Abstract: An apparatus is disclosed for forming an insulated rotor conductor by bonding an insulating material onto a single side of a flat electrical conductor under controlled heat and mechanical pressure. The rotor conductor is suitable for assembly into the rotor assembly of a rotating electrical machine such as an alternating current generator. The apparatus includes modules to facilitate easy relocation within a manufacturing environment and to make efficient use of available manufacturing space. A corresponding method is also disclosed.

Abstract: A lightweight composite fairing bar (14) for use in fabricating a composite component (16) of an aircraft. The fairing bar (14) includes a core (18) and an elongated outer shell (20) surrounding the core (18). The outer shell (20) is comprised of a laminate material, and the core (18) is comprised of epoxy syntactic foam having a lower density than that of the laminate material. The outer shell (20) is configured for supporting the composite component (16) during the manufacture of the same.

Abstract: The present invention relates to a method of forming a board from a number of substantially planar layers, including the steps of a) ensuring a layer is positioned substantially in a horizontal plane; and b) applying adhesive to the layer; and c) moving the layer to a holding station; and d) holding the layer horizontally against another layer within the holding station; and e) repeating steps a) to d) until a stack of layers is formed having a height substantially equivalent to the desired width of the board to be formed; the method characterised by the step of f) removing the stack from the holding device once the layers have had sufficient time to bond to each other.

Abstract: A production apparatus 100 of a skin 150—fitted foam molding member 300 of the present invention includes: a first mold 111 where an internal surface 142 of a core material 140 is so disposed as to face a mold face 115 of the first mold 111; a second mold 112 so disposed as to open and close relative to the first mold 111 where an external surface 152 of a skin 150 having a roll portion 155 bendably formed is so disposed as to face a mold face 116 of the second mold 112; a bender 120 for bending, in a state that the first mold 111 and the second mold 112 are closed, the roll portion 155 to allow the roll portion 155 to face an external surface 147 of an end portion 145 of the core material 140; a welder 130 for forming a seal portion 200 which prevents a leak of a foam body 180 filled between an internal surface 141 of the core material 140 and an internal surface 151 of the skin 150 where the preventing operation of the leak of the foam body is implemented by welding the end portion 145 of the core material

Abstract: A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

Abstract: A label for a container is formed by wrapping a length of label material around a cylindrical mandrel and introducing heat, adhesive or other sealing means into a gap between the leading end portion of the label material and the trailing end portion as the label material is wrapped around the mandrel. The cylindrical sleeve is slid off of the mandrel and telescoped over a container passing thereunder. The container with a cylindrical sleeve therearound is then moved to a heating station which heats the label material, preferably foam polystyrene, to cause it to shrink into conformity with the contour of the container.

Abstract: A method of applying material on a substrate. The material to be applied can be a pattern of material.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: A stabilizing mechanism for resisting relative movement of upper and lower laminates of a composite structure having a core comprises a lower grip strip and at least one upper grip strip. The lower grip strip may be mounted to a tool upon which the composite structure may be processed. The lower grip strip may include an outer surface having at least one engagement feature for engaging at least one of the upper and lower laminates which make up the composite structure. The upper grip strip may have opposing outer surfaces which may include at least one engagement feature for engaging the lower strip and at least one of the upper and lower laminates.

Abstract: Strips containers are formed using two continuous webs in thermoformable and heat-sealable material facing each other. The webs are indexed along a feed line through different operating stations that transform the webs into a continuous strip of containers, each one of which is provided with a mouth. The containers are arranged according to two parallel rows that are opposed to a longitudinal median zone. The mouths of the containers of the upper row are arranged on the upper longitudinal edge of the strip and face upwards, whilst the mouths of the containers of the lower row are arranged on the lower longitudinal edge and face downwards. The method enables productivity to be increased and waste to be reduced.

Abstract: A sportsball includes a ball carcass having an air cavity therein, wherein the ball carcass includes two ball shells, each of the ball shells having an outer surface, a plurality of channels indented on the outer surface to form a plurality of panel contours thereon, and a contouring edge defining a starting point at one of the channels to continuously extend from the channel to another the adjacent channel until the contouring edge is extended back to the starting point, wherein the two ball shells are integrally bonded with each other to form the ball carcass that the contouring edges of the ball shells are alignedly linked to form a common edge of the ball carcass, such that the common edge of the ball carcass, which is a molding line thereof, also forms as the channels of the ball carcass to invisible the molding line thereat.

