Chamber Enclosing Work During Bonding And/or Assembly Patents (Class 156/381)
  • Patent number: 10479134
    Abstract: A method for producing a decorated wall or floor panel comprises providing a pourable carrier material, placing the carrier material between two belt-like conveying means, forming the carrier material under the action of temperature to form a web-shaped carrier, compressing the carrier, treating the carrier under action of pressure using a twin belt press, wherein the carrier is cooled within or upstream of the twin belt press, optionally cooling the carrier, optionally applying a decorative subsurface onto at least a portion of the carrier, applying a decoration reproducing a decorative template onto at least a portion of the carrier, applying a protective layer onto at least a portion of the decoration, optionally structuring the protective layer in order to introduce pores and/or the edge region of the carrier in order to form connecting elements, and optionally treating the carrier for electrostatic discharge prior to any one of the above steps.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 19, 2019
    Assignee: AKZENTA PANEELE + PROFILE GMBH
    Inventor: Hans-Juergen Hannig
  • Patent number: 10131108
    Abstract: A method of manufacturing a composite core can include: wrapping a mandrel in a mandrel wrapping process by securing a mandrel with a winding jig; orienting the composite material at a wrap angle to the mandrel; and depositing the composite material around a circumference of the mandrel. The method can further include assembling the wrapped mandrels in a tool and applying a pressure to the composite material during a curing cycle.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: November 20, 2018
    Assignee: Bell Helicopter Textron Inc.
    Inventors: Phillip A. Kendrick, Paul K. Oldroyd, Levi H. Armstrong, Elizabeth Oberle
  • Patent number: 10000019
    Abstract: An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: June 19, 2018
    Assignee: The Boeing Company
    Inventors: Michael W. Evens, Megan Nicole Watson, Russell L. Keller, Nicholas H. Room, John F. Spalding, Mary Helen Vargas, James D. Chanes, Kathy Lynn Ferguson, Joseph Lawrence Hafenrichter
  • Patent number: 9728438
    Abstract: Production of a holding apparatus (100) for electrostatically holding a component, e.g., silicon wafer (1), includes connecting plate-type first holding element (11, 12) and plate-type core element (13), first holding element (11, 12) having first electrode device (20) and spanning support surface for receiving component (1), and the connecting includes the steps: providing liquid adhesive to at least one of the mutually facing surfaces of first holding element (11, 12) and core element (13), aligning first holding element (11, 12) with first forming tool (40) such that support surface is matched to predetermined master surface (41) of first forming tool (40), and curing the adhesive, wherein first adhesive connecting layer (15) is formed, which has thickness variations constituted by form deviations between support surface and at least one of the mutually facing surfaces. Also described is a holding apparatus (100) configured to electrostatically hold a component, e.g., silicon wafer (1).
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: August 8, 2017
    Assignee: Berliner Glas KGaA Herbert Kubatz GmbH & Co.
    Inventor: Alexander Stein
  • Patent number: 9480814
    Abstract: A method of producing a catheter tube allows a plurality of catheter tubes to be continuously produced using a common core rod, with a proximal end connecting part efficiently attached. The method involves: forming a tubular body on the core rod including an inner layer covering body and an outer layer covering body; attaching a proximal end connecting part, forming a cylindrically shaped hub to a proximal end of the catheter tube, to a radially outer side of the inner layer covering body and the outer layer covering body; severing a tubular continuous body obtained on the core rod is severed at a given position after the proximal end connecting part is attached to produce a plurality of single tubes, each of which is provided with one of the hubs; and removing the core rod from the single tube.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: November 1, 2016
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventors: Hideto Nagata, Katsunori Ebata
  • Patent number: 9038689
    Abstract: A system for fluid partitioning for chemical amplification or other chemical processing or separations of a sample, comprising a first dispenser of a first polymeric sheet, wherein the first polymeric sheet contains chambers; a second dispenser of a second polymeric sheet wherein the first dispenser and the second dispenser are positioned so that the first polymeric sheet and the second polymeric sheet become parallel; a dispenser of the fluid positioned to dispense the fluid between the first polymeric sheet and the second polymeric sheet; and a seal unit that seals the first polymeric sheet and the second polymeric sheet together thereby sealing the sample between the first polymeric sheet and the second polymeric sheet and partitioning the fluid for chemical amplification or other chemical processing or separations.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: May 26, 2015
    Assignee: Lawrence Livermore National Security, LLC
    Inventor: Brian L. Anderson
  • Patent number: 9023163
