Including Uncurable Lamina; E.g., Metal, Paper, Etc. Patents (Class 156/307.7)
  • Patent number: 6475328
    Abstract: To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: November 5, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hirohiko Haniu, Toshikazu Tomioka, Katsumi Tomita, Susumu Kobayashi
  • Publication number: 20020157780
    Abstract: Adhesive systems comprised of one or more photoinitiators and one or more adhesives capable of radiation-induced reaction are useful in one-step or multi-step perfect binding of books and other printed articles. The adhesive may be a low viscosity mixture of a monomer and/or polymer which is cross-linkable by UV or stronger electromagnetic radiation.
    Type: Application
    Filed: September 7, 1999
    Publication date: October 31, 2002
    Inventor: HERMANN ONUSSEIT
  • Publication number: 20020160165
    Abstract: Copper foil lands provided with a through-hole to be filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands would hitherto easily occur, whereby a copper plated-through hole both side printed wiring board using a paper-phenol substrate is obtained in which adhesion strength between the copper foil lands and the copper paste has been enhanced.
    Type: Application
    Filed: June 26, 2001
    Publication date: October 31, 2002
    Inventor: Yoshinari Matsuda
  • Patent number: 6472083
    Abstract: The invention relates to the bonding of a phenolic resin impregnated core and a metal sheet into a high pressure laminate. A binding layer of a styrene-maleic anhydride copolymer is positioned between the core and the metal sheet to ensure bonding of the layers when a lay-up containing the desired layers is heated and pressed.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: October 29, 2002
    Assignee: Premark RWP Holdings, Inc.
    Inventors: Robert R. Krebs, Ernest L. Phelps, Genevieve L. Tepera
  • Publication number: 20020153094
    Abstract: A method of laminating and forming a non-planar composite part from a pair of metal skins having an intervening paper layer in a single operation maintains a uniform pressure between die faces. The paper layer may be degassed prior to the lamination/forming process.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Inventor: David D?apos;Arcy Clifford
  • Patent number: 6468666
    Abstract: A magnetically active laminate is disclosed. The magnetically active laminate is composed of a resin impregnated layer bonded to a distinct, magnetically active sheet. The laminate is especially well suited for use in the construction of erasable markerboards and cubicle panels, although many applications are possible within the scope of the present invention.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: October 22, 2002
    Assignee: Premark RWP Holdings, Inc.
    Inventors: Robert R. Krebs, Ernest L. Phelps
  • Patent number: 6464812
    Abstract: Method for manufacturing trophies, medals, award plates, indicative plates, panels, and the like, starting from laminates produced on bases having planar, spherical, cylindrical, or other geometric form. The laminates are manufactured with thermosetting resins reinforced with fiberglass, and the laminate production process includes an optimized sequence of preferably manual steps. The fiberglass used can be, for instance, chopped strand mat, woven roving, or fabric. Decorative designs that can be in the form of a transparency, paper, cloth, plastic, wood, metal, leather, or other material, and that can contain characters, drawings, paintings, illustration, pictures, signatures, etc., are inserted into the laminates. The decorative designs can be generated by computer, hand made, or otherwise produced. The laminates constitute inviolable casings that maintain the decorative designs isolated inside thereof.
    Type: Grant
    Filed: July 12, 2000
    Date of Patent: October 15, 2002
    Inventors: Erlei Moreira, Ana Maria Do Carmo Magalhães
  • Patent number: 6460240
    Abstract: A profile member of hybrid composite materials including alternating layers of metal and fiber-reinforced composite is fabricated by three successive steps. In a first step, wet composite prepreg layers impregnated with a binder are alternately stacked with metal layers, so that the uncured binder wets the surfaces of the metal layers. Next, the initial uncured layer structure is plastically deformed using successive pressure or bending deformation steps until a prescribed cross-sectional contour of the layer structure is achieved. Finally, the formed layer structure is supported and fixed in an autoclave, in which the binder is cured under an applied mechanical pressure and elevated temperature, to form the finished profile member.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: October 8, 2002
    Assignee: Airbus Deutschland GmbH
    Inventors: Andreas Kielies, Rolf Beck, Guenter Doehle
  • Patent number: 6461455
    Abstract: In a method for making a hybrid leaf spring at least one layer of composite material is provided and a metal primary leaf. The layer of composite material and metal primary leaf are positioned adjacent one another in a mold having an interior cavity defined by at least one cavity wall. A layer of adhesive material is located between and in engagement with the layer of composite material and the metal primary leaf. The adhesive is cured by controllably heating the metal primary leaf so that energy in the form of heat is conducted therefrom into the adhesive layer bonding said metal primary leaf and layer of composite material together.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: October 8, 2002
    Assignee: Pacific Coast Composites
    Inventors: Frank Meatto, Edward Pilpel, D. Michael Gordon, David C. Gordon, Jr.
