abstract: A composite material structure includes a first fiber layer, a second fiber layer, a resin layer between the first fiber layer and the second fiber layer and a plurality of chopped fibers provided in the resin layer.Type: GrantFiled: January 19, 2011Date of Patent: September 11, 2012Assignee: The Boeing CompanyInventors: Michael Joseph Pepka, Steven George Lemery
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Patent number: 8257532Abstract: A method for manufacturing a protection device includes the steps of forming a plurality of cells in a support strip, filling the cells with a non-cross-linked compound, cross-linking the compound to form at least one module made of viscoelastic gel in the plurality of cells, depositing an adhesive substance on each module, and depositing a strip of fabric on the support strip to obtain a final compound strip. The at least one module made of viscoelastic gel is glued onto the strip of fabric by the adhesive substance.Type: GrantFiled: August 4, 2011Date of Patent: September 4, 2012Assignee: Millet InnovationInventors: Odile Grange, Damien Millet
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Patent number: 8246770Abstract: A method for reworking an electrically conductive layer of a composite skin is disclosed in which a patch replaces the altered section of the electrically conductive layer. The method is performed by removing a portion of the electrically conductive layer to reveal the underlying composite skin. A patch is formed, having an electrically conductive section coupled to an adhesive having a low dielectric breakdown strength, and is then introduced over the underlying composite skin such that the adhesive layer covers the underlying composite skin and overlaps an unremoved portion of the electrically conductive layer. The patch is applied such that the electrically conductive section within the patch covers the adhesive layer and overlaps the unremoved section of the electrically conductive layer. The adhesive layer preferably has a low dielectric breakdown strength, so that electricity from lightning which strikes the composite skin may be conducted through the adhesive.Type: GrantFiled: September 8, 2010Date of Patent: August 21, 2012Assignee: The Boeing CompanyInventors: Patrice Ackerman, Steven Blanchard, Daniel Kovach
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Patent number: 8246775Abstract: The disclosure concerns a method, an apparatus and a system for producing or equipping paperboard such that information carriers can be implanted between two layers of material, together with a piece of paperboard material produced in this way and a package. In particular, the disclosure concerns the implantation of an information carrier in corrugated paperboard, taking into account cuts that are subsequently to be made in the transverse direction, the distance of the position at which the cross-cuts are made from the position at which the information carriers are applied, and the movement executed by the web of material between the application position and the cross-cutting position.Type: GrantFiled: May 21, 2010Date of Patent: August 21, 2012Assignee: Texmag GmbH VertriebsgesellschaftInventor: Thomas Ernst
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Publication number: 20120199284Abstract: A substrate may include a plurality of wirings arranged side by side to extend in a predetermined direction, and a protective insulating layer formed between adjoining pixels and formed as a rib protruding from the substrate. An emissive layer formation method for transferring, to the substrate, an emissive layer provided on a transfer element may include pressing the emissive layer on the transfer element onto the protective insulating layer and affixing it through pressure to a top surface of the rib. Thereby the emissive layer transferred to the substrate is confined to an area which is surrounded by the rib of the protective insulating layer, the substrate and the transfer element, and diffusion of the emissive layer is controlled by the area, thereby transferring the emissive layer in the area.Type: ApplicationFiled: February 27, 2012Publication date: August 9, 2012Applicant: SANYO ELECTRIC CO., LTD.Inventors: Hideki Matsuoka, Kazuyuki Maeda
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Patent number: 8231751Abstract: A method for reworking an electrically conductive layer of a composite skin is disclosed in which a patch replaces the altered section of the electrically conductive layer. The method is performed by removing a portion of the electrically conductive layer to reveal the underlying composite skin. A patch is formed, having an electrically conductive section coupled to an adhesive having a low dielectric breakdown strength, and is then introduced over the underlying composite skin such that the adhesive layer covers the underlying composite skin and overlaps an unremoved portion of the electrically conductive layer. The patch is applied such that the electrically conductive section within the patch covers the adhesive layer and overlaps the unremoved section of the electrically conductive layer. The adhesive layer preferably has a low dielectric breakdown strength, so that electricity from lightning which strikes the composite skin may be conducted through the adhesive.Type: GrantFiled: January 29, 2010Date of Patent: July 31, 2012Assignee: The Boeing CompanyInventors: Patrice Ackerman, Steven Blanchard, Daniel Kovach
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Patent number: 8220221Abstract: Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges.Type: GrantFiled: February 9, 2010Date of Patent: July 17, 2012Assignee: Interface, Inc.Inventors: Keith N. Gray, Connie D. Hensler, Chung-Hsien Zah, Susan F. Fezer, Horace Eddie Bradley, Jr.
