Of Application Of Bonding Pressure Patents (Class 156/358)
  • Patent number: 7946098
    Abstract: Apparatus for applying a drinking straw on a receiving surface of a stand up bag which can be supplied on a conveying surface to a transfer device for drinking straws. To increase the conveying speed of said apparatus, the transfer means is arranged such that the drinking straw while being handed over encloses an acute angle with the conveying surface.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: May 24, 2011
    Assignee: INDAG Gesellschaft für Industriebedarf mbH & Co. Betriebs KG
    Inventors: Hans-Peter Wild, Eberhard Kraft
  • Publication number: 20110108188
    Abstract: The present invention creates a tape laying device as well as a method for the construction of a laminate by means of a tape laying device, in particular in the field of aviation and aerospace. The tape laying device comprises a laying arrangement for laying tape for the construction of a laminate and a stimulation arrangement by means of which the tape which has to be laid can be stimulated directly and evenly over the thickness thereof so as to be heated. The idea the present invention is based on consists in that instead of the stimulation at the surface of the tape which has to be laid which is known to the Applicant a direct and evenly stimulation of the tape which has to be laid takes place, that means, a stimulation which acts substantially direct and evenly over the thickness of the tape which has to be laid on the tapes components. The heating achieved by this is much faster than by means of convection according to the known approach.
    Type: Application
    Filed: March 12, 2009
    Publication date: May 12, 2011
    Applicant: AIRBUS OPERATIONS GMBH
    Inventor: Hauke Lengsfeld
  • Patent number: 7921893
    Abstract: A method and apparatus is disclosed for joining of composites with thermoplastic surfaces. The process includes the location of the said components within a load bearing frame, and bringing the thermoplastic surfaces to be joined into contact. Pressure application devices, in the form of fluid filled bladders, are also located within the frame, and are located such that pressure is applied evenly to said thermoplastic surfaces. Where components have a high level of curve or twist, form blocks that have the approximate shape of the component surface are located between the frame and bladders. Pressure and heat are applied to the joint area, and heat removed while the joint area is maintained under some pressure. A feature of the present invention is the option of using opposing pressure application devices, reducing the need for substantial tooling in order to maintain component location accuracy.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: April 12, 2011
    Assignee: Advanced Composite Structures Limited
    Inventors: Andrew Beehag, Kenneth Douglas Horton, Bruce Cartwright
  • Publication number: 20110079339
    Abstract: Friction stir welding equipment control force spindle for mounting in an orbital head housing uses a coaxial sensor to measure downforce. Simultaneously, an axial electrical actuator is controlled to dynamically correct the axial tool position during the welding, by a direct axial force system control, in order to maintain controlled downforce according to parameters previously set, based on numerical control. The equipment also sets up, monitors and controls spindle rotation speed, welding speed, acceleration speed and downforce using for example closed loop control functions. A laser system may scan the backing surface before welding and correct original tool path, in order to get an offset tool path. A precision alarm system may provide safe welding while preventing the tool from colliding with the backing surface.
    Type: Application
    Filed: September 15, 2010
    Publication date: April 7, 2011
    Applicant: EMBRAER-Empresa Brasileira de Aeronautica S.A.
    Inventors: Marcio Fernando Cruz, Gustavo Freitas, Hamilton Zanini, Jefferson Adriano da Costa, Robson Fernando de Oliveira Pereira, Edson Pereira, Fernando Ferreira Fernandez, Mauricio Andena
  • Publication number: 20110073250
    Abstract: A pallet is made from thermoformed polymeric sheets with an attached communications device. A further aspect of the present invention includes a radio frequency identification device attached to an apparatus. In still another aspect of the present invention, a communications device is incorporated into one or more sheets of a pallet or other container prior to forming. Methods of making and using a thermoformed pallet and container having a communications device are also provided.
