Abstract: A film-removing apparatus configured to remove a protecting film from a workpiece includes a supporting module configured to support the workpiece, a clamping module configured to clamp the workpiece supported by the supporting module, and a peeling module. The peeling module includes a first peeling member and a second peeling member. The first peeling member includes a bearing surface. The peeling module moves towards the clamping module to bring the bearing surface to below the protecting film, the second peeling member moves towards the protecting film to cooperate with the first peeling member in clamping the protecting member. The peeling module is then moved away from the clamping module to peel off the protecting film.

Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.

Abstract: A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

Abstract: The present disclosure provides a peeling device and method for film material. The film material includes a first film layer, a second film layer, and a third film layer stacked in sequence, and the first film layer and the second film layer have bodies corresponding to the third film layer and protrusions. The peeling device is configured to peel off the first film layer and includes: an abutment divided into a first area configured to place the bodies of the first film layer and the second film layer and the third film layer, and a second area configured to place the protrusions of the first film layer and the second film layer; and a peeling mechanism configured to be coupled to the protrusion of the first film layer to separate the first film layer from the second film layer.

Abstract: A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.

Abstract: A sheet conveyor includes a feed roller configured to contact a sheet from above and feed the sheet in a sheet feed direction, a frictional member disposed downstream from the feed roller, a separation roller disposed downstream from the feed roller and facing the frictional member from above, and a guide portion located downstream from the feed roller and upstream from the separation roller. The guide portion includes a pointed portion located above a portion of a common tangent to the feed roller and the separation roller when viewed in a cross section that is orthogonal to an axial direction of the feed roller and an axial direction of the separation roller. The pointed portion is located along a width direction of the sheet. The guide portion is configured to guide the sheet fed over the pointed portion toward a nip between the separation roller and the frictional member.

Abstract: An antimicrobial composition which comprises an active agent that reduces the spread of pathogens. The active agent is mixed with a water-soluble polymer in order to form a mixture, in which the polymer forms a continuous phase, from which the active agent is capable of being released. The composition can be used to produce objects, for example elongated extrudates, which can be used to cover and coat different objects. Thus, the surface is constantly covered with the active agent until the object is mechanically worn away.

Abstract: A coaxial cable has an inner conductor, an insulator provided on an outer circumference of the inner conductor, a film provided on an outer circumference of the insulator, an outer conductor provided on an outer circumference of the film, and a sheath provided on an outer circumference of the outer conductor. At least a part of the film is colored in a different color from both colors of the insulator and the outer conductor.

Abstract: Systems and methods for debonding a carrier from a semiconductor device are disclosed herein. In one embodiment, a system for debonding a carrier from a semiconductor device includes a support member positioned to carry the semiconductor device and a fluid delivery device having an exit positioned to direct a fluid toward an adhesive layer between the carrier and the semiconductor device. The fluid directed from the fluid delivery device initiates debonding of the carrier from the semiconductor device by weakening or loosening at least a portion of the adhesive. The system further includes a liftoff device configured to releasably engage the carrier and apply a debonding force to the carrier to complete debonding of the carrier from the semiconductor device.

Abstract: This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

Abstract: A film peeling apparatus including a peeling unit, a peeling unit position adjusted, and a clamp. The peeling unit has uneven portions at an end portion thereof. The peeling unit is configured to peel off a protection film attached on a display panel. The peeling unit position adjuster is connected to the peeling unit. The peeling unit position adjuster is configured to adjust a position of the peeling unit. The clamp is disposed separately from the peeling unit. The clamp is configured to clamp the peeling unit.

Abstract: A coaxial cable includes an internal conductor, an insulator that is provided at an outer circumference of the internal conductor, a film that is provided at an outer circumference of the insulator, an external conductor that is provided at an outer circumference of the film, a sheath that is provided at an outer circumference of the external conductor, and an adhesive layer that is provided between the insulator and the film and that bonds the insulator and the film with each other.

Abstract: An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater extending at least partially around and at least partially defining an elongate heating region configured for receiving the lengthwise section of the optical fiber. The heater can heat the heating region to a temperature above the thermal decomposition temperature of the at least one coating. A controller automatically deactivates the heater after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region. Thereafter, an air mover can cause ambient air to cool the heater.

Abstract: A device body comprises: a winding roller that is provided so as to contact with a flooring material sheet bonded to a floor and on which is wound the sheet that is stripped from the floor starting from a contact portion with the sheet; a driving means that, by rotationally driving the winding roller, winds the sheet onto the winding roller and strips the same from the floor, and that advances the device body by the winding roller being pushed toward the floor by the reactive force of the removal and rolling on the sheet; and a guiding means that discharges the sheet being stripped from the floor in front of or to the side of the direction of advancement of the device body.

Abstract: A roller system can include: a rear rolling member configured for rolling contact with a surface; a front rolling member rotating in an opposite direction to the rear rolling member and the front rolling member configured to be elevated above the surface during use; and a chassis coupling the rear rolling member to the front rolling member.