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Patent number: 8197632Abstract: According to the present invention, an electrolyte membrane having recesses and projections on the surface thereof is obtained. In addition, a membrane-electrode assembly comprising the electrolyte membrane, in which the effective contact area between the electrolyte membrane surface and an electrode catalyst layer is increased, is obtained. An electrolyte membrane 1 which comprises a fluorine-based electrolyte is heated and pressed with the use of plates 10a and 10b each having recesses and projections 11 on the surface thereof such that recesses and projections 2a and 2b are formed on the surface of the electrolyte membrane 1. Thereafter, the electrolyte membrane 1 is subjected to a treatment for imparting ion exchange properties to an electrolyte polymer, such as hydrolysis, such that an electrolyte membrane 3 having recesses and projections on the surface thereof is obtained.Type: GrantFiled: June 18, 2007Date of Patent: June 12, 2012Assignee: Toyota Jidosha Kabushiki KaishaInventor: Hiroshi Suzuki
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Patent number: 8168029Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.Type: GrantFiled: October 3, 2011Date of Patent: May 1, 2012Assignee: Fiberforge CorporationInventors: David R. Cramer, Neal J. Beidleman, Colin R. Chapman, Don O. Evans, Michael K. Passmore, Michael L. Skinner
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Patent number: 8161634Abstract: A method of fabricating a printed circuit, which involves forming a bump on a first metal layer; laminating an insulating layer on the bump so that the bumps passes through the insulating layer; placing a second metal layer on the insulating layer and then conducting heating and pressing, thus laminating the second metal layer on the insulating layer; etching the first metal layer and the second metal layer, thus forming circuit patterns on both surfaces of the insulating layer; and heating and pressing both surfaces of the insulating layer, thus embedding the circuit patterns in the insulating layer, such that the circuit pattern is embedded in an insulating layer to decrease the thickness of a printed circuit board, and the time and cost required for the process of fabricating a printed circuit board are decreased.Type: GrantFiled: March 7, 2008Date of Patent: April 24, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jee Soo Mok, Jun Heyoung Park
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Patent number: 8142593Abstract: A method of transferring a thin film onto a first support, includes supplying a structure comprising a film of which at least one part originates from a solid substrate of a first material and which is solidly connected to a second support having a thermal expansion coefficient that is different from that of the first material and close to that of the first support, forming an embrittled area inside the film that defines the thin film to be transferred, affixing the film that is solidly connected to the second support to the first support, and breaking the film at the embrittled area.Type: GrantFiled: August 11, 2006Date of Patent: March 27, 2012Assignee: Commissariat a l'Energie AtomiqueInventors: Chrystel Deguet, Laurent Clavelier, Jerome Dechamp
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Patent number: 8123996Abstract: In one step of a method of fabricating a composite tube, layers of uncured composite material may be laid over a surface. In another step, spaced-apart strips of at least one of uncured, partially cured, and completely cured composite material may be laid lengthwise over the laid layers of composite material. In still another step, the spaced-apart strips may be compacted against the layers of uncured composite material. In an additional step, the compacted spaced-apart strips and the layers of uncured composite material may be further consolidated and/or cured to form a composite tube.Type: GrantFiled: February 7, 2008Date of Patent: February 28, 2012Assignee: The Boeing CompanyInventors: Garry A. Booker, Wesley L. Holman
