Abstract: In a cooling system for cooling a heating element mounted in a vehicle, a radiator is located at a position higher than a heat sink, which absorbs heat from the heating element. When the amount of heat generated from the heating element, which is detected by a sensor, is greater than a predetermined first value, a blower is operated. Further, when the detected amount of heat is greater than a predetermined second value that is higher than the predetermined first value, a pump is operated. When the detected amount of heat is equal to or less than the predetermined first value, the pump is stopped and the cooling water is circulated by a principle of heat siphon. Accordingly, power consumption of the pump is reduced. Further, power consumption of the cooling system is reduced or an increase in power consumption of the cooling system is restricted.

Abstract: A device and method for removing heat from an object by spraying a cooling agent is disclosed. A cooling casing or a heat sink is mounted to the object. A spray nozzle is arranged to spray the cooling agent onto the cooling casing or the heat sink from a reservoir. The temperature of the object is detected. A controller receives the temperature and issues a signal to drive the spray nozzle when the detected temperature exceeds a predetermined upper temperature limit. The cooling agent is sprayed onto the cooling casing or the heat sink and evaporates by absorbing heat from the cooling casing or the heat sink thereby removing heat from the object. A fan is selectively provided for generating air flows to expel the evaporated cooling agent and thus enhancing heat removal from the object.

Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.

Abstract: A rotor structure rotatably supported within a stator structure, having primary and secondary heat exchanging chambers in thermal isolation from each other. The rotor structure has primary and secondary heat transferring portions within which a closed fluid flow circuit is embodied. The closed fluid flow circuit within the rotor has a spiraled fluid-return passageway extending along its rotary shaft, and is charged with a refrigerant which is automatically circulated between the primary and secondary heat transferring portions of the rotor when the rotor is rotated within an optimized angular velocity range under the control of a temperature-responsive system controller. A technically feasible heat transfer engine can be built upon the rotor structure, while avoiding the need for conventional external compressors, and allowing the use of environmentally safe refrigerants. Various embodiments of the heat transfer engine are disclosed, in addition to methods of manufacture and fields and applications of use.

Abstract: Heat dissipating apparatus or system for dissipating heat generated by a payload on a spacecraft having a plurality of surfaces. The system includes at least one radiator-condenser coupled to one or more of the surfaces of the spacecraft and a heat pump including an evaporator, a compressor, and an expansion valve coupled in a closed-loop manner to the radiator-condenser. The system components are coupled together using small diameter, thin- and smooth-walled tubing. The system enables the radiator-condenser to be elevated above the source or payload temperature, and, along with the use of thin walled tubing, reduces the mass of the spacecraft. Because the radiator-condenser temperatures are elevated, multiple surfaces of the spacecraft (west, east, earth and aft) can be effectively used as radiating surfaces.

Abstract: The conventional thermal transport system has disadvantages of the configuration being complex, large, heavyweight and expensive. In the present invention, a plurality of evaporators are connected in series via the liquid flow line, the evaporator of the first position is connected to the condenser via the liquid supply line, the evaporator of the last position is connected to the reservoir tanks for adjusting the amount of the liquid. The liquid amount measuring sensor is installed to measure the amount of the liquid in the liquid reservoir of the evaporator. Based on the measured result of the liquid amount measuring sensor, the control valve operates so as to supply the liquid accommodated in the reservoir tanks to each evaporator.

Abstract: A system and method for power management of a computer with a vapor-cooled processor is disclosed. A dual mode cooling system for an information handling system includes a heat exchanger for receiving heat generated by the information handling system. The system further includes a condenser in communication with the heat exchanger such that the heat received at the heat exchanger is transferred to the condenser. The heat exchanger and the condenser are able to selectively operate in an active cooling mode and a passive cooling mode.

Abstract: A boiling cooler has a heat exchange part in which refrigerant vapor performs heat exchange with cooling water. The refrigerant vapor is produced from liquid refrigerant that is boiled and gasified by heat transferred from a heating element. In this boiling cooler, the refrigerant vapor can be cooled by cooling water having a thermal conductivity larger than that of air.

Abstract: A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.

Abstract: The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.

Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die.

