Of Application Of Bonding Pressure Patents (Class 156/358)
  • Patent number: 10266288
    Abstract: Certain implementations provide a form-fill-seal machine that can efficiently seal a packaging material. The transverse sealing unit may have first members to sandwich the packaging material and sealing the packaging material in a transverse direction, and second members for squeezing the packaging material while sandwiching the packaging material with a prescribed gap left therebetween. The control unit may cause the packaging material to be squeezed by the second members by causing the transverse sealing unit located at a reference position to descend faster than the packaging material being conveyed downward. The control unit may cause the transverse sealing unit to ascend while the packaging material is being sealed by the first members. The control unit may cause the transverse sealing unit to move such that the first members are separated from the packaging material.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: April 23, 2019
    Assignee: ISHIDA CO., LTD.
    Inventors: Makoto Ichikawa, Ryoichi Sato, Ryota Nagashima, Shinji Koike, Ryo Sasaki
  • Patent number: 10213964
    Abstract: A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: February 26, 2019
    Assignee: The Boeing Company
    Inventors: Morteza Safai, Kimberly Meredith
  • Patent number: 10053250
    Abstract: An adhesive tape case sealer machine comprises a machine seat (1), an upper machine core provided on the upper portion of the machine seat for sealing the upper part of the case, a lower machine core (3) provided on the lower portion of the machine seat for sealing the lower part of the case, and a conveyor device (4) for conveying the case, the lower machine core being slidingly connected to the machine seat. By sliding the lower machine core with respect to the machine seat, it is easy to pull the lower machine core out from the machine seat, and to quickly replace the adhesive tape for it, so that replacing the adhesive tape is convenient, efficiency of operations is high, and it is more suitable for high-speed, large-scaled assembly link operation.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: August 21, 2018
    Assignee: SU-ZHOU XUENUO MECHANICAL PRODUCTS CO., LTD.
    Inventor: Qicang Zhang
  • Patent number: 9889612
    Abstract: A composite structure is fabricated by laying up at least one ply of fiber reinforcement and at least one layer of resin on a tool. The resin film layer is formed by laying strips of resin film. The fiber reinforcement is infused with resin from the resin layer.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: February 13, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Michael D. Silcock, Christopher A. Howe, Brice A. Johnson
  • Patent number: 9841710
    Abstract: A transport device includes: a first rotational member; a second rotational member that forms a nip with the first rotational member; a guide member that guides the medium in a predetermined direction; a changing part that supports the second rotational member so as to be rotatable and that moves the second rotational member to change a nip state between the second rotational member and the first rotational member; and an interposed member supported by the changing part and nipped between the first rotational member and the guide member, the interposed member including, in an intersecting direction intersecting a direction in which the interposed member is nipped, multiple portions having different thicknesses, the interposed member being nipped at any one of the multiple portions, while being moved in the intersecting direction in accordance with the movement of the second rotational member.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: December 12, 2017
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Kenji Kanai, Shogo Kamiya, Keisuke Hidaka
  • Patent number: 9776757
    Abstract: A labeling device for a syringe that includes a first labeling subsystem adapted to print a first label having machine readable information and a second labeling subsystem adapted to print a second label having human readable information is disclosed. The first labeling subsystem includes a label applicator adapted to automatically apply the first label to a portion of the syringe. The first labeling subsystem includes a syringe clamp assembly that securely holds the syringe while the label applicator automatically applies a first label to the syringe. The second labeling subsystem includes a removal device adapted to automatically remove a backing material from the second label.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: October 3, 2017
    Assignee: Becton, Dickinson and Company
    Inventors: Austin Jason McKinnon, Scott William Gisler, Philip C. McNeill, Rahul Khurana, Drew Davidock, Robert Nicholas Graf, Kaushal Verma, Gary Stacey, Mark Rogers, Mark Ridley, David Stocks, Alistair Ward, Andrew Scholan, Keith Marshall
  • Patent number: 9636903
    Abstract: An automatic lay-up machine includes a head device and a support mechanism. The head device includes a sheet supplying unit that supplies a prepreg sheet including sheet-shaped prepreg and release paper bonded to a surface of the prepreg, a lay-up unit that lays up the prepreg on a receiving surface by pressing the prepreg sheet against the receiving surface, and a sheet take-up unit that takes up the release paper separated from the prepreg. The support mechanism supports the head device and includes a mechanism for moving the head device in a lay-up direction of the prepreg and a width direction of the prepreg sheet. The head device is moved in the width direction while a position of an edge of the prepreg sheet coincides with a lay-up position and an end portion of the prepreg sheet is pressed against the receiving surface.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: May 2, 2017
    Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
    Inventor: Isao Nishimura
  • Patent number: 9573332
    Abstract: Exemplary presses, e.g., for applying indicia to garments by application of heat, are disclosed. For example, a press may include an upper platen, and a lower platen disposed below and generally aligned with the upper platen. The press may further include a support head adapted to move the upper platen between an open position, wherein the upper and lower platens are spaced away from one another, and a closed position, wherein the upper platen is pressed against the lower platen. Exemplary presses may further include a stand supporting the press.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: February 21, 2017
    Assignee: Stahls' Inc.
