Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

Abstract: A pre-fabricated composite reinforcement device for installation on a structure, comprising a metal reinforcement layer; a fiber reinforced polymer layer; an adhesive layer configured between the metal and fiber reinforced polymer layer; and a plurality of power-actuated fasteners configured for securing the metal reinforcement, fiber reinforced polymer, and adhesive layer to the structure; and wherein a first side of the metal reinforcement layer is for positioning upon the structure for installation of the fasteners with the first side facing away from the structure, and a second side is configured with the adhesive and fiber reinforced layer across a surface area of the second side of the metal reinforcement layer.

Abstract: A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.

Abstract: A method of forming a semiconductor device includes attaching a metal foil to a carrier, the metal foil being pre-made prior to attaching the metal foil; forming a conductive pillar on a first side of the metal foil distal the carrier; attaching a semiconductor die to the first side of the metal foil; forming a molding material around the semiconductor die and the conductive pillar; and forming a redistribution structure over the molding material.

Abstract: A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.

Abstract: A flexible fiber substrate and a flexible display device including the same are provided. The flexible fiber substrate includes: an insulating body woven from an insulating fiber and a patterned conductive member made of a conductive fiber. The conductive member and the insulating body are fixed to each other by interlacing, and the conductive member is touchable from outside of the flexible fiber substrate.

Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

Abstract: The present invention provides recyclable copper clad laminates (CCLs) each including copper foil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.

Abstract: A method for manufacturing a circuit structure is described as follows. Two patterned circuit layers are formed on a core layer. The patterned circuit layers are located on two opposite surfaces of the core layer. A patterned insulating layer is respectively formed on each of the patterned circuit layers. The patterned insulating layers respectively expose a portion of the patterned circuit layers. The core layer is removed so as to expose an upper surface of each of the patterned circuit layers and a top surface of each of the patterned insulating layers. The upper surface of each of the patterned circuit layers is aligned with the top surface of each of the patterned insulating layers.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: A substrate strip with wiring is provided. The substrate strip includes a plurality of wiring blocks, a carrying substrate, and an adhesive layer. Each of the wiring blocks includes at least one wiring board unit, and each of the wiring board unit includes an insulating layer and a wiring layer disposed on the insulating layer. The carrying substrate has a carrying surface. The adhesive layer is disposed between the carrying surface and the wiring layers, and adheres to the wiring blocks and the carrying substrate. When the adhesive layer is separated from the wiring blocks, the wiring layers are kept on the insulating layers. Further, a manufacturing method for the substrate is provided.

Abstract: Provided is a method for manufacturing solar modules with an improved yield. A heat and pressure applying step is performed in which an opposing solar cell (10) and wiring member (11) with a resin adhesive (21) interposed between them are heated while applying pressure. After the heat and pressure applying step has been performed, a cooling step is performed in which the solar cell (10) and the wiring member (11) are cooled while applying pressure.

Abstract: A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

Abstract: A bonding method and a bonding tool that enable quick and reliable bonding of an optical fiber to a structural body by a simple process, and a method for producing a structural body are provided. In an optical fiber (1), a strand is coated with a coating portion of a thermoplastic resin. At least one portion of the coating portion is heated and melted by a heater (14). The portion where the thermoplastic resin is melted of the optical fiber (1) and a surface of a structural body (17) are brought into contact with each other in a state in which the thermoplastic resin is melted. A molding roller (15) pressure-bonds the optical fiber (1) to the surface of the structural body (17) . The thermoplastic, resin is then cooled and cured, so that the optical fiber (1) is bonded to the structural body (17).

Abstract: Disclosed herein are composites as well as methods of making these composites. The composite may, for example, be used as light-weight, high-strength structural members and wall panels. In some embodiments, the composites can be prepared from a light-weight assembly using simple procedures. Also disclosed herein are assemblies for preparing the composites.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

Abstract: Various embodiments include a fuel cell stack seal application method including the step of applying a seal paste to a fuel cell, placing the fuel cell in a fuel cell stack, and thermally treating the fuel cell stack to set the seal paste into a seal. Further embodiments include applying the seal paste to an interconnect using stencil printing.