  • Patent number: 6454889
    Abstract: A structural member for reinforcement of asphalt and concrete roadways and other products, and which comprises a gridwork of warp strands and weft strands which are disposed at right angles to each other and so as to define an open structure. In one embodiment, the gridwork is impregnated with a thermosettable B-stage resin so as to interlock the strands at their crossover points and maintain the gridwork in a semi-flexible state, and after being applied to the product to be reinforced, the resin is heated to convert the same into a fully cured composite to thereby rigidize the gridwork and reinforce the product. In cases where the product to be reinforced is heated, such as asphalt paving, the heat of the product provides the heat necessary to fully cure the resin in situ. In another embodiment, the resin is fully cured to rigidize the gridwork prior to its being applied to the structure to be reinforced. A method of producing the resin impregnated gridwork is also disclosed.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: September 24, 2002
    Assignee: Hexcel CS Corporation
    Inventors: James E. Hendrix, Gordon L. Brown, Jr., Mansfield H. Creech, Jr.
  • Publication number: 20020121334
    Abstract: A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.
    Type: Application
    Filed: December 20, 2001
    Publication date: September 5, 2002
    Inventors: Kenichi Ikeda, Toshiyuki Kawashima, Nobuharu Tahara
  • Patent number: 6432245
    Abstract: A method for manufacturing a thin metal film with an embossed pattern, which enables the precise transfer of the embossed pattern and generates a strong interference color is provided. An embossing belt 10 having an embossed pattern formed on one surface thereof is coated with a thermosetting transparent resin 12. The transparent resin 12 is dried and cured and is coated with PVA which is sintered to form a PVA layer 20, whereby the transfer of the embossed pattern is completed. After that, the transparent resin 12 with the PVA layer 20 bonded to the surface opposite to the embossed pattern is peeled from the embossing belt 10 and reeled in, and an aluminum layer 24 is deposited on the surface of the belt 10 on which the embossed pattern is formed. The aluminum layer 24 is coated with another transparent resin and the PVA layer 20 is removed through a dissolving step. Resulting resin layers are pulverized to create a hologram pigment.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: August 13, 2002
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshihiro Yamamura, Nobuhiro Ito
  • Patent number: 6432541
    Abstract: A resin composition including from about 1 to about 100 weight percent of a thermoplastic oxazolidone ring-containing compound having a molecular weight of at least 5000, which is the reaction product of: a) from about 20 to about 43 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyisocyanate having an isocyanate-functionality of from about 1.8 to about 2.2; b) from about 80 to about 57 weight percent, based on the polyepoxide and polyisocyanate reactants, of a polyepoxide having an epoxide functionality of from about 1.8 to about 2.2; and optionally, c) a chain extender. The resin composition is used as an adhesive to adhere a copper foil to a prepreg or a laminate, with improved peel strength and Tg.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: August 13, 2002
    Assignee: Dow Global Technologies Inc.
    Inventor: Joseph Gan
  • Publication number: 20020106482
    Abstract: This invention relates to methods of making visually uniform, light transmitting panels and to the resulting panels, which include a cellular core sandwiched between two light transmitting sheets and possess improved light transmitting characteristics.