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Publication number: 20120007926Abstract: A liquid discharge head includes an element substrate including an energy generating element; a supporting member adhesively supporting the element substrate; a sheet member adhesively bonded to the supporting member to adjoin the inner surface of an opening accommodating the element substrate in the sheet member and an end section of the element substrate; a wiring substrate bonded to the sheet member to adjoin the inner surface of an opening accommodating the element substrate in the wiring substrate and the end section of the element substrate and including a wire electrically connected to the energy generating element; and a sealant sealing a part electrical connecting the wiring substrate and element substrate, wherein the height of a wiring substrate surface opposite to that contacting the sheet member from supporting member is smaller than the element substrate surface opposite to that contacting the supporting member from the supporting member.Type: ApplicationFiled: June 28, 2011Publication date: January 12, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Shogo Kawamura, Toshiaki Hirosawa, Akira Yamamoto
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Publication number: 20120003433Abstract: A decoration film, a decoration device and a method for manufacturing a decoration device are provided. The decoration film includes a substrate, a releasing layer, a pattern layer and an adhesion layer. The releasing layer is disposed on the substrate. The pattern layer is disposed on the releasing layer at a side far from the substrate. The adhesion layer is disposed on a portion of the pattern layer.Type: ApplicationFiled: July 1, 2010Publication date: January 5, 2012Applicant: SiPix Chemical Inc.Inventor: Shih-Min Huang
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Patent number: 8075543Abstract: A disposable diaper 1 includes a topsheet 2, a backsheet 3, and an absorbent member 4 between the sheets 2 and 3. A pair of leg flaps 5 each having an elastic member is provided along the laterally opposite side edges of the absorbent member 4. Each of the leg flaps 5 is fixed at its front end portion 52 and rear end portion 53 to a portion C, one of longitudinally opposite end portions of the diaper, and to a portion B, the other end portion, in such a configuration that each of the leg flaps 5 may be folded back over the side of the backsheet 3 when the disposable diaper 1 is in a flat-out state with the elastic members stretched.Type: GrantFiled: April 28, 2006Date of Patent: December 13, 2011Assignee: Kao CorporationInventor: Yasuyuki Okuda
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Patent number: 8052826Abstract: A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.Type: GrantFiled: March 24, 2009Date of Patent: November 8, 2011Assignee: The Boeing CompanyInventors: Steven J. Burpo, Michael P. Renieri, Nicholas B. Segobiano, Neal A. Froeschner
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Patent number: 8048253Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.Type: GrantFiled: September 24, 2008Date of Patent: November 1, 2011Assignee: Fiberforge CorporationInventors: David R. Cramer, Neal J. Beidleman, Colin R. Chapman, Don O. Evans, Michael K. Passmore, Michael L. Skinner
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Patent number: 8034209Abstract: An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.Type: GrantFiled: June 27, 2008Date of Patent: October 11, 2011Assignee: E Ink CorporationInventors: Guy M. Danner, Valerie C. Northrop, Jonathan D. Albert, Holly G. Gates, Erik van Veenendaal, Fredericus J. Touwslager
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Patent number: 8016966Abstract: A stackable equipment container includes at least one reinforcement panel made of a composite material attached to the container on an interior surface proximate an arrangement of stackable elements. The panel is attached to the container using spin-weld plugs installed at a high rotation rate. Through the installation of the spin-weld plugs, the panel becomes fused or welded to the container. In one embodiment, the rotation rate of the spin-weld plugs during installation is sufficient to cause the panel and container to locally vulcanize with each other and with the spin-weld plugs. The panel provides the container with increased strength and operates to minimize or eliminate distortion of the stackable elements.Type: GrantFiled: October 28, 2008Date of Patent: September 13, 2011Assignee: Environmental Cotainer SystemsInventor: Dennis M. Becklin