    Abstract: A method for laminating essentially plate-shaped work pieces with a thermally activated adhesive layer, particularly photovoltaic modules. Work pieces are inserted into a vacuum chamber having a compression element dividing the vacuum chamber in a gas tight fashion that can be raised and lowered by pressure differences. The compression element presses against the work piece which in turn presses against a heating plate which forms a lower side of the vacuum chamber, with processing heat being transferred into the work piece to soften the adhesive. The work piece is first impinged by the compression element with a slight load from approx. 2% to 10% of the defined processing load, and is simultaneously kept below the adhesive activation temperature. Thereafter, the slight load is lifted off the work piece and the work piece is heated to the activation temperature and impinged via the compression element with the processing load.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: May 5, 2015
    Assignee: Robert Bürkle GmbH
    Inventor: Norbert Damm
  • Patent number: 9016342
    Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 28, 2015
    Assignee: Apic Yamada Corporation
    Inventor: Kazuhiko Kobayashi
  • Patent number: 9005381
    Abstract: A method of molding a wind turbine blade in a mold is provided. The method includes applying a film to an inside surface of a mold, assembling component layers for the wind turbine blade on the film, performing curing to harden the component layers, and subsequently removing the cured wind turbine blade from the mold. Also provided is a film suitable for use in a wind turbine blade molding process and a mold suitable for molding a wind turbine blade.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: April 14, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventor: Karsten Schibsbye
  • Patent number: 9004135
    Abstract: The invention provides a method of bonding a first wafer onto a second wafer by molecular adhesion, the method comprising applying a point of initiation of a bonding wave between the first and second wafers, the method further comprising projecting a gas stream between the first wafer and the second wafer generally toward the point of initiation of the bonding wave while the bonding wave is propagating between the wafers. The invention also provides a bonding apparatus for carrying out the bonding method.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 14, 2015
    Assignee: Soitec
    Inventors: Arnaud Castex, Marcel Broekaart
  • Patent number: 8986479
    Abstract: An in-situ double vacuum debulk (DVD) composite repair system designed to produce partially or fully cured autoclave-quality hot-bond composite repairs on contoured structures. The system provides vacuum pressure for hot bond repairs to be performed on flat and contoured structures using one set-up capable of debulking (partially curing) and then fully curing composite repairs on composite and metallic aircraft structures. The use of in-situ DVD also eliminates handling of the patch/adhesive when transferring from an off-aircraft DVD chamber to the repair site on the aircraft. This can increase the probability of successful repairs because the possibility of contaminating and misaligning the adhesive and repair patch are eliminated.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: March 24, 2015
    Assignee: The Boeing Company
    Inventors: Michael W. Evens, Karl Edward Nelson, John F. Spalding, Jr., James D. Chanes, Joel P. Baldwin, Paul S. Rutherford
  • Patent number: 8985174
    Abstract: A reusable vacuum bag for processing parts is made by encapsulating a generally rigid frame within a flexible diaphragm.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: March 24, 2015
    Assignee: The Boeing Company
    Inventors: Michael Kenneth-Que Louie, Kenneth M. Dull, Timothy David Aquino
  • Publication number: 20150075720
    Abstract: The stack manufacturing apparatus includes a first supporting body supply unit which is configured to intermittently unroll a roll sheet-shaped first supporting body and includes one of a pair of tension applying devices capable of applying tension to the unrolled first supporting body; a first adhesive layer formation unit configured to form a first adhesive layer over the first supporting body while the first supporting body supply unit suspends unrolling of the first supporting body; a first bonding unit configured to bond the first supporting body and a sheet-shaped member using the first adhesive layer; and a control unit which is configured to hold an end portion of the first supporting body and includes the other of the pair of tension applying devices.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 19, 2015
    Inventors: Yoshiharu Hirakata, Satoshi Seo
  • Publication number: 20150059968
    Abstract: A device for printing a functional material on a biocompatible thin-film is provided, including: a feeder for feeding a thin-film sheet including the biocompatible thin-film and a first support into the printing device; a controller for loading makeup information for printing the functional material on the thin-film; a printing unit for printing the functional material corresponding to the makeup information on the thin-film based on a makeup signal from the controller; a feeder for feeding a second support into the device; a transfer unit for transferring a thin-film printed body, the thin-film on which the functional material is printed by the printing unit from the first support to the second support; and a delivery unit for delivering the transferred thin-film printed body to outside the device. This configuration enables people who lack sufficient makeup knowledge, techniques, or time to apply makeup easily, quickly, and safely.