    Inventors: Benjamin B. Robinson, Michael Bendis, Brian Sukaraukoff
  • Patent number: 9511577
    Abstract: The present invention provides a transport system for a jig for fixing material to be laminated, which system can transport a jig for fixing material to be laminated using a simple exhaust device that is of a space-saving-type while it continuously exhausts air, a transport method for transporting a jig for fixing material to be laminated, and an apparatus for manufacturing bonded laminated material comprising the transport system.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: December 6, 2016
    Assignee: SINTOKOGIO, LTD.
    Inventors: Masahiko Nagasaka, Shogo Nakajima, Takayuki Nozawa, Osamu Sugino, Ikuto Mishima
  • Patent number: 9505169
    Abstract: The invention relates to an ultrasound welding device (1) for ultrasonic machining of a material by means of a sonotrode (2) mounted in a vibration-decoupled manner, which sonotrode comprises a sealing surface having a cylinder barrel shape, and a counter tool (8), wherein a converter is connected to the sonotrode (2) optionally via a first amplitude transformation unit and the sonotrode (2) and the first converter are designed in such a manner that the sonotrode (2) can be set into vibration by means of a natural vibration of the ultrasonic frequency fS.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: November 29, 2016
    Assignee: Herrmann Ultraschalltechnik GmbH & Co. KG
    Inventor: Thomas Herrmann
  • Patent number: 9481158
    Abstract: A composite automation method and apparatus for the generation of short path course application of a composite lamina is realized by reconfiguring the functional mechanisms of the fiber placement head. Separating the fiber advance and retract functions, nesting the activation cylinders, and making use of push only activation results in a simplified, compact AFP delivery head. Uniform cutting is provided by a circular configuration fiber cutting blade, were at activation the blade both provides a progressive cutting force and rotates to providing a new cutting edge, and requires limited cutting edge guidance as all orientations cut equally well. The mechanism nested in functions and placed in close proximity to the compaction roller reduces the overall fiber course to the application point.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: November 1, 2016
    Assignee: THE BOEING COMPANY
    Inventors: Perry T Horst, Brice A Johnson
  • Patent number: 9365019
    Abstract: An apparatus for distributing a hydrophobic material in a hydrophilic substrate includes a first plate, a second plate, a heater operatively connected to the first plate and configured to heat the first plate to a first temperature that is greater than a second temperature of the second plate, and an actuator configured to move the first plate and second plate together with a hydrophilic substrate between the plates. The first plate and second plate form a temperature gradient to enable a hydrophobic material on one side of a hydrophilic substrate that faces the second plate to penetrate into the hydrophilic substrate towards the first plate.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: June 14, 2016
    Assignee: Xerox Corporation
    Inventors: Jing Zhou, Mandakini Kanungo, Nancy Y. Jia, Wei Hong
  • Patent number: 9354460
    Abstract: A detachment apparatus having an arched drum pad and a method for fabricating a lightweight, thin liquid crystal display (LCD) device using the same are provided. The detachment apparatus includes: a table to which an object to be processed is loaded; an arched drum pad installed over the table and including O-rings formed on a lower surface thereof and a plurality of vacuum compartments demarcated by the O-rings; and a plurality of driving units configured to control a position of the drum pad. In case of using an auxiliary substrate to perform a process of a thin glass substrate, the auxiliary substrate can be easily separated from a liquid crystal panel in a cell state attached after processes are completed by using the arched drum pad having O-rings and a plurality of vacuum compartments.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: May 31, 2016
    Assignee: LG Display Co., Ltd.
