Of Application Of Bonding Pressure Patents (Class 156/358)
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Patent number: 8418739Abstract: A press is described having an upper platen. The press includes one piece base for support an upper rotatable support arm and a lower cantilever support arm. The upper support arm is adapted to selectively move the upper platen between an open position, a partially open position and a closed position with respect to a lower platen. A lower cantilever support arm configured to provide an open working surface around a lower platen. A sliding mechanism disposed on the base to selectively move the lower platen to an open, partially open or closed position.Type: GrantFiled: March 19, 2010Date of Patent: April 16, 2013Assignee: Stahls' Inc.Inventor: Benjamin B. Robinson
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Patent number: 8409394Abstract: A lamination apparatus has opposed plenums that project pressurized fluids toward a fluid pressure lamination zone. Material sheets to be laminated are advanced through the lamination zone and laminated together due to the pressure exerted by the pressurized fluid.Type: GrantFiled: May 26, 2006Date of Patent: April 2, 2013Assignee: First Step Partners, LLCInventor: James McLaughlin
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Patent number: 8408271Abstract: A system, apparatus, and method for removing pressure adhesive indicia, such as labels or stamps, from their backing and affixing the same to a target substrate is provided. The automated process affixes stamps, for example, to the target substrate with both speed and precision of placement. Desired stamps can be selectively removed from a backing, for example, can be placed on variable locations upon the target substrate, and can be affixed in the desired orientation with precise spacing between stamps. The precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons.Type: GrantFiled: February 2, 2007Date of Patent: April 2, 2013Assignee: The United States Postal ServiceInventors: Khalid X. Hussain, David C. Faulkner
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Patent number: 8408262Abstract: An electrostatic chuck includes an array of independently biased conductive chuck elements, an array of sensor-conductor assemblies, and/or a combination of an array of sensor-conductor assemblies and at least one motorized chuck. Conductive chuck elements, either standing alone or embedded in a sensor-conductor assembly, are independently biased electrostatically to compensate for bowing and/or warping of a substrate thereupon so that the substrate can be bonded with a planar surface. A single electrostatic chuck can be employed to reduce the bowing and warping of one of the two substrates to be bonded, or two electrostatic chucks can be employed to minimize the bowing and warping of two substrates to be bonded.Type: GrantFiled: October 8, 2009Date of Patent: April 2, 2013Assignee: International Business Machines CorporationInventors: Dechao Guo, Fei Liu, Leathen Shi, Keith Kwong Hon Wong
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Patent number: 8393368Abstract: A method of manufacturing a composite structure by compacting layers of laminate material within a mold and then curing the layers of laminate material within the mold.Type: GrantFiled: June 1, 2009Date of Patent: March 12, 2013Assignee: Lockheed Martin CorporationInventor: Steve L. Bichsel
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Patent number: 8389611Abstract: An object of the present invention is to provide a pressure sensitive adhesive composition for an optical member, which is excellent in coating property because of low viscosity, can reduce an amount of an organic solvent used, and can form a pressure sensitive adhesive layer excellent in durability and having high surface uniformity.Type: GrantFiled: January 10, 2006Date of Patent: March 5, 2013Assignee: Nitto Denko CorporationInventors: Fumiaki Shirafuji, Masayuki Satake, Kohei Yano, Yutaka Moroishi, Fumiko Nakano
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Patent number: 8381963Abstract: A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.Type: GrantFiled: June 18, 2010Date of Patent: February 26, 2013Assignee: Fujitsu LimitedInventors: Kimio Nakamura, Yoshiyuki Satoh, Kenji Kobae
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Publication number: 20120325398Abstract: A composite structure is fabricated by laying up at least one ply of fiber reinforcement and at least one layer of resin on a tool. The resin film layer is formed by laying strips of resin film. The fiber reinforcement is infused with resin from the resin layer.Type: ApplicationFiled: June 26, 2011Publication date: December 27, 2012Inventors: Michael D. Silcock, Christopher A. Howe, Brice A. Johnson
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Publication number: 20120328846Abstract: The invention relates to a device and a method for the realization of elongated textile preforms intended for manufacturing load-bearing composite members by means of a method using resin infusion. More specifically, the device and the method, which are the subjects of the invention, are designed for manufacturing substantially circular preforms, intended, for example, for the realization of aircraft fuselage frames or segments of frames. The invention provides a method for depositing gradually and continuously a fibrous tape comprising a small amount of binding agent over the length of an elongated shape to make a preform whose shape comprises at least two non-coplanar wings.Type: ApplicationFiled: September 30, 2010Publication date: December 27, 2012Applicant: AIRBUS OPERATIONS (S.A.S.)Inventors: Philippe Blot, Christophe Marchand, Claude Le Bail, Simon Deseur, Jerome Soto
