Abstract: A device for producing heavy gas-filled insulating glass sheets (62, 64, 60) has two plates (4, 6), between which the insulating glass sheet (62, 64, 60) which is to be filled can be located. On the vertical edges of the plates (4, 6) there are sealing devices (12) to seal the space (10) between the plates (4, 6). On the lower edge of the plates (4, 6) there are a conveyor means (40) for insulating glass and a channel (44) for the supply of heavy gas into the space (10) between the plates (4, 6) and into the interior (60) of the insulating glass sheets (62, 64, 60). In one of the plates (4, 6) there is a seal (20) which extends solely transversely to the plane of the plate (4) from bottom to top essentially vertically and which is located for example in the (lengthwise) middle of the plate (4).

Abstract: When a laminating apparatus M is constituted with a vacuum suction step S1 for vacuum sucking an enclosed space in a work tray 2 accommodating a laminated-substrate W, a thermocompression-bonding step S2 for heating and pressuring the work tray 2 having finished the vacuum suction step S1, and a cooling step S3 for cooling the work tray 2 having finished the thermocompression-bonding step S2, a conveyer route R of a rectangular frame form to circulatorily convey the work tray 2 along a horizontal direction is provided, and in a processing conveyer section Rp composing one side of the conveyer route R, the vacuum suction step S1, the theremocompression-bonding step S2, and the cooling step S3 are sequentially disposed.

Abstract: A substrate bonding apparatus for a liquid crystal display device includes a vacuum processing chamber, a lower stage provided in an interior of the vacuum chamber, an upper stage provided in the interior of the vacuum chamber and having at least one first through hole, a stage moving system having a stage moving axis connected to one of the lower and upper stages, and a driving motor, and at least one first alignment system having one end provided in the interior of the vacuum chamber for aligning a first substrate and a second substrate.

Abstract: Nozzle apparatus and method for affixing an annular transponder unit to an annular surface of a tire includes a nozzle block having an adhesive conduit extending therein to an inward end; a transverse channel open along an outward side and extending into the block, the channel being dimensioned for close receipt segment by segment of the annular transponder unit therein; and at least one adhesive port opposite the open channel side in fluid communication with the channel and the adhesive conduit inward end. The block channel open side is positioned opposite the annular tire surface and the adhesive port is positioned to direct adhesive material therefrom into the block channel to surround a segment of the annular transponder unit located within the channel.

Abstract: A device for placing a ply on a substrate surface includes a vacuum manifold assembly configured for attachment to a vacuum source and a substrate seal configured to provide a substantially gas impermeable interface with the substrate surface. This device further includes a ply seal configured to provide a substantially gas impermeable interface with the ply. In this manner, vacuum applied to the vacuum manifold assembly depressurizes an area between the ply and the substrate surface.

Abstract: An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desired thermal profile to effect solidification of the interface material from the center outward.

Abstract: An apparatus and method for retaining composite structures, such as composite honeycomb structures, during manufacture are provided. The composite structure is cured on a mandrel that defines a layup surface with a grip feature. The grip feature is configured to engage the composite structure during manufacture and retain the structure in a predetermined configuration. A film adhesive can be provided between the grip feature and a tiedown ply that extends from the composite structure.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: According to one embodiment of the invention, a system for curing a composite material includes an oven having an inner wall defining an inner chamber, an outer wall defining an outer chamber between the inner wall and the outer wall, a hot air distribution manifold disposed within the inner chamber, a cold air distribution manifold disposed within the outer chamber, and an exhaust chimney having a cold air distribution conduit disposed therein coupled to the outer chamber. The system further includes a hot air supply system coupled to the hot air distribution manifold of the oven that is operable to supply hot air to the hot air distribution manifold, a cold air supply system coupled to the cold air distribution manifold and the cold air distribution conduit that is operable to supply cold air to them, and a plurality of hot air exhaust passages formed in the inner wall of the oven. The hot air exhaust passages are adapted to transport hot air within the inner chamber to the outer chamber.

Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: An apparatus and a method for vacuum laminating an article to a substrate. The apparatus comprises a movable assembly engaged with a support surface for the substrate and movable relative thereto. The movable assembly comprises a manifold for receiving vacuum force from a source of vacuum, and a fin member for translating the vacuum force across substantially a width of the printing plate. A holder for the article is positioned such that an end of said article to be laminated is engageable with the support surface. A moving device is provided for passing the movable assembly and the article over the printing plate as the vacuum force is translated across the printing plate, such that the article is laminated to the printing plate without substantial air entrapment.

Abstract: A system of heat shrink lamination that uses one or more lamination chambers with forced flow of heated air from a central heating area. The central heating area includes at least one heating element. A fan situated at one end of the central heating area provides high speed air circulation by forcing the heated air down through hot air plenums in the lamination chambers. At the lower end of the lamination chambers, the hot air is returned through air flow ducts to the central heating area.

Abstract: In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8).

Abstract: The present invention relates to an apparatus and method for laminating a dry film using a microwave which are capable of quickly transforming a photosensitive substance of a dry film to a semi-liquid state by vibrating a water or acryl group copolymer molecular in a dry film for thereby implementing a laminating operation. The apparatus for laminating a dry film includes a microwave oscillating apparatus which includes an interior surrounded by a reflection film, for thereby heat-oscillating a water and acryl group copolymer molecular in a dry film, a caterpillar belt clean apparatus for removing foreign substances formed after pressurizing the film heated by the oscillating apparatus, a frame for performing a laminating work with respect to the substrate fed by the feeding apparatus, and a discharging apparatus for discharging the PCB photosensitive-processed by the microwave oscillating apparatus.

Abstract: A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.

Abstract: A portable curing system includes a carrying case, a controller located within the carrying case and having a microprocessor, a vacuum pump located within the case and having at least two vacuum ports for connection of vacuum lines, at least two vacuum sensor connectors for receiving leads of vacuum sensors, at least two heater connectors for receiving leads of electrical heaters, and at least two temperature sensor connectors for receiving leads of thermocouples. The controller is operably connected to the vacuum pump, the vacuum sensor connectors, the heater connectors, and the temperature sensor connectors. A touch-screen video display is mounted within the carrying case and operably connected to the controller to display information from the controller and input information to the controller. The video display is pivotable between a stowed position and a viewing position.

Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.

Abstract: A method of assembling a rotor structure for a spindle motor for use in an information recording and playback apparatus is provided in which pollution of the recording medium due to gases emitted from adhesives and the like used in the manufacturing process can be prevented. To be more specific, in an assembling process of securing a rotor yoke and a rotating magnet on a disc section, the rotor yoke, the rotating magnet, and the disc section is disposed one after another at predetermined positions of a centering jig used for centering the center of rotation of the rotating magnet and the center of rotation of the disc section. A pressing mechanism is then placed on the disc section to press the disc section, the rotor yoke, and the rotating disc so as to integrate them into one piece. At the same time, emitted gases are exhausted with an exhausting apparatus in a manner such that the direction of flow of the emitted gases is from the main surface of the disc section toward the rotor yoke.

Abstract: Framework, defining a predetermined curing area, corresponds in size and shape to a provisionally-assembled watercraft body to be subjected to adhesive curing. Openable/closeable gate, constituting one end portion of the framework, allows the provisionally-assembled watercraft body to be carried therethrough into the curing area. Positioning mechanism positions the carried provisionally-assembled watercraft body in the curing area. Warm air blowing mechanism includes a plurality of nozzles provided at predetermined intervals on and along upper horizontal portions of the framework and gate and at a level slightly higher than peripheral edges of a hull and deck of the watercraft body to be joined by adhesive, which blow warm air downward onto the peripheral edges of the watercraft body.

Abstract: A center robot is fixed approximately in a central portion of a process part. A coating unit, a drying unit, a transfer unit, a peeling unit, a film supplying unit and a reversing unit are arranged around the center robot. The center robot comprises a hand-for-substrate and a hand-for-film which are allowed to directly access the respective units. Within a process part, the center robot transports a sheet film and/or a substrate between the coating unit, the drying unit, the transfer unit and the film supplying unit, and a thin film is formed on the substrate using the sheet film.

