Chamber Enclosing Work During Bonding And/or Assembly Patents (Class 156/381)
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Patent number: 8540002Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.Type: GrantFiled: March 14, 2012Date of Patent: September 24, 2013Assignee: Rockwell Collins, Inc.Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
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Publication number: 20130244400Abstract: A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.Type: ApplicationFiled: March 8, 2013Publication date: September 19, 2013Applicant: SUSS MICROTEC LITHOGRAPHY GMBHInventors: GREGORY GEORGE, Stefan Lutter
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Patent number: 8535470Abstract: A mold for shaping a baseball or softball is constructed from two identical figure of 8 shaped mold pieces which correspond to an outside shape of a ball. The two mold pieces are made from flexible materials such as rubber, silicone or plastic resin, fit onto each other to form the outside shape of the ball. Joining areas of the two mold pieces have joining edges, and on inside sides of the joining edges on interior surfaces of the two mold pieces grooves are set which form a raised sewn section on a surface of the ball cover, and a material inlet and air outlet are formed where the two mold pieces join.Type: GrantFiled: July 20, 2011Date of Patent: September 17, 2013Inventor: Shyi-Ming Chen
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Patent number: 8529726Abstract: A method for producing a hollow product comprises a film arrangement step wherein a film is arranged on a fiber layer; a molded body arrangement step wherein a molded body having a recess is arranged on the film after the film after the film arrangement step in such a manner that the opening of the recess faces the film; the gas present between the fiber layer and the film is evacuated; the gas present between the film and the molded body is evacuated; a film-molded body bonding step wherein the film and the molded body are bonded together after the step of gas evacuation from between the film and the molded body; and a fiber layer-film bonding step wherein the fiber layer and the film are bonded together after the step of gas evacuation from between the fiber layer and the film.Type: GrantFiled: December 8, 2009Date of Patent: September 10, 2013Assignee: Nippi CorporationInventors: Terukuni Fukuoka, Keiichi Hosoda
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Patent number: 8529715Abstract: An apparatus for attaching substrates includes a first chamber for supporting a first substrate and a second chamber for supporting a second substrate. A main seal member is placed between the first chamber and the second chamber so as to maintain a seal and a gap between the chambers. An alignment control part is placed between the first chamber and the second chamber so as to maintain the seal, and also to allow the second chamber to move with respect to the first chamber in order to align the substrates. The alignment control part may also control a gap between the chambers, to thereby maintain a uniform gap between the substrates.Type: GrantFiled: March 4, 2013Date of Patent: September 10, 2013Assignee: ADP Engineering Co., Ltd.Inventors: Bong Hwan Choi, Seok Hee Shim
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Patent number: 8511362Abstract: Method and apparatus for consolidating and curing a composite part places and registers a composite laminate layer of thermoset polymer matrix and reinforcing fibers onto the temperature-controlled curing surface of a heated curing mold and provides a base mold with base surface covered by a rubber mask having a mask surface. Three-dimensional surfaces of the curing, base and mask surfaces complement each other so with the curing and base molds adjacent, a pressure space is formed between the base and curing surfaces that contains the compressed rubber mask, a bleeder layer for removing excess air and polymer matrix, and the composite laminate, the pressure space having a perimeter.Type: GrantFiled: January 11, 2010Date of Patent: August 20, 2013Inventors: Daniel Walczyk, Casey Hoffman, Michael Righi, Suvranu De, Jaron Kuppers
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Publication number: 20130193610Abstract: A method for producing a moulding, the shape of which is adapted to an initial mould, in which method a plurality of layers are deformably placed on top of one another such that said layers can be joined to each other by heat, the layers are deformed by being pressed onto the initial mould and in order to join the layers, heat is applied in the deformed state, characterized by the fact that in the arrangement made of layers, at least one converter element is introduced that transforms supplied energy into heat energy and with which at least parts of the layers are heated to join the layers.Type: ApplicationFiled: August 8, 2011Publication date: August 1, 2013Applicant: OTTO BOCK HEALTHCARE GMBHInventors: Olaf Kroll-Orywahl, Gordon Siewert, Michael Nolte, Michael Ottleben
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Publication number: 20130119710Abstract: A method for fastening an in particular tub-shaped floor panel to an in particular frame-like vehicle structure is provided. The method includes applying an adhesive to a contact surface of the floor panel and/or of the vehicle structure, and joining the floor panel and the vehicle structure. The method includes expanding and/or activating the adhesive by heating the joint vehicle structure-floor panel composite.Type: ApplicationFiled: November 9, 2012Publication date: May 16, 2013Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventor: GM GLOBAL TECHNOLOGY OPERATIONS LLC