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Publication number: 20120329241Abstract: According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.Type: ApplicationFiled: March 16, 2012Publication date: December 27, 2012Applicant: Kabushiki Kaisha ToshibaInventors: Naoko Yamaguchi, Kazumasa Tanida, Hideo Numata, Satoshi Hongo, Kenji Takahashi
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Patent number: 8313190Abstract: A stripper blade system has been developed for high throughput inkjet printers. The stripper blade system includes a metallic blade having a leading edge that is less than 0.06 mm in thickness, a blade holder to which the metallic blade is mounted, and an actuator that is associated with the blade holder to move the metallic blade into and out of contact with an intermediate imaging member.Type: GrantFiled: March 11, 2010Date of Patent: November 20, 2012Assignee: Xerox CorporationInventors: Ruddy Castillo, Daniel J. McVeigh, Donald M. Bott, Barry P. Mandel
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Publication number: 20120251789Abstract: A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.Type: ApplicationFiled: March 27, 2012Publication date: October 4, 2012Inventors: Keiichi TANAKA, Shigeto Izumi
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Patent number: 8250834Abstract: Described is an apparatus for applying a drinking straw on a receiving surface of a stand up bag which can be supplied on a conveying surface to a transfer device for drinking straws. To increase the conveying speed of said apparatus, the transfer means should be arranged such the drinking straw while being handed over encloses an acute angle with the conveying surface.Type: GrantFiled: October 25, 2010Date of Patent: August 28, 2012Assignee: INDAG Gesellschaft für Industriebedarf mbH & Co. Betriebs KGInventors: Hans Peter Wild, Eberhard Kraft
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Publication number: 20120186743Abstract: A composite layup method is described in which strips of fibrous material are deposited progressively on a mould surface. The method involves feeding a strip of fibrous material to a placement device for placing the strip progressively on the mould surface, and imparting a shape to the strip upstream of the placement device. In this way, shape is imparted to the strip prior to the strip reaching the placement device. The shape imparted to the strip corresponds at least partially to a shape of the mould surface. This prevents or reduces air from becoming trapped between the strip and the mould surface as the strip is deposited in the mould. An end effector assembly suitable for use in the composite layup method is also disclosed.Type: ApplicationFiled: December 21, 2011Publication date: July 26, 2012Applicant: VESTAS WIND SYSTEMS A/SInventor: Gary Holloway
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Publication number: 20120180955Abstract: The machine for producing a corrugated board includes a first corrugating roller (3) and a second corrugating roller (5) defining a corrugating nip (7) through which a first web material (N1) passes. A gluing unit (9) applies a glue on crests of the first web material (N1) formed in the corrugating nip (7). A pressing member (11) cooperates with the second corrugating roller (5) to press a second web material (N2) against the crests of the first web material (N1). A pressure regulating system adjusts the pressure of the pressing member (11) against the second corrugating roller (5). At least a first pressure chamber (27C), which contains a pressure liquid and a pressure transducer, is associated with a first abutment (33) for said pressing member (11). A control unit (69) opens a stop valve (39) when the pressure detected by the pressure transducer (37) is outside a tolerance range.Type: ApplicationFiled: January 13, 2012Publication date: July 19, 2012Inventors: Mauro Adami, Lorenzo Vannucchi
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Patent number: 8220513Abstract: The present invention relates to a laminator with changeable rotation speed and heating temperature including a first roller set, a second roller set, a transmission gear set, a speed changing gear set, a first driving device, a second driving device, an input interface, a controller and a heating device. A user selects an option of the input interface according to film thickness. The controller determines rotation speed and heating temperature of the first roller set and the second roller set according to the option. Then the controller controls the second driving device to move the speed changing gear set to alter the engagement between the speed changing gear set and the transmission gear set, as to modulate the rotational speed of the first roller set and the second roller set.Type: GrantFiled: January 3, 2012Date of Patent: July 17, 2012Assignee: Primax Electronics Ltd.Inventors: Chih-Hsun Lin, Yen-Te Lee, Qi-Feng Zou
