Abstract: The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance.

Abstract: A light system of a vehicle comprising: a housing comprising: a glue bucket; a glue leg located partially or entirely within the glue bucket; and a light guide located between the glue bucket and the glue leg; wherein the light system is located proximate to a gap in the vehicle and the light guide guides light from the light guide into the glue leg and from the glue leg across the gap so that the light extends across the gap to illuminate the gap.

Abstract: An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO2 (unit Q?) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO2 (unit Q?) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.

Abstract: A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the semiconductor device. A reflow wall is on a portion of the lead frame and is in contact with the solder joint. A molding compound covers portions of the semiconductor device, the lead frame, the solder joint, and the reflow wall.

Abstract: Disclosed are laminates comprising a carbon fiber reinforced polymer sheet and a layer of polysilazane and methods for producing such laminates.

Abstract: The present invention relates to a composition comprising a first component containing at least one polyol, and a second component containing at least one polyisocyanate, the composition further comprising at least one aldimine of formula (I). The composition exhibits a long open time and fast curing without odor immissions, wherein a bubble-free, elastic material having a non-tacky surface and good strength, extensibility, elasticity and resistance is produced, which does not tend to problems arising with plasticizer migration.

Abstract: A system and method for aligning a screen protector to a cell phone comprises a screen protector with an alignment liner disposed over the screen protector; alignment indicia disposed on the alignment liner; and a display source configured to enable display of alignment indicia on the display screen of the cell phone. The alignment indicia of the display screen correspond to the alignment indicia of the alignment liner so that the alignment indicia of the alignment liner is capable of being aligned over the alignment indicia on the display screen to properly align the screen protector with the display screen when the screen protector is positioned above the display screen.

Abstract: The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.

Abstract: A method of manufacturing a semiconductor device of the present disclosure includes the steps of sequentially forming an adhesion-improving film, a Pt film, a Sn film, and an Au film on a semiconductor wafer through vapor deposition; dicing the semiconductor wafer to obtain a semiconductor element; sequentially forming a Ni film and an Au film on a substrate through vapor deposition; and laminating the semiconductor element and the substrate so that the Au film formed on the semiconductor element and the Au film formed on the substrate face each other, followed by joining the semiconductor element and the substrate through heating.

Abstract: 1) Polyurethane composition comprising: a) at least 98% by weight of at least one non-hot-melt polyurethane bearing NCO end groups based on 2,4-toluene diisocyanate, b) a TDI monomer content of less than 0.1% by weight, c) at least one particular isocyanate compound with a molar volume of less than or equal to 300 milliliters per mole. 2) Process for preparing a polyurethane composition as defined previously, and an adhesive composition formulated from such a polyurethane composition.

Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles having a volume-average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.

Abstract: A starch-based adhesive composition, having a tan ? at 10 Hz and 20° C. of at least 1.40 is provided. The adhesive composition is in particular useful as labelling adhesive. Also provided is a bottle that has a label whereby the label is attached to the bottle by the aforesaid adhesive composition.

Abstract: The present specification relates to a (meth)acrylate compound, and a copolymer and a homopolymer including a repeating unit derived therefrom.

Abstract: A composite curb for a shower base, and a self-sealing anchoring cap for a shower curb. The composite curb includes a lower-density base portion formed of closed cell foam, and a higher-density anchoring cap portion attached to the base. The self-sealing anchoring cap comprises a resilient or self-healing material or a self-sealing layer, and is configured to retain a fastener therein and form a water-resistant seal between the fastener and the anchoring cap portion.

Abstract: A method for closing a wound in tissue is provided which includes providing a surgical fastener having a plurality of reactive members of a specific binding pair attached on a surface of the surgical fastener, and providing tissue with a plurality of complementary reactive members of the specific binding pair, wherein upon contact of the reactive members on the surface of the surgical fastener with the complimentary reactive members on the tissue, covalent bonds are formed between the reactive members and the complementary reactive members, thus adhering the device to the tissue.

Abstract: The invention concerns a heat-sealable biodegradable packaging material, which comprises a fibrous substrate (1) and one or more polymer coating layers (2) extruded onto said substrate. According to the invention the packaging material includes at least one polymer coating layer (2) containing at least 70 weight-% of polylactide (PLA) and at least 5 weight-% of polybutylene succinate (PBS) or its derivate blended therewith. Optionally an acryl copolymer such as ethylene butyl acrylate glycidyl methacrylate terpolymer (EBAGMA) may be included in the polymer blend. The invention further concerns a heat-sealed container, such as a disposable drinking cup, and a heat-sealed product package made from the packaging material, as well as uses of PBS or its derivates as blends with PLA in extrusion coating, for improving adhesivity of the coating to the fibrous substrate and reduced raw edge penetration to the packaging material, especially penetration of hot coffee held in the drinking cup.

