Abstract: The present invention relates to a method for treating fragments of polyvinyl butyral (PVB) in which glass shards are encrusted in or on the surface of the PVB. The method involves placing PVB fragments in contact with an aqueous solution comprising a cationic surfactant and a weak base, to obtain a mixture. This mixture, subjected to ultrasound within a defined temperature range, leads to separation of the glass shards and the PVB. In particular, the inventors have discovered that the combined, simultaneous, and complementary action of a weak base, a cationic surfactant, and ultrasound, at an appropriate temperature, made it possible to detach and/or unembed the glass shards fixed to the collected PVB without degrading the polymer matrix.

Abstract: A method for transferring a semiconductor structure is provided. The method includes: coating an adhesive layer onto a carrier substrate; disposing the semiconductor structure onto the adhesive layer, in which the adhesive layer includes an adhesive component and an surfactant component after the disposing, the semiconductor structure includes a body and a bottom electrode, and the bottom electrode is disposed between the body and the adhesive layer after the disposing; irradiating a first electromagnetic wave to the adhesive layer to reduce adhesion pressure of the adhesive layer to the semiconductor structure while the semiconductor structure remains on the adhesive layer, in which the carrier substrate, the semiconductor structure, and the bottom electrode have a pass band in between ultraviolet to infrared; and transferring the semiconductor structure from the adhesive layer to a receiving substrate after the adhesion pressure of the adhesive layer is reduced.

Abstract: An apparatus for processing display laminate, wherein the display laminate includes a front electrode layer, a display material layer and a protective film layer. The display laminate is continuous. A section of protective film layer is continuously removed from the edge of the display laminate by a cutting unit while the display laminate is running through the cutting unit. After removing the section of the protective film layer, a section of the display material layer located at the same edge as the removed section of the protecting film layer is continuously removed by spraying medium in a spraying unit while the display laminate is running through the spraying unit.

Abstract: A method for transferring a semiconductor structure is provided.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A belt welding apparatus is provided for joining together the ends of one or more monolithic conveyor belts. In one form, a belt support is configured to support the belt ends in spaced relation to each other and a non-contact heating device is provided for being disposed between the belt ends to generate thermal radiation for joining the belt ends together. In one form, the non-contact heating device is a ribbon heating device. In another form, a drive mechanism is operable to cause relative movement of a pair of platens, for supporting belt ends, toward and away from each other and a heating device between heating and stowed positions. An actuator of the drive mechanism is movable by an operator between at least three operation positions corresponding to three different operation positions of the platens.

Abstract: An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater configured for heating a heating region to a temperature above a thermal decomposition temperature of the at least one coating; a securing mechanism configured for securing the optical fiber so that the lengthwise section of the optical fiber is positioned in the heating region; and a controller operatively associated with the heater, wherein the controller is configured for deactivating the heater not later than immediately after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region, and the heater may be deactivated before the removal of the at least one coating from the lengthwise section of the optical fiber.

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: A method for removing a label affixed to a material includes exposing the label to one or more of heat, hot gas, or hot liquid having a predetermined temperature, in the absence of any caustic solution, for a period sufficient for the label to release from the material to which it was affixed.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Abstract: The present invention discloses a graphene platelet fabrication method, which comprises Step (A): providing a highly-graphitized graphene having a graphitization degree of 0.8-1.0; and Step (B): providing a shear force acting on the highly-graphitized graphene to separate the highly-graphitized graphene into graphene platelets, wherein the graphene platelets have a length of 10-500 ?m and a width of 10-500 ?m and have a single-layer or multi-layer structure. The present invention also discloses a graphene platelet fabricated according to the abovementioned method.

Abstract: An object of the invention is to provide a pressure-sensitive adhesive optical film-peeling method capable of easily detaching the pressure-sensitive adhesive optical film from a glass substrate with no damage to the glass substrate or no adhesive deposit on the glass substrate, and to provide a pressure-sensitive adhesive optical film suitable for use in such a peeling method. The invention is directed to a method for peeling a pressure-sensitive adhesive optical film from an optical film-carrying glass substrate including a glass substrate and the pressure-sensitive adhesive optical film bonded thereto, which includes: exposing the optical film-carrying glass substrate to an environment at a temperature of 40 to 98° C. and a relative humidity of 60 to 99% for three minutes or more; and then peeling the pressure-sensitive adhesive optical film from the glass substrate under the environment.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair. The clam shell reactor includes first and second isolated chambers. An upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber. A lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder includes means for holding an unbounded surface of the first wafer onto the lower surface of the upper chuck. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair.

Abstract: A label for removable application to an article such as a beverage bottle includes a backing layer (2) comprising a laminate of a bi-axially oriented polyester such as PET (12) and a bi-axially oriented polypropylene (14). The polyester film (12) has a lower coefficient of thermal expansion than the polypropylene film (14). Consequently, when the label is heated, it will tend to curl and this effect can be used to assist in the removal of the label from the article in a hot washing bath during recycling of the article.

Abstract: A label for removable application to an article such as a beverage bottle includes a backing layer (2) comprising a laminate of a bi-axially oriented polyester such as PET (12) and a bi-axially oriented polypropylene (14). The polyester film (12) has a lower coefficient of thermal expansion than the polypropylene film (14). Consequently, when the label is heated, it will tend to curl and this effect can be used to assist in the removal of the label from the article in a hot washing bath during recycling of the article.

Abstract: Systems and methods for the ultrasonic cleaving of bonded wafer pairs are described. The system includes a tank for containing a volume of liquid, a wafer boat having a recess formed therein for receiving the bonded wafer pair. The recess has a pair of opposing, spaced-apart sidewalls disposed at an angle from a vertical axis. An ultrasonic agitator is configured to ultrasonically agitate the volume of liquid. The ultrasonic agitation of the volume of liquid results in the cleaving of the bonded wafer pair.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate.

Abstract: A method for thinning a structure of at least two assembled wafers, where one of the wafers includes channels on its surface facing the other wafer. In order to cause thinning of the structure, a fluid is introduced into the channels in a supercritical state and the fluid is passed from the supercritical state into the gaseous state. The channels do not open to the outside of the structure, such that the method further includes forming at least one access opening to the channels from the outer surface of the structure and before introducing the fluid in the supercritical state.