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Patent number: 8205653Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.Type: GrantFiled: October 29, 2008Date of Patent: June 26, 2012Assignee: Advanced Display Process Engineering, Co., Ltd.Inventors: Dong Gun Kim, Bong Hwan Choi
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Patent number: 8206525Abstract: Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit (101U) and a lower unit (101L), and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. The wafer bonding apparatus is provided with a top plate (111), a pressure profile control module (131), and a heater section arranged between the top plate and the pressure profile control module for heating. Shape change generated on the surface of the pressure profile control module causes change of the surface of the top plate.Type: GrantFiled: June 15, 2007Date of Patent: June 26, 2012Assignee: Nikon CorporationInventor: Shigeto Izumi
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Patent number: 8187408Abstract: A method of forming a precision microspace with given configuration and volume; a process for manufacturing a member having a precision microspace with given configuration and volume; etc. There is provided a method of forming a precision microspace by the step of laying a film on a substratum having a precision microscopic depressed portion, comprising the steps of mounting such a substratum on a first stage and setting a second stage covering the outer circumference of the first stage so that the uppermost face of the second stage is higher than that of the first stage; and laying a film on the substratum to thereby obtain a precision microspace with given configuration and volume.Type: GrantFiled: June 14, 2007Date of Patent: May 29, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Atsushi Yamanouchi, Koichi Misumi, Takahiro Senzaki, Koji Saito
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Patent number: 8182639Abstract: A weight applicator for a wheel of a tire-wheel assembly is disclosed. The weight applicator includes an arm portion and an applicator portion connected to the arm portion. The applicator includes a radially-extending flange portion. The radially-extending flange portion is connected to the arm portion. A first plunger portion is movably-connected to the radially-extending flange portion by one of more first radial arms. A method is also disclosed.Type: GrantFiled: December 10, 2009Date of Patent: May 22, 2012Assignee: Android Industries LLCInventors: John Donnay, Dale Terry
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Publication number: 20120085496Abstract: An ultrasonic welding method includes pressing an ultrasonic welding stack mounted for linear movement against a first workpiece using an electrical servo motor, applying a predetermined initial load to the first workpiece, and initiating a weld, comprising outputting energy from the ultrasonic welding stack to the first workpiece. The method includes sensing, with at least one sensor, a control variable, outputting a signal corresponding to the sensed control variable to a controller, simultaneously outputting energy from the ultrasonic welding stack to the first workpiece and maintaining a weld distance at or near zero until the signal corresponding to the sensed control variable satisfies a predetermined condition, and applying a controlled force, speed, or a combination thereof to said first workpiece with an electrically powered linear actuator to urge the first workpiece against a second workpiece to which the first workpiece is to be joined following satisfaction of the predetermined condition.Type: ApplicationFiled: September 26, 2011Publication date: April 12, 2012Applicant: Dukane CorporationInventors: Leo Klinstein, Paul Golko, William E. Jurkowski
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Publication number: 20120067524Abstract: The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a pumping device; a vacuum chamber connected to the pumping device; and an optical system configured to determine the position of alignment marks on the surfaces of the semiconductor wafers to be bonded in the bonding module. The apparatus also includes a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure.Type: ApplicationFiled: November 29, 2011Publication date: March 22, 2012Inventors: Marcel Broekaart, Ionut Radu
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Publication number: 20120031557Abstract: A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.Type: ApplicationFiled: October 27, 2010Publication date: February 9, 2012Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.,Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
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Patent number: 8109310Abstract: The rotational vacuum press with a membrane; according to the invention, is aimed at veneering of profiled surfaces and laminating of wooden elements and other materials according to a modem facilitated with pressure generated by vacuum and applied on the surface through the membrane. It is consisted of the main construction (21) on which central axis (16) is placed on which at least four turning working tables are placed (12) with moveable frame (14) which has an elastic rubber membrane fixed on (13) under which, on the working table (12), a working piece (15) is placed preheated in the heating chamber (31) with heaters (36), which is placed on rails in the low down part of the construction (21).Type: GrantFiled: October 24, 2007Date of Patent: February 7, 2012Inventor: Zvjezdan Vi{hacek over (s)}t