    Inventors: JaeWon Lee, JeongJoon Lee, DaeHoon Lee, Byongll Lee, JinKyoung Kim, KiBok Kang
  • Patent number: 9342709
    Abstract: Data is moved through a pipeline as processing of the data unrelated to detection of pattern is performed. The detector detects the pattern within the data at a predetermined location or based on a predetermined reference as the data is moved through the pipeline, in parallel with the processing of the data as the data is moved through the pipeline. The detector detects the pattern within the data as the data is moved through the pipeline without delaying movement of the data into, through, and out of the pipeline.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: May 17, 2016
    Assignee: HEWLETT-PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: David A. Warren, Bruce E. LaVigne
  • Patent number: 9321252
    Abstract: A laminating device for laminating at least one flexible substrate includes a frame, a pressing module, a driving module, a pressure sensor and a control module. The pressing module is disposed on the frame. The pressing module at least includes a first roller and a second roller which are used for moving relative to each other. The driving module is connected to the first roller for driving the first roller. The pressure sensor is disposed on one side of the second roller and opposite to the first roller for detecting a pressure of the pressing module. The control module is electronically connected to the pressure sensor and the driving module for ordering the driving module to adjust the position of the first roller based on the difference between the pressure detected by the pressure sensor and a predetermined pressure.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: April 26, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chang-Chou Li, Chin-Lung Liu, Chih-Yu Ke
  • Patent number: 9196600
    Abstract: Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: November 24, 2015
    Assignee: Ableprint Technology Co., Ltd.
    Inventor: Chih-Horng Horng
  • Patent number: 9174425
    Abstract: The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: November 3, 2015
    Assignee: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    Inventors: Jeroen Van Den Brand, Andreas Heinrich Dietzel, Sander Christiaan Broers, Milan Saalmink
  • Publication number: 20150144268
    Abstract: A machine converts a web of preformed pouches, which are defined by transverse seals extending from a remote edge, into inflated dunnage units. A sealing arrangement is positioned to provide a longitudinal seal intersecting the transverse seals to close the preformed pouches and form a dunnage unit. The sealing arrangement has at least two sealing belts. Each belt is positioned so that respective first sides engage a surface of the web and pull the web through sealing elements positioned on either side of the web. A heating element is on a second side of the first belt not engaging the web. A compliant material is on a second side of the second belt not engaging the web. As the web passes between the heating element and compliant material, imperfections in the web are smoothed by the compliant material and the layers of the web are sealed by the heating element.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 28, 2015
    Inventors: Douglas C. Corbin, Donald P. Shook, Robert L. Ferrante, Michael J. Riccardi, Rick Steven Wehrmann
  • Patent number: 9038688
    Abstract: An active anvil assembly for use in forming a looped suture is provided. The active anvil assembly includes an anvil member, a first sensor operably connected to the anvil member, and a control assembly. The first sensor is configured for measuring at least one of force, torque, and distance feedback. Also provided are systems and methods for forming a looped suture including an active anvil assembly.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: May 26, 2015
    Assignee: Covidien LP
    Inventors: Nicholas Maiorino, Timothy Kosa, Mark Buchter, Keith Kroeber, Richard Casey Hart, Gary Suszynski
  • Patent number: 8974615
    Abstract: A label dispensing system includes a feed assembly, a separation assembly, an application assembly, and a control assembly. The feed assembly provides a label initially attached to a substrate. The separation assembly is located in a downstream location relative to the feed assembly, and includes an angled surface over which the substrate passes configured to at least partially separate the label from the substrate. The application assembly is articulable between a plurality of positions, including a first position at which the application assembly engages the label after the label is at least partially separated from the substrate and a second position at which the label is affixed to a target. The control assembly causes vibration of at least a portion of the application assembly proximate to the first position proximate to a time when the application assembly contacts the label.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: March 10, 2015
    Assignee: Illinois Tool Works Inc.