Abstract: A heat transfer device which employs a reciprocating mechanism for driving liquid from the heat rejection section to the heat receiving section is disclosed. The heat transfer device is coined as the reciprocating-mechanism driven heat loop which comprises a hollow loop having an interior flow passage, an amount of heat-carrying fluid filled within the loop, and at least one reciprocating driver. The hollow loop has at least one heat receiving section, one heat rejection section, and one liquid reservoir. The reciprocating driver is integrated with the liquid reservoir and facilitates a reciprocating flow of the heat-carrying fluid within the loop, so that the liquid is supplied from the heat rejection section to the heat receiving section under both saturated and unsaturated conditions and a high heat transfer rate from the heat receiving section to the heat rejection section is achieved.

Abstract: In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to be cooled. The surface forms an integral part of the pump chamber in such a manner that the fluid as it passes through the rotating device also passes across the surface, resulting in a heat transfer between the surface and the fluid. Another aspect of the invention includes having the surface to be cooled integrally connected with the pump chamber, so that the pump chamber is separable from the surface to be cooled without disturbing the fluid circuit of the heat exchange application. A means for driving the rotating device may also be configured to drive a means for cooling the fluid.

Abstract: A cold plate includes a face sheet comprising a composite material and having a lower surface and at least one cooling tube attached to the lower surface and being capable of transmitting a cooling fluid therethrough. A heat extraction system includes a cold plate comprising a face sheet comprising a composite material and having a lower surface and at least one cooling tube attached to the lower surface and being capable of transmitting a cooling fluid therethrough. The heat extraction system further includes a pump in fluid communication with the cold plate and a heat exchanger in fluid communication with the pump and the cold plate. A method for fabricating a cold plate includes providing a face sheet comprising a composite material and attaching at least one cooling tube to a lower surface of the face sheet.

Abstract: An active heat sink uses a liquid coolant to transfer heat from a hot zone to a cool zone. The liquid coolant is propelled using a motor comprised of a plurality of external coils that are in magnetic communication with a plurality of magnets attached to a pump gear. The motor does not require any penetration of the liquid cavity. Further, the heat pump may have a temperature monitoring circuit to determine whether or not the pump should be activated.

Abstract: In general, the invention relates to a pump system for use in a heat exchange application having a pump chamber with a fluid inlet and a fluid outlet. A rotating device is contained within the pump chamber, for causing a fluid to move across a surface to be cooled. The surface forms an integral part of the pump chamber in such a manner that the fluid as it passes through the rotating device also passes across the surface, resulting in a heat transfer between the surface and the fluid. Another aspect of the invention includes having the surface to be cooled integrally connected with the pump chamber, so that the pump chamber is separable from the surface to be cooled without disturbing the fluid circuit of the heat exchange application. A means for driving the rotating device may also be configured to drive a means for cooling the fluid.

Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.

Abstract: A heat pipe loop includes a first heat pipe section having a first temperature and a second heat pipe section having a second temperature higher than the first temperature. The first heat pipe section is a condenser and the second heat pipe section is an evaporator. A vapor line connects an upper portion of the first heat pipe section with an upper portion of the second heat pipe section. A liquid line connects a lower portion of the first heat pipe section with a lower portion of the second heat pipe section. In one embodiment, the first heat pipe section is disposed at a first elevation and the second heat pipe section is disposed at a second elevation higher than the first elevation. A pump directs liquid from the first heat pipe section to the second heat pipe section through the liquid line.

Abstract: A heat mass transport device, utilizing microchannels and micropumps, achieving a thinner form and offers a higher thermal conductance. The heat mass transport device (1) has a structure in which the microchannels for passing through a coolant and the micropumps for transporting the coolant form a single unit. For example, a channel layer (2), in which the microchannels (2a) are formed, and a pump layer (4), in which the micropumps (4a) are formed, may be laminated in a multi-layer structure, or a large number of single units in which a microchannel and a micropump are combined, may be placed in an array. Moreover, the heat mass transport device is made flexible, as the microchannels and micropumps are formed on a resin substrate utilizing flexible material.

Abstract: A heat transfer system includes a wick, a vacuum pump and a heat exchanger. The wick receives a condensed liquid. The wick receives heat from a heat source. The vacuum pump reduces pressure in the wick while turned on, so that at least a portion of the liquid evaporates within the wick to form a vapor that is pumped by the pump. The heat exchanger is coupled to receive the vapor from the pump. The heat exchanger rejects heat to form the condensed liquid from the vapor. The heat exchanger returns the condensed liquid to the wick.