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Patent number: 7998298Abstract: The invention is aimed at shortening time and reducing labor in a work of fitting a multiplicity of cords, respectively, into grooves of a grooved press roll and of a grooved comb roll to align the same in a calender apparatus, in which rubber is topped on the multiplicity of cords as aligned, in an aligning work, the multiplicity of cords are first fitted into grooves on an upper surface side of the comb roll to be aligned, the press roll is then displaced to an alignment transfer position from a standby position close to a topping roll to be opposed to the upper surface side of the comb roll to thereby transfer an aligned state of the cords fitted into the grooves of the comb roll to the press roll as it is to fit the respective cords into grooves of the press roll and to displace the press roll to the standby position while maintaining the fitted state, to set the cords in an aligned state.Type: GrantFiled: July 20, 2005Date of Patent: August 16, 2011Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Tetsuo Tatara, Tomoyuki Takatsuka, Hirokatsu Mizukusa, Osamu Fujiki
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Publication number: 20110185594Abstract: The present invention pertains to a shoe upper, the method for preparing the same and the use thereof. This invention provides a method for preparing shoe upper by spraying polyurethane reaction system, avoids the complicated steps of cutting, shaping, stitching and bonding, simplify the production process, reduces the equipment requirements, saves cost and improves the production efficiency.Type: ApplicationFiled: May 19, 2009Publication date: August 4, 2011Applicant: Bayer MaterialScience AGInventors: Yuedong Zhang, Sam Torres, Gang Sun, Yongdong Pang, Roy Lin
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Publication number: 20110162340Abstract: The invention relates to a method for making a nacelle element (2) that includes the steps of: (A) forming an array of heating resistors on a substrate using a photolithographic method; (B) applying a web (50, 52) of composite materials onto the array obtained in step (A); (C) applying an inner skin (12) onto the de-icing assembly (13) thus obtained. The invention also relates to a nacelle including such an element (2).Type: ApplicationFiled: August 14, 2009Publication date: July 7, 2011Applicant: AIRCELLEInventors: Laurent Georges Valleroy, Marc Gerome
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Patent number: 7951126Abstract: An absorbent article is disclosed in which an absorbent body intervenes between a liquid permeable front sheet and a back sheet. A middle-height portion is provided by thickening a front surface of an approximately center area of the absorbent body with respect to a standard portion absorbent body. The article includes leakage preventing grooves which extend to a longitudinal direction of the absorbent article are provided on both sides which sandwich a body fluid discharge portion area in the area of the middle-height portion, respectively.Type: GrantFiled: September 30, 2004Date of Patent: May 31, 2011Assignee: Daio Paper CorporationInventors: Ayako Nanjyo, Yasuo Ido
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Patent number: 7943002Abstract: A tool and a method for packaging lens module are provided. The method for packaging lens module includes the following steps. Firstly, a carrier having at least one cavity is provided. Next, a holder is disposed in the cavity. Then, a die is disposed on a surface of a substrate. After that, the substrate is inversely placed on the carrier, wherein the surface where the die is disposed faces the carrier, and the die corresponds to the holder. Then, a cover plate covers the carrier and the substrate, such that the substrate is fixed on the holder.Type: GrantFiled: January 22, 2009Date of Patent: May 17, 2011Assignee: Advanced Semiconductor Engineering, Inc.Inventor: Hsin-Chieh Lu
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Patent number: 7927450Abstract: A method of manufacturing a mount includes dispensing a predetermined amount of molten thermoplastic adhesive on a release liner, attaching a tab to the adhesive while the adhesive is at a temperature above its softening point, and cooling the adhesive to a temperature below its softening point.Type: GrantFiled: February 23, 2009Date of Patent: April 19, 2011Assignee: Stanley Black Decker, Inc.Inventors: James Spaulding, John C. Murray
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Patent number: 7914639Abstract: A method of making an implantable medical device includes extruding a first ePTFE tube and a second ePTFE tube, cutting a plurality of slits in the first ePTFE tube, positioning a radially expandable support layer between the first and second ePTFE tubes so that the slits span portions of the support layer, and laminating the first ePTFE tube to the second ePTFE tube through openings in the support layer.Type: GrantFiled: August 10, 2009Date of Patent: March 29, 2011Assignee: Bard Peripheral Vascular, Inc.Inventors: Richard E. Layne, Sandra M. Cundy, Debra A. Bebb