Abstract: A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base material 1 and an adhesive layer 2 provided on the peeling base material 1 in the form of an island, the method including a peeling step of, after laminating a long adhesive layer 2 on the peeling base material 1, peeling off an unnecessary portion 6 of the adhesive layer 2 so that a predetermined portion of the adhesive layer is left on the peeling base material 1 in the form of an island, wherein, in the peeling step, the width W of a narrow portion 8, which is the narrowest in width in a short direction of the unnecessary portion 6 of the adhesive layer 2, is adjusted so that the breaking strength in the narrow portion 8 is 200 g or more.

Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.

Abstract: Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: In the separation of a cover tape 15e from a carrier tape 15 performed by a cover tape separating mechanism 50, a cover tape 15e, which is separated from a base tape 15a by a separating blade edge 51f, comes into contact with a concave conical surface 52c, so that one side portion of a cover tape 15e is bent toward the other side portion; and the bent cover tape 15e is pressed against a guide surface 32s from below while the carrier tape 15 is guided to a pick-up position. Accordingly, the cover tape 15e is folded on the base tape 15a in a flat shape.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.

Abstract: An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.

Abstract: A tape feeder includes a guide part that guides a carrier tape and is detachably attached to a main body. The guide part includes: a lower member guiding the carrier tape and attached to and detached from the main body; an upper member pressing down the carrier tape from above; a tape introduction part guiding the carrier tape into the upper member at an upstream side thereof in a tape feed direction; a confirmation opening part disposed in the upper member for visually confirming that the carrier tape arrives at a pin engagement range; an open/close mechanism opening and closing the upper member with respect to the lower member; and a positioning mechanism fitting a positioning pin into a feed hole of the carrier tape in the guide part, thereby positioning the carrier tape relative to the guide part in the tape feed direction.

Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.

Abstract: Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system.

Abstract: By controlling the flow rate of one or more gaseous components of an etch ambient during the formation of metal lines and vias on the basis of feedback measurement data from critical dimensions, process variations may be reduced, thereby enhancing performance and reliability of the respective metallization structure.

Abstract: A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

Abstract: Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).

Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.

Abstract: A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core.

Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.

Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.

Abstract: A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.

Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.

Abstract: A system includes a first drive unit used for driving at least one of a release device, a gripper device, and a second drive unit used for driving a support device. The release device is a vacuum device. The vacuum device is coupled to a vacuum source and applies a suction force against an edge portion of one layer among a first layer disposed on a second layer. Another layer among the first layer and the second layer is held by a support surface of the support device. The vacuum device and/or the support device are movable upwards and downwards for peeling the edge portion of the one layer from the other layer. The gripper device holds the peeled edge portion of the one layer and the support device or the gripper device is movable along at least one axis for removing the one layer from the other layer.

Abstract: A label for a container may include a planar body comprising a first edge and a second edge, the first and second edges disposed at opposite sides of the body from each other; a cut-out portion of the planar body disposed between the first and second edges; and first and second tear lines extending from the cutout portion to respective first and second termination locations at or proximate to the first and second edges, respectively. The first and second tear lines may diverge at an angle away from each other in a direction from the cut-out portion to the respective first and second termination locations.

Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

Abstract: In a structure that exfoliation is performed in the pitch sending of a carrier tape (15) by making a cover tape exfoliating mechanism (50) intervene between joining surfaces of a base tape (15a) and a cover tape (15e), in an exfoliation start position where an exfoliating knife tip (51f) of an acuminate shape, which is provided at a front end, starts to exfoliate the joining surface, a lower guide member (40), which guides the carrier tape (15) from below, is pushed up from the bottom side by a lever member (44), and when the carrier tape (15) is installed, the carrier tape (15) is pushed up together with the lower guide member (40) to make the exfoliating knife tip (51f) in the exfoliation start position to be aligned to the joining surfaces and enter between the joining surfaces.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: An automatic corner lift-off apparatus for a polarizer of a liquid crystal display (LCD) panel is disclosed, which is suitable for use in a process of removing a polarizer during manufacturing of an LCD panel and comprises: a front clip, comprising a long arm and a short arm which intersect with each other to substantially form an “L” shape; a back clip, spaced apart from the front clip and being capable of cooperating with the front clip to perform a clipping action; and at least one sensor disposed on the front clip or the back clip, being configured to sense whether the polarizer has been successfully lifted off. Thereby, the present disclosure allows for fully automatic polarizer removing operations and can reduce work-related injuries and improve the success ratio of and efficiency of removing the polarizer.

Abstract: Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.

Abstract: Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate.

Abstract: A positioning mechanism, which determines the relative position of a carrier tape 15 in a tape feed direction by fitting alignment pins 37 to feed holes 15d in a lower member 31, and a cover tape separating mechanism 50, which is provided on an upper member 32 and exposes electronic components 16 stored in component pockets 15b by separating a cover tape 15e from a base tape 15, are provided at non-interference positions that do not interfere with each other when the upper member 32 is closed to the lower member 31. Accordingly, when the cover tape 15e is separated from the carrier tape 15, the carrier tape 15 is aligned with the guide section 30.

Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.

Abstract: A method of operation of a micro device feeder system includes: adjusting a distance between a movable drive plate and a mounting plate for aligning a carrier tape carrying a micro device to a center line for pick-up of the micro device by external device handling equipment; and configuring a tape handling mechanism, having a sprocket assembly, to accommodate a predetermined width of the carrier tape.

Abstract: A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.