Abstract: A table receives an object, subjected to the adhesion process, in an adhesive setting apparatus. An adhesive have been applied on the object on the table. An exposure mechanism is designed to expose the adhesive to a gaseous accelerator. The adhesive setting apparatus utilizes the gaseous accelerator to promote the setting or hardening of the adhesive. The gaseous accelerator uniformly contacts the adhesive as compared with the mist of the accelerator. Since the adhesive is uniformly exposed to the gaseous accelerator, an uneven progression can reliably be avoided in the setting of the adhesive. It is possible to reliably avoid heterogeneity or localization of the set adhesive.

Abstract: The invention provides a non-autoclave method and apparatus for producing laminated glass. The method and apparatus provide a non-autoclave laminated glass process that is continuous and thus eliminates the batch processing of known autoclave processes. In addition, the method and equipment do not require vacuum processes, involving complicated vacuum bags, vacuum rings, or the like.

Abstract: A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.

Abstract: A method and an apparatus are provided for bonding a coating to a web of cloth or foam without sacrificing the characteristics of the spandex mesh or foam. The coating and the cloth or foam are bonded and heated and then conveyed to an aspiration device for removing air between the coating and the cloth, thereby providing a thorough bonding therebetween.

Abstract: Vacuum-assisted film laminating and removal systems and methods of using the same. The systems include a vacuum-assisted laminator for applying large format films to substrates where lamination pressure is generated at least partially by a vacuum drawn in a vacuum cavity. The removal apparatus applies tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width of the film. The systems and methods can be used to apply and remove large-scale adhesive films from substrates.

Abstract: A tray sealing assembly includes a seal support frame for supporting a flange of a tray during sealing of a sealing film to the flange, a seal plate having a sealing surface provided with a raised bead, and a heater for heating the seal plate. The seal support frame is movable relative to the seal plate between a retracted position and a seal position in engagement with the seal plate. Preferably, the raised bead forms a continuous closed loop on the sealing surface. The raised bead produces a reliable seal between the sealing film and the tray flange, despite the presence of contaminants on the tray flange.

Abstract: Apparatus for permitting the transfer of organic material from a donor onto a substrate to form a layer of organic material on one or more OLED devices, comprising a first fixture arranged to support the donor and substrate in a relationship relative to one another whereby there will be either a separation between portions of the substrate and the donor, or the substrate and donor will be in contact, and wherein organic material will be transferred onto portions of the substrate; a second fixture aligned with and engaging the first fixture to clamp the donor and substrate and forming a chamber relative to a non-transfer surface of the donor; means for supplying a fluid to the chamber to apply pressure to the non-transfer surface of the donor so as to ensure the position of the donor relative to the substrate; and the first fixture including a transparent portion located in relationship to the non-transfer surface of the donor to permit transmission of radiation through such transparent portion to the non-tran

Abstract: Apparatus for transferring organic material from a donor web onto a substrate to form a layer of organic material on one or more OLED devices including a web of donor material; first and second fixtures and a structure for applying fluid to a chamber to containing the fixtures to apply pressure to the non-transfer surface of the donor web so as to ensure the position of the donor web relative to the substrate; the first fixture including a transparent portion located in relationship to the non-transfer surface of the donor web to permit transmission of radiation through such transparent portion to the non-transfer surface of the donor web so that heat will be produced and the organic material will transfer from the donor web to the substrate.

Abstract: A method for transferring organic material from a flexible donor element onto a substrate to form a layer of organic material in making one or more OLED devices, includes providing the flexible donor element and the substrate in a spaced relationship within a chamber under atmospheric pressure defined by a transfer station so that the flexible donor element partitions the chamber into first and second cavities; varying the pressure differential between the first and second cavities to cause the flexible donor element to move into a contact relationship with the substrate; providing a transparent window which defines the top surface of the second cavity; and providing radiation energy through the transparent window onto the flexible donor element in contact with the substrate to cause the flexible donor element to absorb heat and transfer organic material onto the substrate.

Abstract: The space between a material sheet laminate 105 and the inner wall of a processing chamber 13a is filled with a buffer material. The material sheet laminate is heated in a firing furnace while the material sheet laminate is pressurized through the buffer material in a way of reducing the volume of a processing chamber 13a by loading of a weight 17. In this way, the material sheet laminate 105 is fired which it is pressurized from all the directions through the buffer material 14. This suppresses the warp of a ceramic laminate 100 due to the densification phenomenon occurring during the step of firing the material sheet laminate 105, thereby providing the ceramic laminate 100 with no warp.