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Publication number: 20110049437Abstract: Coatings comprising functionalized graphene sheets and at least one binder. In one embodiment, the coatings are electrically conductive.Type: ApplicationFiled: January 9, 2009Publication date: March 3, 2011Applicant: The Trustees of Princeton UniversityInventors: John M. Crain, John S. Lettow, Ilhan A. Aksay, Robert K. Prud'Homme, Sibel Korkut
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Patent number: 7883597Abstract: A method is disclosed. The method includes forming a groove in at least one of opposing planar surfaces of a cellular thermoform plastic substrate. The groove is formed at an edge region of the substrate. A stiffener is positioned in the groove, and a fiber matt is laid on the at least one planar surface containing the groove. The stiffener and fiber matt are embedded in a thermoset resin. The thermoset resin is cured to form a fiber reinforced thermoset plastic reinforcement. The substrate is then cross-sectionally cut to form a profile. The profile can be further finished to form a beveled siding for buildings.Type: GrantFiled: January 5, 2010Date of Patent: February 8, 2011Assignee: Integritect Consulting, Inc.Inventor: James Blahut
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Publication number: 20110027520Abstract: A method for producing a floor covering substrate is provided, wherein at least one electronic device is embedded within a layer, which includes at least one curable material; wherein the at least one electronic device is embedded in a substrate layer and/or on a substrate layer; wherein the substrate layer, including the electronic device, is embedded in a layer, which includes at least one curable material; wherein the substrate layer that includes a porous or meshed structure or a reinforcement fabric, which is penetrable for the at least one curable material.Type: ApplicationFiled: February 20, 2009Publication date: February 3, 2011Applicant: Future-Shape GmbHInventors: Christl Lauterbach, Axel Steinhage, Andre Bartel
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Patent number: 7867210Abstract: In a disposable absorbent article structured such that an article body is composed of at least a top sheet arrange in a front face side, a back sheet arranged in a back face side and an absorber interposed between both of top sheet and back sheet, and a feces pocket is provided in a hip contact portion of the article body, wherein an opening portion of the feces pocket is covered with a mesh sheet.Type: GrantFiled: October 14, 2005Date of Patent: January 11, 2011Assignee: Daio Paper CorporationInventors: Yosuke Mori, Shinichi Kouno, Tomoka Kamoto
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Publication number: 20100310873Abstract: A method of reinforcing a thermoplastic part includes softening a portion of the thermoplastic part to form a pool, embedding fibers in the softened pool, and re-solidifying the pool embedded with fibers into a weld that strengthens the thermoplastic part.Type: ApplicationFiled: June 8, 2009Publication date: December 9, 2010Applicant: UNITED TECHNOLOGIES CORPORATIONInventors: Nicole Sullivan, William Bogue, Daniel M. Stadtlander
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Patent number: 7846538Abstract: A connection structure includes a workpiece, and a coating layer disposed above the workpiece. A groove is formed on a surface of the coating layer. The connection structure further includes an object installed inside the groove and adhered to the workpiece.Type: GrantFiled: November 14, 2006Date of Patent: December 7, 2010Assignee: Micro-Star Int'l Co. Ltd.Inventors: Hun-Jen Chen, Li-Yen Liu, Hsiu-Yu Fan, Tsun-Wu Liu
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Patent number: 7846279Abstract: A static control device suitable for printers, copiers and the like is disclosed with a manufacturing method therefor. A carrier strip of non-metallic, electrically conductive material, such as plastic, is provided with a plurality of spaced bundles of electrically conductive filaments. The bundles extend beyond the carrier strip, in close proximity to media transported along a media path. In the presence of electrical fields, the filaments induce ionization, and establish a conductive path for charges on the media to the carrier strip for grounding. A strand is attached across the bundles, for improving the structural integrity of the device.Type: GrantFiled: January 21, 2005Date of Patent: December 7, 2010Assignee: Illinois Tool Works Inc.Inventors: Hieyoung W. Oh, Jeffrey W. Richarson