Abstract: A method for manufacturing a printed wiring board includes laminating a first core substrate and a second core substrate, forming a first upper buildup layer on a surface of the first core substrate, forming a second upper buildup layer on a surface of the second core substrate, separating the first core substrate and the second core substrate from each other, laminating the first upper buildup layer formed on the first core substrate and the second upper buildup layer formed on the second core substrate, forming a first lower buildup layer on the opposite surface of the first core substrate, forming a second lower buildup layer on the opposite surface of the second core substrate, and separating the first upper buildup layer and the second upper buildup layer.

Abstract: A method and an apparatus for retaining magnetic properties of a magnet while undergoing manufacturing processes are presented. Ferrous materials with relatively good magnetic permeability are disposed adjacent to poles of magnet substantially containing magnetic field lines from the magnet within the ferrous materials. When the magnetic field lines are thereby substantially contained, the magnet can be exposed to elevated temperatures without losing magnetization strength. Adhesives, particularly adhesives that cure when exposed to elevated temperatures can be used with magnets configured to contain magnetic field lines without having the magnets lose magnetic strength.

Abstract: Method for producing a fastening system, in particular for components of photovoltaic systems, preferably on roof surfaces of buildings, includes providing a support surface (1) and applying at least one fastening component (7, 19) of loops and/or other interlocking elements on the support surface. After applying the fastening component (7, 19) in the mounted state of the support surface (1), at least one other corresponding fastening component (7, 19) provided with other interlocking elements can be detachably connected to the fastening components (7, 19) on the support surface.

Abstract: A composite structure is fabricated by laying up at least one ply of fiber reinforcement and at least one layer of resin on a tool. The resin film layer is formed by laying strips of resin film. The fiber reinforcement is infused with resin from the resin layer.

Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.

Abstract: An assembly kit is provided for supplying a fixing agent to fix two objects. The kit comprises two storage receptacles. An aerobic adhesive is stored in one of the two storage receptacles. A hydrophilic material containing moisture is separately stored in the other of the two storage receptacles. The two storage receptacles are adapted to permit removal of the aerobic adhesive and the hydrophilic material from the receptacles for mixing together the fixing agent.

Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).

Abstract: An Electret Condenser Microphone (ECM) motor apparatus includes a diaphragm ring support structure, a charge plate, and at least one stitch. The diaphragm ring support structure defines an opening there through. The charge plate is disposed within the opening. The at least one stitch is coupled to the diaphragm ring support structure to the charge plate. The diaphragm is disposed adjacent to and in a generally parallel relationship to the charge plate. The stitch is configured to hold the charge plate and the diaphragm ring, and the stitch is configured to maintain a constant or nearly constant distance between the charge plate and the diaphragm in the absence of sound energy.

Abstract: A method for forming a nanopore membrane includes forming an array of carbon nanotubes on a substrate that are disposed side by side in a direction perpendicular to a length of the carbon nanotubes. The array of carbon nanotubes are embedded in a patternable polymer material. The patternable polymer material is crosslinked over the array of carbon nanotubes. An adhesive layer is deposited on the polymer material having the array of carbon nanotubes to form a pad. The pad is rolled using a transfer rod to form a membrane with carbon nanotubes of the array, forming nanopores through the membrane such that as the pad is rolled the membrane increases in diameter.

Abstract: A method of forming a fan blade includes the step of positioning a piece of low density filler in a cavity of an inner exposed surface of a fan blade body. An upper surface of the piece of low density filler is located above the inner exposed surface of the fan blade body, and the low density filler has a density lower than a density of a material of the fan blade body. The method further includes the steps of positioning the fan blade body in a lower die of a press and applying pressure to the inner exposed surface of the fan blade body with an upper die of the press to compress the low density filler such that the upper surface of the piece of low density filler is approximately flush with the inner exposed surface of the fan blade body.

Abstract: A method of forming a fan blade includes the step of applying an adhesive layer around a leading edge of a fan blade body. The adhesive layer includes an adhesive film supported by a scrim cloth, and the adhesive layer contacts a portion of an inner surface of the fan blade body and a portion of an outer surface of the fan blade body. A leading edge sheath is positioned relative to the fan blade body such that a first flank and a second flank of the leading edge sheath is positioned over the portion of the inner surface and the portion of an outer surface, respectively, of the fan blade body. Pressure is applied to the first flank and the second flank of the leading edge sheath to secure the leading edge sheath to the blade body and curing the adhesive film.