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Publication number: 20130112334Abstract: A room temperature bonding method of the present invention includes a step of activating two substrates to prepare two activated substrates; a step of bonding the two activated substrates to produce a bonding resultant substrate; a step of performing annealing of the bonding resultant substrate to reduce residual stress of the bonding resultant substrate. According to such a room temperature bonding method, the residual stress of the bonding resultant substrate can be reduced and the quality can be improved.Type: ApplicationFiled: July 29, 2011Publication date: May 9, 2013Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Kensuke Ide
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Publication number: 20130098558Abstract: In one aspect, the invention provides a laminating pouch. The laminating pouch includes first and second plies bonded by a pre-sealed edge. The laminating pouch also includes indicia in the pre-sealed edge that correspond to a property of the laminating pouch. The laminating pouch is configured to receive an article between the first and second plies and laminate the article when processed in a laminator.Type: ApplicationFiled: October 22, 2012Publication date: April 25, 2013Applicant: ACCO BRANDS CORPORATIONInventor: ACCO BRANDS CORPORATION
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Publication number: 20130098560Abstract: The carrying apparatus is a carbon fiber-containing resin sheet carrying apparatus for carrying a carbon fiber-containing resin sheet W heated in a heating furnace to a pressing device, comprising a slider 4 that moves between the heating furnace and the pressing device and a sheet holder 10 that is mounted thereon and chucks both the end parts of the carbon fiber-containing resin sheet W to apply tension. The sheet holder 10 can have a structure such that it comprises chuck claws 13, 16 and a tension unit 19 that displaces these chuck claws to the outside. The sheet holder 10 may have a structure such that it comprises a holding metal fitting with a spring, that is arranged inside a holding frame and a chuck claw that chucks this holding frame.Type: ApplicationFiled: October 12, 2012Publication date: April 25, 2013Applicants: NGK Kiln Tech, Corporation, NGK Insulators, Ltd.Inventors: NGK Insulators, Ltd., NGK Kiln Tech, Corporation
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Patent number: 8408263Abstract: A vacuum lamination device for laminating a lamination member includes a base plate having an uneven surface contacting the lamination member for placing the lamination member, a frame member fixed to the base plate and having a discharge port for evacuating a processing space, and a cover member for hermetically sealing the processing space in the lamination process. The lamination member is placed on the uneven surface, and the cover member is placed so as to cover the lamination member. Then, a gaseous material in the processing space is evacuated through the discharge port while heating the processing space.Type: GrantFiled: March 16, 2007Date of Patent: April 2, 2013Assignee: Fuji Electric Holding Co., Ltd.Inventor: Yasuhiro Yokoyama
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Publication number: 20130075034Abstract: The invention relates to an oven (10) for the production of stratified sheets (12) from pre-assembled sheets (14). The pre-assembled sheets (14) comprise at least two sheets (16, 18) and at least one sheet of polymer material (20). The oven (10) comprises a hot chamber (22) which in turn comprises heating means (26) and an inlet opening (28) provided with first closing means (30). The oven also comprises a cold chamber (24) communicating with the hot chamber (22) and able to be separated from the hot chamber (22 via separation means (23). The cold chamber comprises cooling means (36) and an outlet opening (42) provided with second closing means (44). The invention also relates to a method for the production of stratified sheets.Type: ApplicationFiled: May 25, 2011Publication date: March 28, 2013Applicant: LISEC COSTRUZIONE MACCHINE ITALIA SRLInventor: Loris Grando
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Patent number: 8403018Abstract: Equipment of manufacturing a wearing article includes a plurality of units movably arranged on a unit basis for transferring a half-completed product of the wearing article. The plurality of units is configured to perform the steps of shaping pulverized pulp into an absorbent body, sandwiching the absorbent body between first and second sheet members to obtain a continuous body of an absorbent main body, producing at least apart of a belt element, severing the continuous body to obtain the absorbent main body, affixing a pair of the belt elements to end sections of the absorbent main body, folding the absorbent main body in two, and superposing the belt elements on each other, joining the superposing belt elements at intervals at a to-be-joined portion to obtain the waist-belt section, and severing the continuous body corresponding to the to-be-joined portion for each waist-belt section to obtain the wearing article.Type: GrantFiled: July 24, 2008Date of Patent: March 26, 2013Assignee: Uni-Charm CorporationInventors: Hiroki Yamamoto, Kenji Takeuchi, Fumihito Kawazu