    Type: Application
    Filed: September 22, 2010
    Publication date: March 31, 2011
    Inventor: Scott A. W. Muirhead
  • Patent number: 7900675
    Abstract: There is provided a printing device 12 that performs printing on each of first and second labels L1, L2 on the way of feeding out a raw strip sheet M, which is temporarily stuck with a first label L1 and a second label L2 having a smaller plane area than that of the first label on a release liner S, a peel plate 27 that peels off the first and second labels L1, L2 from the release liner S, first and second label suction plates 30, 31 that hold the respective peeled labels L1, L2, and a laminating device 17 that laminates the first and second labels L1, L2 with the adhesive layer of the second label L2 facing the adhesive layer of the first label L1. The adhesive layer of the first label L1 laminated with the second label L2 is exposed in a closed loop manner in an outer peripheral area all around the second label L2.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: March 8, 2011
    Assignee: Lintec Corporation
    Inventors: Akira Dangami, Kenji Kobayashi
  • Patent number: 7901526
    Abstract: An apparatus for automatic feeding of elongated sheet stock from a stamping station into a roll forming station in a window component production line includes a transfer mechanism, a feed mechanism and a controller. The transfer mechanism is between the stamping station and the roll forming station. The feed mechanism is positioned at an entrance to the roll forming station. The controller is in communication with the stamping station, the transfer mechanism and the feed mechanism. The controller is programmed to engage stock material that extends from the stamping station with the transfer mechanism, transfer the stock material paid out by the stamping station to the feed mechanism, and drive the feed mechanism to feed the elongated sheet stock into the roll forming station.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: March 8, 2011
    Assignee: GED Integrated Solutions, Inc.
    Inventors: Brian G. James, Mohamed Khalfoun, Timothy B. McGlinchy
  • Patent number: 7896046
    Abstract: A substrate bonding apparatus includes a first chamber having a first surface plate where a first substrate is placed. A second chamber is disposed opposite to the first chamber. The second chamber has a second surface plate where a second substrate is placed. The second substrate is to be bonded to the first substrate. An alignment unit is installed in at least one of the first and second chambers. The alignment unit is capable of carrying out a six-degrees-of-freedom alignment between the first and second substrates. Thus, the substrates can be maintained parallel to each other, a spacing between the substrates can be automatically adjusted, and the substrates can be aligned in the X and Y axis directions.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: March 1, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventor: Si Hyun Park
  • Patent number: 7886793
    Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 15, 2011
    Assignee: LG Display Co., Ltd.
    Inventors: Sang Seok Lee, Myoung Gu Kang, Young Kug Lim, Soo Min Kwak, Jong Han Kim, Heung Sun Kim
  • Patent number: 7882879
    Abstract: Apparatus for bonding rubber O-Rings from cord stock, rubber extrusions and extruded tubing materials, consists of heated die-sets, holding fixtures, electronic module, assembly device, spring clamping and pneumatic clamping arrangement. The combined heated die-set and holding fixture are two separable heat conductive blocks having a common interface. Apertures are located across the interface having diameters or matching shapes of extrusions, these apertures are slightly less than the cord or extrusion dimensions, the rubber is axially mated in the open heated aperture, and will stay unlovable when the clamping device is closed. The electronic module controls both a heating and timing device for proper control of maintaining a constant temperature and accurate timing cycle.
    Type: Grant
    Filed: July 26, 2008
    Date of Patent: February 8, 2011
    Inventors: Paul Stuart Patterson, George Everett Warrin
  • Publication number: 20110017402
    Abstract: An apparatus includes a heating station, a laminating and transfer-printing station, and a molding station in succession, and a transport arrangement that transports the material being processed among the stations. In the heating station, a substrate is pre-heated and consolidated. In the laminating and transfer-printing station, a decorative cover layer is laminated onto the substrate and simultaneously a surface decoration (design, pattern, image, colors, text, etc.) is transfer-printed by sublimation of inks or dyes from a transfer paper onto an outer surface of the decorative cover layer. The resulting laminated body with a transfer-printed surface decoration is then three-dimensionally deformed and molded to form a three-dimensionally contoured, molded, laminated article with the transfer-printed surface decoration. The article may be a motor vehicle interior trim component.