Abstract: A method for fabricating stringers is provided. The co-cured composite stringer includes a stringer and a mandrel positioned within a channel defined in the stringer. A plurality of strips are positioned within an opening of the mandrel, and a substrate layer, such as aircraft skin, is positioned adjacent to the stringer. During application of the substrate layer to the stringer, the mandrel and plurality of strips support the stringer.

Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.

Abstract: A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.

Abstract: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.

Abstract: A substrate bonding apparatus for use in fabricating LCD devices substantially prevents substrates held to upper stages from sagging. The substrate bonding apparatus may, for example, include upper and lower stages having a plurality of passages for holding respective substrates; suction force applying means having one end mounted within each passage for transmitting a suction force to operably proximate portions of a substrate, wherein the one end of the suction force applying means is projectable from within each passage to a predetermined distance from the stage; and a vacuum pump for providing a suction force to the suction force applying means.

Abstract: An apparatus and method for producing a dye-sensitized cell are provided, in which a pre-transparent electrode and an opposite electrode are partially bonded, dye molecules are applied to the bonded electrodes followed by washing, an electrolyte is injected, and then the electrodes are hermetically sealed. With the apparatus and method, the manufacturing cost can be reduced and the manufacturing process can be simplified.

Abstract: The invention relates to a method for joining an uncured stringer to a structural component of an aircraft or spacecraft. The uncured stringer is supplied with at least one joining section and at least one web section. A rapidly curing low-temperature auxiliary material is deposited on web flanks of the at least one web section, which are to be supported. The at least one joining section of the uncured stringer is fitted to the structural component. Curing of the auxiliary material then takes place at a first curing temperature in order to form cured supporting elements for the web flanks of the at least one web section, which are to be supported. Curing of the uncured stringer is undertaken at a second curing temperature which is greater than the first precuring/curing temperature, and then the deposited and cured auxiliary material is removed.

Abstract: A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.

Abstract: A production layout for an LCD is provided. The production layout for an LCD includes a bonding part operable to bond a pair of substrates for the LCD with a sealant and a hardening part operable to harden the sealant. The hardening part includes an ion provider operable to supply ions to the substrates during a hardening process of the sealant. The production layout further includes a transfer unit that loads and unloads the bonded substrates. Footprint and tact time for manufacturing the LCD may be reduced. Electrostatic removal effect of the bonded substrates may improve.

Abstract: A method for attaching a sealing profile to a vehicle body part includes the steps of pulling the sealing profile from a storage unit; passing the sealing profile through a first buffer which compensates for differences between incoming and outgoing speeds of the sealing profile; attaching an adhesive strip to the sealing profile continuously, the adhesive strip having a first adhesive layer facing the sealing profile and a second adhesive layer facing away from the sealing profile; passing the sealing profile with the attached adhesive strip through a second buffer which compensates for differences between incoming and outgoing speeds of the sealing profile; and rolling the second adhesive layer onto the vehicle body part. The adhesive strip is attached to the sealing strip in an assembly unit which heats the first adhesive layer as it moves around a press roller.

Abstract: A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.

Abstract: Disclosed herein are roll fed air heated flotation ovens and related thermoforming systems, assemblies, and machines that enable the corrugation-free expansion of a gas impregnated thermoplastic web passing through an oven chamber (without use of a pin-chain assembly), as well as to related methods. In an embodiment, a gas impregnated thermoplastic web is conveyed and expanded through an elongated air heated oven chamber, wherein the elongated oven chamber includes a plurality of downwardly directed heated air nozzles positioned at regular intervals along and within the upper portion of the oven chamber, and a plurality of upwardly directed heated air nozzles positioned at regular intervals along and within the lower portion of the oven chamber, but staggered apart from the downwardly directed heated air nozzles such that the gas impregnated thermoplastic material web undulates in an up and down wavelike fashion, thereby minimizing sagging, bagging, puckering, and/or buckling of the web.

