Abstract: A high-temperature bonding composition comprising a silicon base polymer as a thermosetting binder is provided. The silicon base polymer is obtained from dehydrolytic condensation of a condensate precursor comprising a silane compound having at least one pair of silicon atoms tied by a crosslink composed of an aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group, and having at least three hydroxyl and/or hydrolyzable groups. Those silicon atoms having a direct bond to the crosslink composed of the aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group are present in a proportion of at least 90 mol % relative to all silicon atoms in the polymer.

Abstract: An article comprising an adhesive having an acid number of less than about 5 is provided. The adhesive is selected from the group consisting of polyurea, polyamide, polyurethane, polyester, addition cure silicone and combinations thereof. The adhesive is in contact with a corrosion sensitive layer selected from the group of metal and metal alloys. When the article is conditioned for about 21 days at about 60° C and 90% relative humidity, the corrosion sensitive layer exhibits a change from its initial electrical resistance value of 20% or less.

Abstract: A fastening element for the fixed attachment of an object to a surface. The element comprises a base body which is capable of accommodating an element for holding the object and can be attached to the surface with the aid of a moisture-curable bonding and fixing agent. The base body is capable of acting at least in part as a water reservoir and/or of accommodating a water reservoir therein such that the agent can receive moisture for curing from the water reservoir. An installation system comprising the fastening element and a moisture-curable agent and a method of curing the agent are also disclosed. This Abstract is not intended to define the invention disclosed in the specification, nor intended to limit the scope of the invention in any way.

Abstract: Prepare a laminated assembly by providing an insulating member comprising a polymeric foam having opposing surfaces and a structural member by positioning the structural member so as to extend over at least one of the opposing surfaces of the insulating member and providing a moisture-curable hot-melt polyurethane or silicone adhesive having an open time and an application temperature range and disposing the adhesive between the insulating and structural members at a coating weight of 16 grams per square meter or less and three grams per square meter or more while at an application temperature and then pressing the structural and insulating members together during the open time of the adhesive.

Abstract: A two-part moisture-curing composition having as a first part water and an hydroxy-terminated diorganosiloxane; and a second part which includes a reactive silicone, at least one end-capping silane which includes one or more enoxy groups, at least one end-capping catalyst and at least one moisture cure catalyst. Enhanced and controlled cure speed is obtained by these compositions.

Abstract: The disclosure is directed to a framed device. The framed device includes a substrate, a frame, and a seal. The substrate has a first length, a first width, and a peripheral edge. The frame has a second length, a second width, and a groove that runs along the second length and the second width of the frame. The groove is substantially engaged with the peripheral edge of the substrate. The seal is disposed within the groove of the frame, wherein the seal runs contiguously from the substrate to the frame and the seal includes a foamed polymer.

Abstract: When an air bag is prepared by laying a pair of silicone rubber-impregnated and/or coated base fabric pieces one on the other, with the coated surfaces of the pieces inside, and joining peripheral portions of the pieces together to form a bag, an addition reaction curing type silicone rubber composition which cures into a silicone rubber having an elongation at break of at least 1000% is used as a sealer and applied to the peripheral portions of the base fabric pieces, thereby achieving improved adhesion therebetween.

Abstract: A laminate includes a backing material coated with an adhesive composition. The adhesive composition includes a silylated polyurethane obtained from the silylation of a polyurethane prepolymer derived from the reaction of polybutadiene polyol and polyisocyanate; and an additional adhesive component.

Abstract: A membrane-electrode assembly for a fuel cell including a first substrate and a second substrate and a catalyst layer between the first substrate and the second substrate is provided, where the first substrate is a polymer electrolyte membrane and the second substrate is a electrode substrate, or the first substrate is the electrode substrate and the second substrate is the polymer electrolyte membrane. The catalyst layer has a h1/t1 ratio of about 0.5 or more, where s1 represents a point on the first substrate at one end of the catalyst layer, h1 represents a distance between the first substrate and the second substrate, s2 represents a point on the first substrate closest to s1 at which a height (h) of the catalyst layer becomes h1, and t1 represents the distance between the s1 and the s2. The membrane-electrode assembly can include a greater amount of catalyst by decreasing a shadow effect, and thereby increasing its energy density.

Abstract: A base material for adhesion to be adhered to a solid body comprising; a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.

Abstract: This document provides components comprising a predetermined sealing surface and a curable composition thereon. The cured reaction product of the curable composition forms a seal having improved resistance to vapor permeation when exposed to hydrocarbon fluids and especially to hydrocarbon fluids comprising low molecular weight components, oxygenated compounds, polar compounds or blends containing polar and non-polar compounds such as alcohol and alcohol containing fuels.

