Abstract: Laminate structures and methods for forming same are disclosed. In one embodiment, a laminate structure includes a metal-polymer composite lamina. The metal-polymer composite lamina has a first face and a second face spaced apart, and extends to a terminal edge. The lamina includes a ply of fiber-reinforced polymer that extends between the first face and the second face and has an interior edge. The interior edge defines at least one cutout. A ply of metal foil extends between the first face and the second face substantially from the interior edge filling the at least one cutout.

Abstract: An improved mat is disclosed. Long and short legs support the mat and cause it to feel resilient although it is fabricated from hard rubber. The mat has drain holes on vertical surfaces. Ribs prevent the mat from embedding within grating. Grit is selectively placed upon the mat and physically supported. Adhesive for bonding the grit is retained by retention lips. Also disclosed is a process for creating drain holes on vertical surfaces of mats by attaching a grooving tool to a robot and programming the robot to cut through molded mat channels to create the desired drain holes. The claimed process uses the robot to selectively place adhesive upon the mat. An adhesive dispenser is attached to the robot and the robot is appropriately programmed.

Abstract: The invention is multilayer laminate comprising at least one scouring layer and at least one nonmetal layer; wherein the scouring layer includes a scouring surface and a laminating surface such that the laminating surface is laminated to the nonmetal layer.

Abstract: A novel composite of glass fiber paper and reinforcing material that is useful for high speed manufacturing of devices comprising it is disclosed. The composite is formed by pressing into a glass fiber paper, having multimodal (at least bi-modal) composition, a hydrophilic reinforcing material. The composite has anisotropic separation properties that are particularly useful for preparing a fluid fraction from whole blood. The preferred glass fiber paper comprises glass fibers such that there are a plurality of short fibers (6) having large diameters and long fibers (2) with smaller diameters. The preferred glass fiber paper also exhibits partial ordering. There are many more of the long fibers (2) with smaller diameters than of the short fibers (6) having large diameters. Also disclosed are several blood separator device designs for efficiently separating the fluid fraction of blood from whole blood using the composite.

Abstract: A leather or leather-like composite material that supports a layer of soft foam laminated to its back side, the outside of which foam is flocked with textile staple fibers. When this material is manufactured, the back side of a leather or a leather-like material is laminated to a layer comprised of a soft foam, whose outside oriented away from the leather or leather-like material is flocked with staple fibers.

Abstract: A method is provided for creating composites by combining pre-fabricated nanoscale structures (nanostructures) and other materials in which the nanostructures are anchored. This method results in anchored nanostructures with their base held and encased within the anchoring material to a specified depth and with a specified length of protrusion of the nanostructures from the anchoring material. This represents a major advance over previous methods of creating composites containing nanostructures which were limited to fully embedded nanostructures or, at best, very limited and uncontrolled protrusion of nanostructures. In summary, the current method involves bringing nanostructures and anchoring materials into physical contact in a controlled fashion and optionally conducting a treatment step to complete the anchoring process.

Abstract: Disclosed are systems and methods which provide durable and substantially smooth surfaces comprised of a number of smaller pieces of surfacing material. For example, tiles of natural materials, such as marble or granite, are formed into larger unitary structures, wherein the surfaces of the tiles are substantially dead flat and the seams therebetween are diminished in size so as to minimize their visual impact. These unitary structures are preferably adapted to interconnection to thereby allow formation of substantially larger surfaces. Jig apparatus and methods for there use are disclosed for casting unitary structures of various shapes and configurations in such a manner that a dead flat surface with very little to zero lippage is provided.

Abstract: A cost effective manufacturing process encapsulates a light emitting polymer (LEP) device between two flexible sheet materials, where one sheet may act as the substrate for the LEP device and the other sheet may act as a cover for the LEP device, and at least one of the sheets is transparent. Both encapsulating sheets and, as required, an adhesive system binding the sheets together provide sufficient environmental barriers with low moisture vapor transmission rates (MVTR) and oxygen transmission rates (OTR). The encapsulating sheets may, for example, be laminated together, sandwiching the LEP device in a vacuum, or oxygen/moisture free, and inert gas environment. Prior to encapsulation the LEP device may be heated and placed in a vacuum to remove moisture, air and residual solvents.