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Patent number: 7794561Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.Type: GrantFiled: May 22, 2008Date of Patent: September 14, 2010Assignee: International Business Machines CorporationInventors: Tobias P. Lamprecht, Roger F. Dangel, Folkert Horst
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Patent number: 7776176Abstract: A process for marking a composite panel prior to curing for subsequent identification. An illustrative embodiment of the process includes applying a label strip made of a resin-permeable material to a composite panel formed of a resin and curing the panel to an elevated temperature such that the resin at least partially permeates the label strip. A marked composite panel is also disclosed.Type: GrantFiled: August 31, 2007Date of Patent: August 17, 2010Assignee: The Boeing CompanyInventors: Max U. Kismarton, Dusty Dequine
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Patent number: 7776177Abstract: A method for affixing covering products to building structures is described. The covering product includes a thermoplastic membrane, a layer in which a fabric that includes an adhesive coating, and a release liner. The layer is affixed to a primary surface of the membrane. After the covering product is transported to the building structure, the release liner is removed, and the covering produce is adhered to the building structure.Type: GrantFiled: April 11, 2007Date of Patent: August 17, 2010Inventor: Michael J. Hubbard
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Patent number: 7757457Abstract: Connectors for joining adjacent modular floor covering units. Embodiments of the connectors include a film and an adhesive layer coated on one side of the film. The connectors can have a conductive component that allows electrical continuity to be maintained between adjacent tiles. In yet another embodiment, the connectors can be equipped as radio frequency identification tags by including radio frequency transponders. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. One or more tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges.Type: GrantFiled: March 27, 2008Date of Patent: July 20, 2010Assignee: Interface, Inc.Inventors: Chung-Hsien Zah, Connie D. Hensler, Keith N. Gray, Susan F. Fezer, Horace Eddie Bradley, Jr.
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Publication number: 20100095489Abstract: Method for the production of an adhesive closure device together with an apparatus and adhesive closure device produced accordingly. The invention relates to a method for the production of an adhesive closure device (10), preferably consisting of at least one plastic material, during which a backing (12) with a plurality of protruding stems (14) is connected to individual heads (16) in such a way that for at least a part of the above-mentioned stems (14), the free ends (18) thereof come into contiguous or embedded contact with a contact face (20) of each assignable head (16). The invention relates additionally to an apparatus for carrying out the method and to an adhesive closure device produced according to the method.Type: ApplicationFiled: January 29, 2008Publication date: April 22, 2010Inventor: Jan Tuma
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Publication number: 20100071277Abstract: Method for manufacturing floor panels of the type comprising at least a single-piece or multi-piece substrate (3) and a top layer (2) with a pattern (30), characterized in that photographic material (18) is present in the top layer (2) and that said pattern (30) is formed at least partially by performing a photographic process on said photographic material (18).Type: ApplicationFiled: March 17, 2008Publication date: March 25, 2010Applicant: FLOORING INDUSTRIES LIMITED, SARLInventor: Benny Schacht
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Publication number: 20100065207Abstract: The invention relates to a repulpable adhesive comprising orthophosphoric acid, to adhesive tapes comprising at least one layer of such an adhesive, and to the use of adhesive tapes of this kind.Type: ApplicationFiled: September 16, 2009Publication date: March 18, 2010Applicant: TESA SEInventors: Kai ELLRINGMANN, Stefan Wulf, Kristin Kerber
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Publication number: 20100062219Abstract: The invention is a method of using a waterborne acrylic latex roof membrane component as a universal primer to adhere virtually any epoxy or cementitious polymer-modified product or overlay to virtually any substrate without the need for physical preparation of the substrate surface. The present method now makes it possible to cleanly and simply adhere hundreds of coatings from various manufacturers to dozens of various substrates.Type: ApplicationFiled: September 9, 2008Publication date: March 11, 2010Inventor: Scott Richards