    Type: Application
    Filed: November 5, 2014
    Publication date: March 5, 2015
    Inventors: MASAYO SHINODA, TOMOKI MASUDA, HARUKA KUSUKAME, MITSURU HARADA
  • Publication number: 20150053350
    Abstract: A bonding method for bonding a semiconductor chip to an underlying structure includes aligning an electrical contact of a lower surface of the semiconductor chip with an electrical connection member of an upper surface of the underlying structure, the electrical contact at least partially encased by a support material. The method further includes first heating the semiconductor chip and the underlying structure, deforming the electrical contact, and curing the support material encasing the deformed electrical contact. The method still further includes second heating the semiconductor chip and the underlying structure to bond the electrical contact of the semiconductor chip to the electrical connection member of the underlying structure while maintaining the support material in a cured state.
    Type: Application
    Filed: April 25, 2014
    Publication date: February 26, 2015
    Inventors: ILYOUNG HAN, KYOUNGRAN KIM, DONGGIL SHIM, YOUNGJOO LEE, BYUNGGON KIM, BYEONGKAP CHOI
  • Patent number: 8950046
    Abstract: A method for disassembling a low-pressure process apparatus. The method provide a transmission device and a low-pressure process apparatus; and moves the housing to a transmission device in a first horizontal direction via the first roller set.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: February 10, 2015
    Assignee: AU Optronics Corp.
    Inventor: Ting-Hui Huang
  • Publication number: 20150031189
    Abstract: Embodiments of mechanisms for cleaning a surface of a semiconductor wafer for a hybrid bonding are provided. The method for cleaning a surface of a semiconductor wafer for a hybrid bonding includes providing a semiconductor wafer, and the semiconductor wafer has a conductive pad embedded in an insulating layer. The method also includes performing a plasma process to a surface of the semiconductor wafer, and metal oxide is formed on a surface of the conductive structure. The method further includes performing a cleaning process using a cleaning solution to perform a reduction reaction with the metal oxide, such that metal-hydrogen bonds are formed on the surface of the conductive structure. The method further includes transferring the semiconductor wafer to a bonding chamber under vacuum for hybrid bonding. Embodiments of mechanisms for a hybrid bonding and a integrated system are also provided.
    Type: Application
    Filed: July 24, 2013
    Publication date: January 29, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Chau Chen, Chih-Hui Huang, Yeur-Luen Tu, Cheng-Ta Wu, Chia-Shiung Tsai, Xiao-Meng Chen
  • Publication number: 20150013881
    Abstract: The invention relates to a device (1) for producing a case having a large length for food, in particular for sausages, from a plurality of individual case sections made of casings that contain collagens, such as natural casings or collagen-containing artificial casings, comprising a mandrel (2) and at least two sleeve sections (3), wherein the sleeve sections (3), in order to create an overlapping area (4), are pushed over the mandrel (2) and arranged such as to overlap each other, a heating element (5) for temporarily exchanging heat between the heating element (5) and the overlapping area (4), such that the case sections are at least partially welded to each other in the overlapping area (4), a deformable extension body (6), wherein the deformable extension body annularly surrounds the mandrel (2) and is arranged inside the case sections (3), wherein the deformable extension body (6) is made of an elastically deformable material, and a mold (7) that encloses the mandrel (2) in some sections.
    Type: Application
    Filed: February 4, 2013
    Publication date: January 15, 2015
    Applicant: CDS Hackner GmbH
    Inventor: Michael Hackner
  • Patent number: 8931535
    Abstract: An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: January 13, 2015
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
  • Publication number: 20140374012
    Abstract: A device and method for manufacturing a bonded component with fiber-reinforced plastics with a base molding tool and a molding tool. The adhesive component is arranged between the base molding tool and the molding tool. The bonded component has a base laminate and a reinforcement laminate. The molding tool is covered with an aeration material and a vacuum envelope. The vacuum envelope is sealed with respect to the base molding tool. The molding tool is at least partially formed from a metal alloy, which has an anomalous thermal expansion coefficient. Undesirable lost cavities in the device are reduced to minimize reductions in thickness in the end face or longitudinal face regions of the cured bonded component. A seal can additionally be provided, as can at least one molding tool free of projections, and also an aeration material arranged on the at least one molding tool in only some regions.
