With Shearing During Delaminating Patents (Class 156/718)
  • Patent number: 11067887
    Abstract: A method of manufacturing a pellicle includes preparing a pellicle frame having an adhesive layer coated thereon, treating a pellicle membrane with vapor under vapor atmosphere, attaching the pellicle membrane onto the pellicle frame, and drying the pellicle membrane.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: July 20, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Mun-Ja Kim, Ji-Beom Yoo, Soo-Young Kim, Hee-Bom Kim, Hwan-Chul Jeon, Seul-Gi Kim, Tae-Sung Kim, Dong-Wook Shin
  • Patent number: 10926524
    Abstract: There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: February 23, 2021
    Assignee: DISCO CORPORATION
    Inventor: Katsuhiko Suzuki
  • Patent number: 10814603
    Abstract: Methods of processing a first substrate bonded to a second substrate include moving a wire along an interface to propagate a debonding front and debond the first substrate from the second substrate. In some embodiments, the first substrate includes a thickness less than or equal to about 300 ?m. In further embodiments, the wire includes a tensile strength less than a critical failure stress of the first substrate. In still further embodiments, the wire is configured to conform to a shape of the debonding front during the step of moving the wire such that one or more edges of the first substrate are debonded from the second substrate prior to a debonding of a corresponding interior portion of the first substrate from the second substrate.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: October 27, 2020
    Assignee: Corning Incorporated
    Inventor: Leena Kumari Sahoo
  • Patent number: 10569520
    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: February 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Patent number: 10315406
    Abstract: A film-like structure, a film removing device and a film removing method are provided. The film-like structure includes a thin film, and a to-be-removed film arranged on the thin film and having a magnetic region. The film removing device includes: a working table provided with a support surface onto which the film-like structure is placed; and a film moving mechanism provided with a magnetic member and configured to remove the to-be-removed film from the thin film of the film-like structure through a magnetic force.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 11, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xuequan Jin, Yachao Tong, Gu Yao, Linlin Wang
  • Patent number: 9805953
    Abstract: A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 31, 2017
    Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Masakatsu Ohno, Satoru Idojiri, Kanpei Kikuchi, Yoshiharu Hirakata, Kohei Yokoyama
  • Patent number: 9553009
    Abstract: There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: January 24, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae In Sim, Gyeong Seon Park, Kyung Ja Lim, Seung Woo Choi, O Hak Kwon
  • Patent number: 9144916
    Abstract: A system and method for removes steel beads from large diameter tires by making a series of overlapping punched cuts in a circumferential pattern in the sidewall of the tire around the beads. The punching mechanism is hydraulically operated and remains stationary while a powered roller advances the tire after each successive punching motion until the beads have completely severed from both sidewalls of the OTR tire. The machine is capable of either simultaneously or individually removing both rubber-encased inner beads from the tire.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 29, 2015
    Assignee: EAGLE INTERNATIONAL, LLC
    Inventors: Julie K. Prochello, Les Pederson, Dennis Metz, Joe Brehmer
  • Patent number: 8991463
    Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: March 31, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Il-Young Jeong, Gyoo-Wan Han, Jeong-Hun Woo
  • Patent number: 8985177
    Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: March 24, 2015
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yizhuang Zhuang, Jungmao Tsai, Shiueshih Liao, Songxian Wen, Mingfeng Deng
  • Patent number: 8945344
    Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: February 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai
  • Patent number: 8932432
    Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: January 13, 2015
    Assignee: Nikon Corporation
    Inventors: Keiichi Tanaka, Masahiro Yoshihashi
  • Patent number: 8919412
    Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: December 30, 2014
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Gregory George, Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles
  • Patent number: 8920601
    Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: December 30, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Kaori Miki, Masahito Niwa, Takahiro Nonaka, Masato Fujita
  • Patent number: 8858756
    Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: October 14, 2014
    Inventor: Masahiro Lee
  • Patent number: 8801881
    Abstract: A method of producing a flat panel display including step 1-step 4, or step 1-step 5, where at least one of the optical elements after step 4 or step 5 can be reused as an optical element in step 1: step 1: adhering two optical elements to each other via an adhesive sheet or a curable resin layer, and applying an autoclave treatment to give an optical laminate step 2: checking the appearance of the optical laminate obtained in step 1 step 3: assembling a flat panel display using the optical laminate that passed the check in step 2 step 4: separating the two optical elements in an optical laminate that was rejected by the check in step 2 by relatively rotating them with a vertical line penetrating the opposing faces thereof as a rotation axis step 5: washing the optical element resulting from step 4.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: August 12, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Takahiro Nonaka, Masato Fujita, Masahito Niwa, Kaori Miki
  • Publication number: 20140196831
    Abstract: Systems, methods, and components for the construction and disassembly of raised panel assemblies. These systems, methods, and components may include a flow-limiting structure that is configured to define at least one boundary of a channel that includes at least a portion of a gap between adjacent raised panels and is configured to receive a sealant material. The flow-limiting structure may limit a flow of the sealant material therepast, thereby decreasing an overall volume of sealant material needed for construction of the raised panel assembly and/or limiting undesired adhesion of the raised panels to other structures. These systems, methods, and components also may include an elongate disassembly aid that is configured to sever at least a portion of the sealant material from between adjacent raised panels upon removal from the raised panel assembly, such as to decrease a time needed for disassembly and/or repair of the raised panel assembly.