Abstract: In a board cleaning method for dry cleaning of connection sites on resin-based boards, one or more gases selected from a group consisting of gas that contains a hydrogen element and gas that contains a fluorine element are supplied at least to the connection sites, plasma is generated from the supplied gas, and the boards are cleaned by radicals and ions that are produced by the generated plasma.

Abstract: Methods, systems and apparatuses are provided for producing delivery devices, preferably for oral intake of an agent. In the broadest aspect, the method comprises assembling one or more layers comprising one or more materials with an agent or an agent-releasing formulation to form an intergraded, preferably laminated device; folding said integrated delivery device to form a folded integrated delivery device; and at least partially enclosing said folded delivery device to a form suitable for oral delivery. Preferably, the integrated device comprise a first external layer of a first material; a frame of a second material mounted on the first external layer; an agent-releasing formulation housed within the frame; and a second external layer of the first material mounted on the frame.

Abstract: The invention relates to a device (1) for applying heated adhesive and/or hot glue having at least one application head (2) having at least one nozzle (3) and a controller for the delivery of the heated adhesive and/or hot glue through the nozzle (3), the application head (2) being sheathed by a housing (4) and the housing (4) exposing an opening (5) for the nozzle (3) in such a way, that the nozzle (3) is enclosed on at least two diametrically opposite sides by at least two webs (6a, 6b).

Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: A stacked laminator comprising multiple vertically stacked laminating units provides a more compact laminator and improves the efficiency with which workpieces are produced. The plurality of vertically stacked laminating units 10, with each including an upper chamber 13a and a lower chamber 11a upon which the upper chamber is set, a heating plate 11b provided to the lower chamber 11a upon which the workpiece is set, and a pressing member 13b provided in the upper chamber 13a. The workpiece is set on the heating plate 11b, pressed between the heating plate 11b and the pressing member 13b, and laminated. The laminator further comprises opening and closing devices for opening and closing each of the laminating units one after another in succession. Each laminating unit can perform laminating independently of the other laminating units.

Abstract: Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.

Abstract: The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

Abstract: A device for aligning and/or assembling filtering elements, in particular of particulate filter, an installation for assembling a filter from filtering elements incorporating the device, and a method for aligning and/or assembling monolithic filtering elements, in particular for making a particulate filter. The device includes a back plate whereon are set the filtering elements, the back plate being for example fixed on a base plate, and walls laterally foldable upwards by a folding mechanism, such that the filtering elements are mutually maintained tightly when the walls are in an upper position.

Abstract: An apparatus is disclosed for forming an insulated rotor conductor by bonding an insulating material onto a single side of a flat electrical conductor under controlled heat and mechanical pressure. The rotor conductor is suitable for assembly into the rotor assembly of a rotating electrical machine such as an alternating current generator. The apparatus includes modules to facilitate easy relocation within a manufacturing environment and to make efficient use of available manufacturing space. A corresponding method is also disclosed.

Abstract: A pressure membrane, a method and a laminator for laminating components, in particular solar cell modules or laminated glass plates, through the combined application of pressure and heat. The laminator includes at least one laminating chamber that accommodates one or more component stacks, the chamber having a component support and at least one heating device. Each heating device is made up of at least one heating element. At least one elastic and/or flexible pressure membrane is clamped in pressure-tight fashion in the chamber above the component support and is movable relative thereto. The pressure membrane divides a lower chamber part from an upper chamber part. At least the lower chamber part is capable of being sealed in airtight fashion and is capable of being evacuated and ventilated. The at least one heating element is provided integrally with the pressure membrane.

Abstract: A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.

Abstract: A forming apparatus for forming at least one continuous strip of containers comprises a feed line for the indexing along a preset route according to an advancing direction and with a preset advancing step two continuous webs in film material that face each other. The webs pass through a heat-sealing station provided with a separator the end of which is arranged to be inserted between two open longitudinal flaps of the webs. During the phase of heat-sealing of the webs the separator is kept in position to exert downward pressure against said flaps by means of an axial fluid actuator. The invention ensures that at the forming station, that is contiguous with and subsequent to the heat-sealing station the flaps are sufficiently separated to receive the nozzles that blow in the forming fluid.