Abstract: A method for manufacturing a board for gliding over snow comprises producing a decorative and protective exterior assembly with at least one additional piece. At least one opening is made in the exterior assembly. The additional piece or pieces are placed on an outer surface of the exterior assembly, each piece having at least one through-fixing zone, passing through the opening or openings. The through-fixing zone or zones penetrate an inner structure of the board and constitutes one or more securing means for the piece or pieces.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: The present application generally relates to adhesive transfer devices. One embodiment of the application discloses a hand-held actuatorless adhesive transfer device. Another embodiment of the application discloses an adhesive transfer device for applying adhesive to a side edge portion of a selected substrate.

Abstract: Fabricating roll-good fuel cell material involves laminating first and second bonding material webs having spaced apart windows to first and second surfaces of a fuel cell membrane web. First and second active regions of the membrane web are positioned within the respective bonding material windows. Third and fourth gasket material webs having spaced apart windows are respectively laminated to the bonding material on the first and second membrane web surfaces. The bonding material windows align with the respective gasket material windows so that at least some of the bonding material extends within the respective gasket material windows. Fluid transport layer (FTL) material portions cut from fifth and sixth FTL material webs are laminated to the respective first and second active regions. The FTL material portions are positioned within respective gasket material windows and contact the bonding material extending within the respective gasket material windows.

Abstract: An odor adsorption agent, in particular for use in a hygiene article, is formed of a thermoplastic granulate and a zeolite bonded to the thermoplastic granulate by means of a welded bond.

Abstract: A method for joining bodies by melting down a joining element. The joining element acts on a surface of one of the bodies and penetrates the surface as a result of a directed force. Once in a penetrated condition, a mechanical excitation is generated such that during further penetration of the joining element into the one body, the advance is maintained through the directed force and the melting down is maintained through the mechanical excitation. Molten or melted material is hydraulically displaced into the bodies.

Abstract: A laminar “precured” or “replacement” tread for wheeled vehicles operating at night on retreaded tires is made more readily visible when grooves in the tires are provided with elastomeric strips or bands in which are embedded retroreflective elements such as transparent glass or synthetic resinous microspheres (referred to herein as “beads”). Upper surfaces of longitudinal ridges in a flat curing mold lend themselves to supporting the strips which are then precisely positioned in grooves defined by the ridges, when the flat tread is cured.

Abstract: A layered flame retardant system and method is disclosed comprising a first flame retardant stable layer for covering a solid combustible material and a second moisture protecting polyolefin stretch film layer. The polyolefin stretch film layer further compactly affixes the first flame retardant stable layer to the solid combustible material. Some embodiments incorporate a five layer flame retardant polyolefin stretch film with flame retardant additives primarily in the inner layers. Another embodiment incorporates thermal insulating material.

Abstract: A method of manufacturing a hearing device including providing a hearing aid housing having an opening, providing an electric/acoustic transducer, providing a support plate forming a blind hole having a membrane as a base, inserting the transducer into the blind hole, bringing the housing and support plate together such that a portion of the transducer enters through the opening in the housing, bonding the housing to the support plate, and trimming excess portion of the support plate.

Abstract: Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.

Abstract: Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.

Abstract: A method of vulcanizing an object formed of unvulcanized rubber, in which the unvulcanized-rubber formed object is vulcanized by pressing and heating by mold means, comprises disposing a fiber sheet member on a surface of the unvulcanized-rubber formed object and vulcanizing the unvulcanized-rubber formed object by the mold means.