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Patent number: 8393370Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.Type: GrantFiled: July 24, 2007Date of Patent: March 12, 2013Assignee: Hitachi Plant Technologies, Ltd.Inventors: Masaru Mitsumoto, Shigeo Watanabe, Tatsuhito Kunihiro
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Patent number: 8393371Abstract: A system for processing a composite material may comprise a chamber, a mandrel, an upper ramp, and an upper diaphragm. The chamber generally provides structural support while a vacuum is applied to the system and may have a six-sided generally rectangular box shape. The mandrel generally provides support for the composite material, and may be located within the chamber. The upper ramp generally provides a path for the upper diaphragm to follow under vacuum, and may be located adjacent to the mandrel and tilted at approximately 45 degrees downward thereto. The upper diaphragm may be placed over an opening along one side of the chamber. During processing, a vacuum may be applied to chamber and the upper diaphragm may be pulled inward through the opening to press the composite material against the mandrel.Type: GrantFiled: April 6, 2010Date of Patent: March 12, 2013Assignee: Spirit AeroSystems, Inc.Inventors: William Joseph Bryant, Christopher J. Morrow, Kenneth I. Fried
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Patent number: 8387674Abstract: The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.Type: GrantFiled: March 24, 2008Date of Patent: March 5, 2013Assignee: Taiwan Semiconductor Manufacturing Comany, Ltd.Inventors: Chen-Hua Yu, Jui-Pin Hung, Weng-Jin Wu, Jean Wang, Wen-Chih Chiou
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Patent number: 8388781Abstract: An apparatus for attaching substrates includes a first chamber for supporting a first substrate and a second chamber for supporting a second substrate. A main seal member is placed between the first chamber and the second chamber so as to maintain a seal and a gap between the chambers. An alignment control part is placed between the first chamber and the second chamber so as to maintain the seal, and also to allow the second chamber to move with respect to the first chamber in order to align the substrates. The alignment control part may also control a gap between the chambers, to thereby maintain a uniform gap between the substrates.Type: GrantFiled: October 5, 2007Date of Patent: March 5, 2013Assignee: ADP Engineering Co., Ltd.Inventors: Bong Hwan Choi, Seok Hee Shim
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Patent number: 8383063Abstract: A microchip 1 in which a resinous film can be inhibited from sagging into a channel. The microchip 1 comprises: a resinous substrate 2 having a channel groove formed therein; and a resinous film bonded to a surface of the substrate on which the channel groove has been formed. A micro-channel 3 including channels 3A and channels 3B is formed by the channel groove and the resinous film 10. The total length of the channels 3B, which is parallel to the X direction for the resinous substrate 2, is larger than the total length of the channels 3A, which is parallel to the Y direction for the resinous substrate 2. The resinous substrate 2 has been bonded to the resinous film so that the sides parallel to the channels 3B are parallel to the TD direction of the resinous film and that the sides parallel to the channels 3A are parallel to the MD direction of the resinous film.Type: GrantFiled: August 10, 2009Date of Patent: February 26, 2013Assignee: Konica Minolta Opto, Inc.Inventors: Hiroshi Hirayama, Toshinori Takimura
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Patent number: 8377248Abstract: A system and method for forming a hollow, complex, monolithic composite part. Composite material may be placed around the mandrel, then an internal impermeable membrane may be placed into and/or through tunnels formed in the mandrel. Next, an external impermeable membrane may be placed around the composite material and sealed against itself and the internal impermeable membrane such that the mandrel and the composite material are both contained in an airtight manner between the internal and external impermeable membranes. Air may then be removed from within the sealed impermeable membranes, compressing the impermeable membranes against the mandrel and/or the composite material. The consolidated composite material may be hardened to form the composite part. Finally, the impermeable membrane may be removed from around the hollow composite part and from within the mandrel, followed by removal of the mandrel from within the composite part by breaking it up into smaller pieces.Type: GrantFiled: June 16, 2010Date of Patent: February 19, 2013Assignee: Spirit AeroSystems, Inc.Inventors: Robert Alexander Coleman, Timothy Dean King, Steven Fillmore Hanson, Leonard Lloyd Baca
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Publication number: 20130014900Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article.Type: ApplicationFiled: September 19, 2012Publication date: January 17, 2013Applicant: Nike, Inc.Inventor: Nike, Inc.