Abstract: Steered vacuum-assisted laminating apparatus and methods of using the same are disclosed. The apparatus includes a vacuum-assisted laminator for applying large format films to substrates where lamination pressure is generated at least partially by a vacuum drawn in a vacuum cavity. The apparatus also includes a steering system to control the vertical position the laminator and a vehicle to move the laminator along the substrate in a desired direction.

Abstract: A tool and method for applying an insert to the face of a chuck so that holes in the insert register with holes in the chuck, includes a removable vacuum chamber that is brought into sealing engagement with the chuck and that is indexed with respect to the chuck by means of locating pins. The removable vacuum chamber includes a stamp on which the insert is mounted and to which the insert is indexed by locating pins. The stamp is advanced until an adhesive surface of the insert contacts the face of the chuck. Thereafter, the vacuum is relieved and the vacuum chamber is removed from the chuck. The tool insures that the holes in the insert register with those in the face of the chuck, and the absence of air within the vacuum chamber prevents air from being trapped between the insert and the face of the chuck.

Abstract: A self-dispensing fastener for attachment to a substrate by a quick-setting photocuring adhesive has a UV transparent flange for placement against the substrate and UV opaque adhesive reservoir for containing the adhesive in the fastener, and upon pressing the fastener against the substrate the adhesive is expelled into the interface formed between the flange and the substrate for curing by UV radiation.

Abstract: A method for producing ceramic composite bodies, in particular, cylindrical ceramic bodies for sheathed-element glow plugs, in which a plurality of shaping sleeves, which accommodate piece parts premolded by cold pressing, are inserted into corresponding bore holes of a vertically standing supporting plate that is heated via additional bore holes with the aid of cartridge heaters or a heat transfer liquid. The vertically standing supporting plate with the shaping sleeves is then clamped between two press plates of a press, and the piece parts located inside are subsequently pressed by press pins which, on both sides, pass through the press plates and into the shaping sleeves. Upon completion of the necessary pressure keeping period, the pressed compound, after retraction of the press pins and opening the press, can be hardened in a non-pressurized manner in the shaping sleeves located in the withdrawn supporting plate that is subjected to further heating.

Abstract: Steered vacuum-assisted laminating apparatus and methods of using the same are disclosed. The apparatus includes a vacuum-assisted laminator for applying large format films to substrates where lamination pressure is generated at least partially by a vacuum drawn in a vacuum cavity. The apparatus also includes a steering system to control the vertical position the laminator and a vehicle to move the laminator along the substrate in a desired direction.

Abstract: The present invention is designed to effectively band ornamental trims onto panel edges, such as those of furniture tops. The present invention utilizes pneumatic forces to hold the ornamental trims against the panel edges instead of traditional clamps, resulting in asserting a uniform pressure press-fitting the trims against the panel edges along a good length of the trims instead of merely along several points of the trims. furthermore, since the contacting surface of the present invention is made of a soft material, it would not leave any pressmarks or indentations on the trims as can left by a hardened clamp.

Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.

Abstract: A method for making a consolidated wood product comprising coating wood components with a B-stageable, phenol-formaldehyde resole resin; heating the coated wood components to about 80 to 140° C. for a time sufficient to advance the resin to a B-stage; forming a mat or stack of the wood components coated with the B-stage resin; exposing the mat or stack of coated wood components to a saturated or superheated steam atmosphere in a hot press; and compressing the layup to form the consolidated wood product. The phenol-formaldehyde resole resin used in the method has a number average molecular weight of between about 200 and 600, has a F:P mole ratio of about 1.3:1 to 2.0:1, and has been modified with 0 to about 5.5 wt % of caustic based on resin solids.

Abstract: A balloon catheter is formed by a heat shrinkable tube. In the method, a rod member is inserted into the shrinkable tube, and parts of the shrinkable tube are heated so that the parts of the shrinkable tube shrink to thereby form end portions of at least one balloon portion while a portion away from the end portions does not shrink. Two end portions of the balloon portion are processed to have a small diameter. Then, the rod member is removed from the shrinkable tube, and a catheter shaft is inserted into the balloon portion to completely pass therethrough. Finally, the two end portions of the balloon portion are fixed onto the catheter shaft. Since the heat shrinkable tube with the constant thickness is used, high quality catheter can be formed without fail.