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Publication number: 20090314533Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.Type: ApplicationFiled: August 28, 2009Publication date: December 24, 2009Inventors: Itsuo Watanabe, Kenzo Takemura, Akira Nagai, Kazuhiro Isaka, Osamu Watanabe, Kazuyoshi Kojima
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Patent number: 7628879Abstract: Systems and methods for providing a structural adhesive film that includes a conductive scrim layer are disclosed. In one embodiment, a method for producing a structural adhesive film includes providing a first resin adhesive layer. The first resin adhesive layer is configured to bind to a first carbon fiber ply. The method also includes providing a second resin adhesive layer. The second adhesive layer is configured to bind to a second carbon fiber ply. The method also includes providing a conductive scrim that is embedded between the first resin adhesive layer and the second resin adhesive layer. In some embodiments, the conductive scrim is infused with resin adhesive.Type: GrantFiled: August 23, 2007Date of Patent: December 8, 2009Assignee: The Boeing CompanyInventor: Patrice K Ackerman
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Publication number: 20090269560Abstract: The invention is directed to carbon nanostructure composite systems which may be useful for various applications, including as dry adhesives, self-cleaning applications, electronics and display technologies, or in a wide variety of other areas where organized nanostructures may be formed and integrated into a flexible substrate. The present invention provides systems and methods wherein organized nanotube structures or other nanostructures are embedded within an adhesive, with the properties and characteristics of the nanotubes or other nanostructures exploited for use in various applications.Type: ApplicationFiled: February 11, 2009Publication date: October 29, 2009Applicants: The University of Akron, Rensselaer Polytechnical InstituteInventors: Ali Dhinojwala, Pulickel M. Ajayan, Sunny Sethi
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Patent number: 7588668Abstract: A sputtering target assembly and method for bonding a sputtering target to a backing plate is disclosed. When insulatively bonding a sputtering target to a backing plate, it is necessary to ensure that the bonding material has good thermal conductivity so that the temperature of the target can be effectively controlled. It is also important to not have electrical conductivity through the bonding materials. In order to achieve both goals, it is beneficial to utilize an elastomer with diamond powder filler. Diamond power has very good thermal conductivity, and it also has very good dielectric strength. Diamond is a thermally effective and cost effective substitute for silver in insulative bonding.Type: GrantFiled: March 3, 2006Date of Patent: September 15, 2009Assignee: Applied Materials, Inc.Inventors: Yan Ye, John M. White
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Patent number: 7524391Abstract: An optical device includes a substrate having a through hole formed therein, and an optical element mounted on the substrate with its optical section being placed to face the through hole, and a light transmissive member disposed at the through hole. Light transmissive under-fill material is provided between the substrate and the optical element and between the light transmissive member and the optical element.Type: GrantFiled: June 10, 2004Date of Patent: April 28, 2009Assignee: Seiko Epson CorporationInventor: Kazunori Sakurai
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Publication number: 20090048084Abstract: There is described a gluing unit (1) for applying adhesive to a succession of opening devices (3) to be fitted to respective sealed packages of pourable food products, the unit (1) having: conveying means (20) for feeding the opening devices (3) along a path (A); and adhesive dispensing means (21) located along the path (A) and interacting with each opening device (3) on the conveying means (20) to apply the adhesive to a portion (10) of the opening device (3); and the unit (1) being characterized in that the dispensing means (21) are movable parallel to the path (A), so as to increase output of the unit (1).Type: ApplicationFiled: December 19, 2006Publication date: February 19, 2009Applicant: TETRA LAVAL HOLDINGS & FINANCE S.A.Inventors: Alessandro Morselli, Roberto Franceschi, Alessandro Zuccotti