Abstract: A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

Abstract: An ion exchange system includes an ion exchange column filled with ion exchange media and a passive cooling system. The passive cooling system includes a working fluid that transfers heat away from the ion exchange column. In one embodiment, the working fluid is in a closed system. In another embodiment, the passive cooling system includes a heat pipe. In yet another embodiment, the ion exchange system is used to separate radionuclides, such as Cs-137 from a liquid waste stream.

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract: The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is let into the refrigerant delivery portion and an outlet port through which the refrigerant is let out; a cooling fin portion arranged in the refrigerant delivery portion of the casing portion and between the two opening portions; and a loss adding portion arranged in the refrigerant delivery portion of the casing portion and between the cooling fin portion and at least one of the two opening portions, the loss adding portion generating pressure loss in the refrigerant passing therethrough.

Abstract: Techniques for integrating two-phase cooling into a microprocessor chip package lid are provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a condenser plate attached to the evaporator plate such that a cavity is formed between the evaporator plate and the condenser plate; a thermal insulation layer sandwiched between the evaporator plate and the condenser plate; and a working fluid enclosed within the cavity, wherein the working fluid partially fills the cavity. At least one heat-dissipating device can be placed in thermal contact with the evaporator plate via a thermal interface material. A method is also provided for forming the vapor chamber lid device.

Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser and to form a loop together with the liquid pipe, a first porous body provided in the evaporator, and a second porous body provided in the liquid pipe. A connection region between the evaporator and the liquid pipe includes a first porous extension part extending from one of the first porous body and the second porous body toward the other, and a space part in contact with the first porous extension part. A leading end of the first porous extension part is inserted in a first concave part formed in the other of the first porous body and the second porous body.

Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.

Abstract: The disclosure relates to the field of electronic elements, and discloses an Insulated Gate Bipolar Transistor (IGBT) module assembly which comprises a cooling plate and an IGBT module fixedly connected to the cooling plate, wiring terminals are arranged at an end face of the IGBT module, which is away from the cooling plate, the IGBT module comprises a side face adjacent to the end face, and the side face and the cooling plate form a water guiding groove. In the disclosure, the side face and the cooling plate form the water guiding groove, and a great amount of condensed water collected on the cooling plate can be guided to flow out through the water guiding groove instead of flowing to the end face of the IGBT module, on which the wiring terminals are arranged.

Abstract: An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.

Abstract: A two-phase fluid heat transfer structure includes: at least one evaporator having an evaporation chamber, which containing a first working medium; at least one evaporator tube body having a first end and a second end, which communicating with the at least one evaporator to form a loop of the first working medium, the at least one evaporator tube body further having a condensation section between the first and second ends; at least one heat sink; at least one heat sink tube body having a heat absorption section, which containing a second working medium, the at least one heat sink tube body being connected to the at least one heat sink; and at least one heat exchanger having a first face and a second face for the condensation section of the evaporator tube body and the heat absorption section of the heat sink tube body to attach to.

Abstract: Method for conversion of energy, by which a sun energy, or heat energy, or radiation energy is converted in an other form of energy, where the energy in its heat form or in the form of radiation is supplied to a vaporizer of a heat pipe, and this energy is converted in the energy of a working gas of the heat pipe through (as a consequence of) the absorption of this energy by the working liquid of the heat pipe; the energy in its heat form is extracted (conducted away) from the condenser of the heat pipe, and the energy of movement of the gas of the heat pipe is converted in others, not heat forms of energy, in particular into electric energy, where additionally to the capillary or gravitational forces, usually acting in the heat pipe transport zone to recover the heat pipe liquid, an additional energy, in its mechanical or electrical or any other not-heat form, is supplied to the working liquid of the heat pipe, among other possibilities, from outside in respect to the heat pipe, and this additional energy is

Abstract: An enclosure configured to at least partially surround a data storage library, and a system including a data storage library and enclosure(s). The enclosure includes at least one surface configured to surround the at least one library access opening and form a chamber and to permit movement of the movable panel to permit access to the interior of the data storage library, and at least one enclosure access opening in the at least one of the surface to permit access to the interior of the chamber. The enclosure is configured to resist environmental conditions from intruding into the interior of the enclosure, and is further configured to permit exterior environmental conditions from within the interior of the library to intrude into the chamber of the enclosure.