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Patent number: 8100160Abstract: A film transfer apparatus includes an application unit, a transfer unit downstream of the application unit, and at least one third unit for further processing a printing material with a transfer layer applied. In the prior art, if contact pressure is exerted on coated printing material again in a following nip, the adhesive layer under the transfer layer can be pressed out. A blanket can then be contaminated with adhesive, ink itself can be contaminated and parts of the transfer layer can be detached from the coated sheet. In order to avoid pressing out the adhesive, measured values in the transfer unit are compared with corresponding values in the third unit. At least one controlled variable in the units can then be readjusted on the basis of a difference, to at least reduce the quantity of adhesive squeezed out. A transfer method and a covering surface are also provided.Type: GrantFiled: February 2, 2009Date of Patent: January 24, 2012Assignee: Heidelberger Druckmaschinen AGInventors: Peter Franzen, Nils Klockmann, Alexander Weber
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Patent number: 8096339Abstract: An ultrasonic welding tool with fluid drive, wherein the ultrasonic welding tool (2) is connected by way of a piston rod (3) to a working piston (5) which is guided in a housing (4) of the drive, wherein the working piston (5) sub-divides the drive housing (4) into a primary chamber (6) and a secondary chamber (7), wherein each of the chambers is able to communicate by way of a valve (16) with a fluidized pressure source, wherein at least one sensor (18, 19) is provided for detecting a physical property of the fluid drive which sensor emits an actual signal which is in relationship with the physical property detected and which via a control circuit controls the two valves in such a way that the physical property detected follows a reference value profile.Type: GrantFiled: March 25, 2009Date of Patent: January 17, 2012Assignee: Herrmann Ultraschalltechnik GmbH & Co. KGInventor: Volker Aust
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Patent number: 8092625Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.Type: GrantFiled: August 19, 2008Date of Patent: January 10, 2012Assignee: Silverbrook Research Pty LtdInventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell, Peter John Morley Sobey
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Publication number: 20110303358Abstract: One automated process for evenly applying a thin layer within a device housing includes applying a vacuum hold from a curved surface applicator to the thin layer, pressing the thin layer against the device housing with the applicator, wherein said pressing includes applying pressure from the center of the applicator first and then radially expanding said pressure, and pressing the cylindrical outer housing against an outer region of the thin layer to effect a hard pressed application at the outer surface thereof.Type: ApplicationFiled: September 29, 2010Publication date: December 15, 2011Applicant: APPLE INC.Inventors: Houtan R. Farahani, Joseph B. Moak, Matthew D. Rohrbach
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Patent number: 8062444Abstract: The present invention relates to an apparatus for conforming a functionalized flexible planar film on an optical lens. The apparatus according to the invention may also be used in a process of functionalization of an optical lens. As a factor of the functionalization that one wishes to introduce into said optical lens and the nature of the functionalized flexible planar film used, the functionalization process is a process of gluing, transfer, or molding of a functionalized flexible planar film onto an optical lens. The implementation of each of these respective processes makes it possible to obtain a functionalized optical lens, said functionalization being adhered, transferred, or molded using a functionalized flexible planar film.Type: GrantFiled: April 4, 2006Date of Patent: November 22, 2011Assignee: Essilor International (compagnie Generale d'optique)Inventors: Cédric Begon, Christelle Defranco, Gilles Menges
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Publication number: 20110277905Abstract: A printer has a printer unit including a recording head and automatic cutter, and an adhesive transfer unit disposed downstream from the automatic cutter. The adhesive transfer unit has a transfer mechanism that supplies adhesive tape and transfers adhesive to recording paper at a transfer position. When a paper detector disposed upstream from the transfer position detects recording paper, the control unit of the printer causes the pressure mechanism to alternately form the contact state pressing the recording paper to the adhesive tape, and the non-contact state in which the recording paper is separated from the adhesive tape. Adhesive is transferred to the recording paper passing the transfer position while this contact operation repeats intermittently.Type: ApplicationFiled: May 9, 2011Publication date: November 17, 2011Applicant: SEIKO EPSON CORPORATIONInventor: Yoshimitsu KOIKE