Abstract: A composite structure is fabricated by staging at least a portion of an uncured, first composite component. The first composite component is assembled with a second composite component, and the staged portion of the first composite component is cocured with the second composite component.

Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

Abstract: The present invention is predicated upon methods and devices for positively mounting structural members while preventing or substantially limiting exposure of such members to environmental conditions possibly leading to corrosion.

Abstract: Provided are methods of bonding a fluoroelastomer to a metal substrate; fluoropolymer compounds comprising a fluoroelastomer, a curing agent and a bonding promoter; and composite materials obtained by curing the compound. Further provided is the use of bonding promoters for increasing the bond strength between a fluoroelastomer and a metal substrate.

Abstract: Mold-free resin-insulated coil windings are obtained by applying continuous fibers embedded in a quasi-solid-state epoxy-resin matrix, e.g. in the form of a tape, to the coil windings. The tape is locally heated up to the melting point of its polymer matrix, and is subsequently pressed against the winding body. The heated and fused resin of the tape, which is pressed onto the coil, flows under pressure into the voids and gaps between the coil windings and fills them up, thereby hermetically insulating the coil windings. After leaving the heating and pressing apparatus the fused epoxy resin becomes solid again. The resulting curing process is thus considerably simplified and shortened, compared to the state of the art.

Abstract: Building panels and a method to produce such panels including a solid decorative surface having a decorative wear layer including fibers, binders, color substance and wear resistant particles. A method of manufacturing a building panel having a decorative surface connected to a core wherein the surface has at least two homogenous layers, a lower sub layer and an upper decorative layer, the upper decorative layer including fibers, a first color substance a binder and wear resistant particles, the lower sub layer including fibers, a second color substance, and a binder, whereby the method including the steps of applying the layers comprising a mix of fibers, binder, wear resistant particles and color substance on a core wherein the layers comprise different colors, displacing particles from their original position such that particles from the sub layer are visible on the decorative surface, and curing the layers by providing heat and pressure.

Abstract: A polymeric film or sheet comprising an ionomeric composition comprising ionomeric copolymer of an alpha olefin and about 1 to about 30 wt % of alpha,beta-ethylenically unsaturated carboxylic acid having 3 to 8 carbons, based on the total weight of the ionomeric copolymer, wherein the carboxylic acid is neutralized to a level of 1 to 100 mol %, with one or more metal ions, based on the total number of moles of carboxylate groups in the ionomeric copolymer, and wherein the ionomeric copolymer has a Melt Index of about 20 to about 300 g/10 min. The ionomeric composition preferably comprises an additive selected from the group consisting of silane coupling agent, organic peroxide, and combinations thereof. In addition, an article comprising an interlayer formed of the polymeric film or sheet and an additional layer selected from the group consisting of glass, other polymeric interlayer sheets, polymeric film layers, and metal films or sheets. Examples of articles include safety windows and solar cells.

Abstract: A composite structural element and a method for making same are provided. The element includes a polymer foam core and at least one fibrous layer adhered to the polymer foam core by epoxy. Nano-particles are suspended in the epoxy prior to curing; preferably they are mixed with the hardener before it is mixed with the resin. The polymer foam core is preferably an exothermic foam such as polyurethane, and heat generated by the exothermic foam cures the epoxy, thereby causing the fibrous layer to adhere to the foam core. The nano-particles may be made from at least one of carbon, a ceramic, tungsten, a carbide, titanium, zircon, aluminum, silver, or boron. When carbon nano-particles are used, the strength of the composite is greatly increased, and the curing time of the heat-curable epoxy is significantly reduced. Ceramic nano-particles can be used to increase penetration resistance and provide increased ballistic protection.

Abstract: A method for fabricating a display device 1 includes a first step of attaching a display panel and a first substrate member to each other with a first adhesive sandwiched between the display panel and the first substrate member, and a second step of attaching a second substrate member to the first substrate member on a surface of the first substrate member opposite to the display panel with a second adhesive sandwiched between the first and second substrate members, where the second step is carried out subsequently to the first step. The second adhesive used in the second step has a glass transition point higher than a glass transition point of the first adhesive.