    Type: Application
    Filed: June 28, 2013
    Publication date: July 17, 2014
    Applicant: The Boeing Company
    Inventors: STEPHEN WILLIAM AYRES, Ralph David Druckman, Paul Henry Allen, Scott Allen Ziemann, Michael C. Esposito
  • Patent number: 8776857
    Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: July 15, 2014
    Assignee: Computype, Inc.
    Inventors: Richard Jackson, Kevin Nobbs
  • Patent number: 8771456
    Abstract: According to one embodiment, there is disclosed a method of manufacturing a semiconductor device forming a release layer on a region excluding a peripheral edge portion of a surface of a first substrate, bonding a second substrate to at least a region including the release layer of the surface of the first substrate via an adhesive layer, removing physically a peripheral edge portion of the second substrate in a manner that at least a surface of the adhesive layer right under the peripheral edge portion of the second substrate is exposed, the adhesive layer is caused to remain between the peripheral edge portion of the first substrate and the second substrate, and adhesion between the first and second substrates is maintained, and then dissolving the adhesive layer.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: July 8, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Noriko Shimizu, Shinya Takyu
  • Patent number: 8758553
    Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jens A. Riege, Steve Canale, David J. Zapp
  • Patent number: 8679290
    Abstract: Exfoliation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 25, 2014
    Assignee: Empire Technology Development LLC
    Inventor: Carlos A. Cruz
  • Patent number: 8652643
    Abstract: Provided a thin plate glass laminate of a thin plate glass substrate and a support glass substrate, which suppresses inclusion of bubbles and occurrence of convex defects due to foreign matters, from which the thin plate glass substrate and the support glass substrate are easily separated, and which is excellent in heat resistance. A process for producing a display device using the thin plate glass laminate, and a silicone for release paper for the thin plate glass laminate are also provided. A thin plate glass laminate is formed by laminating a thin plate glass substrate and a support glass substrate using a silicone resin layer having releasability and non-adhesive properties.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: February 18, 2014
    Assignee: Asahi Glass Company, Limited
    Inventor: Toshihiko Higuchi
  • Publication number: 20130186575
    Abstract: A method of separating two plates adhered to each other via an adhesive sheet or a curable resin layer, comprising relatively rotating the two plates using the vertical line penetrating opposing faces of the two plates as a rotation axis to produce a shear stress in the adhesive sheet or curable resin layer, wherein effective torque T represented by the following formula (1), which is obtained after a torque peak produced by the initial motion for the relative rotation of the aforementioned two plates, is not more than 0.085 (×106 N/m): effective torque T=[maximum torque(N·m)]/[area(mm2) of adhesive sheet or curable resin layer].
    Type: Application
    Filed: January 22, 2013
    Publication date: July 25, 2013
    Applicant: Nitto Denko Corporation
    Inventor: Nitto Denko Corporation
  • Patent number: 8469075
    Abstract: A coating film peeling apparatus for resin material includes: a peeling cylinder, a peeling roll installed therein with a space for a peeling process along an inner wall of the peeling cylinder, a resistance lid disposed to block a discharge port of the peeling cylinder, and a pressure adjustment part for adjusting an outflow rate and internal pressure of the peeling cylinder. The peeling cylinder is constituted by a polygonal-shaped angular columnar body having, as coating film pass-through holes, rows K of small holes and rows L of small holes and projection rings (angular embossments) provided alternately in multiple rows along a direction perpendicular to a rotating direction of the peeling roll.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: June 25, 2013
    Assignee: Satake Corporation
    Inventors: Hidekazu Furukawa, Katsumi Okamoto
  • Patent number: 8449716
    Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: May 28, 2013
    Assignee: EV Group GmbH
    Inventors: Markus Wimplinger, Friedrich Paul Lindner
  • Publication number: 20130048223
    Abstract: A method and an apparatus for peeling a donor film from a substrate are disclosed. In one embodiment, the donor film peeling apparatus includes i) a first roller disposed on a side of the donor film, ii) a second roller disposed on a side of the support at a position corresponding to the first roller and iii) first and second grippers configured to withdraw the donor film and support, respectively. The apparatus may further include i) first and second peeling rollers engaged with the first and second rollers with the donor film and support withdrawn by the first and second grippers being interposed therebetween to support the withdrawn donor film and support, respectively, and ii) an insertion mechanism disposed in at least one of the first and second peeling rollers and inserted between the bonded donor film and support.