    Inventor: Steven M. Dods
  • Patent number: 8966748
    Abstract: The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: March 3, 2015
    Assignee: MSG Lithoglas AG
    Inventors: J├╝rgen Leib, Simon Maus, Ulli Hansen
  • Patent number: 8967215
    Abstract: A labelling device includes a linearly displaceable piston operably connectable to a moving mechanism for moving the piston from a resting position to a labelling position. A label carrying mechanism is arranged at the distal end of the piston for carrying an adhesive label and affixing the adhesive label to an object via physical contact at the labelling position of the piston. A force-switching-state system is provided to maintain the piston in relation to the moving mechanism in an attracting force state and the piston moves with the moving mechanism. The physical contact creates an opposite repelling force from the object onto the label carrying mechanism causing separation of the displaceable piston from the moving mechanism. This separation causes a change of the force state of the displaceable piston from an attracting to a repelling force state, causing the linearly displaceable piston to move back to the resting position.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: March 3, 2015
    Assignee: Marel Limited
    Inventor: Steven Bates
  • Patent number: 8968499
    Abstract: To provide a laminating method which achieve high accuracy and high quality in a laminating step of an optical sheet and a display panel. Contact areas between the optical sheet and the sheet holding head are read. At this time, an optical element face of the optical sheet is brought into contact with the sheet holding head, light is irradiated to the contact areas therebetween from a no-optical-element face, and positional information of the optical sheet is read based on the distribution of the reflected light thereof.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: March 3, 2015
    Assignee: NLT Technologies, Ltd.
    Inventors: Tsutomu Hiroya, Koji Shigemura
  • Patent number: 8968500
    Abstract: A method for joining, by adhesive bonding, at least two large joining partners in vehicle construction, in particular in aircraft construction, comprises the following steps: detecting the geometric data of the joining partners in an automated manner, detecting the joint gap dimensions of the joining partners from the geometric data, applying adhesive to one or both joint faces of the two joining partners to be joined as a function of the joint gap dimensions, joining the joining partners in the joining position, and sequentially applying joining pressure to the joint faces along the joint gap to bring the joining partners into the final joining position.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: March 3, 2015
    Assignee: Airbus Operations GmbH
    Inventors: Dirk Niermann, Holger Frauen
  • Publication number: 20150047779
    Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.
    Type: Application
    Filed: February 15, 2013
    Publication date: February 19, 2015
    Applicants: ECO-A CO., LTD., OKAWA SANKI INDUSTRIAL CO., LTD.
    Inventors: Yoshinobu Mizuno, Osamu Kuriyama
  • Publication number: 20150041065
    Abstract: A film-applying machine includes a bracket, a mechanical arm, an application apparatus, and a storage apparatus. The storage apparatus includes a storage mechanism, a driving mechanism, and a first rolling mechanism. The storage mechanism includes a supporting frame mounted to the bracket, and a storage assembly adjustably coupled to the supporting frame. The driving mechanism includes a supporting member and a driving assembly. The supporting member couples with the supporting frame. The driving assembly includes a driving member coupled to the supporting member and a first transmission belt coupled to the driving member. The first rolling mechanism includes a pressing plate and a plurality of rollers. An end of the pressing plate couples with the first transmission belt, and another end is coupled to the supporting frame. The rollers are rotatably mounted on the pressing plate.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 12, 2015
    Inventors: MING-LU YANG, JIE NI
  • Publication number: 20150034247
    Abstract: A composite structure is fabricated by laying up at least one ply of fiber reinforcement and at least one layer of resin on a tool. The resin film layer is formed by laying strips of resin film. The fiber reinforcement is infused with resin from the resin layer.