    Type: Application
    Filed: February 2, 2001
    Publication date: August 8, 2002
    Inventors: Emmanuelle Bourlier, Christian B. Mitman
  • Patent number: 6428649
    Abstract: A laminate having a metal reinforcement and a bonding veneer is disclosed, wherein the bonding veneer is a peroxide cured rubber including at least one of a polybutadiene and (meth)acrylate. A feature layer is formed on the bonding veneer and can be any of a variety of cross-linkable materials such as EPDM and EPM.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: August 6, 2002
    Assignee: Schlegel Corporation
    Inventor: Krishnamachari Gopalan
  • Publication number: 20020096247
    Abstract: The invention describes an improved process for the sealing of alternating flutes of ‘honeycomb’ designed filters to be made after construction, or fabrication, of the basic filter structure, rather than during construction, as is shown in the prior art. The method seals both sides of the primary flutes as is typically done for one side in the prior art and then the media is rolled into a honeycomb shape so that secondary flutes, open on both sides of the roll are created. The roll is vertically orientated and then the lower end is immersed into a sealing compound to such a depth which will cause the sealing compound to travel up into the lower portion of the roll to a height above the height of the lower seal for the primary flutes. The sealing compound is allowed to cure, effectively sealing the secondary flutes. The roll is then cut along a line located above the height of the lower seal for the primary flutes and before the top surface of the sealing compound in the secondary flutes.
    Type: Application
    Filed: December 17, 2001
    Publication date: July 25, 2002
    Inventor: Robert M. Wydeven
  • Publication number: 20020096249
    Abstract: In a method for making a hybrid leaf spring, at least one layer of composite material is molded onto a primary leaf using a mold with an interior cavity having a curvature for receiving the primary leaf at a depressed camber relative to its initial camber. The depressed camber is between unloaded and curb load cambers of the hybrid leaf spring. The primary leaf and the layer of composite material are positioned in the mold adjacent to one another and with a layer of adhesive therebetween. The layer of adhesive is cured for bonding together the primary leaf and the layer of composite material at the depressed camber so as to generally eliminate bond line shear stress when the camber of the hybrid leaf spring is at the curb height.
    Type: Application
    Filed: March 19, 2002
    Publication date: July 25, 2002
    Inventors: Frank Meatto, Edward Pilpel, D. Michael Gordon, David C. Gordon
  • Publication number: 20020092610
    Abstract: A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectively formed on the surface of the supporting substrate, except cover the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the above supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding method whereby the sealing between the supporting substrate and the semiconductor bare chip is simultaneously conducted.
    Type: Application
    Filed: March 6, 2000
    Publication date: July 18, 2002
    Inventors: TAKUO FUNAYA, KOJI MATSUI
  • Publication number: 20020084013
    Abstract: A method for manufacturing a fiber aggregate formed by fiber having reforming surface comprises the steps of providing a fiber surface having thermoplastic resin at least on the surface layer thereof with a hydrophilic processing liquid containing polymer having a first portion with more hydrophilic group than the surface, and a second portion having interfacial energy different from that of the hydrophilic group, and interfacial energy substantially equal to the surface energy of the fiber; orientating the second portion toward the fiber surface, while orientating polymer to the side different from the surface of the first group; and forming a fiber absorber by heating the fiber having the reformed surface in the step of orientating polymer to thermally bond the contact points of fibers themselves.
    Type: Application
    Filed: November 5, 2001
    Publication date: July 4, 2002
    Inventors: Mikio Sanada, Sadayuki Sugama, Shozo Hattori, Hajime Yamamoto, Eiichiro Shimizu, Hiroshi Koshikawa, Hiroki Hayashi, Kenji Kitabatake
  • Publication number: 20020084029
    Abstract: A method of making a stator for a helicoidal pump/motor formed by a network of fibers encapsulated in an elastomer. The core is formed by laying up elastomeric preforms into helical grooves formed in a mandrel and wrapping an elastomeric sheet around helical projections formed in the mandrel. Successive strips of calendered rubber/wire cloth are then laid up into the grooves so as to fill the grooves, which are then wrapped in another layer of calendered rubber/wire cloth. The assembly is then filament wound with reinforcing cords and compression cured so as to bond the elastomeric components into a unitary element. The assembly is then placed in the stator housing and additional elastomer injected into the annular passage between the stator housing and the assembly. The completed assembly is then further cured so that the injected and previously cured elastomers bond to form a unitary structure having good strength and heat transfer capabilities.
