Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.

Abstract: A method of producing a multilayered ceramic substrate in which wiring conductors can be provided on both main surfaces and the density of the wiring conductors can be increased by a non-shrinkage process. In the producing method, a green composite laminated product in which metallic foils are arranged to cover both main surfaces of a green laminated structure comprising a plurality of ceramic green sheets on which conductive paste is coated for forming internal wiring conductors is burned. In this burning step, shrinkage of the ceramic green sheets is suppressed by the metallic foils in the direction of the main surfaces thereof. After burning, the metallic foils are patterned by etching based on photolithographic technology to form external conductor films.

Abstract: A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.

Abstract: A highly reliable ceramic electronic device is manufactured by suppressing diffusion of silver, the ceramic device having a silver-based conductive pattern on a sintered glass ceramic compact primarily composed of BaO—TiO2—ReO3/2 dielectric ceramic powder. A method for manufacturing the ceramic electronic device involves the steps of blending BaO—TiO2—ReO3/2 dielectric ceramic powder and glass powder to form a powdered glass ceramic mixture, in which Re is a rare-earth element, molding the powdered glass ceramic mixture to form a glass ceramic compact having a predetermined shape, forming a silver-based conductive pattern on the glass ceramic compact, and heating the glass ceramic compact provided with the silver-based pattern at a heating rate of at least about 10° C./minute from a temperature of at least about 500° C., in which the total baking time at the temperature of at least about 500° C. is set to be about 20 to 90 minutes.

Abstract: The present invention relates to a process for producing filled vias which are made of two components, a first component which forms a bonding layer between the wall of the via and a second component which forms the core of the via. Preferably, the two components solidify from a melt which includes two immiscible liquids. The first liquid is capable of wetting the wall of the via and the second liquid. The resulting product is also disclosed. Preferably the first component comprises a copper oxide and the second component comprises a conductive metal such as silver or copper.

Abstract: A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000° C., and eliminating the unsintered sheet type bases.

Abstract: The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact having the plurality of the laminated ceramic green sheets containing the ceramic insulating material and the wiring conductor; providing raw sheet type bases on the principal plane at both ends with respect to the lamination direction of the raw compact, the raw sheet type bases containing a ceramic not to be sintered at the baking temperature of the raw compact; baking the raw compact in the state interposed between the sheet type bases so as to obtain the laminated member; and eliminating the unsintered sheet type bases; wherein the heat expansion coefficient difference of the sheet type bases and the laminated member after baking is 2.5×10−6 degK−1 or more.

Abstract: A method of forming a distortion-free circuit whereby a conductive composition is applied to at least one layer of green ceramic tape. The conductive composition formulation is based on total composition, conductive powder selected from Ag, Pd, Pt and mixtures thereof and 0.5 to 1.5 wt. % boron; wherein a and b are dispersed in organic medium. The green tape formulation is, based on total composition, 25-50 wt. % glass composition comprising, based on mole %, 50-67% B2O3; 20-50% alkaline earth metal oxide; 2-15% rare earth oxide and 0-6% alkali metal oxide and 0-10% Al2O3; 50-75 wt. % refractory oxide and organic polymeric binder. The assemblage is fired to form a distortion-free circuit.