Abstract: A detector assembly for a CT system includes a plurality of detector modules, each detector module including a grid of pixelated scintillators, a photodiode having pixelations that correspond with the pixelated scintillators, and an electronics package for processing acquired X-ray data, a support structure extending along a Z-direction of the CT system and having the plurality of detector modules positioned thereon, and a heat sink extending along the Z-direction and having the support structure mounted thereon, the heat sink including a passageway passing therethrough and along the Z-direction, such that cooling air may pass into the passageway at a first end of the heat sink and exit the passageway at a second end of the heat sink opposite the first end.

Abstract: In each of a plurality of semiconductor element groups of a power converter, a second semiconductor switching element and a third semiconductor switching element are shifted from each other in a second direction such that at least a portion of fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to surfaces of coolers is different from fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

Abstract: Embodiments of the present disclosure are directed to a cold plate assembly for an electrical cabinet, including: a main body part, a sealing part, and a mounting part. The main body part is provided with a channel for the circulation of a liquid cooling medium and an accommodation groove located on a first upper surface of the main body part. The sealing part is disposed in the accommodation groove and the mounting part is located above the sealing part. A lower surface of the mounting part faces the main body part, and a second upper surface of the mounting part is configured to mount an electronic device to be cooled.

Abstract: A power converter includes a sealing member in a loop shape sealing a space between a sealing surface of a cooler and a sealing surface of a casing. Either one of the sealing surface of the cooler and the sealing surface of the casing is provided with a groove in a loop shape enabling the sealing member to be fitted therein. A first positioning portion is provided on a bottom surface of the groove. The sealing member includes an internal sealing portion with a circular cross-section and located along the bottom surface of the groove, an external sealing portion with a circular cross-section and located so as to surround a looped outer circumference surface of the internal sealing portion, and a connected portion that connects the internal sealing portion to the external sealing portion across an entire circumference of the loop. The connected portion includes a second positioning portion capable of being fitted in the first positioning portion.

Abstract: A supply system with a plurality of consumers, which can be supplied with a minimum volumetric flow by the supply system to ensure their operational function, wherein the supply system exhibits a network of lines with a plurality of lines, which are each hooked up to the consumers, and a pump connected to the lines for generating a volumetric flow of supply fluid in the lines, wherein the supply system incorporates a network of lines in which consumers are fluidically connected in parallel in relation to the pump arrangement, and wherein each consumer has allocated to it at least one flow control valve functionally placed upstream from the respective consumer in the cooling circulation as viewed from the position of the pump in the direction of flow.

Abstract: Passive on-board aircraft cooling systems are provided with an evaporator/receiver in heat-exchange relationship with at least one heat source on board the aircraft, the evaporator/receiver containing a liquid phase working fluid which changes state to a vapor phase working fluid in response to heat transfer therefrom from the at least one heat source. First and second condensers are fluid-connected to the evaporator/receiver for receiving vapor phase working fluid from the evaporator/receiver. At least a portion of the vapor phase working fluid transferred to the first and second condensers is condensed by heat transfer between the first and second condensers and aircraft-external unpressurized and aircraft-internal pressurized air supply streams, respectively, to thereby form liquid phase working fluid which returns to the evaporator/receiver by virtue of the fluid connection with the first and second condensers.

Abstract: A temperature controlled case includes a housing that defines a temperature controlled space and a multi-circuit cooling element in thermal communication with the temperature controlled space. The multi-circuit cooling element includes two or more cooling coils. Each of the cooling coils is coupled to a different circuit structured to selectively circulate coolant through the multi-circuit cooling element. Each circuit is fluidly separate from each remaining circuit such that the coolant circulated through each circuit is not shared with each remaining circuit. The multi-circuit cooling element further includes a plurality of heat exchange fins coupled to each of the two or more cooling coils such that each of the heat exchange fins facilitates heat removal from the temperature controlled space by each of the two or more cooling coils.

Abstract: A pumped refrigerant cooling system having multiple pumping units for providing working fluid to a load to enable cooling of a space via the load. The pumped refrigerant cooling system operates the pumping units at less than capacity. When a pumping unit is deactivated, the output of the remaining pumping units is increased to maintain fluid flow.

