Abstract: A dicing tape attaching apparatus (10) comprises a fixed table (38) for supporting a mount frame (36), a movable table (31) for supporting a wafer (20) with the reverse surface thereof ground, and a height adjusting unit (70) such as a screw jack for adjusting the height of the movable table. When the dicing tape (3) is attached on the mount frame and the wafer, the height adjusting unit such as the screw jack so operates that the height of the dicing tape attaching surface of the wafer supported on the movable table coincides with the height of the upper surface of the mount frame supported on the fixed table. As a result, the wafer is prevented from forming cuts, cracks and internal distortions.

Abstract: The present invention relates to an apparatus for finishing the edge of a garment fabric and the like, including, on a bearing framework, a guide element for guiding an adhesive strip, leading to a top wheel and a bottom wheel. Said top and bottom wheels operate, at a base defining a working surface, on an edge portion of a fabric to apply the adhesive strip thereto. Heating means for heating the adhesive strip and cooling means for cooling the made piece are moreover provided.

Abstract: The invention relates to a process and tooling for the lining of molds for curved pieces, the process comprising the application of a lining (15) of width A2 on the mold (3) in several successive passes, exerting pressure thereon so that it adapts to the curvature of the piece, and the number of passes being the minimum required so that the width A2 of the tape (15) allows achieving such adaptation, and the tooling comprising a drum (25) for applying the lining (15), a means of attaching its end to the mold (3) at the beginning of each pass, a conical roller (25), to exert pressure on the lining (15) uniformly along its entire width, and means (26, 29) for its movement through side guides (27, 28) arranged on the mold (3) parallel to the curved lines (5, 7) demarcating the piece.

Abstract: A sticker weight pressurizer includes a base plate, a hanger which protrudes upwards from a center portion of the base plate, double-acting cylinders which are disposed on the base plate on opposite sides of the hanger, a pressure block on one end of a piston rod of each of the double-acting cylinders, a regulator valve which adjusts pressure of compressed air supplied from a pneumatic pressure source, and a direction control valve which transfers pressure, supplied from the regulator valve, to the double-acting cylinders while controlling the direction of the pressure.

Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.

Abstract: A device for manufacturing double-faced corrugated paperboards is provided, which exerts uniform pressure and enlarge the heated area during the adhesion of a single-faced corrugated paperboard and a liner into a double-faced corrugated paperboard. The device mainly contains a number of flexible, strip-shaped, pressurizing members arranged in parallel along the advancing direction of the paperboard, each of which is suspended by two ore more lifting members which can lower the pressurizing member down to the paperboard and lift the pressurizing member up from the paperboard.

Abstract: A press for laminating together a pair of foils has an upper die and a movable lower die, the foil extending. An actuating plate is movable toward and array from the stationary die. A spring is provided between the actuating plate and the movable die. A drive displaces the actuating plate and the movable die carried by the spring thereon toward and away from the stationary die for compressing the foils between the dies when the dies are spaced apart by a predetermined distance equal substantially to a thickness of the foils. A sensor detects movement of the movable die toward the actuating plate with compression of the spring on movement of the actuating plate toward the stationary die. When the sensor detects movement of the movable die when the dies are spaced apart by a distance greater than the predetermined distance the actuating plate is arrested.

Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the

Abstract: The invention relates to a method of producing a product comprising a support having a long-acting adhesive and a protective tape disposed thereon, so that said adhesive can be used at a later time.

Abstract: An apparatus and method are provided for forming a composite part on a tool surface, during an automated fiber placement process, by depositing the composite material onto the tool surface with two or more fiber placement heads which are capable of simultaneous movement independently from each other and the tool surface, but dynamically synchronized for operation with respect to a common time base. Fiber placement heads, and creels for holding composite materials supplied to the fiber placement heads are replaceable during fabrication of the composite part.