Abstract: Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.

Abstract: A laminate includes a backing material coated with an adhesive composition. The adhesive composition includes a cured silylated polyurethane composition derived from polyester based polyurethane prepolymer. The silylated polyurethane composition when partially silylated is especially useful for pressure sensitive adhesives where it imparts superior adhesive and cohesive performance thereto.

Abstract: A sputtering target assembly and method for bonding a sputtering target to a backing plate is disclosed. When insulatively bonding a sputtering target to a backing plate, it is necessary to ensure that the bonding material has good thermal conductivity so that the temperature of the target can be effectively controlled. It is also important to not have electrical conductivity through the bonding materials. In order to achieve both goals, it is beneficial to utilize an elastomer with diamond powder filler. Diamond power has very good thermal conductivity, and it also has very good dielectric strength. Diamond is a thermally effective and cost effective substitute for silver in insulative bonding.

Abstract: The invention relates to an abradable material composition comprising a resin-based matrix, in particular a silicone matrix together with filler comprising hollow beads. In characteristic manner, the hollow beads withstand high temperatures and are made of refractory material. The hollow beads are preferably made of an alumino-silicate material. The composition is applicable to making abradable coverings for compressor casings, in particular casings for compressors of the low pressure type or of the booster type, or for a fan, the covering being in register with moving blades.

Abstract: A primer composition for silicone rubbers, in particular for addition-crosslinking silicone rubbers, comprises a tetraalkoxysilane and/or partial hydrolysate thereof, a metal salt, alkoxide, or chelate and/or partial hydrolysate thereof, a silicone resin, and from 50-95% by weight of solvent. The primer provides excellent adhesion between silicone rubber and numerous substrates.

Abstract: A photovoltaic assembly including first and second substrates joined together and spaced apart, on either side of an airspace, by a seal system formed of a first seal and a second seal, the second seal comprising one or more silyl terminated polyacrylate polymers. A photovoltaic functional coating is disposed over a second major surface of one of the substrates, which faces the second major surface of the other substrate. Lead wires are coupled to bus bars and/or electrical contacts affixed to the functional coating and routed out from the airspace. Affixing the seal system to the first and second substrates, in order to join the substrates together, may be accomplished by applying pressure to the substrates.

Abstract: Aqueous adhesive comprising a polyurethane and a silane of the formula where R1 to R4 each independently are an organic radical, with the proviso that at least two of the groups R1 to R4 are a hydroxyl or alkoxy group.

Abstract: The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable.

Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.

Abstract: Provided is a room temperature curable organopolysiloxane composition, including (A) 100 parts by mass of a diorganopolysiloxane with both terminals blocked with silanol groups, or a diorganopolysiloxane with each terminal blocked, independently, with a trialkoxysilyl group or a dialkoxyorganosilyl group, or a mixture thereof, (B) 0.1 to 30 parts by mass of a silane compound and/or a partial hydrolysis-condensation product thereof containing an average of at least two hydrolysable groups bonded to silicon atoms within each molecule, and in which the remaining groups bonded to silicon atoms are methyl groups, ethyl groups, propyl groups, vinyl groups, or phenyl groups, and (C) 0.1 to 10 parts by mass of either one, or two or more organosilicon compounds containing amino groups, and also containing four or more hydrolysable groups. Also provided are a sealing material and an adhesive including the above composition.

Abstract: Polydiorganosiloxane polyoxamide, linear, block copolymers and methods of making the copolymers are provided. The method of making the copolymers involves reacting a diamine with a precursor having at least one polydiorganosiloxane segment and at least two oxalyamino groups. The polydiorganosiloxane polyoxamide block copolymers are of the (AB)n type.

Abstract: In accordance with the disclosure, a fusing member is provided comprising, in order, a base member, a cured liquid silicone rubber substrate layer, an amino silane, and an anhydrous solvent containing adhesive layer. The fusing member further comprises a fluoroelastomer fusing surface topcoat layer including poly (vinylidene fluoride-tetrafluoroethylene-hexafluoropropylene).

Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20.

Abstract: A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Abstract: A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Abstract: A moisture curable acrylic formulation is provided inclusive of a majority by weight polyacrylic prepolymer. The prepolymer has an average molecular weight of between 3,000 and 6,000 grams per mole and between 2 and 4 moisture curable functional moieties of isocyanate or silane per prepolymer. A thermoplastic adhesive resin is also included within the formulation. When the prepolymer functional moieties are all silane, the thermoplastic adhesive resin is ethylene vinyl acetate resin. A silane molecule is provided within the formulation as an adhesion promoter and also affords a degree of storage stability through sacrificial reaction with water during storage. The resultant formulation achieves a shear strength of at least 10 pounds per square inch when applied to a thickness of 0.75 millimeters between a glass substrate and a vinyl article 15 minutes after application at 120° Celsius in ambient atmospheric air.