Abstract: A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

Abstract: An integrated heat dissipation device includes at least one first case, a second case and multiple third cases. The first and second cases respectively have a first case chamber and a second case chamber. Each third case has a third case chamber. Each third case is connected to the second case via a first heat pipe. The first case is connected to the corresponding third case via a second heat pipe passing through the second case. Accordingly, the working fluid in the third case chambers can flow through the respectively connected first and second heat pipes to the first and second case chambers to achieve the vapor-liquid circulation effect and dissipate the heat.

Abstract: A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.

Abstract: Methods for thermalsiphoning supercritical CO2 within a geothermal formation includes providing a geothermal energy system that includes an underground hot rock reservoir, a production well, and an injection well that together form a fluid path suitable for circulating supercritical CO2. The supercritical CO2 flows by thermosiphoning. Thermosiphoning is maximized by maintaining a pressure between 1400-4000 psia, an injection temperature in a range from 50-200 C and a production temperature in a range from 150-600 where injection temperature and the production temperature differ by at least 50° C.

Abstract: A thermoelectric generation apparatus includes a heat absorbing surface configured to absorb heat from an internal combustion engine, a heat generating surface bonded to the heat absorbing surface by a semiconductor and configured to discharge the heat to the outside, and a conductive converting part interposed between the heat absorbing surface and the internal combustion engine. The conductive converting part is configured to allow the heat to be conducted from the internal combustion engine to the heat absorbing surface when a temperature of the internal combustion engine is equal to or greater than a specific value.

Abstract: An air containment system for a datacenter. The air containment system includes horizontally slidable vertical rails that engage the rear rails to two adjacent server racks. The vertical rails can include a front face that is compressible to provide an airtight connection with the server racks. Filler plates attach to adjacent vertical rails and fill the space between a top of the server rack and the top of the rails.

Abstract: The invention relates to a variable speed drive (1) intended to control an electrical load, said variable speed drive (1) being constructed to be inserted along a main axis (X) through an opening (200) produced in a frame (2). The variable speed drive has the particular feature of comprising an undercut (40) produced on its rear part and having a sufficient depth to allow its fixing plinth (111) to pass through said opening (200). The invention also relates to a system comprising the variable speed drive and a seal-tight architecture. The seal-tight architecture comprises said frame through which the opening (200) intended to accommodate the variable speed drive (1) is produced.

Abstract: An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Abstract: A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.

Abstract: According to the present invention, the method of heat transfer in a direction, which is reverse to natural convection, includes introduction of an additional pumping substance into the heated area. The pumping substance is incapable to be dissolved in the heat-transfer agent and its boiling temperature is lower than the boiling temperature of the heat-transfer agent. The heat-transfer agent is heated up, the pumping substance evaporates and the vapor pressure of the pumping substance is used to force the hot heat-transfer agent to flow along the branches of the circulating loop. The device for heat transfer in a direction reverse to the natural convection characterized in that its design incorporates technical means intended for vapor condensation of the pumping substance as well as technical means intended for draining that condensate from the condensation area to the evaporation area.

Abstract: A cooling device includes an enclosure housing, an external heat rejection device, a primary cooling system including a loop heat pipe like (LHPL) device. The LHPL device includes an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, several different types of compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway.

Abstract: A refrigerator includes a main body defining a compartment, the compartment having an access opening, a first wall and a heat exchanger supported by the first wall; a refrigeration system containing therein a working medium and including an evaporator which is disposed outside of the compartment for cooling the compartment; a door supported by the main body for selectively closing at least part of the access opening of the compartment; and a sub-compartment on the door and including a second wall with an opening. The heat exchanger is coolable by the working medium. The heat exchanger and the second wall are positioned so that when the door is in a closed position, the heat exchanger is exposed to an interior of the sub-compartment through the opening.

Abstract: A solar collector (26) includes: an outer tube (64) of circular cross-section, closed at one of its ends, an absorption layer (52) arranged inside the outer tube (64), for absorbing solar radiation (Rs), and a heat pipe (56) including a hot part (58) laid out inside the outer tube (64), a cold part (60) arranged outside the outer tube (64), and a reservoir (62) containing a heat pipe fluid (63) and extending over the hot part (58) and the cold part (60). The outer tube (64) is hermetically closed around the heat pipe (56) at the other of its ends, a vacuum being formed inside said outer tube (64). For the hot part (58) of the heat pipe (56), the reservoir (62) is applied at least locally against the absorption layer (52).