    Type: Application
    Filed: July 27, 2012
    Publication date: December 25, 2014
    Inventor: Heinz Bardenhagen
  • Publication number: 20140367027
    Abstract: A cover window manufacturing apparatus includes a plurality of fixed plates, a plurality of moving plates, a plurality of molds and a driver. The plurality of fixed plates is layered and spaced apart at a distance from each other. The plurality of moving plates is layered, spaced apart at a distance from each other and respectively disposed under the plurality of fixed plates. A plurality of connection members integrally connects the plurality of moving plates with each other. The plurality of molds is respectively provided on the plurality of moving plates, and inner spaces for molding the cover window are respectively defined in the plurality of molds. The driver is coupled to one of the plurality of moving plates, and is configured to move the plurality of moving plates towards the plurality of fixed plates such that the plurality of molds are pressed to the plurality of fixed plates.
    Type: Application
    Filed: December 15, 2013
    Publication date: December 18, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventor: Moon-Seok ROH
  • Patent number: 8910688
    Abstract: An autoclave may be reconfigured to accommodate differently shaped parts by relatively rotating portions of the autoclave.
    Type: Grant
    Filed: February 26, 2011
    Date of Patent: December 16, 2014
    Assignee: The Boeing Company
    Inventors: Sergey Barmichev, Kevin Matthew Retz
  • Patent number: 8905103
    Abstract: A tool defines a piston/cylinder with first and second chambers on either side of the piston. A sealable port couples the first chamber to ambient environment. One end of the tool (i) defines a volume that is open to ambient environment, and (ii) has a cartridge coupled thereto such that the volume remains open to ambient environment. The cartridge defines (i) a chamber filled with a meltable material, and (ii) a channel coupling the material-filled chamber to ambient environment. A melting device in thermal communication with the meltable material simultaneously heats an air/water mixture in the second chamber and melts the meltable material. An element releasably coupled to the tool spans a region within the cartridge that lies within the channel. The element incorporates a check valve separating the volume defined by the tool and ambient environment.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: December 9, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Robert D. Conner
  • Patent number: 8899291
    Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: December 2, 2014
    Assignees: Nichigo-Morton Co., Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Ryoichi Yasumoto, Kazutoshi Iwata, Kinya Kodama, Grigoriy Basin
  • Patent number: 8899289
    Abstract: When joining a processing target substrate and a supporting substrate together by suction-holding the processing substrate and the supporting substrate respectively on a first holding unit and a second holding unit arranged to face each other and pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, the present invention preheats at least the processing target substrate before suction-holding the processing target substrate on the first holding unit to suppress generation of particles when joining the processing target substrate and the supporting substrate together so as to properly perform the joining of the processing target substrate and the supporting substrate.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: December 2, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Masatoshi Deguchi, Masatoshi Shiraishi, Shinji Okada
  • Publication number: 20140338815
    Abstract: A mould shell for forming a wind turbine blade (20) comprises at least two mould shell sections (401, 402) each having a mould surface with a recessed portion (419, 420) adjoining the connecting edges (407, 408) between the mould shell sections. A bridging sheet (421) is accommodated in the recessed portions (419, 420) of the mould shell sections (401, 402). The bridging sheet (421) fills up the recessed portions.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 20, 2014
    Inventors: Olav Davis, Mohana Krishna Dhamodharan, Damien Rajasingam, Glenn Thomas
  • Patent number: 8876999
    Abstract: Techniques and apparatus for providing a flexible shape low volume autoclave are disclosed. In one embodiment, an autoclave includes an elongated pressure vessel that is sealed on both ends and has a circumferential joint between a first portion and a second portion. The autoclave further includes the portions defining an interior configured for accepting an elongated part, the joint being configured to create an angle between the portions and further creating an opening with a seal, the opening facilitating an insertion of the part into the interior, and the seal enabling pressurization of the interior.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: November 4, 2014
    Assignee: The Boeing Company
    Inventors: Sergey D. Barmichev, Max U. Kismarton, Stephen T. Brown
  • Patent number: 8877116
    Abstract: A method of manufacturing a wind turbine blade shell part comprising fiber material impregnated with cured resin is described. The method comprises the steps of: a) providing a first mold part having a first forming surface with a contour that defines at least a part of an outer surface of turbine blade shell part, b) arranging fiber material in the first mold part, the fiber material comprising fibers of a magnetizable material, c) providing a resin in the first mold part simultaneous with and/or subsequent to step b), and d) curing the resin in order to form the wind turbine blade shell part or wind turbine blade. The fiber material is retained against the first forming surface by use of magnet means during step b) and/or step c).