Abstract: Moisture-curing compositions include at least one silane-functional polymer P with at least two terminal groups of formula (I) and at least one reaction product R which is produced from at least one aminosilane AS with at least one primary amino group and at least one silane group-free alkene M which is capable of entering in 1,4 addition reactions with primary amino groups. The compositions have improved adhesive properties and are especially suitable for use as adhesives, sealing materials or coatings, especially as elastic adhesive or sealing materials.

Abstract: The present invention relates to adhesion-promoting compositions comprising a latent acid in a non-aqueous composition, the latent acid by contact with water being convertible into an acid having a pKa of less than 2. These compositions have the effect more particularly of promoting the adhesion of adhesives and sealants to paints.

Abstract: An adhesive comprising a polyurethane and 0.0001 to 0.1 mol of carbodiimide groups per 100 g of polyurethane, wherein the polyurethane contains 0.0001 to 0.1 mol of hydroxysilane or alkoxysilane groups (silane groups for short) per 100 g of polyurethane.

Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.

Abstract: Adhesive tape having a carrier and a layer of adhesive applied on at least one side to the carrier, the carrier having at least one foam layer composed at least in part of a polyolefin-based polymer, wherein the polyolefin-based polymer contains an ethylene multi-block copolymer in a fraction of at least 40% (w/w), the ethylene multi-block copolymer being composed of hard segment blocks, containing at least 95% (w/w) of ethylene and a comonomer, and of soft segment blocks, containing ethylene and a comonomer, the fraction of comonomer in the soft segment blocks being between 10 and 20 mol %.

Abstract: A hot melt sealant/adhesive composition is provided which comprises the following components—Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c); and either or both of components B. and C. wherein:—B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200° C.; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from O° C. and 15O° C.; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition.

Abstract: A fuel cell, having improved sealing against leakage, includes a sealant disposed over the peripheral portions a membrane electrode assembly such that the cured sealant penetrates a gas diffusion layer of the membrane electrode assembly. The sealant is applied through liquid injection molding techniques to form cured sealant composition at the peripheral portions of the membrane electrode assembly. The sealant may be thermally cured at low temperatures, for example 130° C. or less, or may be cured at room temperature through the application of actinic radiation. The sealant may be a one-part or a two-part sealant. The sealant includes a polymerizable material, such as a polymerizable monomer, oligomer, telechelic polymer, functional polymer and combinations thereof functionalized with a group selected from epoxy, allyl, vinyl, (meth)acrylate, imide, amide, urethane and combinations thereof.

Abstract: An organopolysiloxane composition comprising an organopolysiloxane, an organosilicon compound having at least three hydrolyzable radicals in the molecule, an acid anhydride and optionally a filler cures at room temperature and exhibits excellent adherence to magnesium alloys.

Abstract: A moisture-curable, graft-modified resin composition includes at least one thermoplastic polymer (i) and at least one silyl group containing polymer (ii) possessing at least one hydrolyzable silyl group that is bonded to the polymer through a linking group containing at least one heteroatom selected from the group consisting of oxygen and nitrogen, each of polymers (i) and (ii) having grafted thereto at least one same or different silane (iii) which, prior to being grafted, possesses at least one reactive carbon-carbon unsaturated bond.

Abstract: A method for the adhesion of a layer of fluorosilicone rubber which is curable using a non-hydrosilylation curing process to a layer of silicone rubber which contains substantially no perfluoroalkyl groups and which is curable using a non-hydrosilylation curing processes described. The comprises the steps incorporating either a hydrosilylation catalyst or a siloxane containing at least two silicon bonded hydrogen groups into the fluorosilicone rubber composition prior to curing and incorporating the other of the hydrosilylation catalyst or the siloxane containing at least two silicon bonded hydrogen groups into the alternative silicone rubber composition prior to curing; forming the products of step (i) and step (ii) into required shapes; bringing the shaped products of step (iii) into contact with each other; and adhering the shaped products in contact with each other together by effecting a hydrosilylation reaction therebetween.

Abstract: A curable, alkoxysilane-functional polyether urethane composition formed by combining a) a first silane terminated polyurethane prepared by reacting i) a mono-functional compounds with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one or more reactive silane groups to form a moisture-curable, alkoxysilane-functional polyether urethane; and b) a second silane terminated polyurethane prepared by reacting i) an alkyl monofunctional alcohol, amine, and/or thiol, with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one more reactive silane groups. The urethane composition can be used in coating, sealant and/or adhesive compositions. The coating compositions are used to form a coated substrate.