Abstract: The present application is directed to methods for applying multiple labels to an object. An exemplary method comprises affixing an inner label to the object, then affixing an outer label over the inner label. One or more edges of the outer label may be coupled to the inner label using a releasable or a resealable adhesive such that the outer label may be decoupled from the inner label.

Abstract: A wafer level method of manufacturing a liquid crystal optical device removes the need for a rigid barrier fillet while minimizing any risk of contamination of the liquid crystal. An uncured adhesive may be deposited on a bottom substrate and partially cured to form a liquid crystal barrier. After addition of the liquid crystal and a top substrate, the adhesive is fully cured to bond the substrate layers together. An uncured adhesive may be used together with the partially cured adhesive, and may be deposited separately or filled into an extracellular matrix surrounding a plurality of liquid crystal cells. The adhesive may be cured by a variety of means, including light that may be spatially modulated. One or both of the substrates may be deformed during assembly so as to create a structure with a lensing effect on light passing through the liquid crystal region.

Abstract: A method of forming a roofing product can include providing a ceramic base material having an open structure, and filling the open structure of the ceramic base material with a bituminous material. In a particular embodiment, the bituminous material has no greater than approximately 5 weight % of abrasive particles or has a first particle size distribution. The method can further include applying a recycled roofing material. In an embodiment, the recycled roofing material is applied along a principal surface of the ceramic base material or adjacent to the ceramic base material. In a particular embodiment, the recycled roofing material has at least 2 weight % acid-insoluble solids or has a second particle size distribution that is narrower than the first particle size distribution.

Abstract: A method for producing an active substance-containing polyurethane plaster for transdermal application is described, said plaster containing at least one active substance at a highly accurate declared dose. In the described method, a solvent-free active substance-containing polyurethane is produced by reactively coating a solvent-free active substance-containing polyurethane material (40), which is mixed in a coating unit (60) immediately before or during the application process, onto an elastic backing foil (20) that has been rendered non-extensible at least in the direction in which the applied polyurethane material is processed by means of a supporting, adhering auxiliary foil (30) which is at least mono-axially non-extensible.

Abstract: A method for fabricating a laminated composite body including a metal foil and a plurality of fiber plies. The method includes perforating a sheet of metal foil, stacking the perforated metal foil sheet and the plurality of fiber plies in face to face relation in a predetermined order and orientation, and infusing resin into the stacked sheet and plies so that resin flows through the perforations in the metal foil sheet and intersperses between the plurality of fiber plies to form the laminated composite body.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.

Abstract: A method for manufacturing a reliable multilayer wiring substrate at a relatively low cost having little or no warpage or distortion is provided. In certain embodiments an insulation core made of an insulation material that is more rigid than that of resin insulation layers is prepared. A through hole is formed through core upper and lower surfaces of the insulation core, and a through hole conductor is formed therein. A plate-like substrate is prepared, and resin insulation layers and at least one conductor layer are laminated on the substrate to form a first buildup layer. The insulation core is laminated on the first buildup layer so as to electrically connect the conductor layer and the through hole conductor. Resin insulation layers and at least one conductor layer are then laminated on the insulation core. Lastly, the substrate is separated from the first buildup layer to yield a multilayer wiring substrate.

Abstract: A method for anticorrosive treatment of metal surfaces, especially at edges and transitions of the metal components, characterized in that a self-adhesive tape is applied to the metal surface and the self-adhesive tape contains at least one layer with a material which is heated such that the material melts onto the metal surface and thus forms an anticorrosive layer.

Abstract: A ballistic resistant article is presented comprising a plurality of fibrous layers, each of said layers comprising a network of fibers, wherein the fibers have a strength of at least 800 mN/tex (1100 MPa) according to ASTM D 7269-07 and a matrix material, wherein the matrix material comprises a mixture comprising at least one self-crosslinking acrylic resin and/or at least one crosslinkable acrylic resin, and at least one tackifier. Compared with an article of the same construction but with a matrix material without tackifier the article according to the invention comprises a higher adhesion between the fibrous layers both in the unaged and aged state and a lower water pick up after water soak and the article passes the gasoline soak test.

Abstract: In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the process, voids are easily eliminated irrespective of the design of the wiring board, and the adhesive is prevented from curling up on the chip.