Abstract: The invention relates to a resin having a plurality of cyclic carbonate groups comprising the reaction product of: a) an epoxidized sucrose fatty acid ester resin, and b) carbon dioxide where a) and b) are reacted under conditions sufficient to carbonylate a plurality of the oxirane groups of the epoxidized sucrose fatty acid ester resin, and optionally in the presence of a catalyst or of a solvent. In one embodiment the epoxidized sucrose fatty acid ester resin is epoxidized sucrose soyate. The invention also relates to methods for producing a resin having a plurality of cyclic carbonate groups. In a method of the invention, an epoxidized sucrose fatty acid ester resin is contacted with carbon dioxide under conditions sufficient to carbonylate a plurality of the oxirane groups of the epoxidized sucrose fatty acid ester resin, and optionally in the presence of a catalyst or of a solvent.

Abstract: The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerization accelerator.

Abstract: The disclosure is directed to an adhesive material which can be applied underwater comprising hydrophilic adhesive molecules. In other embodiments, the adhesive material may also include hydrophilic polymers and/or an oxidizing agent.

Abstract: One aspect of the present disclosure provides a semiconductor device. In some embodiments, the semiconductor device includes an integrated circuit die, at least one conductive terminal disposed on the integrated circuit die, a frame positioned on the integrated circuit die, wherein the frame substantially exposes the at least one conductive terminal, and at least one conductive bump positioned in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal.

Abstract: A method for attaching a semiconductor die to a substrate includes providing a substrate that includes an attachment layer at a surface of the substrate. The attachment layer is covered by a protective flash plating layer. The protective flash plating layer has a reflow temperature less than or equal to a reflow temperature of the attachment layer. The method further includes preheating the substrate to a temperature greater than or equal to a reflow temperature of the attachment layer, attaching a semiconductor die to the attachment layer, and cooling the substrate and semiconductor die.

Abstract: The present invention provides a hot melt adhesive suitable for use in disposable products, which can be applied at a high speed and provides excellent in adhesion in a wet state and low-temperature coating, with little odor. The hot melt adhesive for disposable products comprises: (A) a propylene homopolymer having a melting point of 100° C. or lower obtained by polymerizing propylene using a metallocene catalyst; and (B) a wax modified with carboxylic acid and/or carboxylic acid anhydride. The wet adhesion of the hot melt adhesive is improved when the wax is modified with maleic acid and/or maleic anhydride.

Abstract: A vertical LED with current blocking structure and its associated fabrication method involve an anisotropic conductive material and a conductive substrate with concave-convex structure. The anisotropic conductive material forms a bonding layer with vertical conduction and horizontal insulation between the concave-convex substrate and the light-emitting epitaxial layer, thereby forming a vertical LED with current blocking function.

Abstract: Low emissivity coated panels can be fabricated using a base layer having a low refractive index layer on a high refractive index layer. The low refractive index layer can have refractive index less than 1.5, and can include MgF2, CaF2, SiO2, or BO. The high refractive index layer can have refractive index greater than 2.3, and can include TiOx, NbOx, or BiOx. The multilayer base structure can allow color tuning with enhanced transmission, for example, as compared to similar structures having single layer base layer.

Abstract: A semiconductor device and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a chip substrate, a mold, and a buffer layer. The mold is disposed over the chip substrate. The buffer layer is externally embedded between the chip substrate and the mold. The buffer layer has an elastic modulus or a coefficient of thermal expansion less than that of the mold. The method includes disposing a buffer layer at least covering scribe lines of a substrate, forming a mold over the substrate and covering the buffer layer, and cutting along the scribe lines and through the mold, the buffer layer and the substrate.