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Patent number: 8347931Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.Type: GrantFiled: April 11, 2011Date of Patent: January 8, 2013Assignee: LG Display Co., Ltd.Inventors: Choong Keun Yoo, Ae Kyung Jeon, Choong Keun Yoo
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Publication number: 20130000837Abstract: A substrate sealing apparatus includes a chamber, at least one lower compressing member, and at least one lower compressing member. The lower compressing member includes a lower compressing surface for emitting heat, is configured to be elevated up and lowered down in a vertical direction with respect to the compressing surface, and rotates about the vertical direction. The upper compressing member includes a lower compressing surface for emitting heat, and is configured to be elevated up and lowered down in the vertical direction.Type: ApplicationFiled: April 11, 2012Publication date: January 3, 2013Applicant: SAMSUNG MOBILE DISPLAY CO., LTD.Inventor: Dong-Sul Kim
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Patent number: 8343405Abstract: The invention relates to a production method for incorporating an object into a multi-part, transparent casing. According to the method, an object is aligned on a first joint surface of a first casing part and is pressed into said part using a second casing part with a second joint surface. The first joint surface of the first casing part and the second joint surface of the second casing part are then fused by pressure and temperature, forming a region between the casing parts that is devoid of a visible seam.Type: GrantFiled: September 18, 2006Date of Patent: January 1, 2013Assignee: Montblanc-Simplo GmbHInventors: Dietmar Podszuweit, Manfred Martens, Holger Wuttke
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Patent number: 8316905Abstract: An isostatic press is disclosed in which tunnel-like passages are formed between the envelope surface of a force absorbing body and a prestressing device. A method and a press are further disclosed, wherein a cylindrical element is prestressed simultaneously with obtaining a tunnel-like passage on the cylindrical element.Type: GrantFiled: February 18, 2004Date of Patent: November 27, 2012Assignee: Avure Technologies ABInventors: Stefan Sehlstedt, Lennart Svensson
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Publication number: 20120241080Abstract: A kind of baseball and softball shaping mold and shaping method thereof, firstly according to the outside shape of the ball, two figure of 8 shaped soft pieces are manufactured and fit together to make a mold cavity, and on the inside sides along where the two soft pieces join, grooves are set which forms the raised sewn section which appears on the surface of the softball or baseball. An inlet is set where the seams of two soft pieces join, and fluid PU material is poured into the center of the cavity through the inlet, partially filling the cavity. Thereafter the inlet is plugged, and the mold is shaken to allow the PU material to be evenly distributed and harden on the inside walls of the cavity, which forms the ball cover of the ball, and at the same time, an accommodating space for the ball core is formed in the cavity of the ball cover.Type: ApplicationFiled: July 20, 2011Publication date: September 27, 2012Inventor: Shyi-ming CHEN
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Patent number: 8220691Abstract: There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip.Type: GrantFiled: November 16, 2010Date of Patent: July 17, 2012Assignee: Shibuya Kogyo Co., Ltd.Inventor: Yoshihisa Kajii
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Patent number: 8211263Abstract: A method for fabricating an air-filled cellular structure for use as a resilient cushion. The method includes providing a molding structure including a shelf substantially surrounding a depression, and a platform that fits within the depression and is selectively movable between a plurality of positions relative to the shelf, moving the platform to a preselected position relative to the shelf, wherein the preselected position corresponds to a substantially predetermined amount of air to be contained by the air-filled cellular structure, and using a vacuum device to draw air from within the depression.Type: GrantFiled: September 3, 2009Date of Patent: July 3, 2012Assignee: Applied FT Composite Solutions Inc.Inventor: Daniel Kim
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Publication number: 20120165141Abstract: The high straightness arrow in the present invention is designed to improve the straightness of the archery arrow by adopting new manufacturing technique and method. Chamber and post are made of dissimilar metals and the chamber includes a wall that creates an external housing and defines an internal airspace. Once the post with shaft is positioned through chamber, nuts are tightened securely, forming an assembly, to straighten post. Due to the different coefficients of thermal expansion of chamber and post, when they are heated simultaneously, the chamber expands more than the post, creating a natural tension along post which results in a near perfectly straight shaft. As the assembly cools, the post and chamber return to their original length, yet the shaft retains its straightened form and thus this manufacturing process yields an arrow shaft that is straighter than shafts made of the same materials but with a traditional manufacturing technique.Type: ApplicationFiled: November 16, 2011Publication date: June 28, 2012Inventor: Martin T. Connolly