Abstract: A process for preparing a fiberglass insulation product, including the steps of: (a) providing a layer of fire-retardant kraft paper, (b) coating the fire-retardant kraft paper layer with from 2 to 10 pounds of HDPE or of polypropylene per 3000 square feet of the paper to form an HDPE-fire-retardant kraft laminate or a polypropylene-fire-retardant kraft laminate, (c) coating the HDPE-fire-retardant kraft or polypropylene-fire-retardant kraft laminate with from 3 to 10 pounds of LDPE per 3000 square feet of the HDPE-fire-retardant kraft laminate or polypropylene-fire-retardant kraft laminate to form an LDPE-HDPE-fire-retardant kraft laminate or an LDPE-polypropylene-fire-retardant kraft laminate, (d) adjusting the temperature of the LDPE-HDPE-fire-retardant kraft laminate or the LDPE-polypropylene-fire-retardant kraft laminate so that the LDPE becomes tacky while the HDPE or polypropylene remains solid, (e) providing a layer of fiberglass wool, and (f) contacting the LDPE layer of the LDPE-HDPE-fire-retardant

Abstract: Processes for fabricating a customized, three-dimensional, bioerodable, polymeric prosthetic implant are provided. In a highly preferred embodiment, the prosthetic implant has a porous network. The method employs a sterolithography instrument, a solution comprising chains of one or more photocurable, bioerodable polymers and a photoinitiator, and a three-dimensional CAD image. In a highly preferred embodiment, the solution comprises poly (propylene) fumarate (PPF) and a solvent for controlling the viscosity of the solution. During the fabrication process, the solution is placed in a container in the stereolithography instrument. The container also holds a movable build platen for supporting each of the covalently bonded layers of the polymeric prosthetic implant that are formed when successive layers of the solution are exposed to UV light energy.

Abstract: An optical recording head is provided which includes a slider body having a leading edge. A void is formed in the slider body to receive a sphere of optically transparent material. The sphere is inserted into the void such that a portion of the sphere protrudes from the slider body. The protruding portion is lapped to be coplanar with a surface of the slider body to form a near-field lens. A mesa may be formed onto the lapped portion and may include a coil. The slider body, mesa, near-field lens, and coil may be formed in one batch process.

Abstract: A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1×103 to 5×105 Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80° C. to 150° C. at an elevating temperature rate of 2.4° C./min and at a shearing rate of 6.28 rad/sec and a storage modulus of elasticity after curing from 5×105 to 5×107 Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150° C. in a tensile mode at a measuring frequency of 6.28 rad/sec.

Abstract: Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in a facing-but-spaced-apart relation in the bonding apparatus with the spheres and the adhesive between the first component and the second component. The bonding apparatus forces the first component toward the second component with sufficient force to bond the spheres to the first component and to the second component, while monitoring at least one measured bonding reaction of the first component and the second component, and controlling the bonding apparatus responsive to the step of monitoring. The adhesive is thereafter cured, optionally with the bonding pressure released and the assembly removed from the bonding apparatus.

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract: The invention relates to a glass fibre-reinforced plastic-plate which is provided with an anti-slip coating, consisting of resin and sand, as well as a production process of such a plate. The process according to the invention is a continuous one and does not require manual production steps. Initially, for the production a resin is bonded (10) with glass-fibre mats to a glass fibre-reinforced laminate as base material (20) and heated. As is conventional, the plate (20) is covered on both sides with carrier films (11, 12). In the subsequent phase of cooling-down (13) the point in time is waited for in which the plate (20) is in actual fact partly gelatinized, but the surface which is supposed to be coated is not yet completely cured. In this stage the upper carrier film (11) is pulled-off and a premixed coating compound consisting of resin and sand is applied (18) from above onto the base material (20). Alternative to the application of a premixed coating material, the resin and sand can be applied separately.

Abstract: A shrink wrap material for protecting articles includes at least one non-woven fabric and a woven scrim defining apertures. A sufficient portion of the fibers from the non-woven fabric being forced into the apertures of the scrim such that the scrim reinforces and supports the non-woven fabric, thus increasing their strength. A shrinkable, stretchable film is intermittently bonded to at least one non-woven fabric. The material is used by placing the material around the article to be protected and then shrinking the film.