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Patent number: 8048254Abstract: A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.Type: GrantFiled: August 20, 2008Date of Patent: November 1, 2011Assignee: Sony Chemical & Information Device CorporationInventor: Takashi Matsumura
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Publication number: 20110259515Abstract: A composite layup is formed on a tool and placed on a contoured part. The tool is contoured to substantially match the contour of the part. A set of location data is generated which represents the location of the part in space relative to the tool. An automated manipulator uses the location data to move the tool into proximity to the part and place the contoured layup on the part.Type: ApplicationFiled: April 27, 2010Publication date: October 27, 2011Inventors: Daniel M. Rotter, Kurtis S. Willden, William S. Hollensteiner, Brian G. Robins
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Patent number: 8042594Abstract: A method and system for a fiber compaction device with interdependent segment travel is described. A compaction device structure supports a series of individual interdependent segments including a compaction surface. Each segment also includes an opening in which a presser member can be located. The presser members consist of either an elastomeric bladder filled with an incompressible fluid or individual pistons that are manifolded together with a fixed volume of incompressible fluid. The presser members create an interdependence in segment positions such that if one or more segments are displaced the others move to balance the segment positions. Having a fixed volume of incompressible fluid allows the segments to work interdependently, thus guaranteeing that the average section position will be the nominal position and eliminating the need for a fixed center section.Type: GrantFiled: June 28, 2006Date of Patent: October 25, 2011Assignee: Alliant Techsystems Inc.Inventors: Lloyd G. Miller, Douglas G. Harris, Vernon M. Benson, Keith G. Shupe, Kevin L. Wade
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Patent number: 8042588Abstract: A press is described having an upper platen. The press includes a support arm adapted to selectively move the upper platen between an open position, a partially open position and a closed position with respect to a lower platen. An electromagnet is disposed proximate the support arm and configured to selectively secure the upper platen in the closed position. Another electromagnet, which may be disposed proximate a base member, is configured selectively to secure the upper platen in a partially open position.Type: GrantFiled: March 31, 2009Date of Patent: October 25, 2011Assignee: Stahls' Inc.Inventors: Benjamin B. Robinson, George C. Tichnell, Jr.
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Patent number: 8011405Abstract: A labeller includes a waste liner rewind wheel for taking up the release liner after it has been separated from the labels, and a print mechanism positioned along the label path for real-time printing of a desired print material on the labels. In one embodiment, the waste liner rewind wheel includes a mechanism for adjusting the speed of the rewind wheel as the amount of waste liner on the rewind wheel increases, while maintaining sufficient tension on the waste liner to pull the waste liner onto the rewind wheel. In another embodiment, the print mechanism is mounted to the frame along the label path, such that the print mechanism is capable of printing on the labels as they are moved past the print mechanism. The labeller may additionally include an encoder for registering the position of the label web with respect to the print mechanism.Type: GrantFiled: May 5, 2009Date of Patent: September 6, 2011Assignee: Joe & Samia Management Inc.Inventors: Joseph Z. Sleiman, Michael R. Schram, Douglas F. Lovegrove, Bradley V. Allen
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Patent number: 8006614Abstract: Two press cylinders are disposed at an equal interval at left and right having the opening-closing cylinder therebetween, so as to have the approximately same distance from the conveying reference plane as the opening-closing cylinder. The opening-closing cylinder comprises an opening-closing linear encoder, which detects a decreased amount of the entire thickness of the object-to-be-processed as a displacement of the ram, when the object-to-be-processed is hot-pressed. The respective press cylinders comprise pressure sensors for press cylinders detecting pressing pressures of the pressing plates as cylinder inner pressures.Type: GrantFiled: July 27, 2009Date of Patent: August 30, 2011Assignee: Taihei Machinery WorksInventors: Reiji Yamada, Yasuyuki Ohdaira, Fumio Kurita, Mineo Masuda
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Publication number: 20110203737Abstract: An automated tape head assembly for a multiple axis tape laying machine includes a tape supply reel and a tape compaction roller, and a chute. Tape passes from the supply reel, through the chute, to the tape compaction roller. The tape path and at least a portion of the chute are maintained substantially at a zero Gaussian curvature. The tape path and chute are curved to define a compliance loop that results from a substantially or partially unrestrained curved path between the supply reel and the compaction roller. This structure allows the compaction roller to shift laterally and vertically with respect to the supply reel while the supply reel is in a fixed position with respect to the tape head assembly generally. This structure also allows the compaction roller to roll, steer, and follow the fiber tape's natural path, all with significant independence from the supply reel.Type: ApplicationFiled: November 22, 2010Publication date: August 25, 2011Inventor: William J. SLYNE