    Type: Application
    Filed: October 4, 2010
    Publication date: January 27, 2011
    Applicant: HERBERT OLBRICH GMBH & CO. KG
    Inventor: Gerhard SPENGLER
  • Patent number: 7875145
    Abstract: An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: January 25, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Naoki Ishii
  • Patent number: 7866364
    Abstract: A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: January 11, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Troy D. Schwinabart, William M. Atkinson
  • Patent number: 7857251
    Abstract: Film lamination vehicles and methods that can be used to laminate films to surfaces are disclosed. The vehicles and methods use a moving lamination device that forms a lamination front over which the film is applied to the surface. The lamination front complies to irregularities in the surface such as dips, bumps, etc. while providing substantially uniform pressure such that the film conforms to the surface.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: December 28, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Jason L. Aveldson, Conrad V. Anderson, H. Aaron Christmann, Anne M. DePalma, Brian T. Loesch, Chin-Yee Ng, Justin W. Wilhelm
  • Patent number: 7850800
    Abstract: A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: December 14, 2010
    Assignee: Panasonic Corporation
    Inventors: Tetsuro Ueno, Toshihiko Tsujikawa
  • Patent number: 7849896
    Abstract: An alignment tool for a bonding apparatus comprises a loading surface for receiving a pushing force from a surface of a device which is attached to the bonding apparatus, the loading surface being arranged and constructed to experience a tilting moment upon receiving an unequally distributed pushing force from a misaligned device acting on it. The loading surface transmits the tilting moment experienced by it to a sensing surface which is operatively connected to the loading surface through a columnar body, which has a smaller width than the loading surface and the sensing surface, and which connects the loading surface and the sensing surface. An array of piezoelectric elements communicates with the sensing surface and produces electrical signals in response to the tilting moment such that a computing unit operatively connected to the piezoelectric elements may detect a direction of tilt of the loading surface from the electrical signals produced by the piezoelectric elements.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: December 14, 2010
    Assignee: ASM Assembly Automation Ltd
    Inventors: Ping Kong Joseph Choy, Chung Sheung Tate Yung, Ju Fan, Hon Yu Peter Ng
  • Patent number: 7849905
    Abstract: A stripping apparatus has a simplified structure for stripping a supporting plate from a layered structure, occupies less space, and strips a supporting plate in a shorter period of time. The stripping apparatus comprises a transfer robot, a cassette, a stripping device and a cleaning device which surround the transfer robot. The stripping device comprises a chucking plate for attracting and retaining a layered structure, and a stripping plate for stripping the supporting plate from the layered structure. The chucking plate is constructed so as to be rotated by 180° within a vertical plane, elevated and lowered in a vertical direction in a state of retaining the layered structure.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: December 14, 2010
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
  • Patent number: 7847217
    Abstract: An exemplary hot-melting method includes the following steps. A hot-melting machine (20) is provided. The hot-melting machine includes a rotatable worktable (23), a heater (25), at least one cooler (26), and a plurality of carriers located on the worktable and being uniformly spaced apart. A first workpiece loaded on a first one of the carriers is cooled using the at least one cooler. Simultaneously, a second workpiece loaded on a second one of the carriers is heated using the heater.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: December 7, 2010
    Assignees: Hon Hai Precision Industry Co., Ltd., Foxsemicon Integrated Technology, Inc.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chin-Hsien Tsai
  • Patent number: 7828029