    Type: Application
    Filed: December 5, 2001
    Publication date: July 4, 2002
    Applicant: APS Technology, Inc.
    Inventors: William Evans Turner, August H. Kruesi
  • Publication number: 20020079052
    Abstract: Resin compositions are provided which are used in combination with fibers to form self-adhesive prepreg sheets that are applied to core materials to form sandwich panels. The prepreg resin includes a thermoset resin, a curing agent and a viscosity control agent. The prepreg resin further includes certain thermoplastic particles which are used to control the flow characteristics of the prepreg resin and the formation of fillets during bonding of the prepreg to the core material.
    Type: Application
    Filed: November 14, 2001
    Publication date: June 27, 2002
    Inventors: Ligui Zhou, Philippe D. Christou, Winston L. Hedges
  • Publication number: 20020074073
    Abstract: A method for preparing carpet by using polyurethane to anneal secondary backing to a greige, comprising fibers attached to a primary backing. The polyurethane monomers are mixed just prior to application to the greige primary backing allowing the relatively low viscosity polyurethane to penetrate the fibers of the primary backing to aid in fiber lock. The polyurethane coated greige is then contacted with the secondary backing before complete polymerization to insure sufficient tack to hold the backings together.
    Type: Application
    Filed: November 5, 2001
    Publication date: June 20, 2002
    Inventors: Glen Hamrick, Paul C. Walker
  • Publication number: 20020076539
    Abstract: The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition.
    Type: Application
    Filed: February 25, 2002
    Publication date: June 20, 2002
    Inventors: Shigeo Nakamura, Tadahiko Yokota
  • Patent number: 6402871
    Abstract: A method for forming a saturating paper comprising the steps of selecting a sheet of paper, creating an embossed pattern of polygons on the sheet to increase the absorption capacity of the sheet, and causing a resin to contact the sheet such that the sheet absorbs at least a portion of the resin. The invention also includes a method for forming a decorative laminate including the steps of providing an overlay sheet, embossing the overlay sheet to increase the absorption capacity of the overlay sheet, and causing a resin to contact the overlay sheet such that the overlay sheet absorbs at least a portion of the resin. The method also includes the steps of locating the overlay sheet onto a decor sheet, and heating the overlay sheet and the decor sheet under pressure to bond the overlay sheet to the decor sheet.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: June 11, 2002
    Assignee: The Mead Corporation
    Inventor: Stephen A. Canary
  • Patent number: 6391141
    Abstract: A process for adhering a layer of organic paint to the surface of a glass sheet, and the products produced thereby. The process comprises applying a layer of a water-based silicate paint to the surface of the glass sheet, heating to cure the paint, forming the glass sheet into a shape, sensitizing the water based paint with a layer of silane material, applying a layer of organic paint over the layer of sensitized water-based silicate paint, and curing the organic paint to provide organic paint adhered to the glass surface.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: May 21, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventor: Premakaran Tucker Boaz
  • Patent number: 6387205
    Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 14, 2002
    Assignee: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, William Thomas Fotorny, Robert Maynard Japp, Kostantinos Papathomas, Mark David Poliks
  • Patent number: 6375777
    Abstract: Process for the production of a thermosetting laminate made of a number of continuous paper webs impregnated with a thermosetting resin. The dry webs are fed continuously between an upper and a lower press belt (101 and 102 respectively) of a continuous double belt press (100). The continuous paper webs are divided into at least two groups (10) each consisting of at least two sheets of which at least one is impregnated with a thermosetting resin. One or more separation sheets (1) are placed between the groups (10) of paper webs.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: April 23, 2002
    Assignee: Perstorp AB
    Inventors: Hans Sjölin, Håkan Larsson
  • Patent number: 6358351
    Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Hiroyuki Handa
  • Patent number: 6355131
    Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: March 12, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Hiroyuki Handa
  • Patent number: 6348121
    Abstract: Disclosed is a polyol/polyisocyanate adhesive system having an isocyanate component and a catalyzed component which form a heat-cured composition when admixed and heated above a threshold temperature. The catalyzed component has a hydroxyl-functional component catalyzed with a catalyst combination of a heat-activatable amine or amine-like catalyst which is activated at temperatures above the threshold temperature, and an activatable complexed metal catalyst comprising the reaction product of tin or bismuth catalysts, or a mixture thereof, and a molar excess of a mercapto compound complexing agent. The catalyst combination is effective to maintain the processibility of the system at ambient temperatures while promoting the rapid cure of the system when heated above the threshold temperature.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: February 19, 2002