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Patent number: 8005559Abstract: The operation of automated tape heads used to layup a composite structure is optimized in order to reduce layup time and better balance tape head loading. Ply data is generated that defines the ply segments and tape courses for each sequence of the layup. Each sequence is partitioned into groups of either ply segments or tape courses for the sequence. Multiple possible tape head assignments are generated in which the individual tape heads are assigned to the groups A final set of tape head assignments are selected based on the assignments that minimize the time required to complete the layup.Type: GrantFiled: September 26, 2007Date of Patent: August 23, 2011Assignee: The Boeing CompanyInventors: Wei-Pai Tang, Robert A. Kisch
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Patent number: 7992614Abstract: A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually, even when, for example, the size or material of the boards changes. Also, A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually or jointly without adjusting the pressing positions of the press cylinders, even when, for example, the size or material of the boards changes, and further, being able to adapt to change of the material of the boards or the like.Type: GrantFiled: July 15, 2009Date of Patent: August 9, 2011Assignee: Taihei Machinery WorksInventors: Reiji Yamada, Yasuyuki Ohdaira, Fumio Kurita, Mineo Masuda
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Patent number: 7992613Abstract: A method and an arrangement for the production of composite work pieces of layers laminated to each other, with at least one layer representing a glass plate. First, at least one composite work piece is laminated in a lamination press under the effects of pressure and heat in order to at least activate the adhesive material used for lamination. Then the composite work piece is removed from the lamination press and transported into a curing station and/or cooling station for curing and/or cooling. A testing device for detecting broken glass in the composite work piece is arranged between the lamination press and the curing station or between the lamination press and the cooling station, which detects potentially present broken glass by testing the inherent stability of the composite work piece.Type: GrantFiled: July 14, 2009Date of Patent: August 9, 2011Assignee: Robert Burkle GmbHInventors: Norbert Damm, Gerhard Dolker, Michael Pojtinger, Wolfgang Renz, Matthias Zufle
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Patent number: 7992612Abstract: A simulation press having a main body and an actuator attached thereto. The actuator is substantially aligned with the main body. A first plate is coupled to the main body and a second plate is coupled to the actuator. Both plates are adapted to engage a workpiece so as to simulate various modes of deformation of an area or areas on the workpiece when the second plate is moved relative to the first plate. The simulation press further includes a drive controller for controlling operation of the actuator. The drive controller additionally responds to feedback from at least one feedback sensor included with the simulation press.Type: GrantFiled: November 8, 2007Date of Patent: August 9, 2011Assignee: The Procter and Gamble CompanyInventors: Stuart James Shelley, Richard Allan Roth, II, Allan Michael Burwinkel, Richard William Hamm, Larry Ray Gilliam, Jr.
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Patent number: 7984839Abstract: An ultrasonic welding device for welding two components has a rod-shaped first sonotrode for the generation of longitudinal waves and is coupled on its first end to a first converter and on its second end opposite the first end to a second converter. A first welding surface is provided in the middle of the first sonotrode. To improve durability and welding performance, a second sonotrode which is coupled to at least one third converter and is configured as a torsion sonotrode, has a second welding surface arranged opposite the first welding surface. The first and second sonotrodes can be moved relatively to each other such that a clamping force between the first and the second welding surface can be applied to the components to be connected.Type: GrantFiled: June 10, 2010Date of Patent: July 26, 2011Assignee: Telsonic Holding AG.Inventor: Albert Büttiker