    Abstract: A puncture and abrasion resistant, air and water impervious laminated fabric is provided. The laminated fabric includes a woven fabric base layer having warp and weft yarns, with at least 50 percent of the fibers in the warp yarns being formed of high performance material. A first thermoplastic film is bonded by heat and pressure to at least one of the sides of the fabric base layer. The first thermoplastic film is formed of ethylene vinyl acetate. A second thermoplastic film is bonded by heat and pressure to the first thermoplastic film on at least one of sides of the fabric. The second thermoplastic film is formed from either high density polyethylene or low density polyethylene.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: November 9, 2010
    Assignee: JHRG, LLC
    Inventors: John E. Holland, Connie W. Holland
  • Patent number: 7819158
    Abstract: An ultrasonic welding system includes an ultrasonic welding stack mounted for linear movement and for applying a controlled force, speed, or a combination of force and speed to a first workpiece to press the first workpiece against a second workpiece to which the first workpiece is to be joined, and an electrically powered linear actuator coupled to the ultrasonic welding stack for moving the stack while applying a controlled force, speed, or a combination of force and speed to said stack, the actuator including an electrical servo motor producing rotational mechanical motion and an integrated converter for converting the rotational motion into linear motion. In one specific implementation, a controller is coupled to the linear actuator for controlling the force applied by said actuator to the ultrasonic welding stack, and a sensor is coupled to the servo motor for producing a signal related to the torque produced by the servo motor and supplying that signal to the controller.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: October 26, 2010
    Assignee: Dukane Corporation
    Inventors: Leo Klinstein, Paul Golko, William E. Jurkowski
  • Patent number: 7815760
    Abstract: A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: October 19, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akihiro Kimura, Masahiro Tagawa, Nobuhiro Ito, Takayuki Ogawara, Tomonori Nakazawa
  • Patent number: 7811899
    Abstract: A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: October 12, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Yukitoshi Hase
  • Patent number: 7802597
    Abstract: A press apparatus includes upper and lower heating plates arranged in a vertical direction to hot-press the product therebetween, a fixed platen to which the upper heating plate is fixed, a movable platen to which the lower heating plate is fixed, a movable platen driving unit configured to move the movable platen along the vertical direction with respect to the fixed platen, an upper cooling plate, a lower cooling plate, the upper and lower cooling plates being arranged in the vertical direction to cold-press the product therebetween, and a cooling plate driving unit moving the upper and lower cooling plates in a horizontal direction between a first position for cold pressing that is located between the upper and lower heating plates and a second position for hot pressing that is located apart from the upper and lower heating plates in the horizontal direction.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: September 28, 2010
    Assignee: Kitagawa Seiki Kabushiki Kaisha
    Inventors: Shizuaki Okazaki, Hideki Kondo, Ryoji Yumito
  • Publication number: 20100233395
    Abstract: During a caulking process, a pressure is applied to a pressure receiving shoulder portion in the same direction as a direction of a clamping force generated by a caulking portion. The clamping force for holding an outer race can thereby be increased. Also, a pressure receiving surface of the pressure receiving shoulder portion is set higher than an end face. Thus, no pressure resulting from plastic deformation in a direction perpendicular to the direction of the clamping force of the caulking portion is generated. In addition, a groove is formed between the pressure receiving shoulder portion and an end serving as the caulking portion.
    Type: Application
    Filed: February 1, 2010
    Publication date: September 16, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takeshi Ishida, Taro Furukubo
  • Publication number: 20100224310
    Abstract: Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.
    Type: Application
    Filed: December 13, 2006
    Publication date: September 9, 2010
    Inventor: Gary E. Jones
  • Publication number: 20100206485
    Abstract: An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.
    Type: Application
    Filed: August 20, 2008
    Publication date: August 19, 2010
    Applicant: NEC LCD TECHNOLOGIES, LTD.
    Inventor: Hideki Kodera
  • Publication number: 20100206454
    Abstract: Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.