Abstract: The invention provides a method for a thermally activated closed loop heat transfer system, and requires no other external power source other than the heat which it is transferring. The system is based on a two-phase (liquid/vapor) working fluid, with heat input through an evaporator and heat rejected through a condenser. All of the mechanical power produced by an engine, driven by the high vapor quality fluid leaving the evaporator, is consumed by the pump. The pump drives the low vapor quality fluid leaving the condenser back to the evaporator. Nearly isothermal heat transport can be achieved when using a pure or azeotropic working fluid, since the operation only requires the evaporator pressure to be marginally higher than the condensers pressure.

Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure.

Abstract: An offshore power generation structure comprising a submerged portion having a first deck portion comprising an integral multi-stage evaporator system, a second deck portion comprising an integral multi-stage condensing system, a third deck portion housing power generation equipment, cold water pipe; and a cold water pipe connection. The heat exchangers in the evaporator and condenser systems include a multi-stage cascading heat exchange system. Warm water conduits in the first deck portion and cold water conduits in the second deck portion are integral to the structure of the submerged portion of the offshore platform.

Abstract: A thermal management system and method for active cooling of high speed seeker missile domes or radomes comprising bonding to an IR dome or RF radome a heat pipe system having effective thermal conductivity of 10-20,000 W/m*K and comprising one or more mechanically controlled oscillating heat pipes, employing supporting integrating structure including a surface bonded to the IR dome or RF radome that matches the coefficient of thermal expansion the dome or radome material and that of said one or more mechanically controlled oscillating heat pipes, and operating the heat pipe system to cool the IR dome or RF radome while the missile is in flight.

Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.

Abstract: In a closed circuit a heat transfer fluid is cycled from a first heat transfer zone to a second heat transfer zone via a downcomer, all arranged in an ambient. The first heat transfer zone, housed inside a first box, comprises a first heat transfer surface across which the liquefied stream is brought in a first indirect heat exchanging contact with the heat transfer fluid. The heat transfer fluid is allowed to condense, and a part of the condensed portion of the heat transfer fluid is allowed to accumulate within the first box thereby forming a liquid layer of the heat transfer fluid. Liquid is drawn from the liquid layer and passed through the downcomer to the second heat transfer zone. The second heat transfer zone comprises a second heat transfer surface across which the heat transfer fluid is brought in a second indirect heat exchanging contact with the ambient.

Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.

Abstract: A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Abstract: This application discloses a heat driven liquid self-circulating device, system and method, means the liquid system formed by said devices according to said method can be circulated automatically to transfer the heat without external pump power. The heat driven self-circulating device for heated liquid which used with a liquid heat collector, comprises an airtight container for containing heated liquid, having a wall to separate its outer and inner spaces; said inner space is filled with heated liquid partially and having a upper air/vapor space above liquid level surface and lower liquid space under liquid level surface; a first inlet, a first outlet, a second inlet and a second outlet arranged on said wall of the container that both first inlet and first outlet are under the liquid level surface in said container, and said first inlet not lower than said first outlet.

Abstract: A thermal conductivity and phase transition heat transfer mechanism has an opto-luminescent phosphor contained within the vapor chamber of the mechanism. The housing includes a section that is thermally conductive and a member that is at least partially optically transmissive, to allow emission of light produced by excitation of the phosphor. A working fluid also is contained within the chamber. The pressure within the chamber configures the working fluid to absorb heat during operation of the lighting device, to vaporize at a relatively hot location at or near at least a portion of the opto-luminescent phosphor as the working fluid absorbs heat, to transfer heat to and condense at a relatively cold location, and to return as a liquid to the relatively hot location. Also, the working fluid is in direct contact with or contains at least a portion of the opto-luminescent phosphor.

Abstract: A thermal conductivity and phase transition heat transfer mechanism incorporates an active optical element. Examples of active optical elements include various phosphor materials for emitting light, various electrically driven light emitters and various devices that generate electrical current or an electrical signal in response to light. The thermal conductivity and phase transition between evaporation and condensation, of the thermal conductivity and phase transition heat transfer mechanism, cools the active optical element during operation. At least a portion of the active optical element is exposed to a working fluid within a vapor tight chamber of the heat transfer mechanism. The heat transfer mechanism includes a member that is at least partially optically transmissive to allow passage of light to or from the active optical element and to seal the chamber of the heat transfer mechanism with respect to vapor contained within the chamber.

Abstract: A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.