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Patent number: 8205653Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.Type: GrantFiled: October 29, 2008Date of Patent: June 26, 2012Assignee: Advanced Display Process Engineering, Co., Ltd.Inventors: Dong Gun Kim, Bong Hwan Choi
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Patent number: 8196635Abstract: According to the invention, a suspended blade (55) is provided as a seal which is active between the plates (1a, 2a), said blade comprising a suspension (52) which can be displaced along the upper edge of the first of the two plates (1a), the distance of the suspension from each plane being changeable. The front side of the first plate (1a) lies in said suspension and the blade (55) is provided, at least on one side, with a reversible yielding sealing compound.Type: GrantFiled: April 13, 2007Date of Patent: June 12, 2012Assignee: Plus Inventia AGInventor: Karl Lenhardt
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Patent number: 8192574Abstract: A process for bonding a vented hollow component includes placing a preformed component with an aircraft skin on a tool surface, with bonding agent applied between the component and the skin. A vacuum bag is sealed about a vent in the preformed component. The vent may be formed through the vacuum bag and the component, or the vent may be preexisting (i.e., an open end of the preformed component or an aperture through the component). The vacuum bag is sealed to the tool surface with a temporary seal or adhesive, to enclose the preformed component and the skin. A vacuum is applied within the bagging material, to compress the preformed component with the aircraft skin, and the bagged assembly is autoclaved to cure the bonding agent. The vent in the preformed component facilitates pressure equalization within and outside of the component to enhance compression against the aircraft skin.Type: GrantFiled: July 1, 2010Date of Patent: June 5, 2012Assignee: Textron Innovations Inc.Inventor: Richard Boone
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Publication number: 20120132361Abstract: A method of using a assembly facilitator for a pulp-molded shell with polymer liner containing systems to precisely create a integral pulp molded shell is disclosed along with the assembly facilitator itselfType: ApplicationFiled: November 30, 2011Publication date: May 31, 2012Inventors: Julie Corbett, Romeo Graham, Robert Watters, Michael Sirois
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Patent number: 8163125Abstract: The present invention is premised upon a multi-layer laminate structure and method of manufacture, more particularly to a method of constructing the multi-layer laminate structure utilizing a laminate frame and at least one energy activated flowable polymer.Type: GrantFiled: August 12, 2010Date of Patent: April 24, 2012Assignee: Dow Global Technologies LLCInventors: James R. Keenihan, Robert J. Cleereman, Gerald Eurich, Andrew T. Graham, Joe A. Langmaid
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Publication number: 20120080132Abstract: Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Steve Canale, David J. Zapp
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Publication number: 20120067501Abstract: A method and apparatus for forming objects. Layers of precursor material may be placed on top of each other. The layers of precursor material may be selectively cured as the layers of precursor material are placed on top of each other to form an object and a frame associated with the object.Type: ApplicationFiled: September 21, 2010Publication date: March 22, 2012Applicant: THE BOEING COMPANYInventor: Brett Ian Lyons
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Patent number: 8137499Abstract: In a method for reinforcing a fiber composite component for aviation and space flight, a vacuum mat is configured with at least one receiving portion for reproducibly receiving at least one reinforcing element. The at least one reinforcing element is introduced into the at least one receiving portion of the vacuum mat. The vacuum mat with at least one introduced reinforcing element is applied reproducibly in a sealed manner to the fiber composite component to be reinforced to form a mold portion and at least the formed mold portion is cured to connect the at least one reinforcing element to the fiber composite component. The vacuum mat is then removed from the reinforced fiber composite component so that the vacuum mat can be reused.Type: GrantFiled: June 16, 2010Date of Patent: March 20, 2012Assignee: Airbus Operations GmbHInventors: Christian Luebbering, Hauke Lengsfeld, Roland Brandenburg