    Type: Application
    Filed: April 28, 2010
    Publication date: August 19, 2010
    Inventors: Hidehiro MAEDA, Satoshi Katagiri
  • Patent number: 7775413
    Abstract: A system and method for adjusting the gap between a horn and an anvil in an ultrasonic welding system includes the act of positioning a horn proximal to an anvil, so that a gap is established between the horn and the anvil. A force is applied to the horn, so as to urge the horn toward the anvil. A deformable stop is positioned at a location, such that application of the urging force causes a member operatively connected to the horn to abut the deformable stop, and to deform the stop. The urging force is iteratively adjusted during operation of the horn, so as to adjust the extent of the deformation of the deformable stop, and to maintain the gap between the horn and the anvil substantially constant.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: August 17, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Donald S. Oblak, Satinder K. Nayar, John R. Mlinar, Donald L. Pochardt, Paul M. Fettig
  • Patent number: 7776214
    Abstract: A membrane element in which, after membrane breakage or deterioration, the filtration plate made of a thermoplastic resin can be reused to replace the membrane with a fresh one. The membrane element comprises a filtration plate made of a thermoplastic resin and, bonded to a peripheral smooth surface thereof, a microporous filter membrane which has fine pores formed therein and employs a nonwoven fabric comprising synthetic resin fibers as a support. A hot plate having a shape corresponding to the peripheral shape of the resinous filtration plate is brought into contact with a peripheral smooth surface of the plate so as to form a recessed part in the surface. The temperature of the hot plate is regulated so as to be not higher than the melting point of the nonwoven fabric serving as the support and not lower than the Vicat softening temperature of the filtration plate made of a thermoplastic resin.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: August 17, 2010
    Assignee: GS Yuasa Corporation
    Inventors: Kenichi Saito, Shiro Tanso
  • Patent number: 7771551
    Abstract: A system and method are provided which enable the joining of two materials via ultrasonic welding, including materials normally considered incompatible in traditional ultrasonic welding techniques. The system permits ultrasonic welding of a first material to a second material, the second material including material types normally considered incompatible with the first material and includes an abrader for altering the surface of the material/s to be joined. A first pressure device is operative to vary the position of the abrader and thereby vary the abrasion applied to the materials. An ultrasonic source provides acoustic energy to a weld interface between the materials. A second pressure device is operative to vary the force applied to the interface between the materials while a sensor senses the weld interface temperature.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: August 10, 2010
    Assignee: SWCE
    Inventor: Terrence K. Schroeder
  • Patent number: 7766063
    Abstract: A system to fabricate a composite item includes an end effector, robotic vehicle, sensor, and cutting system. The end effector applies a course to a layup form. The robotic vehicle positions the end effector. The sensor senses an edge of a previously applied course. The cutting system cuts a profile on the course in response to the sensed edge.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: August 3, 2010
    Assignee: The Boeing Company
    Inventors: Arnold J. Lauder, Trevor M. McDonald, Roger J. Ledet, David Boonstra, Antonio Ferreira, Kevin C. Barrett, John Yestrau
  • Patent number: 7758710
    Abstract: A method for joining fabrics, particularly high strength fabrics such as airship hull fabrics, including the steps of: measuring selected parameters of two fabric layers to be joined and the adhesive and any tape or other materials intended to be included in the joint; calculating therefrom an optimal value of a quality control parameter of an ideal joint, such as joint thickness, specific gravity or opacity; assembling the two fabric layers and other materials in the desired order; and applying heat and pressure to the assemblage until the selected quality control parameter of the joint, such as joint thickness, specific gravity or opacity, is satisfied.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: July 20, 2010
    Assignee: Warwick Mills, Inc.
    Inventor: Charles A Howland
  • Patent number: 7745761
    Abstract: An exemplary hot-melting machine (20) includes a worktable (23), a number of carriers (24), a heater (25), at least one cooler (26), and a controller (28). The carriers are located on the worktable and are uniformly spaced apart. Each carrier is configured for holding a workpiece. The heater is configured for heating the workpiece. The cooler is configured for cooling the workpiece. The controller is configured for driving the worktable to rotate, the heater to move down toward and up away from a corresponding one of the carriers, and the at least one cooler to move down toward and up away from another corresponding one of the carriers. At each of successive stages in operation of the hot-melting machine, one of the carriers is aligned with the heater, another one the carriers is aligned with the at least one cooler, and a further one of the carriers is positioned such that a workpiece can be unloaded from the further one of the carriers and another workpiece can be loaded on the further one of the carriers.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: June 29, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd., Foxsemicon Integrated Technology, Inc.
    Inventors: Shun-Ho Chen, Li-Pei Huang, Tzyy-Chyi Tsai, Yun-Hsiang Chuang, Chuan-Xiong Tu, Chin-Hsien Tsai
  • Publication number: 20100157599
    Abstract: A method and apparatus are provided for forming a thermal interface for an electronic product. A thermally conductive polymer having an adhesive layer formed thereon is provided, a surface of an electronic assembly is pressed against the adhesive layer, and the adhesive layer is allowed to cure so that the thermally conductive polymer and the electronic assembly are in thermal communication with each other. The electronic assembly could be pressed against the thermally conductive polymer using a press and die assembly having a pad for supporting the polymer and a controller for controlling operation of the press. The thermally conductive polymer is bonded to the electronic assembly so that no air pockets or voids are formed therebetween.