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: November 4, 2014
    Assignee: LM Glasfiber A/S
    Inventor: Peter Grabau
  • Patent number: 8858208
    Abstract: Climbing products containing rails decorated using veil products colored, patterned, painted or in combination with marking methods such as company names and logos and resin formulation designed to withstand exposure to UV radiation with minimal change in appearance which create specific appearances for applications, enhance weathering performance, and facilitate processing efficiency. A combination of a filler free resin or resin with filler and coated veil systems to create a synergistic weather resistance surface with self-contained color, pattern, picture, logo or combination of said same for climbing products. A system for producing components at a rate of greater than 5 ft/min. Various methods, system, a ladder rail.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: October 14, 2014
    Assignee: Werner Co.
    Inventor: James Vincent Gauchel
  • Patent number: 8846456
    Abstract: A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: September 30, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventor: Karl Weidner
  • Publication number: 20140224409
    Abstract: In an exemplary implementation, a system for producing an electrical module includes a pressure chamber configured to receive a first body, a second body, and a sinter material therebetween. The system further includes a pressure generator configured to apply non-mechanical pressure in the pressure chamber to form the electrical module by attaching the first body to the second body using the sinter material. The pressure chamber is configured to enclose the first body over the second body. Furthermore, the pressure chamber includes a bottom opening configured to receive at least the first body. The non-mechanical pressure can include gas pressure.
    Type: Application
    Filed: January 24, 2014
    Publication date: August 14, 2014
    Applicant: International Rectifier Corporation
    Inventor: Henning M. Hauenstein
  • Patent number: 8795463
    Abstract: A joint system includes: a transfer-in/out station capable of holding a plurality of substrates or a plurality of superposed substrates, and transferring-in/out the substrates or superposed substrates to/from a processing station; and the processing station performing predetermined processing on the substrates and joining the substrates together. The processing station includes: a surface activation apparatus activating a front surface of the substrate; a surface hydrophilizing apparatus hydrophilizing and cleaning the front surface of the substrate; a joint apparatus joining the substrates together; and a transfer region for transferring the substrate or superposed substrate to the surface activation apparatus, the surface hydrophilizing apparatus, and the joint apparatus.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 5, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Takahiro Nishibayashi, Yasuharu Iwashita, Takeshi Tamura, Tatsuya Kitayama
  • Patent number: 8758532
    Abstract: An device for simultaneous application of elastoplastic spacer tapes to two glass panes with identical outline shape and identical dimensions has two application heads (107) that can be adjusted essentially vertically up and down on linear axles (105). The application heads (107) are moved synchronously, likewise the two glass panes by the holding devices that are assigned to them and that move the glass panes in a direction that is perpendicular to the direction of motion of the application heads (107). Thus, it is sufficient to measure a single glass pane of a triple insulating glass element, and both application panes of the insulating glass element can be covered at the same time with spacer tapes, so that time is saved, and the two application panes can be assembled with the cover pane in a shorter time interval into an insulating glass element with three panes.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: June 24, 2014
    Assignee: INOVA Lisec Technologiezentrum GmbH
    Inventors: Leopold Mader, Leopold Karner
  • Patent number: 8746311
    Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: June 10, 2014
    Assignee: Rockwell Collins, Inc.
    Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
  • Patent number: 8723809
    Abstract: A touch panel system and process are disclosed. A touch panel system may include: a touch panel; and a deformable glass substrate. A process for manufacturing a touch panel system may include one or more of the following: coupling a deformable glass substrate to a touch panel.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: May 13, 2014
    Assignee: Rockwell Collins, Inc.