Abstract: A process for laminating multi-layer pre-forms into laminated glazing assemblies is provided. The pre-forms are first subjected to a vacuum in an inlet lock. Then, the pre-forms are heated to an assembly or bonding temperature in a heating chamber, while still being subjected to vacuum. Next, the pre-forms are pressed using pressing pieces in a pressing chamber, which is also subjected to vacuum. A greater pressure is exerted along the edges of the laminated glazing assemblies so as to bond the edges, preferably by using membranes. In an outlet lock which follows the pressing chamber, the laminated glazing assemblies are again vented to atmospheric pressure. An apparatus suitable for carrying out the process is also provided. The apparatus has chambers which are connected together by conveyors so as to achieve a quasi-continuous flow of material.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: Compact disk labeling systems for use in applying an adhesive label to a CD card compact disk. The system includes a base with a generally flat upper surface and a compact disk hub that protrudes above the upper surface of the base for holding the CD card compact disk by means of its central hole. A rotatable lid is attached to the base and has a generally flat surface with an tab section and a flexible section that is flexible relative to the tab section. A compact disk label hub protrudes from the tab section that is used to hold the adhesive label. A compact disk registering member is provided on the base that is used to register and align the CD card compact disk. A compact disk label registering member may be provided on the lid that may be used to register labels having different widths. Removal of the compact disk registering member permits labeling of mini round compact disks.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a sealed chamber. The chamber has an inlet through which gas is input. A downward force caused by gas pressure in the chamber causes the cover membrane to contact the parts and presses the plurality of parts against the film. A heating device heats the film to cause the parts to adhere to the film.

Abstract: A vertical processing unit 10 for semiconductor wafers has; a cylindrical processing chamber 2 having an opening 18 in an inside of an annular bottom surface, and a disk-shaped cap 6 having an annular abutting-surface 32 abutting on the annular bottom surface of the chamber. A mounting-surface 6p formed on the inside of the annular abutting-surface 32. A wafer-boat 8 for holding a wafer W to be processed is mounted on the mounting-surface 6p of the cap 6. The abutting-surface 32 has an annular groove 34A formed therein. An inert gas supply passgeway 38 is provided in communication with the annular groove 34A for supplying an inert gas into the annular groove 34A through a header 16. An ejection opening 36 for ejecting an inert gas is provided on the inner side of the annular groove 34A for communicating the annular groove 34A and the interior of the processing chamber 2. Owing to the active leaking of the nitrogen (N.sub.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: An apparatus for joining flat electrical components uses a flexible foil with electrical conductor tracks and an electrically conductive adhesive. A workpiece receptacle receives workpieces to be joined, and a heatable die is pressed against the workpiece receptacle and in so doing adhesively bonds the workpieces under the influence of heat and pressure and electrically conductively joins them to one another. Resiliently supported metal peripheral elements which are disposed on both sides next to the workpiece receptacle, are adapted in terms of their spacing to the width of the respective workpiece. In particular, LCD components and printed circuit boards are joined together, for example for on-board computers for motor vehicles, for telephones and for other devices equipped with liquid crystal displays.

Abstract: An apparatus and a method for increasing the flow rate of a pressurized liquid through an orifice by applying ultrasonic energy to a portion of the pressurized liquid. The apparatus includes a die housing which defines a chamber adapted to receive a pressurized liquid and a means for applying ultrasonic energy to a portion of the pressurized liquid. The die housing further includes an inlet adapted to supply the chamber with the pressurized liquid, and an exit orifice defined by the walls of a die tip. The exit orifice is adapted to receive the pressurized liquid from the chamber and pass the liquid out of the die housing. When the means for applying ultrasonic energy is excited, it applies ultrasonic energy to the pressurized liquid without applying ultrasonic energy to the die tip.

Abstract: A cover provided to partly enclose a pair of bonding rollers is supplied with a gas such as carbon dioxide having high solubility in an adhesive to be used and a sheet-like adhesive or an adhesive in a sheet form is bonded to a support film.