Abstract: A method of forming a bonded part with a press-fit, vulcanized rubber member residing in compression between two rigid members and bonded thereto. The rubber member is a laminate with a core layer between two self-bonding rubber layers. The bonded part may be, for example, a vibration damper, isolator or absorber. The core layer and the self-bonding layers may have the same primary elastomer and cure system type, and the self-bonding layers have an adhesion promoter not present in the core layer. The adhesive layers may be from 0.05 to 1 mm thick or from 5% to 10% of the laminate thickness. The method includes forming a rubber core layer, curing it, applying a rubber adhesive layer on each side to form a laminate, inserting the laminate between two rigid members under compression, and post-curing to form a bonded part. The adhesive layers may be partially cured before inserting.

Abstract: A method for adhering a medical device to biological tissue includes adhering an adhesive composition having a plurality of reactive members of a specific binding pair to tissue which has a plurality of complementary reactive members of the specific binding pair via click chemistry.

Abstract: The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.

Abstract: A method for fixing a bearing ring on or in a component includes applying an adhesive to a surface of the bearing ring having a least one annular groove-shaped receiving space defined therein such that the adhesive at least partially fills the at least one annular groove-shaped receiving space. The adhesive is allowed to pre-cure on the surface until the adhesive is no longer sticky and then the bearing ring and the component are joined in a desired relative position, such a radial distance between a base of the at least one annular groove-shaped receiving space and the component is larger than a radial distance between the surface and the component. The adhesive is then activated so that the adhesive increases in volume and produces an adhesive bond between the bearing ring and the component.

Abstract: A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm3, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.

Abstract: The present invention provides a method of manufacturing a shoe using a multifunctional primer, comprising the steps of coating a rubber outsole made of unvulcanized rubber with a liquid multifunctional primer comprising a polyurethane dispersion, a butadiene rubber solution, and a natural rubber solution; vulcanizing the unvulcanized rubber outsole coated with the multifunctional primer, thermally activating the coated vulcanized rubber outsole; coating the thermally-activated rubber outsole with an adhesive; and attaching the rubber outsole to a variety of other parts.

Abstract: Laminated glass is produced by laminating at least one film A, having a glass transition temperature TA and containing a polyvinyl acetal PA and optionally at least one plasticizer WA, and at least one film B, having a glass transition temperature TB and containing a polyvinyl acetal PB and at least one plasticizer WB, between two glass sheets, wherein, before the lamination process, film A has a proportion of plasticizer WA of less than 24% by weight, film B has a proportion of plasticizer WB of at least 24% by weight, and film A has a thickness of no more than 30% of the thickness of film B.

Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ?800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

Abstract: A method for improving the optical clarity of a coated adhesive layer is described that comprises applying a curable composition onto the substrate surface, the curable composition comprising (a) a curable organopolysiloxane; and (b) a plurality of silica particles having an average particle size within the range of about 1 to about 7 micrometers.

Abstract: Described is the use of synthetic adhesives in the manufacture of corrugated fiberboard at relatively low temperatures and high lineal speeds. The corrugated fiberboard includes a corrugated sheet of paper and a flat linerboard and the corrugation of the corrugated sheet of paper is produced at paper temperatures below 95° C. and at a lineal speed above 150 m/min. The production of the corrugation of a corrugated sheet of paper is immediately followed by a continuous operation in which a preferably unheated corrugated board adhesive is applied and the corrugated sheet of paper is adhered to at least one first linerboard. The corrugated board adhesive used is an aqueous adhesive dispersion based on at least one synthetic, dispersed polymer having preferably more than 40% by weight solids content, selected from acrylate copolymers, copolymers of vinylaromatics and conjugated aliphatic dienes and vinyl acetate-alkylene copolymers, wherein the glass transition temperatures of the polymers are above 20° C.

Abstract: Disclosed is a die for forming a honeycomb structure, including: a second plate-shaped portion that is formed of iron and the like and has back holes; and a first plate-shaped portion that is formed of tungsten carbide based cemented carbide and has cavities communicating with the back holes and slits communicating with the cavities, wherein the first plate-shaped portion has a first layer arranged in the second plate-shaped portion side and a second layer arranged on the first layer, the cavities 11 are opened on both sides of the first layer, and the slits are opened on both sides of the second layer.

Abstract: Apparatus and methods are disclosed for a safety door of an oven having glass therein with a plastic laminate. The safety door retains glass within the door in order to prevent glass from falling or being forced outside of the oven, which may cause injury.

Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.

Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.

Abstract: The invention relates to a sealing liquid for sealing mailpieces containing water and a penetration agent, to the uses thereof and to letter-closing devices and franking machines containing such a sealing liquid.