    Inventors: Tracy J. Barnidge, Paul R. Nemeth, James D. Sampica, Sandra S. Dudley, Gary N. Prior
  • Patent number: 8714225
    Abstract: Disclosed are systems and methods for bonding wafers by use of microwave energy. Various components that facilitate relatively quick and efficient bonding provided by microwave energy are disclosed. In certain embodiments, devices and methods for applying desirable compression to the wafers can be implemented. In certain embodiments, devices and methods for providing a controlled gas environment such as vacuum can be implemented. In certain embodiments, devices and methods for maintaining the integrity of microwave mode of operation during the bonding process can be implemented. In certain embodiments, devices and methods for increasing throughput of the bonding process can be implemented.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: May 6, 2014
    Inventor: Nasser K. Budraa
  • Patent number: 8708014
    Abstract: A method for producing a composite structure comprising fiber reinforced material by means of vacuum assisted resin transfer molding is described. The fiber material is impregnated with liquid resin, and the method comprising the steps of: a) providing a forming structure comprising a rigid mold part and a second mold part, b) placing the fiber material in the rigid mold part, c) sealing the second mold part against the rigid mold part to form a mold cavity, d) connecting a source of uncured fluid resin to at least one resin inlet communicating with the mold cavity, e) connecting at least one vacuum outlet communicating with the mold cavity, f) evacuating the interior of the forming structure through the at least one vacuum outlet, g) supplying uncured resin from the source of uncured resin to the mold cavity through the at least one resin inlet so as to fill the mold cavity with resin, and h) curing the resin in order to form the composite structure.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: April 29, 2014
    Assignee: LM Glasfiber A/S
    Inventor: Karsten Schibsbye
  • Patent number: 8689851
    Abstract: A machine for waterproofing semimanufactured products including footwear, clothing items, and accessories. The machine has a pressing device with at least one pair of deformable plates that have a hollow body. The pressing surface is elastic and suitable for being urged outwards by a fluid pressure. At least one of the deformable plates is fixed in a mobile manner to a support structure for opening or closing the pressing device around at least one shaped support which is provided with transport means to and from the pressing device and is suitable for supporting the semimanufactured product during the pressing with at least one waterproofing sheath.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: April 8, 2014
    Assignee: OutDry Technologies Corporation
    Inventor: Luca Morlacchi
  • Patent number: 8673205
    Abstract: A process for manufacturing a piece made of composite material that includes fibers that are immersed in a resin matrix, whereby the piece is placed in a first chamber with at least one flexible wall. The process includes a thermal cycle with essentially a first phase (50) at a first temperature during which the resin is liquid or in the “gel” state, and then a second phase (52) at a second temperature that is higher than the first during which solidification of the piece takes place by polymerization of the resin. An external pressure is applied to the outside of the first chamber and an internal pressure is generated inside the first chamber, wherein during the first phase (50), the relative internal pressure is less than 0 during a first period, and then greater than 0 during a second period preceding the beginning of the polymerization for reducing the porosity rate.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: March 18, 2014
    Assignee: Airbus Operations S.A.S.
    Inventor: Denis De Mattia
  • Patent number: 8663419
    Abstract: A method of using a assembly facilitator for a pulp-molded shell with polymer liner containing systems to precisely create a integral pulp molded shell is disclosed along with the assembly facilitator itself.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: March 4, 2014
    Assignee: Ecologic
    Inventors: Julie Corbett, Romeo Graham, Robert Watters, Michael Sirois
  • Patent number: 8652279
    Abstract: The invention relates to a method for the production of sandwich components with an open core structure and a cover layer applied to each side, wherein the cover layers are formed with a curable plastic material, and the sandwich component is cured in a closed device under pressure. A charging gas, which may be nitrogen or air, is introduced to the core structure prior to at least partial solidification of the cover layers, wherein a charging gas pressure p Charging gas is selected that is less than or equal to an operating pressure p operating of the closed device in order to, in particular, at least largely prevent the formation of sink marks in the cover layers. Furthermore, the invention relates to a press for implementing the method.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: February 18, 2014
    Assignee: Airbus Operations GmbH
    Inventors: Karsten Hesse, Heinz-Peter Busch
  • Publication number: 20140008005
    Abstract: A method of retreading a tire includes positioning a cured rubber tread around an outer circumferential surface of a tire casing to form a green retreaded tire assembly, the tread having a plurality of radially outwardly extending lugs; and placing the green retreaded tire assembly within an envelope having a plurality of radially outwardly extending recesses, each recess receiving a lug.