Abstract: In a thermal activation method for a heat-sensitive adhesive sheet 2 which has a heat-sensitive adhesive layer 2a on one surface thereof and is to be stuck to an adherend 1, when a surface roughness of the adherend 1 is large, by heating the heat-sensitive adhesive layer 2a with large thermal energy, an adhesive is allowed to easily enter recesses 1a of the adherend. When the surface roughness of the adherend 1 is small, by heating the heat-sensitive adhesive layer 2a with small thermal energy, a viscosity of the adhesive is increased to thereby prevent the heat-sensitive adhesive sheet 2 from sliding and being peeled. The surface roughnesses of the adherends 1 may be classified for each material of the adherends 1, and the classified surface roughnesses may be judged according to each material of the adherends 1 to thereby determine the thermal energy.

Abstract: A laminate comprising aramid paper containing aramid fiber and aramid pulp and polyester film, the aramid paper and polyester film having been subjected to plasma surface treatment before laminating, wherein the aramid paper and polyester film are continuously bonded to each other. The disclosure is concerned with a process for manufacturing the laminate and an apparatus for manufacturing the laminate.

Abstract: A method and an apparatus of wood pressing usable in manufacturing glued laminated wood such as laminated veneer lumber (LVL) using a number of wood veneer sheets are disclosed. A hot press used for wood pressing includes a pair of heating plates which are disposed one above the other and have pressing surfaces facing each other. The paired heating plates are both movable toward and away from each other. In operation, firstly one of the heating plates is moved toward the other heating plate to a position where the pressing surface of the one heating plate is spaced from a surface to which a veneer sheet is to be glued by a distance corresponding to the thickness of the veneer sheet. Then, the other heating plate is moved toward the one heating plate until a desired pressure is produced pressing.

Abstract: The caulking device for the metal plate for the tape reel of the present invention in which a plurality of bosses 14 formed on one end surface of the tape reel 10 are inserted in a plurality of boss holes 22 formed on the metal plate 20, and the bosses 14 projected from the boss holes 22 are caulked to fix the metal plate 20 to the one end surface of the tape reel 10, wherein the front end surface 3a of the welded horn 3 is formed in a flat state, and is formed in a plane shape capable of simultaneously being brought into contact with all the bosses 14.

Abstract: A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on the determined thickness of the first and second substrates. Further, sealant material disposed on a substrate may be prevented from becoming contaminated by foreign material.

Abstract: Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship of (vibration-axial directional holding force)>(die shear strength)+(inertial force) while applying an ultrasonic vibration to a region which is subjected to bonding.

Abstract: Vibratory welded connections are formed between first and second members of thermoplastic material by interposing a junction piece of similar material and vibrating the junction piece at high speed while pressing the first and second members in a controlled manner against opposite sides of the junction piece. Friction created by the vibration generates heat which melts a small amount of material at the engaging surfaces which upon cooling provides a strong welded joint having minimal flash. Entire frame systems such as window frames can be fabricated by an apparatus system which forms a friction welded joint between adjacent ends of the frame members. Furthermore the frame can be fabricated around a panel such as a glazing panel. The welded connections formed by the system do not mar the finish of the frame members and produce no unsightly flash bead requiring subsequent machining steps for its removal.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: A machine and method for welding thermo-plastic rain gutters or other work pieces together. The machine includes a frame assembly and a protective shroud. Handles or a wheeled carriage are provided for transporting the machine to a work site. A stationary plate and a moveable plate are each secured to the frame assembly. Work piece holders and corresponding clamps specially configured for clamping rain gutters or other work pieces are disposed on the stationary and moveable plates together with a spacer plate for positioning and holding the ends of two work pieces in a position for welding the ends together. A heater is provided for heating the ends of the work pieces to a desired welding temperature and a press is provided for pressing and holding the molten ends of the work pieces together for welding.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: An object of the present invention is to provide a production apparatus for a hollow fiber membrane module without a risk of deteriorating characteristics of the hollow fiber membranes to be used, with the module case and the hollow fiber membranes bonded and fixed with a potting resin in a highly fluid-tight or airtight manner, and a production method thereof. A centrifugal type production apparatus (1) for the hollow fiber membrane module, for bonding and fixing at least one end part of the hollow fiber membrane stored in the module case and the module case with each other with the potting resin by utilizing a centrifugal force. The centrifugal force is applied by driving a centrifugal machine (11) while supporting an end part potting working part (3) of the hollow fiber membrane module (2) by a fixing jig (4).

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other.

