Abstract: A solution mined cavity system and method are disclosed. The system comprises an underground cavity created by solution mining in salt deposits, an upper water reservoir, tubing structure adapted to lead water from the upper water reservoir into the underground cavity and out of the underground cavity, and a pumping device adapted to contribute to pumping water from the upper water reservoir via the tubing structure out of the cavity.

Abstract: A heat transport device includes a heat pipe having a capillary container having a wick and a working fluid arranged therein. A first heat source is coupled to a first end of the capillary container to define an evaporator section and a cold sink is coupled to a second end of the capillary container to define a condenser section. A capillary pump includes an evaporator and a reservoir configured to store an additional supply of working fluid. A second heat source coupled to the evaporator is configured to vaporize the working fluid arranged therein. A fluid loop couples the capillary pump to the heat pipe. Upon detection of a predetermined condition indicative that a majority of the working fluid within the heat pipe is frozen, the capillary pump is configured to supply vaporized working fluid to the heat pipe.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Abstract: A cold box having a cooling receptacle filled with a dry protective gas in which is accommodated a rack loaded with tube-shaped vessels. The cooling receptacle is covered by a movable lid which is associated with a lid part and which is preferably formed by an outer lid and a rotatable inner lid integrated in the outer lid so that the cooling receptacle is completely covered in every position of the lid. At least one of the through-holes provided in the inner lid can be arranged over a respective tube-shaped vessel by a coordinated movement of the outer lid and rotation of the inner lid so that the tube-shaped vessel located under the through-hole in alignment therewith can be filled with a sample through the through-hole by means of a commercially available pipette tip/dispensing needle of an automated pipetting device.

Abstract: A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop.

Abstract: An emergency cooling system for cooling an object certainly and rapidly in case a temperature of the object is accidentally raised abnormally. A loop thermosyphon is formed by connecting an evaporating portion with a condensing portion through a vapor pipe and a return pipe in a manner to form a cyclic conduit. A condensable working fluid circulates within the loop thermosyphon to be evaporated by a heat of the cooling object at the evaporating portion, and to be condensed at the condensing portion to radiate the heat conducted from the cooling object. A switching valve is disposed on the return pipe to selectively allow the working fluid in a liquid phase to be returned from the condensing portion to the evaporating portion. Heat transfer pipes to which the heat of the cooling object is conducted are arranged in the evaporating portion.

Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Abstract: A cooling system and method for cooling electronic components. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and is pumped through interstices defined by and between the strands of the mesh. Flow dividers can define interconnected channels within the cavity.

Abstract: An apparatus provides a high efficiency for refrigerator operation. The inclusion of a separate external evaporator and condenser that draws heat away from the common refrigerator condenser allows an increase in the intensity of the cooling process of the cooling agent, thereby diminishing electrical consumption, and decreasing the size and noise of the condenser. This is achieved by structuring the refrigerator condenser with the one tube for the cooling agent of the common refrigerator and another volume for evaporating the cooling substance of the external evaporator and condenser. Moreover, external system of natural cooling has a condenser that is located in the open air and connected to the evaporator with the help of vapor lines and condensed vapor lines.

Abstract: A thermal source provides heat to a heat engine and or one or more thermal demands, including space and water heating and heat storage. Additionally the output of the heat engine may be used for local in situ electricity needs, or directed out over the grid. A system controller monitors conditions of the components of the system, and operates that system in modes that maximize a particular benefit, such as a total accrued desired benefit obtained such as reduced electricity cost, reduced fossil fuel use, maximized return on investment and other factors. The controller may use past history of use of the system to optimize the next mode of operation, or both past and future events such as predicted solar insolation.

Abstract: An exhaust heat recovery apparatus includes an evaporation unit, a condensation unit, an evaporation-side communication part and a condensation-side communication part. The evaporation unit is disposed in a duct member through which an exhaust gas generated from an engine flows, and evaporates an operation fluid by heat of the exhaust gas. The condensation unit is disposed in a coolant passage through which a coolant flows, and condenses the operation fluid by radiating the heat to the coolant. The evaporation-side communication part connects the evaporation unit and the condensation unit for introducing evaporated operation fluid to the condensation unit. The condensation-side communication part connects the condensation unit and the evaporation unit for introducing condensed operation fluid to the evaporation unit. The condensation-side communication part is in contact with an outer surface of the duct member at least at a part.

Abstract: For providing a liquid cooling system for an electronic apparatus having a heat-generating element within a housing thereof, enabling small-sizes thereof and being effective for lowering noises when the apparatus is operated, equipped with a new type of a driving means for a liquid coolant therein, comprises a heat-receiving jacket 100 for transferring heat generated from the heat-generating element to a liquid coolant, to evaporate it, within an inside thereof; a radiator 200 for guiding the evaporated coolant supplied from the heat-receiving jacket into an inside thereof, so as to cool it to be liquefied; and a driving means 300 for applying driving force for circulating the liquid coolant, through repetition of heating and cooling upon a portion of the liquefied liquid coolant supplied from the radiator, while restricting a flow direction of the liquid coolant within an inside thereof into one direction, whereby circulating said liquid coolant within a circulation loop including the heat-receiving jacket,

Abstract: A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header.