    Type: Application
    Filed: October 22, 2014
    Publication date: February 5, 2015
    Inventors: Michael D. Silcock, Christopher A. Howe, Brice A. Johnson
  • Patent number: 8944127
    Abstract: A portable impulse welding assembly operable by an operator with a main air regulator receiving pressurized air for decreasing or maintaining air pressure to a first preset limit. A splitter simultaneously divides a first regulated air into first and second portions and a rod air regulator provides a first valve air to a first air flow conduit and a second air flow conduit. A pair of pneumatic cylinders mounted in the housing, each pneumatic cylinder having a rod, the pneumatic cylinders selectively receive air from the first air flow conduit to extend each rod from each pneumatic cylinder or receive air from the second air flow conduit causing each rod to retract into each pneumatic cylinder and a controller to control seal times and cool times and a laser pointer to ensure sealing accuracy.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: February 3, 2015
    Assignee: Envirocon Systems, Inc.
    Inventors: Gregory L. DeJarnett, Mohammed Ali Ahmad
  • Publication number: 20150007923
    Abstract: The invention relates to a method for joining plastic-metal hybrid components, in which a metal component (3) is heated up in a heating stage and a plastic component (9) is brought into contact with the heated metal component (3) in a joining stage and joined to the metal component (3) by means of melting in the contact area, wherein in the heating stage the metal component (3) is heated up to a temperature higher than a defined joining temperature, said metal component is cooled down in a subsequent cooling stage in which the temperature of the metal component (3) is recorded by means of at least one temperature measuring device and the joining stage is performed when the defined joining temperature has been reached.
    Type: Application
    Filed: January 28, 2013
    Publication date: January 8, 2015
    Inventors: Michael Sickert, Dustin Flock, Viktor Mamuschkin
  • Patent number: 8925193
    Abstract: A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: January 6, 2015
    Assignee: Advantest (Singapore) Pte Ltd
    Inventor: Romi O. Mayder
  • Patent number: 8919406
    Abstract: The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: December 30, 2014
    Assignee: Fuk Co., Ltd.
    Inventor: Mitsuo Uemura
  • Patent number: 8919405
    Abstract: A manual and an automatic fastening device for fastening a bonding element to a surface by means of a light-curing adhesive is disclosed. The fastening devices apply the bonding element to the surface with a specific contact pressure, before the light is irradiated onto the bonding element for curing the adhesive. As the bonding element consists of transparent material, the adhesive is cured between the fastening element and the surface.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: December 30, 2014
    Assignee: Bollhoff Verbinduncstechnick GmbH
    Inventor: Franz Druke
  • Publication number: 20140374021
    Abstract: A bonding tool to facilitate bonding of a liner to a surface of a workpiece is provided. The bonding tool includes a bladder, which is inflatable from an initial size to an expanded size, a frame formed to define a recess in which the bladder is disposed, the recess being oriented such that, when inflated from the initial size to the expanded size, the bladder applies a predefined pressure to the liner such that the liner is pressed against the surface of the workpiece.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 25, 2014
    Inventors: Mark A. Tuscano, Michael Haiday
  • Patent number: 8915278
    Abstract: A press apparatus for curing adhesive on inner adhesion surfaces of substantially continuous wood products (1) under synchronous compression heating. The apparatus includes at least two presses (2) having a mutual distance from each other fulfilling the precondition: L/(n?1), where L is the working length of each press and n is the number of presses in series.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: December 23, 2014
    Assignee: Raute Oyj
    Inventor: Hannu Sinko
  • Patent number: 8905103
    Abstract: A tool defines a piston/cylinder with first and second chambers on either side of the piston. A sealable port couples the first chamber to ambient environment. One end of the tool (i) defines a volume that is open to ambient environment, and (ii) has a cartridge coupled thereto such that the volume remains open to ambient environment. The cartridge defines (i) a chamber filled with a meltable material, and (ii) a channel coupling the material-filled chamber to ambient environment. A melting device in thermal communication with the meltable material simultaneously heats an air/water mixture in the second chamber and melts the meltable material. An element releasably coupled to the tool spans a region within the cartridge that lies within the channel. The element incorporates a check valve separating the volume defined by the tool and ambient environment.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: December 9, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Robert D. Conner
  • Publication number: 20140352253
    Abstract: A horn and an anvil are moved toward and away from each other by axially reciprocating a driving rod and thereby reciprocatingly rotating a forked lever in a predetermined angle range. The horn and the anvil are moved toward and pressed against each other with a predetermined force with a bag mouth b held therebetween. A sensor detects the position of a second mounting block secured to the rear end of a sliding shaft of the anvil, thereby detecting the distance between respective pressing surfaces and of the horn and the anvil, i.e. the thickness m of a portion of the bag mouth held between the pressing surfaces and. When the thickness m is not less than a predetermined threshold value M, a vibrator is activated to perform sealing. When the thickness m is less than the threshold value M, no sealing is performed.
