Abstract: A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

Abstract: An apparatus that separates a resin layer together with a film from a wafer to which the film is made to adhere with the intermediary of the resin layer formed on one surface and around which a protruding part is formed through protrusion of the film from a peripheral edge includes a separating unit that separates the resin layer from the one surface of the wafer. An imaging unit images the one surface from which the resin layer has been separated. A first determining part determines whether or not a resin residual in one pixel of a captured image exists based on the brightness of the one pixel, and a second determining part determines whether or not a resin residual that adversely affects grinding exists from the captured image after the first determining part has determined whether or not a resin residual exists in each pixel.

Abstract: An organic EL element including light emitting layers is formed above a first region of a main surface of a back film. A plurality of terminal portions are formed above a second region of the main surface of the back film. A cover film including an opening is provided as an uppermost layer above the main surface of the back film.

Abstract: A display device and a method for manufacturing the same capable of preventing a defective drive of a gate-in-panel (GIP) driver by dissipating high heat generated in a large-sized thin film transistor of the GIP driver are disclosed. The display device includes a flexible substrate, a GIP driver and a display unit disposed on the flexible substrate, a protective member disposed under the flexible substrate, and a heat pad disposed between the flexible substrate and the protective member and overlapping the GIP driver.

Abstract: A heat-treated titanium nitride film including a polymeric substrate and at least one titanium nitride layer is disclosed. The titanium nitride layer of the film is characterized by microscopic uniform generally parallel surface cracking in the machine direction of the film. The film is particularly useful as a solar control film suitable for application to a contoured transparent substrate with reduced or eliminated ghosting. A method for treating a titanium nitride film prior to application to a transparent contoured substrate and a method for applying a titanium nitride film to a transparent contoured substrate are also described.

Abstract: A display device is provided including a substrate having a first region and a second region, a plurality of pixels above the first region, and a connection terminal above the second region, wherein a Young's modulus of the second region is higher than a Young's modulus of the first region.

Abstract: In a surface light-emitting unit, a wiring board (60) includes, on its side on which a holding substrate (11) is located, an external-wire connecting portion (40). An opening (11h) is provided in the holding substrate (11). The wiring board (60) is disposed to cover the opening (11h) and allow the external-wire connecting portion (40) to be exposed, through the opening (11h), toward a surface of the holding substrate (11) opposite to the surface thereof on which the wiring board (60) is held. With an external wire connected to the external-wire connecting portion (40), a surface of the wiring board (60) located in the opening (11h) is sealed by a second sealing member.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

Abstract: A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

Abstract: A system includes a first drive unit used for driving at least one of a release device, a gripper device, and a second drive unit used for driving a support device. The release device is a vacuum device. The vacuum device is coupled to a vacuum source and applies a suction force against an edge portion of one layer among a first layer disposed on a second layer. Another layer among the first layer and the second layer is held by a support surface of the support device. The vacuum device and/or the support device are movable upwards and downwards for peeling the edge portion of the one layer from the other layer. The gripper device holds the peeled edge portion of the one layer and the support device or the gripper device is movable along at least one axis for removing the one layer from the other layer.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: Apparatuses useful in printing, fixing devices and methods of stripping media from surfaces in apparatuses useful in printing are provided. An exemplary embodiment of an apparatus useful in printing includes a first member including a first surface; at least one heating element for heating the first surface of the first member; a second member including a second surface forming a nip with the first surface, the nip including an inlet end at which a substrate enters the nip and an outlet end at which the substrate exits from the nip; and an air knife disposed downstream from the outlet end of the nip and extending along an axial direction of the first member, the air knife including a first end, a second end opposite to the first end and a plurality of axially-spaced nozzles disposed between the first end and second end; and at least one gas inlet through which gas is supplied to the air knife.

Abstract: Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.

Abstract: A method for removing a protective coating material from a portion of an optical fiber including a glass optical fiber having an outer surface surrounded by said protective coating material, said method comprising the steps of: (i) providing a fiber collection and support device having: (a) a coarse conical fiber collector having an input port and (b) a fine fiber centering collector including a fiber tube having an output port, said input port is larger then said output port; (ii) providing the fiber threaded through the course conical collector into the fiber collection tube of the fine fiber centering collector; (iii) contacting the fiber, as it exits from the output port of the fiber collection tube of the fiber collection and support device, with a stream of hot gas; and (iv) directing a stream of a hot gas onto the protective coating material that is to be removed.

Abstract: A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

Abstract: An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.