Abstract: A manufacturing method of a printed wiring board. On a conductor plate 1, approximately conical conductor bumps 1a, 1a, . . . are formed, the conductor bumps 1a, 1a, . . . being caused to penetrate through a prepreg 5 to project tip ends of the conductor bumps 1a, 1a, . . . from an opposite side of the prepreg 5. The tip ends of the conductor bumps 1a, 1a, . . . and interconnection patterns 7a and 7b on surfaces of core material 17A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump 1a, 1a, . . . and interconnection patterns 7a and 7b on the surface of the core material are stacked to bond both.

Abstract: A three-dimensional object is manufactured by filling and hardening a powder material around a core. A powder material is first filled and layered around the core, and a beam is then selectively irradiated on the layer of powder material to form a hardened layer united with the core. These steps are repeated to form a plurality of hardened layers around the core, thereby manufacturing the three-dimensional object having the core embedded therein.

Abstract: A modular headliner assembly (10) includes a headliner (12) having an appearance surface (13) and a back surface (14). At least one component (19, 20, 22, 23) is disposed adjacent the back surface (14) of the headliner (12). Furthermore, an integration sheet (24) is attached to the back surface for securing the at least one component (19, 20, 22, 23) to the headliner (12). A method of manufacturing the headliner (12) assembly is also disclosed.

Abstract: This technique involves joining copper foils of any type and thickness to aluminum sheets of any alloy and thickness in order to simplify the assembly of multilayer press books, whereby two copper foils of any type and thickness and one aluminum sheet of any alloy and thickness are joined in such a way that the joint is located outside the surface of the aluminum separator. At the same time, the registration slots required for the multilayer press can be punched. The selected copper foil panels.are slightly larger than the aluminum sheet. When the aluminum separators thus covered with a copper foil on both sides are subsequently placed into the press together with the epoxy resin fabrics (prepregs) for laminating the multi-layer, the aluminum sheet can expand unhindered during heating without causing any surface tension on the copper foils.

Abstract: The invention is a wane-free engineered wood product and the method of its manufacture. Lumber having wane along one or more edges is first milled to produce rectangular notches along each of the four edges. The notches are sized to remove all or most of the wane. The notched piece is then ripped lengthwise to produce two strips. These are rotated 180° and placed adjacently so that the notched edges face each other and form longitudinal channels. Strips of oriented strand board or a similar material are then affixed into the channels, preferably by gluing, reuniting then again into a unitary wane-free structural member.

Abstract: The present application generally relates to adhesive transfer devices. One embodiment of the application discloses a hand-held actuatorless adhesive transfer device. Another embodiment of the application discloses an adhesive transfer device for applying adhesive to a side edge portion of a selected substrate.

Abstract: A process for fabricating a BGA flip chip package containing a stiffener or heat spreader monitors edges of the adhesive that attaches the stiffener or heat spreader. The monitoring ensures that the adhesive extends beyond the centers of the outermost solder balls in the BGA. Stress at the edge of the adhesive thus does not cause warping or variations within the BGA.

Abstract: The present application generally relates to adhesive transfer devices. One embodiment of the application discloses a hand-held actuatorless adhesive transfer device. Another embodiment of the application discloses an adhesive transfer device for applying adhesive to a side edge portion of a selected substrate.

Abstract: A method and structure for filling an opening in a substrate which includes positioning a sheet above the substrate and punching the sheet into the opening in the substrate, wherein the sheet and the substrate have similar shrinkage characteristics when subjected to a subsequent sintering process.

Abstract: Apparatus and method for attaching, assembling, and/or mounting a substrate to any semiconductor device or a flip-chip type semiconductor device.

Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.

Abstract: A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

Abstract: A method for forming and applying a roadside display system is disclosed. Character-shaped are formed in a thermoplastic polymer resin material with a highly reflective face. A readily available sheet cutting die press allows the characters, numerals or letters, to be cut on site with a minimum of effort. Typically, a matching set of character-shaped inserts are cut from a second sheet of thermoplastic polymer resin material with a different color, contrast and reflectance. The inserts are placed in the corresponding character-shaped apertures cut in the first sheet and then a reactant, in the form of contact cement, is used to adhere the sign to a roadside curb. An exothermic reaction occurs between the reactant and thermoplastic polymer resin material which adheres the thermoplastic polymer resin material to the curbside.