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Patent number: 8136564Abstract: An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.Type: GrantFiled: December 4, 2006Date of Patent: March 20, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
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Patent number: 8137491Abstract: A reinforcement insert includes superposed laps of fiber which are coupled to each other by a coupling fiber which passes through the laps in order to form fiber sections wherein at least certain sections thereof are rectilinear. The fiber sections and laps are immersed in a cured resin. The total density of the fibers that make up the insert ranges from 50% to 60% of the volume of the insert and the fiber sections take up 3%-10% of the volume of the insert. A method for creating a sandwich structure includes at least one such insert.Type: GrantFiled: October 21, 2005Date of Patent: March 20, 2012Assignee: Astrium SASInventors: Georges Cahuzac, Jack Gauthier, Eric Chocheyras
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Patent number: 8122929Abstract: The machine (1) has a heated plate (5), conveyor means (6) for conveying the elements (4) along a conveyor path leading across the heated plate (5), a top part (8) which can be moved vertically with respect to the heated plate (5), a membrane (9) disposed on the top part (8) and a separating film (10) disposed between the membrane (9) and the heated plate (5) which can be moved synchronously with the conveyor means. The separating film (10) is divided into sections (11) and every section (11) is retained exclusively by a single edge oriented transversely to the conveying path by retaining means (32). The sections (11) therefore sit loosely on the elements (4) free of tension. The membrane (9) lies against a peripherally extending peripheral face (46) of the top part (8) facing the heated plate (5) and can be moved directly onto the plane of the surface of the heated plate (5) in order to form a closed chamber with it. Finally, the membrane (9) is connected to clamping means (25, 26, 27).Type: GrantFiled: June 1, 2006Date of Patent: February 28, 2012Assignee: 3S Swiss Solar Systems AGInventors: Juerg Zahnd, Christoph Boos
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Patent number: 8114241Abstract: A vacuum bag is applied around a fuselage barrel made of composite material to be polymerized, formed by lamination on the outer surface of a mandrel having the form of a solid of rotation about a longitudinal axis. A bag material in the form of a sheet having a transverse width corresponding to the longitudinal length of the fuselage barrel is provided alongside the mandrel. A first transverse end portion of the sheet is fastened or sealed on the outer surface of the barrel or the mandrel. Then the mandrel is rotated around the axis, so as to wrap the sheet about the barrel. While the mandrel rotates, the opposite axial end edges of the sheet are sealed on the mandrel. Finally, a second transverse end portion of the sheet is sealed on the outer surface of the barrel or the mandrel.Type: GrantFiled: October 24, 2008Date of Patent: February 14, 2012Assignee: Alenia Aeronautica S.p.A.Inventors: Gianni Iagulli, Pierluigi Cacace
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Patent number: 8109310Abstract: The rotational vacuum press with a membrane; according to the invention, is aimed at veneering of profiled surfaces and laminating of wooden elements and other materials according to a modem facilitated with pressure generated by vacuum and applied on the surface through the membrane. It is consisted of the main construction (21) on which central axis (16) is placed on which at least four turning working tables are placed (12) with moveable frame (14) which has an elastic rubber membrane fixed on (13) under which, on the working table (12), a working piece (15) is placed preheated in the heating chamber (31) with heaters (36), which is placed on rails in the low down part of the construction (21).Type: GrantFiled: October 24, 2007Date of Patent: February 7, 2012Inventor: Zvjezdan Vi{hacek over (s)}t
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Patent number: 8097113Abstract: A process comprises constructing a sub-assembly including a rigid layer and a poly (vinyl acetal) interlayer in a vacuum bag or vacuum press; applying vacuum to the vacuum bag or vacuum press for a maximum of 30 to 60 minutes while maintaining the sub-assembly at a temperature between 10° C. and 22° C. to produce a cooled sub-assembly; increasing the temperature of the cooled sub-assembly to at least 100° C. or 125° C. over a minimum of 10 minutes or 20 minutes to produce a heated sub-assembly; maintaining the heated sub-assembly at minimum of 100° C. or 125° C. for a minimum of 10 minutes or 20 minutes to form a laminate; cooling the laminate at a rate of at least 0.5° C./minute until the laminate reaches a temperature below 40° C.; contemporaneously with the cooling, removing the vacuum from the vacuum bag, containing the laminate, and allowing the laminate to reach atmospheric pressure.Type: GrantFiled: September 17, 2007Date of Patent: January 17, 2012Assignee: E. I. du Pont de Nemours and CompanyInventor: Luc A. Moeyersons