Abstract: A mounting device and a method thereof for preventing a pellet from cracking or chipping when the pellet is mounted. A mounting device comprises a first head for mounting a second pellet on a first pellet already mounted and temporarily pressure-bonding the second pellet thereto by applying a first load and a second head for pressure-bonding the second pellet, which has been temporarily pressure-bonded by the first head, to the first pellet by applying a second load higher than the first load. The second head includes a protective sheet which is moved so that the unused portion is set with respect to each pellet, a ball which is supported rollably in arbitrary directions and in contact with the second pellet through the protective sheet, a spring for applying an elastic force in the direction of the protective sheet and applying the second load to the second pellet through the protective sheet, and a drive for rolling the ball on the protective sheet in contact with the second pellet.

Abstract: The invention relates to a method of producing a 3-D microscope flow-through cell, consisting of an upper and a lower substrate between which is located a flow channel, an electrode structure penetrating the flow channel and connected with external contacts and with through-connections at the ends of the flow channel for the connection of fluid inlets and outlets. The invention provides a method of producing 3-D microscope micro flow-through cells that are suitable for the reversible assembly of microscope flow-through cells for the ?m-volume range. According to the invention, this is obtained in that a base substrate is first provided with access holes and a flow channel, the flow channel being made of a sandwich of a material non-elastic inside and elastic outside, in that the flow channel for the purpose of a fluid-tight channel closure, is pressed against a second cover glass in order to provide a reversibly sealable flow channel.

Abstract: Method and device for the rotational friction welding of plastic parts. A method for the rotational friction welding of plastics wherein a rotationally symmetrical plastic body is set in rotation and, as it rotates, is pressed against a welding location of a plastic part that is held stationary until plastification of the pressing surfaces of the plastic part and/or the plastic body is achieved, and wherein the rotationally symmetrical plastic body is braked to a standstill after plastifying and is held pressed against the stationary plastic part until the plastified pressing surfaces solidify, is known. According to the invention, the rotationally symmetrical plastic body is pressed at a circumferential speed of more than 7 m/s and a pressing pressure of less than 0.5 N/mm2 against the welding location of the plastic part that is held stationary. Use for plastic tanks.

Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

Abstract: When a laminating apparatus M is constituted with a vacuum suction step S1 for vacuum sucking an enclosed space in a work tray 2 accommodating a laminated-substrate W, a thermocompression-bonding step S2 for heating and pressuring the work tray 2 having finished the vacuum suction step S1, and a cooling step S3 for cooling the work tray 2 having finished the thermocompression-bonding step S2, a conveyer route R of a rectangular frame form to circulatorily convey the work tray 2 along a horizontal direction is provided, and in a processing conveyer section Rp composing one side of the conveyer route R, the vacuum suction step S1, the theremocompression-bonding step S2, and the cooling step S3 are sequentially disposed.

Abstract: An edge modification apparatus for the modification of at least part of edge of a panel. An edge follower with an edge contact roller to follow at least part of the profile of the panel. A support structure to allow movement of the edge follower relative to the panel. An edge sensor capable of determining the slope of the profile of the edge. A force applicator to apply a vectored force to the edge follower to press the at least one contact roller onto the edge of the panel. The force applicator is such that the resultant force to the edge follower is in a direction to press the at least one contact roller onto the edge and substantially not along the edge (save for optionally a very small component in the direction of travel of the edge follower along the profile) wherein relative movement between the edge follower and the planar object induces movement of the edge follower. The edge follower modifies the edge of the panel.

Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: A working range setting method of a bonding device includes identifying a model of a first substrate, extracting a set value corresponding to a working range of working elements according to the identified model, and setting the working range of the corresponding working elements with the extracted set value.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

Abstract: A method for joining fabrics, particularly high strength fabrics such as airship hull fabrics, including the steps of: measuring selected parameters of two fabric layers to be joined and the adhesive and any tape or other materials intended to be included in the joint; calculating therefrom an optimal value of a quality control parameter of an ideal joint, such as joint thickness, specific gravity or opacity; assembling the two fabric layers and other materials in the desired order; and applying heat and pressure to the assemblage until the selected quality control parameter of the joint, such as joint thickness, specific gravity or opacity, is satisfied.