    Assignee: Ashland Chemical
    Inventors: Thomas E. Schoener, Jeffrey B. Housenick
  • Patent number: 6338767
    Abstract: A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: January 15, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Kouichi Hirano
  • Patent number: 6325884
    Abstract: A laminated panel having an abrasion resistant surface is provided. The laminated panel includes a web being impregnated with a thermo-set resin, a bottom coat and an abrasion resistant top coat; a substrate; and thermo-fusing a bottom sheet to a second surface of the substrate opposite the first surface. The web is thermo-fused to one surface of the substrate, and the bottom sheet is simultaneously thermo-fused to the opposite surface of the substrate. A process for making an abrasion resistant laminated panel is also provided. The process includes the steps of partially impregnating a paper sheet or web with a thermosetting resin, drying it, coating the top side of the partially impregnated paper sheet or web with an abrasion resistant coat, simultaneously coating the bottom side of the paper sheet or web with a thermosetting resin composition, thermo-fusing the coated paper sheet or web to a first surface of a substrate and a bottom sheet to produce the laminated panel.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: December 4, 2001
    Assignee: Panolam Industries
    Inventor: Fouad Torkum Karam
  • Patent number: 6322658
    Abstract: A method for making a unitary composite headliner adapted to be installed in a motor vehicle includes providing an inner layer and two reinforcing layers, each of which comprises polymeric material, the inner layer being configured to absorb sound and vibrations, and the reinforcing layers being configured to provide sufficient flexibility to the headliner to facilitate installation in the vehicle, while also providing sufficient rigidity to the headliner to enable the headliner to be self-supporting once installed in the vehicle; differentially heating the layers such that each reinforcing layer is heated to a respective predetermined reinforcing layer temperature, and the inner layer is heated to a predetermined inner layer temperature less than either respective reinforcing layer temperature; inserting the layers into a mold such that the inner layer is disposed between the reinforcing layers; and compressing the layers together to bond the layers and form the headliner.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: November 27, 2001
    Assignee: Lear Corporation
    Inventors: George B. Byma, John J. Gabrysiak
  • Patent number: 6309502
    Abstract: To produce a conductive epoxy resin composition with improvement in the characteristics of rapid-curability, heat resistance and moisture resistance, adhesion reliability, storage properties and low-temperature curability that can be used effectively for production of conductive adhesive films. The conductive epoxy resin composition comprises an alicyclic epoxy resin, optional diols, a styrenic thermoplastic elastomer with an epoxy group in the molecule, an ultraviolet activated cationic polymerization catalyst, an optional tackifier having an aromatic ring in the molecule, and conductive particles.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: October 30, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Yuji Hiroshige, Koji Ito
  • Patent number: 6301773
    Abstract: A method for manufacturing a motor core having a plurality of metallic plate-like laminations includes the steps of a) juxtaposing the laminations in a stacked relation, b) placing the laminations over an alignment post of an alignment fixture, c) flowing at least one bead of hardenable adhesive material along the outer peripheral surface of the laminations where the adhesive material, when cured, fixes the laminations in a predetermined non-moving orientation, d) removing the laminations from the alignment fixture; and e) applying windings to the laminated stack.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: October 16, 2001
    Assignee: General Electric Company
    Inventor: Dilip V. Chemburkar
  • Patent number: 6261395
    Abstract: A method of manufacturing a stiffened composite structure comprising the steps of: forming the structure around a mandrel tool; using digital camera data to record the positions of desired pad locations on the structure; bonding pads to the structure at the desired locations; curing the pads and structure; forming stiffeners from composite materials including forming a plurality of tabs at points on the stiffener corresponding to the pads on the structure; using a laser theodolite connected to receive the stored information of the pad locations relative to a datum point on the stiffener to locate the stiffener tabs accurately on the pads; and bonding the stiffeners to the structure via the tabs and pads. Preferably, the location tabs and pads are machined off the final stiffened structure after autoclaving.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: July 17, 2001
    Assignee: BAE Systems plc
    Inventor: Roger P Duffy
  • Publication number: 20010004919
    Abstract: The present invention relates to a ball, in particular a football. The ball according to the invention has, in its outer skin (11), a syntactic material (50) which consists of a matrix material (52) into which essentially dimensionally stable, elastic blow-moulded parts (54) are mixed. Furthermore, a new method of producing a ball with a verre églomisé print is also claimed.