    Type: Application
    Filed: December 24, 2008
    Publication date: June 24, 2010
    Applicant: Hayward Industries, Inc.
    Inventors: James Anthony Carter, Peter Auld Mackay
  • Patent number: 7722730
    Abstract: The invention relates to a method and device for heat-sealing windows into folding carton blanks for producing liquid-proof folding cartons having film windows. Pieces of film that are cut to measure are placed on the window openings of the folding carton blanks and the edges of the pieces of film are heat-sealed with the folding carton blanks so as to be liquid-proof using heated pressure segments or heat-sealing dies. The folding carton blanks, together with the pieces of film, are fed to a tail pulley for a transport belt by means of the transport belt and are inserted in the gap between the tail pulley and the transport belt resting thereon. In this gap, the blanks and pieces of film are continuously heat-sealed together by means of at least two heated pressure segments that are disposed on the outer periphery of the tail pulley and push radially from inwards against the transport belt in the area of deflection of the transport belt and thus onto the edges of the pieces of film.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: May 25, 2010
    Inventor: Julius Schröder-Frerkes
  • Publication number: 20100101731
    Abstract: A labeler is supported on a frame and includes a waste liner rewind mechanism. The frame may be a two-piece frame, wherein each piece supports a plurality of labeler components. A waste liner rewind wheel is rotatably mounted on one of the frame members, and is capable of supporting the release liner of the label web after the labels have been removed and applied to items. A rewind drive is connected to the waste liner rewind wheel for advancing the waste liner rewind wheel to wind the release liner about the waste liner rewind drive wheel. The rewind mechanism actuates the rewind drive as a function of the amount of tension on the release liner. The labeler may also include a print mechanism positioned along the label web path for printing a desired printed information on the individual labels.
    Type: Application
    Filed: October 22, 2009
    Publication date: April 29, 2010
    Applicant: JOE & SAMIA MANAGEMENT INC.
    Inventors: Joseph Z. Sleiman, Michael R. Schram, Douglas F. Lovegrove
  • Patent number: 7703494
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 27, 2010
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7704345
    Abstract: A method for decorating the cylindrical walls of receptacles, comprising the following steps: a) moveable mandrels are arranged in a loop and are displaced, keeping their axes parallel to a direction D; b) each receptacle is engaged by the cylindrical wall thereof on the mandrel; c) the mandrel is brought into the vicinity of a marking cylinder which turns about a fixed axis parallel to direction D; d) the mandrel is rotated at a speed which is correlated with that of the marking cylinder; e) a transfer film support strip is displaced between the marking cylinder and the mandrel; f) the marking cylinder and mandrel are placed in contact with each other such that the marked area of the transfer film adheres to the cylindrical wall; g) the support strip is removed from the cylindrical wall of the receptacle. The inventive method is adapted to the manufacture of flexible tubes and can be easily implemented on existing devices such as capping machines.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: April 27, 2010
    Assignee: Cebal SAS
    Inventor: Michel Bosshardt
  • Patent number: 7690548
    Abstract: An ultrasonic rotary welding apparatus and methods of using the same are disclosed. The ultrasonic welding device includes an ultrasonic horn and an anvil. The ultrasonic horn is constrained by a mounting system. The mounting system permits the horn to exhibit two degrees of freedom. The first degree of freedom permits translational motion in a direction perpendicular to the longitudinal axis of the horn. The second degree of freedom permits rotation about an axis perpendicular to both the longitudinal axis of the horn and the direction of translational motion.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: April 6, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: John R. Mlinar, Donald S. Oblak, Paul M. Fettig
  • Publication number: 20100065217
    Abstract: An apparatus for bonding an upper half-disc and a lower half-disc to form an optical disc, the apparatus has an upper housing, operable to hold the upper half-disc and a lower housing, operable to support the lower half-disc and operable to contact with the upper housing to form an air-tight chamber between the upper housing and the lower housing. A actuator operates to pair the upper half-disc and the lower half disc by bringing the upper half-disc and the lower half disc into close proximity within the air-tight chamber while pressure in the air-tight chamber is held below ambient air pressure, where bringing the upper half-disc and the lower half disc into close proximity distributes a bonding material between the upper half-disc and the lower half-disc to fill the space between the upper half-disc and the lower half-disc. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 18, 2010
    Inventor: Leonard Krupa, JR.