    Type: Application
    Filed: April 10, 2014
    Publication date: December 4, 2014
    Applicant: Toyo Jidoki Co., Ltd
    Inventors: Kazunori Yamamoto, Yasuyuki Honda, Noriyuki Yamane
  • Patent number: 8899289
    Abstract: When joining a processing target substrate and a supporting substrate together by suction-holding the processing substrate and the supporting substrate respectively on a first holding unit and a second holding unit arranged to face each other and pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, the present invention preheats at least the processing target substrate before suction-holding the processing target substrate on the first holding unit to suppress generation of particles when joining the processing target substrate and the supporting substrate together so as to properly perform the joining of the processing target substrate and the supporting substrate.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 2, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Masatoshi Deguchi, Masatoshi Shiraishi, Shinji Okada
  • Patent number: 8900387
    Abstract: Methods, computer program products, and apparatus for stitching the interior surface of a tire, the steps of the method including rotating the tire about a central rotational axis, applying a force to maintain the tire in a substantially radial fixed position relative to a stitching wheel; applying a predetermined force to the interior surface of the tire with the stitching wheel, the stitching wheel contacting the interior surface of the tire while the tire is rotating; and, mechanically translating the stitching wheel laterally across the interior of the tire during tire rotation.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: December 2, 2014
    Assignee: Michelin Recherche et Technique S.A.
    Inventors: Adib Tony Chebli, Metodi Lubenov Ikonomov
  • Publication number: 20140338813
    Abstract: A bonding method includes: holding a substrate to be processed by a first holding unit; holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate thereon or in a second holding state of electrostatically attracting the glass substrate; depressurizing the interior of a chamber; and bringing the substrate to be processed and the glass substrate into contact with each other and pressing them. Holding a glass substrate includes: switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing in depressurizing the interior of a chamber and a pressing timing in bonding the substrate to be processed and the glass substrate.
    Type: Application
    Filed: May 12, 2014
    Publication date: November 20, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Satoshi OOKAWA
  • Publication number: 20140311670
    Abstract: An assembling system for assembling a backlight light module includes a receiving device, a pressing unit, a driving unit, an image module and a platform. The platform defines a bearing area to accommodate the receiving device. The receiving device includes a receiving room configured for receiving components of a backlight module. The pressing unit is configured for pressing the components to form the backlight module. The driving unit includes a driving device and a control unit. The driving device is used for driving the pressing unit to press the backlight module. The image module includes a camera and an image processor, the camera is configured for capturing images of the pressing unit during the pressing process, the image processor is configured for receiving and processing the images and generating a corresponding control signal, the control unit receives the control signal and control the driving device according to the control signal.
    Type: Application
    Filed: April 4, 2014
    Publication date: October 23, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: YUNG-CHANG TSENG
  • Patent number: 8851133
    Abstract: Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: October 7, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Martin Liu, Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou, Chia-Shiung Tsai
  • Publication number: 20140262045
    Abstract: A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.