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Patent number: 8096336Abstract: The apparatus for manufacturing a liquid crystal display apparatus is equipped with the XYZ?-movement mechanism can move at least one of the first and second attraction stages in a vertical direction so as to adhere the first and second substrates to each other via the sealing agent, and then move the first and second attraction stages relatively to each other in a horizontal direction on the basis of an ordered movement amount, so as to align the first and second substrates with each other, and a control device that can move the first and second substrates relatively to each other by a predetermined amount more than the ordered movement amount while aligning the first and second substrates with each other by the XYZ?-movement mechanism, so as to set the first and second substrates at target positions.Type: GrantFiled: September 20, 2007Date of Patent: January 17, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Hironori Takabayashi
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Patent number: 8097114Abstract: A non-autoclave process for producing a glass laminate comprises applying a sub-assembly including a rigid layer and an ionomer interlayer in a vacuum bag or vacuum press under vacuum followed by heating, cooling, and releasing vacuum.Type: GrantFiled: September 17, 2007Date of Patent: January 17, 2012Assignee: E. I. du Pont de Nemours and CompanyInventor: Luc A. Moeyersons
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Publication number: 20120006494Abstract: A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.Type: ApplicationFiled: August 29, 2011Publication date: January 12, 2012Inventors: Stephen Richard O'Farrell, Jan Waszczuk, Stephen John Sleijpen, James Andrew, Craig Donald Strudwicke, William Granger, Mark Janos
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Patent number: 8062451Abstract: A method of laminating a decorative layer to a molded part comprises molding a part formed of an amorphous or semi-crystalline thermoplastic resin and applying a segment of co-extruded an amorphous or semi-crystalline thermoplastic resin film to the part. The part is loaded into a vacuum forming nest and maintained in a heated state. The film is heated and then positioned over the part in a pressure box. A vacuum is applied through the vacuum forming nest to a first side of the film facing the part at the same time air pressure is applied through the pressure box to a second side of the film. The film is bonded directly to the part without the need for an adhesive.Type: GrantFiled: February 23, 2009Date of Patent: November 22, 2011Assignee: Delta Engineered PlasticsInventors: Wilfried Mozer, Brian L. DeSmith
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Patent number: 8051888Abstract: Provided is a seed crystal fixing device 1 for fixing a seed crystal 9 to a seed crystal placing part 3 of a reaction vessel with an adhesive interposed in between. The seed crystal fixing device 1 includes: a chamber 10 capable of installing the seed crystal placing part 3 in the inside thereof; and a flexible pouched body 16 placed on an upper surface of the chamber 10. The flexible pouched body 16 is inflated with a delivery of gas and is deflated with an exhaust of the gas. The flexible pouched body 16 is configured to come into contact with a surface of the seed crystal 9 when inflated, and thereby applies pressure uniformly across the entire surface of the seed crystal 9. The upper surface of the chamber 10 forms convex shape towards the seed crystal placing part 3, and thereby uniform press-bonding of the seed crystal 9 to the seed crystal placing part 3 is accomplished.Type: GrantFiled: October 3, 2007Date of Patent: November 8, 2011Assignee: Bridgestone CorporationInventors: Daisuke Kondo, Takuya Monbara
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Patent number: 8048254Abstract: A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.Type: GrantFiled: August 20, 2008Date of Patent: November 1, 2011Assignee: Sony Chemical & Information Device CorporationInventor: Takashi Matsumura
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Patent number: 8037915Abstract: An apparatus is disclosed for forming an insulated rotor conductor by bonding an insulating material onto a single side of a flat electrical conductor under controlled heat and mechanical pressure. The rotor conductor is suitable for assembly into the rotor assembly of a rotating electrical machine such as an alternating current generator. The apparatus includes modules to facilitate easy relocation within a manufacturing environment and to make efficient use of available manufacturing space. A corresponding method is also disclosed.Type: GrantFiled: February 14, 2008Date of Patent: October 18, 2011Assignee: Siemens Energy, Inc.Inventors: Mark L Miller, William F Jones, Mark A Williams, Steve Castleberry, Rick Angell