Abstract: A heat transfer engine having cooling and heating modes of reversible operation, in which heat can be effectively transferred within diverse user environments for cooling, heating and dehumidification applications. The heat transfer engine of the present invention includes a rotor structure which is rotatably supported within a stator structure. The stator has primary and secondary heat exchanging chambers in thermal isolation from each other. The rotor has primary and secondary heat transferring portions within which a closed fluid flow circuit is embodied. The closed fluid flow circuit within the rotor has a spiraled fluid-return passageway extending along its rotary shaft, and is charged with a refrigerant which is automatically circulated between the primary and secondary heat transferring portions of the rotor when the rotor is rotated within an optimized angular velocity range under the control of a temperature-responsive system controller.

Abstract: A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and comprising a heat transfer wall for transferring heat from the heat source into the chamber; a heat transfer fluid within the chamber; a fluid circulation path including the chamber interior; a fluid propelling mechanism for propelling the fluid through the circulation path and across the heat transfer wall so that the fluid absorbs heat at the heat transfer wall and flows to a heat discharge region remote from the heat transfer wall where the heat is dissipated into the surrounding environment; where the fluid propelling mechanism includes a mechanical fluid driving structure including blades within the chamber rotatably secured to the apparatus with a blade mounting structure to move adjacent to and along the heat transfer wall and within the flow layer of the fluid adjacent to the heat transfer wall to mechanical

Abstract: A heat transfer engine having cooling and heating modes of reversible operation, in which heat can be effectively transferred within diverse user environments for cooling, heating and dehumidification applications. The heat transfer engine of the present invention includes a rotor structure which is rotatably supported within a stator structure. The stator has primary and secondary heat exchanging chambers in thermal isolation from in each other. The rotor has primary and secondary heat transferring portions within which a closed fluid flow circuit is embodied. The closed fluid flow circuit within the rotor has a spiralled fluid-return passageway extending along its rotary shaft, and is charged with a refrigerant which is automatically circulated between the primary and secondary heat transferring portions of the rotor when the rotor is rotated within an optimized angular velocity range under the control of a temperature-responsive system controller.

Abstract: A heat transfer engine having cooling and heating modes of reversible operation, in which heat can be effectively transferred within diverse user environments for cooling, heating and dehumidification applications. The heat transfer engine of the present invention includes a rotor structure which is rotatably supported within a stator structure. The stator has primary and secondary heat exchanging chambers in thermal isolation from in each other. The rotor has primary and secondary heat transferring portions within which a closed fluid flow circuit is embodied. The closed fluid flow circuit within the rotor has a spiralled fluid-return passageway extending along its rotary shaft, and is charged with a refrigerant which is automatically circulated between the primary and secondary heat transferring portions of the rotor when the rotor is rotated within an optimized angular velocity range under the control of a temperature-responsive system controller.

Abstract: A preferred embodiment of an atomizing apparatus incorporates a source of heat transfer fluid and an atomizing surface adapted to receive a droplet of the heat transfer fluid thereon. A driver also is provided which is configured to control a vibration of the atomizing surface at a frequency less than ultrasonic so that the atomizing surface forms a spray of atomized droplets from the droplet of the heat transfer fluid. Preferably, the vibration is configured to form, on the droplet, surface waves having a smaller wavelength than a diameter of the droplet, thereby ejecting and propelling the atomized droplets from the droplet. Methods also are provided.

Abstract: An air conditioning system comprises a heat source side machine, a plurality of user side machines more than half of which are disposed below the heat source side machine, and liquid phase and gas phase pipes connecting the heat source side machine with the user side machines to form a closed circuit. A phase-changeable fluid included in the closed circuit circulates by utilizing its own specific gravity difference between the liquid and gas phases, so that each of the user side machines can perform cooling and heating operations. The liquid phase pipe and the gas phase pipe can communicate with each other via a gas bypass circuit and/or a liquid bypass circuit including a open-close valve and liquid level detection means, so that bubbles or condensed liquid generated in the closed circuit can be exhausted quickly.

Abstract: A heat pipe with pumping capabilities and use thereof in cooling a device. One embodiment of the heat pipe has an internal pumping mechanism that provides an enhanced capillary flow within a chamber of the heat pipe.

Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.