Abstract: A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Abstract: A pump-free water-cooling system includes a heat-exchange circulating solution container containing heat-exchange circulating solution and vapor of the circulating solution, at least one solution outlet to discharge the circulating solution from the container, and a gas-liquid two-phase fluid inlet to charge into the container gas-liquid two-phase fluid composed of the circulating solution. The system also includes a circulating-solution transporting route in which a first transportation route is linked to a second transportation route which is linked to a third transportation route. A sensible-heat-emitting heat exchanger is provided along the first transportation route. The first transportation route is linked with the solution outlet. Heat exchange is carried out along the second transportation route at least between circulating solution therein and the circulating solution in the container. A heating heat exchanger is provided along the third transportation route.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.

Abstract: A pump-free water-cooling system is provided wherein external power supply is not involved; heat can be transported in any direction; and high reliability and low thermal resistance are ensured.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: An Advanced Loop Heat Pipe (“ALHP”) apparatus, for passively transporting waste heat over a long distance and rejecting it to a heat sink for heat rejection, an evaporator capillary pump (“ECP”) for heat acquisition, includes a reservoir for storing the working fluid of the ALHP, an auxiliary pump for vapor management of the liquid side of the loop, a primary condenser for condensation of vapor from the ECP, and a secondary condenser for condensation of vapor from the reservoir. The reservoir, ECP, and condenser are connected by transport lines to provide a conduit for the working fluid to flow from one component to another. The reservoir also connects to the auxiliary pump by an auxiliary pump transport line via the condenser. The auxiliary pump further connects to the condenser by a vapor transport line.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: A system for supporting pipe within soil or fill material which minimizes positional disturbances of the pipe despite seasonal fluctuations in atmospheric temperature is provided. The system provides a length of double walled pipe, a support member placed in the soil or fill material and a wicking device which transfers energy between the inner pipe of the double walled pipe which is typically full of a cryogenic fluid and the support. The energy transfer stabilizes the soil or fill material, typically by freezing.

Abstract: An Advanced Loop Heat Pipe (“ALHP”) apparatus, for passively transporting waste heat over a long distance and rejecting it to a heat sink for heat rejection, an evaporator capillary pump (“ECP”) for heat acquisition, includes a reservoir for storing the working fluid of the ALHP, an auxiliary pump for vapor management of the liquid side of the loop, a primary condenser for condensation of vapor from the ECP, and a secondary condenser for condensation of vapor from the reservoir. The reservoir, ECP, and condenser are connected by transport lines to provide a conduit for the working fluid to flow from one component to another. The reservoir also connects to the auxiliary pump by an auxiliary pump transport line via the condenser. The auxiliary pump further connects to the condenser by a vapor transport line.

Abstract: An air conditioning system comprising a plurality of heat pipes. Each of the heat pipes includes an input coil at the input end of a chiller for the passage of input air there through and an output coil at the output end of a chiller for the passage of output air there through. Each of the heat pipes also having an inlet leg and an outlet leg coupling an associated input coil and output coil for the flow of a working fluid there through. At least one valve for controlling the flow of the coolant within each heat pipes exists. A tube and shell heat exchanger transfers heat from a chiller fluid to an intermediate portion of the heat pipes.

Abstract: A pulse thermal loop heat transfer system includes a means to use pressure rises in a pair of evaporators to circulate a heat transfer fluid. The system includes one or more valves that iteratively, alternately couple the outlets the evaporators to the condenser. While flow proceeds from one of the evaporators to the condenser, heating creates a pressure rise in the other evaporator, which has its outlet blocked to prevent fluid from exiting the other evaporator. When the flow path is reconfigured to allow flow from the other evaporator to the condenser, the pressure in the other evaporator is used to circulate a pulse of fluid through the system. The reconfiguring of the flow path, by actuating or otherwise changing the configuration of the one or more valves, may be triggered when a predetermined pressure difference between the evaporators is reached.

Abstract: A heat exchanger (1) on the secondary heat source, which exchanges heat with a heat exchanger (12) on the primary heat source in a primary cooling circuit (A), is connected with an indoor heat exchanger (3) through a gas pipe (6) and a liquid pipe (7). A tank (T) storing a liquid cooling medium is connected at its lower end to the liquid pipe (7) and its upper end to a pressure adjustment mechanism (18). Check valves (CV1 and CV2) are disposed on both sides of the connecting point of the tank (T) with respect to the liquid pipe (7).