  • Publication number: 20100050844
    Abstract: A device for processing workpieces uses ultrasound, with an resonant system comprising an ultrasound generator, an ultrasound sonotrode, and an anvil, wherein a workpiece is processed between the anvil and the ultrasound sonotrode. The ultrasound generator comprises a regulation means which has a regulation member connected upstream of the ultrasound generator to receive a feedback signal from the resonant system and to generate a regulation variable which is supplied to the ultrasound generator. A connecting point is provided between the regulation member and the ultrasound generator, at which the regulation variable of the regulation member is linked to a process variable from the processing procedure.
    Type: Application
    Filed: November 11, 2009
    Publication date: March 4, 2010
    Inventors: Gerhard Gnad, Arnold Schneider
  • Patent number: 7669629
    Abstract: A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H, 7, 7A, 7B, 8, 8A-8H, 240a, 240b, 241a, 241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: March 2, 2010
    Assignee: Mitsubishi Heavy Industries Ltd.
    Inventors: Hiroshi Ishibuchi, Junichi Kawase, Yukuharu Seki
  • Publication number: 20100038009
    Abstract: A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 18, 2010
    Inventors: Chouhei Okuno, Masayuki Yamamoto, Saburo Miyamoto
  • Patent number: 7635014
    Abstract: The substrate is placed over a pressure detection film, the element group is placed selectively over the substrate so that a conductive film functioning as an antenna formed over the substrate and a conductive film functioning as a bump formed over the element group overlap each other, the substrate and the element group are pressure-bonded to each other by applying pressure to the substrate and the element group so that the conductive film formed over the substrate and the conductive film functioning as a bump formed over the element group are electrically connected to each other, a value and distribution of pressure applied to the element group at the time of the pressure bonding are detected by the pressure detection film, and the pressure applied at the time of the pressure bonding is controlled, based on the detected pressure value and pressure distribution.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: December 22, 2009
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hidekazu Takahashi, Naoto Kusumoto
  • Publication number: 20090294068
    Abstract: A laminator provided with a means (2) for feeding a planar object to be laminated (7), a rotary lamination film supplier (3) wound up with a lamination film (8) to be adhered on the surfaces of the planar object to be laminated (7) and a mean (4) for heating and pressing the lamination film (8) on the planar object to be laminated (7), wherein: an ID tag (61) is applied on a shaft-end of the rotary lamination film supplier (3), the ID tag (61) is registered a piece of information (S1) which is inherent to the lamination film (8) wound on said lamination film supplier (3), a wireless signal communication means (62) is arranged to face the ID tag (61) for allowing wireless signal communication with the ID tag (61), the wireless signal communication means (62) is connected with a regulation means (63).
    Type: Application
    Filed: May 22, 2009
    Publication date: December 3, 2009
    Inventors: Hideyuki Takeda, Noriyuki Kawashima
  • Patent number: 7595545
    Abstract: An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: September 29, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Shinichi Sueyoshi
  • Patent number: 7566254
    Abstract: A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: July 28, 2009
    Assignee: Rockwell Collins, Inc.
    Inventors: James D. Sampica, Paul R. Nemeth, Vincent P. Marzen
  • Patent number: 7556190
    Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: July 7, 2009
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Takashi Matsumura, Hisashi Ando, Shiyuki Kanisawa, Yasuhiro Suga, Noriaki Kudo
  • Patent number: 7513966
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 7, 2009
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: RE41506
    Abstract: An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding working plane. Furthermore, the tip end of a bonding tool is aligned with the bonding working plane. The object plane of the offset measuring camera is set on the bonding working plane, and the image on the bonding working plane is projected onto the imaging elements of the imaging plane of the offset measuring camera. The imaging elements detect the projected image of the imaging elements of the position detection camera or the image of the tip end of the bonding tool and output this data to the image position measuring part or tool position measuring section of the control block.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: August 17, 2010
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Manabu Haraguchi