Abstract: A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.

Abstract: The present invention includes a method and apparatus for bonding a sputtering target to a backing plate. In one embodiment, a sputtering target is vacuum bonded to a backing plate using an elastomeric adhesive and a metal mesh. The vacuum pulls the backing plate and sputtering target together while also removing air pockets that inevitably form within the adhesive during adhesive deposition and backing plate attachment.

Abstract: A flexible substrate bonding and debonding apparatus is disclosed. In one embodiment, the apparatus includes i) a chamber, ii) a lower chuck disposed in a lower portion of the chamber and having a lower heating unit and a cooling conduit built therein, iii) an upper chuck disposed above the lower chuck and having an upper heating unit built therein, iv) a pressurizing unit disposed above the upper chuck and v) a separating unit corresponding to either side of bonding surfaces of a support substrate and a flexible substrate which are disposed between the lower chuck and the upper chuck. The flexible substrate bonding and debonding apparatus can pressurize the flexible substrate and the support substrate simultaneously using a heat-treatment process. Therefore, the flexible substrate can be more reliably bonded and debonded even at low temperature.

Abstract: The invention relates to a method for adhering components to a composite molding. The method comprises stacking the components provided with an appropriate bonding means, positioning a heating means (11), provided with at least one cavity (12), over at least a section of the stack, and passing a medium brought to a first temperature through the at least one cavity of the heating means, whereby the stack is brought at least partially to the first temperature, and the components are interconnected to the molding. The invention also relates to a device for implementing the method and a heatable membrane that can be applied in the method.

Abstract: A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.

Abstract: An aligning device that can reliably correct misalignment between electronic components for increasing the accuracy in aligning the electronic components, a bonding apparatus equipped with the aligning device, and an aligning method. The aligning device comprises a chamber; a flexible bellows configured to define an airtight chamber therein with the chamber; a driving unit configured to move one of a first block member and a second block member relative to the other, the first block member being for holding a first electronic component and being provided in the airtight chamber, and the second block member being for holding a second electronic component and being provided in the airtight chamber; and an image-taking port protruding inward from an outer surface of the chamber so as to define a space, the image-taking port having an observation window through which at least one of the first electronic component and the second electronic component is observed.

Abstract: Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

Abstract: A bonding machine for fabrication of a large size LCD having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together. The bonding machine having supporting means in the bonding chamber, lifting means, and process supplementing means fitted in the bonding chamber so as to be rotatable and movable up/down. The method including loading the first and second substrates on respective stages, driving the supporting means to support the second substrate loaded on the upper stage, and evacuating the bonding chamber, the upper stage adsorbing the second substrate and bonding the first and second substrates together, and lifting the bonded first and second substrates from the lower stage by using the lifting means, and unloading the first and second substrates.

Abstract: A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.

Abstract: A lightweight composite fairing bar (14) for use in fabricating a composite component (16) of an aircraft. The fairing bar (14) includes a core (18) and an elongated outer shell (20) surrounding the core (18). The outer shell (20) is comprised of a laminate material, and the core (18) is comprised of epoxy syntactic foam having a lower density than that of the laminate material. The outer shell (20) is configured for supporting the composite component (16) during the manufacture of the same.

Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.

Abstract: A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.

Abstract: A cushion forming apparatus includes a frame with a pivoted hold down member and a pneumatic bladder below the hold down member. The bladder is alternately connectable with a source of pressure and to atmosphere through control valve. The components of a cushion sub-assembly are loaded onto the deflated bladder, the hold down member is lowered to the locked position, the bladder is inflated to force a cover around foam blocks and adjacent a base, the cover is attached to the side edges of the base, the bladder is deflated, the hold down member released and the assembled structure removed.

Abstract: In a pairing arrangement, a first half-disc and a second half-disc of an optical disc are bonded together by dispensing a bonding material onto the second half-disc and the first half-disc and second half-disc are placed in a chamber. The pressure within the chamber is reduced to a pressure below an ambient pressure and the first half-disc and the second half-disc are brought together within the chamber to distribute the bonding material between a surface of the second half-disc and a corresponding surface of the first half-disc and thereby form a paired disc. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.