    Type: Application
    Filed: February 1, 2001
    Publication date: June 28, 2001
    Inventor: Otto Dobrounig
  • Patent number: 6245180
    Abstract: Methods for forming a lined brake shoe having a curved brake lining attached to a table of the lined brake shoe. The curved brake lining is manufactured by molding a flat sheet of brake lining material in a partially polymerized state. This flat sheet is allowed to cool prior to be positioned within a press having warmed dies. The warm dies of the press form the curved brake lining while holding the curved brake lining in its desired shape. The warm dies restart the polymerization process. When further polymerization has been completed the curved lining is removed from the press. One embodiment places the table of the lined brake shoe in the press. Then, by adding a bonding material, the completed lined brake shoe can be manufactured while the polymerization process continues in the press.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: June 12, 2001
    Assignee: Midwest Brake Bond Company
    Inventor: Keith F. Barnhardt
  • Patent number: 6242513
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: June 5, 2001
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6210510
    Abstract: The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between a transducer on one side of the substrate and a chemical bath on the other. The polymer seals the surface of the substrate from the chemical bath and may have a low adhesion to the substrate. A thin film of the polymer is brought under a tensile stress to provide intimate physical contact with most of the area of the convex surface. In one embodiment, the tensile stress is achieved by providing polymer as a liquid on the convex surface and then cooling to take advantage of differential thermal contraction between the polymer and the substrate to achieve the tensile stress in the polymer.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: April 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Frederick William Kern, Jr., Donald Joseph Martin
  • Patent number: 6206997
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: March 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6200407
    Abstract: A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.
    Type: Grant
    Filed: June 18, 1997
    Date of Patent: March 13, 2001
    Assignee: Rockwell Technologies, LLC
    Inventors: Christopher J. Wieloch, Thomas E. Babinski, John C. Mather
  • Patent number: 6194081
    Abstract: A method of preparing a beta titanium-composite laminate comprising providing a first layer of beta titanium alloy having a yield strength to modulus of elasticity ratio and adhering a first layer of composite having a strength to modulus of elasticity ratio to the layer of beta titanium alloy, thereby forming a beta titanium-composite laminate, where the yield strength to modulus of elasticity ratio of the first layer of beta titanium alloy matches the strength to modulus of elasticity ratio of the first layer of composite such that the first layer of beta titanium alloy will reach its stress limit and the first layer of composite will reach its stress limits at about the same total strain.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: February 27, 2001
    Assignee: Ticomp. Inc.
    Inventor: William R. Kingston
  • Patent number: 6174578
    Abstract: An adhesive tape is disclosed that is useful in the manufacture of ceramic articles, and particularly ceramic electronic components such as capacitors. The tape can be used to adhere a green ceramic article to a rigid surface for handling during the manufacturing operation. The adhesive can be deactivated after the green ceramic article has been laminated and diced to release the laminated and diced ceramic articles. The adhesive tape comprises a substrate; a light-reflective metallic layer on the substrate; a first adhesive layer of a heat stable adhesive composition on one surface of the substrate, and a second adhesive layer on the opposite surface of the substrate. The second adhesive layer comprises a heat stable, radiation curable adhesive composition which loses its adhesive characteristics upon exposure to radiation.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: January 16, 2001
    Assignee: Rexam Industries Corp.
    Inventor: Leonard E. Holley