    Type: Application
    Filed: June 9, 2014
    Publication date: September 18, 2014
    Applicant: NIKON CORPORATION
    Inventors: Keiichi Tanaka, SHIGETO IZUMI
  • Patent number: 8821676
    Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 ?m, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: September 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
  • Patent number: 8821659
    Abstract: Real-time alignment of substrates is conducted by way of placing a first substrate together with a second substrate located over the first substrate in a fixed relative position onto a first substrate holder. The first substrate holder is operative to support the first substrate. A second substrate holder is operative to contact and control the position of the second substrate relative to the first substrate. A pattern recognition system is operative to view reference marks on the first and second substrates for determining their relative alignment, and a positioning mechanism coupled to the first substrate holder and/or the second substrate holder will align the first substrate relative to the second substrate based on their relative alignment as determined by the pattern recognition system. Thereafter, the substrates are fully laminated to secure them to each other.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: September 2, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Man Chung Ng, Man Lai Chau
  • Patent number: 8822307
    Abstract: According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: September 2, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naoko Yamaguchi, Kazumasa Tanida, Hideo Numata, Satoshi Hongo, Kenji Takahashi
  • Patent number: 8807184
    Abstract: Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 19, 2014
    Assignee: International Business Machines Corporation
    Inventors: Sarah H. Knickerbocker, Jonathan H. Griffith
  • Patent number: 8800628
    Abstract: An airship hull repair system. The system includes a drive subsystem configured to move the system across an airship hull, a damage detecting subsystem configured to detect damage to the airship hull, a hull repair subsystem configured to repair the detected damage to the airship hull, and a magnetic coupling. The drive subsystem, the damage detecting subsystem, and the hull repair subsystem are included in an interior piece of the system configured to move on an interior of the airship hull and an exterior piece of the system configured to move on an exterior of the airship hull. The magnetic coupling couples the interior piece and the exterior piece to move together.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: August 12, 2014
    Assignee: Lockheed Martin Corporation
    Inventors: John Morehead, Nicholas Piini, Kyle Hofstatter, Eric Younge
  • Patent number: 8800627
    Abstract: A transfer medium manufacturing method for manufacturing a transfer medium in which a foil forming recording material containing metallic particles capable of being transferred onto a target has been applied to a base material includes: applying the foil forming recording material to the base material; and smoothing the surface of the foil forming recording material applied to the base material in the applying, the foil forming recording material being in a partially-melted state.
    Type: Grant
    Filed: August 9, 2010
    Date of Patent: August 12, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Kunihiko Matsuhashi
  • Patent number: 8794287
    Abstract: Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit (101U) and a lower unit (101L), and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. The wafer bonding apparatus is provided with a top plate (111), a pressure profile control module (131), and a heater section arranged between the top plate and the pressure profile control module for heating. Shape change generated on the surface of the pressure profile control module causes change of the surface of the top plate.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: August 5, 2014
    Assignee: Nikon Corporation
    Inventor: Shigeto Izumi
  • Publication number: 20140209232
    Abstract: The invention relates to a connection arrangement (30b) for connecting two profiled elements (32, 34) in a seamless and aerodynamically smooth manner in order to form a profiled surface around which a laminar flow is possible. A first profiled element (32) has a first fixing strip that extends towards the second profiled element (34), and the surface (44) of the first fixing strip is lower than the surfaces of the profiled elements (32, 34) in the outward direction. Furthermore, the second profiled element (34) has a second fixing strip (44) which is molded on the inside and which is arranged below the first fixing strip (36), and the two profiled elements (32, 34) are rigidly connected to each other by means of the second fixing strip. A filler region that can be found below the connecting surface (55) between the profiled surfaces (32, 34) and above the fixing strip surface (44) is tilled with at least two layers of cured filling material.
    Type: Application
    Filed: May 29, 2012
    Publication date: July 31, 2014
    Applicant: EADS DEUTSCHLAND GMBH
    Inventors: Tamas Havar, Matthias Geistbeck, Meinhard Meyer, Oliver Rohr, Thomas Meer