    Type: Application
    Filed: May 23, 2012
    Publication date: February 28, 2013
    Applicant: Samsung Mobile Display Co., Ltd.
    Inventor: Kyung-Hyun Ahn
  • Publication number: 20130008614
    Abstract: An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for debonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and to de-bond the workpiece from the adhesive fastening element.
    Type: Application
    Filed: June 20, 2012
    Publication date: January 10, 2013
    Applicant: ROLLS-ROYCE PLC
    Inventors: Mark H. RAFFLES, Dragos A. AXINTE, Peter D. WINTON, Helen L. LLEWELLYN-POWELL
  • Patent number: 8349104
    Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: January 8, 2013
    Assignee: United Technologies Corporation
    Inventor: John H. Vontell, Sr.
  • Patent number: 8337657
    Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: December 25, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Brett Arnold Dunlap, Robert Francis Darveaux
  • Patent number: 8236125
    Abstract: A method for manufacturing a thin film multilayer device includes bonding a plastic substrate to a support substrate using an adhesive so that an upper film and a lower film constituting a weak adhesive inorganic film are sandwiched between the plastic substrate and the support substrate, and the plastic substrate is supported by the support substrate with an adhesive force stronger than an adhesive force between the upper and lower films, stacking a plurality of thin films on the plastic substrate supported by the support substrate, and separating the upper film from the lower film to separate the plastic substrate on which the plurality of thin films are stacked, from the support substrate.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: August 7, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Tohru Okabe
  • Patent number: 8226796
    Abstract: A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: July 24, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yau Sun Fan, Wai Shing Ho, Hiu Leung Tse, Yee Fan Yeung, Ka On Yue
  • Patent number: 8211270
    Abstract: A method of detaching two plates adhered via an adhesive sheet or a curable resin layer, comprising moving, relatively parallel to each other, said two plates to develop a shear stress causing rupture of said adhesive sheet or curable resin layer. According to the present invention, two plates bonded via an adhesive sheet or a curable resin layer can be detached by only moving the two plates relatively parallel to each other. Therefore, even when at least one of the two plates is thin and poor in flexibility, two plates can be detached from each other substantially without a force (load) which causes high distortion (deformation) producing a breakage or crack on the plates. Accordingly, for example, when two optical plates adhered via a transparent adhesive sheet need to be re-bonded, two optical plates can be detached from each other and adhered again. Thus, the production cost of equipment with a display function, which carries a flat-panel display, can be reduced.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: July 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Tatsuya Suzuki, Ryuuichi Kabutoya, Yuuki Fukuda
  • Publication number: 20120152466
    Abstract: A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core.
    Type: Application
    Filed: November 18, 2011
    Publication date: June 21, 2012
    Applicant: NORDENIA TECHNOLOGIES GMBH
    Inventors: Dieter Homoelle, Marcus Schoenbeck
  • Patent number: 8181688
    Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: May 22, 2012
    Assignee: Suss Microtec Lithography, GmbH
    Inventors: Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kuhnle
  • Publication number: 20110253315
    Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward.
    Type: Application
    Filed: April 14, 2011
    Publication date: October 20, 2011
    Applicant: SUSS MICROTEC LITHOGRAPHY, GMBH
    Inventor: GREGORY GEORGE
  • Patent number: 8012307
    Abstract: A separating device for separating an electronic main body from a substrate bonded thereto comprises a platform, a conveying section, a dissolving section, a cleaning section, and a first partition plate. The conveying section is disposed on the platform for moving the electronic main body and the substrate forward. The dissolving section is disposed on the platform for spraying a solvent onto the bonded electronic main body and substrate. The cleaning section is also disposed on the platform for cleaning the electronic main body. The first partition plate is located between the dissolving section and the cleaning section and has at least one first slot, which allows only the electronic main body but not the substrate to pass therethrough, so that the electronic main body is separated from the substrate at the first partition plate. A method for separating the electronic main body and the substrate is also provided.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: September 6, 2011
    Assignee: Asia IC Mic-Process, Inc.
    Inventors: Yuan-Hsin Li, Chiu-Feng Yang