Abstract: A method and device for applying a label to a packet of cigarettes travelling in a given direction along a conveying path; to apply the label to the packet, a pickup head is fed along a feed path by rotating the pickup head about two axes parallel to each other, and by moving the pickup head radially with respect to one of the two axes.

Abstract: Crimped seals that are formed in overlapping portions of a packaging material are tested for quality. Initially, the packaging material is installed on first and second clamps. A portion of the packaging material is then extended between first and second crimpers. The first and second crimpers are moved into engagement with the portion of the packaging material to form a crimped seal. During this engagement, the amount of force that is exerted on the portion of the packaging material by the first and second crimpers to form the crimped seal is measured. Then, the first and second clamps are moved to pull apart the crimped seal. The amount of force that is exerted by the first and second clamps to pull apart the crimped seal is also measured. An apparatus for testing the quality of such crimped seals is also provided.

Abstract: When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad.

Abstract: By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.

Abstract: A system and method to control the head suspension assembly static attitude during the manufacturing process are disclosed. A loading fixture loads and supports a head suspension while a slider is attached. A pitch static attitude and roll static attitude (PSA/RSA) monitor takes a first measurement of the pitch static attitude and roll static attitude of the head suspension. A rotatable positioning tool holds the slider in a position relative to the head suspension for attachment and to adjust the position of the slider in response to the first measurement.

Abstract: Techniques to apply a label to an object are described.

Abstract: An apparatus for feeding and cutting lengths of tape and advancing the lengths to a vacuum wheel applicator, the feed section of the apparatus comprising a feed roll, an anvil vacuum roll, and a rotary knife adjacent to the anvil vacuum roll, and means for adjusting the speed of the feed roll and the speed of the anvil vacuum roll to vary the length of the tape advanced to the applicator, and a tape roll splicing assembly to provide a continuous supply of tape to the apparatus.

Abstract: An apparatus for monitoring the operation of a heating element moving periodically along a predefined path includes first and second sensors positioned adjacent the path of the heating element. The first sensor is configured to sense the presence of the heating element proximate to the second sensor, and the second sensor is configured to sense a temperature associated with the heating element as is passes by the second sensor. A controller receives signals from the first and second sensors and performs a control function such as indicating when the temperature sensed by the second sensor fall outside a predetermined range.

Abstract: A mounting device and a method thereof for preventing a pellet from cracking or chipping when the pellet is mounted. A mounting device comprises a first head for mounting a second pellet on a first pellet already mounted and temporarily pressure-bonding the second pellet thereto by applying a first load and a second head for pressure-bonding the second pellet, which has been temporarily pressure-bonded by the first head, to the first pellet by applying a second load higher than the first load. The second head includes a protective sheet which is moved so that the unused portion is set with respect to each pellet, a ball which is supported rollably in arbitrary directions and in contact with the second pellet through the protective sheet, a spring for applying an elastic force in the direction of the protective sheet and applying the second load to the second pellet through the protective sheet, and a drive for rolling the ball on the protective sheet in contact with the second pellet.

Abstract: A 3D micro flow cell is fabricated by forming a first spacer on a substrate to define the flow channel of the cell extending between inlet and outlet openings. A second spacer, comprising a pasty adhesive is applied outside the first spacer or in a groove on the first spacer to seal the cell when the first substrate is joined to a second substrate.

Abstract: A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is movable in the horizontal plane. The linear motors 130 and 140 respectively include driving sections 132 and 142 and movable coil assemblies 134 and 144. An arm 136 extending from the movable coil assembly 134 of the first linear motor 130 is fastened to the bonding head 120, and an arm 146 extending from the movable coil assembly 144 of the second linear motor 140 is engaged with the bonding head 120. A driving force aimed at the center of gravity of the bonding head 120 is applied to the bonding head 120 via the arms 136 and 146, so that the bonding head 120 is moved.

Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: A method of manufacturing a capacitor stack for a flat capacitor includes sequentially stacking a plurality of capacitor layers on top of each other such that each one of the plurality of capacitor layers is, in turn, a top layer of the capacitor stack, and continually applying a compression force between a bottom layer of the capacitor stack and the top layer of the capacitor stack until all of the plurality of capacitor layers have been placed.