    Type: Application
    Filed: June 23, 2013
    Publication date: January 9, 2014
    Inventor: Hideo Hara
  • Patent number: 8607836
    Abstract: The present disclosure relates to converting lines for manufacturing absorbent articles, and more particularly, to converting lines having modular process equipment modules and converting mechanisms reconfigurable for making different absorbent articles.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: December 17, 2013
    Assignee: The Procter & Gamble Company
    Inventors: Patrick John Healey, Stoyan Lokar, Daniel Jon Amundson, James Jay Benner, Jose Mauricio Berrizbeitia
  • Patent number: 8596321
    Abstract: A method for manufacturing light emitting devices is provided. The method may reduce the inner pressure of a laminated image emitting device panel, thereby preventing failure of the panel. The method includes holding a first substrate with a lower chuck located in a vacuum chamber; holding a second substrate with an upper chuck located opposite the first chuck in the vacuum chamber; creating a high vacuum in the vacuum chamber; correcting positions of the first substrate and the second substrate; supplying gas having a temperature of about 50 to about 200° C. into the vacuum chamber; temporarily laminating the first substrate and the second substrate; venting the vacuum chamber; and bonding the first substrate and the second substrate. The panel is laminated after being filled with a heated gas and thus, when it is exposed to room temperature, the mobility of the gas decreases while reducing its initial inner pressure, thereby preventing panel failure.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: December 3, 2013
    Assignee: LG Display Co., Ltd.
    Inventors: Choong Keun Yoo, In Sun Yoo, Kang Ju Lee
  • Patent number: 8584726
    Abstract: A tool and method for bonding layers of a shell by the differential pressure bonding process. The tool and method includes a plurality of separable mandrel segments that combine to form a mandrel having a longitudinal axis, an outer surface, an upper end, and at least one substantially continuous inner surface. The inner surface has a substantially axisymmetric shape having complex curvature. In this embodiment, the tool further includes a retort configured to at least partially shroud the outer surface and upper end of the hollow body. The retort includes at least one vacuum port. The tool is configured to facilitate the compression of a plurality of layers of a multi-layer shell having complex curvature as the shell layers and an interdisposed bonding material are heated to an elevated bonding temperature.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: November 19, 2013
    Assignee: Rohr, Inc.
    Inventors: Thomas Edward Sommer, Mark Alan Ramsey, David Dwain Rishel
  • Publication number: 20130292058
    Abstract: It is provided that a method and a system for manufacturing an optical display device, which make it possible to bond an optical member and an optical display unit together with a certain degree of cleanliness maintained. The method for manufacturing an optical display device including an optical display unit(W) and an optical member(11, 12) bonded to the optical display unit(W), which includes a bonding step for bonding the optical member(11, 12) to the optical display unit(W) in an environment with an airflow.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Kazuo Kitada, Satoru Koshio, Takuya Nakazono, Tomokazu Yura
  • Patent number: 8568125
    Abstract: Disclosed herein are roll fed air heated flotation ovens and related thermoforming systems, assemblies, and machines that enable the corrugation-free expansion of a gas impregnated thermoplastic web passing through an oven chamber (without use of a pin-chain assembly), as well as to related methods. In an embodiment, a gas impregnated thermoplastic web is conveyed and expanded through an elongated air heated oven chamber, wherein the elongated oven chamber includes a plurality of downwardly directed heated air nozzles positioned at regular intervals along and within the upper portion of the oven chamber, and a plurality of upwardly directed heated air nozzles positioned at regular intervals along and within the lower portion of the oven chamber, but staggered apart from the downwardly directed heated air nozzles such that the gas impregnated thermoplastic material web undulates in an up and down wavelike fashion, thereby minimizing sagging, bagging, puckering, and/or buckling of the web.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: October 29, 2013
    Assignee: MicroGREEN Polymers Inc.
    Inventors: Gregory Branch, Krishna Nadelia
  • Publication number: 20130276987
    Abstract: A stabilizing mechanism for resisting relative movement of upper and lower laminates of a composite structure having a core comprises a lower grip strip and at least one upper grip strip. The lower grip strip may be mounted to a tool upon which the composite structure may be processed. The lower grip strip may include an outer surface having at least one engagement feature for engaging at least one of the upper and lower laminates which make up the composite structure. The upper grip strip may have opposing outer surfaces which may include at least one engagement feature for engaging the lower strip and at least one of the upper and lower laminates.
    Type: Application
    Filed: June 21, 2013
    Publication date: October 24, 2013
    Inventors: Doan D. Pham, Mark W. Tollan, Richard M. Outzen, John C. Lockleer, Christopher G. Harris
  • Patent number: 8540002
    Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: September 24, 2013
    Assignee: Rockwell Collins, Inc.
    Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
  • Publication number: 20130244400
    Abstract: A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 19, 2013
    Applicant: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: GREGORY GEORGE, Stefan Lutter