Abstract: Adhesives and sealants comprising submicron particles and nanomaterials, methods of making such adhesives and sealants, and methods of using such adhesives and sealants are provided.

Abstract: It is an object of the present invention to provide a surface-modified film which has adhesive properties improved by surface modification and a process for producing the same. It is also an object of the present invention to provide a laminated film in which at least the surface-modified film has been laminated and a process for producing the laminated film. The surface-modified film according to the present invention is characterized by being obtained by bringing a halide complex of an element in Group 13 of the periodic table into contact with at least a part of a region in the surfaces of a resin film.

Abstract: Compositions for binding organic or inorganic fibers is described. The compositions may include an aqueous solution having a pH of about 4.5 or more. The aqueous solution may include a polycarboxy polymer that is about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; and a polyol. The compositions can maintain a pH of about 5 or more after being cured into a thermoset plastic with the fibers. Processes for preparing a binder composition for organic or inorganic fibers are also described. The processes may include providing an aqueous solution of polycarboxylic acid polymers, where the polymers comprise about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; adding a polyol to the aqueous solution; and maintaining the pH of the aqueous solution at about 5 or more.

Abstract: A hot melt adhesive composition, comprising a blend of components including about 5% to about 50% by weight of an olefin block copolymer; about 10% to about 70% by weight of a first tackifying resin having a softening point of at least about 95° C.; about 0 to 65% of a second tackifying resin that is different than the first tackifying resin; about 0% to about 60% by weight of a plasticizer; about 0% to about 20% by weight of an aromatic reinforcing resin having a softening point equal to or higher than 115° C.; about 0.1% to about 5% by weight of a stabilizer; and about 1% to about 40% by weight of a secondary polymer that is different from the olefin block copolymer, the first and second tackifying resins and the reinforcing resin, having relatively low crystallinity, which low crystallinity is equal to or less than 250 Joules/gram, wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 mPa·s at 163° C.

Abstract: A nitrogen gas tank, a rotary pump and a mechanical booster pump are connected to a bonding vessel that constitutes a bonding apparatus for carrying out diffusion bonding, the apparatus further comprising a pressure sensor. A nitrogen gas atmosphere is formed inside the bonding vessel, and under control operations of a control circuit, a nitrogen introduction rate is controlled so that a pressure is substantially fixed at a predetermined pressure between 3-105 Pa. At such a state, under the action of a rod of a hydraulic cylinder, a second electrode is brought into proximity with a first electrode, so that ultimately, a first object to be bonded and a second object to be bonded on the first electrode are pressed. Further, current is applied through the first electrode and the second electrode with respect to the first object to be bonded and the second object to be bonded.

Abstract: There is provided an acrylic adhesive composition which comprises: (A) a vinyl polymer comprising a homopolymer or a copolymer of an alkyl (meth)acrylate having a C4 to C14 alkyl group; (B) an organophilic layered double hydroxide organically treated with an organic anion; and (C) a crosslinking agent. Therefore the obtained adhesive composition has sufficient adhesiveness to an object, excellent heat resistance and excellent adhesive properties particularly at higher temperatures, and is substantially free from variations in adhesiveness.

Abstract: A conductive sealant comprises a sealant material and conductive particles, wherein the conductive particles are of a composite material obtained by adding graphene or carbon nanotubes into a resin. The conductive sealant avoids the problem of bad electrical conduction of the display panel caused by the aggregation of graphene. A display panel and a manufacturing method thereof and a display device are further provided.

Abstract: A tape-dispensing apparatus may include a removable part and a base part.

Abstract: The present invention relates to a conductive particle, a conductive adhesive with the conductive particles, a LCD panel with the conductive adhesive, a method of manufacturing of the conductive particle and a method of manufacturing of the conductive adhesive. The conductive particle comprising an outer coating layer of graphite and an inner core of an organic resin enclosed by the outer coating layer, and therefore the conductive particles can have good conductivity as well as good strength and elasticity.

Abstract: Disclosed herein is a method of manufacturing a touch screen panel, including the steps of: forming a spacer array and a mold having a shape corresponding to that of a horizontal groove array or a vertical groove array; fabricating a transparent upper plate having a horizontal groove array including two or more horizontal grooves and a transparent lower plate having a vertical groove array including two or more vertical grooves using the mold; charging a predetermined amount of conductive ink in the horizontal groove array and the vertical groove array; and drying the conductive ink to form a conductive array and then attaching the upper plate to the lower plate.