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Patent number: 7975743Abstract: A labeler is supported on a frame and includes a waste liner rewind mechanism. The frame may be a two-piece frame, wherein each piece supports a plurality of labeler components. A waste liner rewind wheel is rotatably mounted on one of the frame members, and is capable of supporting the release liner of the label web after the labels have been removed and applied to items. A rewind drive is connected to the waste liner rewind wheel for advancing the waste liner rewind wheel to wind the release liner about the waste liner rewind drive wheel. The rewind mechanism actuates the rewind drive as a function of the amount of tension on the release liner. The labeler may also include a print mechanism positioned along the label web path for printing a desired printed information on the individual labels.Type: GrantFiled: October 22, 2009Date of Patent: July 12, 2011Assignee: Joe & Samia Management Inc.Inventors: Joseph Z. Sleiman, Michael R. Schram, Douglas F. Lovegrove
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Publication number: 20110155317Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: applying of adhesive resin onto the transparent protector sheet or the display panel to form dot patterns of applied adhesive resin; seizing the protector sheet and the display panel on upper and lower chucking parts; colliding of undermost tip of the applied resin onto the panel or the protector sheet at an approaching rate no more than a predetermined rate, preferably in a range of 0.01-0.5 mm/sec; and squeezing of the layer by moving the upper or lower chucking part at a rate no less than three times of the approaching rate at a time of the colliding, preferably in a range of 1-10 mm/sec.Type: ApplicationFiled: December 23, 2010Publication date: June 30, 2011Inventors: Tatsuya SHINODA, Takayuki IIZUKA, Hideo SHIBATA, Yukinori UEDA, Susumu OTANI, Toshifumi SHIMIZU
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Publication number: 20110146893Abstract: A method of bonding a film (2) to a curved substrate (1) comprises preforming the film by applying a pneumatic pressure difference between two sides of the film and by heating said film. An intermediate shape is then conferred on the film, which is suitable for applying the film against a curved face of the substrate. This application is carried out, on the one hand, by keeping the film m the intermediate shape by means of an adjusted pressure difference applied between the two sides of the film and, on the other hand, by pressing the substrate against the film by means of a movable support (12-14). Such a method is used to obtain a defect-free ophthalmic lens with a film bonded to it.Type: ApplicationFiled: June 7, 2007Publication date: June 23, 2011Applicant: Essilor International (Compagnie Generale D'optique)Inventors: Antoine Marty, Paul Lefillastre
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Patent number: 7964056Abstract: A process and implementing apparatus are disclosed by which the curing time of a water-based adhesive is shortened as applied to the bonding of two fibrous substrates, such as paperboard or corrugated fiberboard.Type: GrantFiled: October 10, 2008Date of Patent: June 21, 2011Inventors: Anthony R. Bucco, William Zelman
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Patent number: 7954530Abstract: At least one guide roller is provided for guiding a moving cable or conduit. At least one tamping device comprising at least one tamping pad is provided for applying at least one label onto the moving cable or conduit. A guide shoe assembly comprising at least one guide shoe is provided for pressing the at least one label directly against at least one side of the moving cable or conduit. A method for applying labels is also provided. A method comprising guiding a cable or conduit to a labeling unit with a set of guide rollers, affixing a label to the cable or conduit with at least one tamping device, and pressing the label against at least one side of the cable or conduit using at least one guide shoe.Type: GrantFiled: June 15, 2009Date of Patent: June 7, 2011Assignee: Encore Wire CorporationInventors: Mark Bennett, William Thomas Bigbee, Jr., Steve Griffin
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Patent number: 7950432Abstract: A graphic transfer assembly is disclosed. The graphic transfer assembly includes an inflatable member that is capable of expanding to fill the interior of an article of footwear. The graphic transfer assembly can include a fluid pump for filling the inflatable member.Type: GrantFiled: June 24, 2009Date of Patent: May 31, 2011Assignee: NIKE, Inc.Inventors: Elizabeth Langvin, Zvi Rapaport
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Publication number: 20110120654Abstract: A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually, even when, for example, the size or material of the boards changes. Also, A horizontal hotpress system is provided, which can maintain the thickness of the boards (laminated boards) after hot-pressing within the allowable range, by driving and controlling the press cylinders individually or jointly without adjusting the pressing positions of the press cylinders, even when, for example, the size or material of the boards changes, and further, being able to adapt to change of the material of the boards or the like.Type: ApplicationFiled: July 15, 2009Publication date: May 26, 2011Applicant: Taihei Machinery Works, Ltd.Inventors: Reiji Yamada, Yasuyuki Ohdaira, Fumio Kurita, Mineo Masuda
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Publication number: 20110120619Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.Type: ApplicationFiled: February 3, 2011Publication date: May 26, 2011Applicant: FUJITSU LIMITEDInventors: Tohru Harada, Kazuhisa Mishima, Hirokazu Yamanishi, Yoshiaki Yanagida