Abstract: A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.

Abstract: There is provided a method for separating an optical film bonded to an adherend with a pressure-sensitive adhesive layer interposed therebetween from the adherend. The pressure-sensitive adhesive layer is formed using an optical pressure-sensitive adhesive. The optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): wherein A1 and A2 are different functional groups, one of A1 and A2 shows reactivity or interaction with the functional group (F) of the base polymer, R1 is an optionally substituted alkylene group of 1 to 12 carbon atoms and/or an optionally substituted phenylene group, and R2 and R3 are each a hydrogen atom or an alkyl group of 1 to 12 carbon atoms and may be the same or different.

Abstract: A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.

Abstract: A direct-write method, apparatus and end use device for selective separation of at least one layer of material from another layer of material at the interface between them using a beam of electromagnetic radiation from an ultrashort pulse source is disclosed.

Abstract: An ultrashort pulsed laser beam, the fluence of which on an interface BF is set to be larger than a substrate processing threshold and smaller than a film processing threshold, is irradiated to the interface BF via a thin film F. Thus, in a laser irradiated portion of the interface BF, the substrate W is selectively processed, bonding between the substrate and the thin film F is reduced and the thin film F is peeled.

Abstract: There is disclosed a method of separating laminated sheets comprising first and second sheets which are bonded by an adhesive interlayer, the method comprising heating the interlayer to soften it and causing the first and second sheets to be forced apart when the interlayer is softened.

Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.

Abstract: The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

Abstract: A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Abstract: A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure.

Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Abstract: There is provided a method for disassembling a bonded structure obtained by bonding a first base member and a second base member to each other via a bonding film mainly made of a compound having a branched polyorganosiloxane skeleton having a structural unit expressed by a following general formula (1) at a terminal portion, a structural unit expressed by a following general formula (2) at a linking portion, and a structural unit expressed by a following general formula (3) at a branched portion: In the formulas, each R independently represents a non-substituted hydrocarbon group; each Z independently represents a hydroxyl group or a hydrolytic group; each X represents a siloxane residue; a represents 0 or an integer of 1 to 3; b represents 0 or an integer of 1 or 2; and c represents 0 or 1.

Abstract: A laminated composition includes a first polymer layer having a first surface and a second surface; a second polymer layer having a first surface and a second surface; and an adhesive layer joining the second surface of the first polymer layer to a first surface of the second polymer layer; where the adhesive layer includes a heat-shrinkable resin including heat-generating particles.

Abstract: Laser-based methods of stripping different types of fiber optic cables (100) are disclosed. The method includes directing a focused laser beam (202) onto the cable's protective cover (114). The method also includes moving the fiber optic cable relative to the focused laser beam in a direction substantially along a central axis (AC) to form a substantially axially oriented groove (250) in the protective cover, wherein the groove does not reach one or more optical fibers (110) carried by the cable. The method can further include opening the protective cover at the groove to form a split protective cover portion (114S), and removing the split protective cover portion from the fiber optic cable. Methods of stripping a cable by forming two grooves in the protective cover using two focused laser beams are also disclosed.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: This invention describes Extreme low-defect Nitride Boules and associated methods of manufacture using low-defect seed templates or composite templates arranged in precise hexagonal or partial hexagonal crystal facets, and nearly exact lattice and thermal expansion coefficient matching of a low-defect nitride template or composite template with a thick nitride boule grown upon said template or composite template through alloying and doping. Reduction of the critical thickness of said template or composite template and said boule by thinning of template or composite template is also described.

Abstract: A method for recycling thin-film solar cell modules which are which are composed of a substrate layer with a superimposed structure of functional layers, a plastic layer that encapsulates the functional layers, and a cover layer. The substrate layer is transparent to a working laser beam, and the first functional layer, an electrode layer, is able to absorb this working laser beam. The free surface of the substrate layer is scanned with the working laser beam so that the first electrode layer, due to having absorbed the working laser beam, is at least partially vaporized and the superimposed structure of the functional layers is thus detached from the substrate layer. The substrate layer, separately from the functional layers that are attached to the plastic layer and the cover layer, is subsequently available for separate further processing.

Abstract: An adhesive tape joined to a wafer is irradiated with ultraviolet rays via diodes. Simultaneously, a heater heats the adhesive tape to a preset temperature. Consequently, an ultraviolet reaction with the diodes and an infrared reaction with the heater may ensure promotion of a polymerization reaction, which results in cure of an adhesive that is not curable with only ultraviolet rays. As a result, an adhesive force of the adhesion tape may sufficiently be reduced. After ultraviolet irradiation via the diodes and heating with the heater, a separation mechanism separates the adhesive tape from the wafer. Therefore, accurate separation may be realized of the adhesive tape joined to the wafer.

Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.