Abstract: Surface treating articles and methods for the manufacture of such articles are provided. The articles of the invention comprise a rotatable core; a plurality of surface treating segments, the segments having first ends adjacent the core and second ends opposite the first ends; and a cured, expanded adhesive composition bonding the surface treating segment to the core, the adhesive composition comprising (a) an organic epoxide compound having an epoxide functionality of at least 1, (b) an epoxide hardener, (c) a film-forming material, and (d) a foaming agent; wherein the expanded adhesive provides a substantially continuous bond area extending from the core into and around the first end of the segments.

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.

Abstract: The invention is an apparatus and method for producing a hybrid boron reinforced polymer matrix composition from powder pre-impregnated fiber tow bundles and a linear array of boron fibers. The boron fibers are applied onto the powder pre-impregnated fiber tow bundles and then are processed within a processing component having an impregnation bar assembly. After passing through variable-dimension forming nip-rollers, the powder pre-impregnated fiber tow bundles with the boron fibers become a hybrid boron reinforced polymer matrix composite tape. A driving mechanism pulls the powder pre-impregnated fiber tow bundles with boron fibers through the processing line of the apparatus and a take-up spool collects the formed hybrid boron-fiber reinforced polymer matrix composite tape.

Abstract: A process for preparing a fiberglass insulation product, including the steps of: (a) providing a layer of fire-retardant kraft paper, (b) coating the fire-retardant kraft paper layer with from 2 to 10 pounds of HDPE or of polypropylene per 3000 square feet of the paper to form an HDPE-fire-retardant kraft laminate or a polypropylene-fire-retardant kraft laminate, (c) coating the HDPE-fire-retardant kraft or polypropylene-fire-retardant kraft laminate with from 3 to 10 pounds of LDPE per 3000 square feet of the HDPE-fire-retardant kraft laminate or polypropylene-fire-retardant kraft laminate to form an LDPE-HDPE-fire-retardant kraft laminate or an LDPE-polypropylene-fire-retardant kraft laminate, (d) adjusting the temperature of the LDPE-HDPE-fire-retardant kraft laminate or the LDPE-polypropylene-fire-retardant kraft laminate so that the LDPE becomes tacky while the HDPE or polypropylene remains solid, (e) providing a layer of fiberglass wool, and (f) contacting the LDPE layer of the LDPE-HDPE-fire-retardant

Abstract: A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained.

Abstract: This invention relates to a process for manufacturing a ski, or like board for gliding over snow, which comprises, on the surface, embedded elements constituted by elements of additional protecting and decorative layers, these elements being flush with the surface of the ski. According to the invention, the protecting and decorative sheet is laid flat, before being placed in the mould, and the thin elements to be embedded are added thereon by bonding. The assembly of the ski elements is then moulded conventionally, with the result that the inner, uniformly smooth surface of the lid of the mould presses on the additional elements and consequently embeds them in the protecting and decorative sheet.

Abstract: This invention relates to a light transmitting filter comprising (a) light absorbing layer having a first and second surface, (b) microspheres embedded in the light absorbing layer and (c) an optically clear, substantially uniform, conformable layer covering the microspheres, wherein the microspheres provide light tunnels through the light absorbing layer. The invention also relates to methods of making the same. The invention also relates to a method of preparing a light transmitting filter comprising the step of laminating a clear substantially uniform conformable layer over transparent microspheres embedded in a light absorbing layer wherein the transparent bead form light tunnels through the light absorbing layer. The light transmitting filters of the present invention have improved light throughput and improved angularity.

Abstract: A ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manufacture of radio frequency identification devices including a micro IC chip embedded therein. The process results in a device having an overall thickness in the range of 0.005 inches to 0.033 inches with a surface suitable for receiving dye sublimation printing—the variation in the device thickness across the surface is less than 0.0005 inches. The hot lamination process of the present invention results in an aesthetically pleasing device which can be used as a sticker when adhesive is applied to the device. The invention also relates to a plastic device in all shapes and sizes formed in accordance with the hot lamination process of the present invention and can withstand harsh chemicals and various pressures.