Abstract: A silicone adhesive composition used for adhering a device or a substance to a wet surface contains (i) a silicone resin that is cohydrolysis product of a trialkyl hydrolyzable silane and an alkyl silicate in which the cohydrolysis product contains a plurality of silicon-bonded hydroxy groups; (ii) a linear organopolysiloxane fluid containing terminal silicon-bonded hydroxy groups having a viscosity above 200,000 mm2/s at 25° C.; (iii) a trialkylsiloxy terminated polyorganosiloxane fluid having a viscosity of 100,000-600,000 mm2/s at 25° C.

Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.

Abstract: A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components.

Abstract: A room temperature fast-curing organopolysiloxane composition which has excellent fast curability as well as deep curability is provided without using an organic compound having C?O group and the organic compound having NH2 group which are the volatile components. A method for curing such composition is also provided. The room temperature fast-curing organopolysiloxane composition comprises: (A) 100 parts by weight of a diorganopolysiloxane having both ends terminated with hydroxy group and/or a hydrolyzable group; (B) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 alkenoxysilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; (C) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 aminosilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; and (D) 0.01 to 10 parts by weight of a curing catalyst.

Abstract: The present disclosure provides a silane crosslinking adhesive, sealant or coating containing a polymer, consisting of an organic framework that supports at least two alkoxy or acyloxysilyl groups and at least one filler. The filler consists at least partially of a highly disperse silicic acid with a BET surface area of 35 to 65 m2/g and is present in the adhesive, sealant or coating in a quantity of 1 to 60% by weight, in relation to the total weight of said adhesive, sealant or coating. The disclosure also provides the use of the adhesive, sealant or coating for bonding plastics, metal, glass, ceramics, wood or wood-based material, paper, paper-based material, rubber and textiles.

Abstract: Embodiments of methods and systems to generate an enhanced layered display system are described herein. In one embodiment, a method of generating an enhanced layered display system is provided including dispensing an optical bonding liquid onto a first substrate; forming an adhesive preform unit by curing the optical bonding liquid on the first substrate; and laminating the adhesive preform unit to a second substrate to form the enhanced layered display system, where one of the first substrate and the second substrate is a display.

Abstract: A surface-modified member including a metal base, a surface modification layer formed on at least a part of a surface of the metal base, the surface modification layer containing a metal hydroxide, and at least one of a curable resin layer, an ink layer and a coating material layer which is provided on at least a portion of the surface modification layer. A method of modifying a surface of a metal member, including applying an energy to at least a part of the surface of the metal member to produce a metal hydroxide on the surface of the metal member.

Abstract: The invention is an adhesive composition comprising a) one or more silane functional prepolymers comprising a polyether or a polyolefin backbone and silane moieties capable of silanol condensation; b) one or more isocyanate functional prepolymers comprising a polyether backbone and isocyanate moieties; c) one or more organotin compounds or titanate or zirconate compounds having one or more ligands comprising a hydrocarbyl phosphate ester or a hydrocarbyl sulfonate ester, or a mixture thereof; d) a tertiary amine or an anhydrous strong organic acid which is miscible with the polymer and enhances the bonding of the adhesive to a coated unprimed substrate. In one embodiment, the invention is a method of bonding two or more substrates together using the adhesive compositions of this invention. The process comprises applying an adhesive as described herein to one or more of the substrates; contacting the one or more substrates with the adhesive disposed between the substrates; and allowing the adhesive to cure.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A?) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or more hydrocarbyl groups; one or more catalysts for the reaction of silane moieties with active hydrogen containing compounds. Preferably, the adhesive composition further comprises one or more heat stabilizers and/or light stabilizers. In another embodiment, the invention is a method of bonding a window to a coated substrate, such as a window in a vehicle, which comprises applying to the window or the coated substrate an adhesive as described; contacting the window with the coated substrate wherein the adhesive is located between the window and the substrate; and allowing the adhesive to cure.

Abstract: Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line. The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.

Abstract: A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, the shell being of a soft polymeric material providing a mounting member; mounting electronic hearing aid components to the mounting member; joining the mounting member to the hollow shell to define a mold cavity; and filling the shell with a soft polymeric material that substantially encapsulates at least one of the electronic components and bonds to the mounting member, wherein the combination of shell, electronic components and soft polymeric material define a soft structure that is compliant to ear canal movement during use.