Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.

Abstract: A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.

Abstract: A family of structures and designs for use in devices such as heat exchangers so as to allow for enhanced performance in heat exchangers smaller and lighter weight than other existing devices. These structures provide separate flow paths for liquid and vapor and are generally open. In some embodiments of the invention, these structures can also provide secondary heat transfer as well. In an evaporative heat exchanger, the inclusion of these structures and devices enhance the heat transfer coefficient of the evaporation phase change process with comparable or lower pressure drop.

Abstract: A cooling device which is provided with an evaporator with a built-in wick, a condenser, and a loop type heat pipe which connects the evaporator and condenser in a loop and is provided with a liquid pipe and vapor pipe, wherein the evaporator is divided into a liquid-pipe-side case and a vapor-pipe-side case and wherein a plurality of discharge ports of working fluids and a wick in which the working fluid from the discharge ports is completely permeated are arranged between the two cases. The wick is provided with projecting parts which have recessed parts corresponding to the discharge ports, while the outer circumferential surfaces of the projecting parts are provided with grooves. The working fluid which permeates the wick is changed to a vapor inside the vapor-pipe-side case, collects in the evaporation chamber, and is discharged to the liquid pipe, and thus, dry out of the wick is prevented.

Abstract: An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section.

Abstract: A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.

Abstract: A sintered heat pipe having a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. The sintered powder layer is circumferentially sintered onto the inner wall of the tube. The capillary grooves extend from one end of the metal tube but do not extend to the other end of the metal tube, leaving a section of the metal tube uncovered. The sintered powder layer extends from the other end of the metal tube but does not extend to the one end of the metal tube so as to cover the section of the metal tube uncovered by the capillary grooves.

Abstract: A capillary flow valve for use in a two phase heat transfer system such as a loop heat pipe, including an inlet port for receiving working fluid in a vapor-phase, an outlet port for outputting working fluid in a vapor-phase, and a porous wick material extending across the interior of the valve. Heating the wick evaporates liquid-phase working fluid from the wick and allows the vapor-phase working fluid to pass through the wick to the outlet port. Removing the heat allows liquid to condense in the wick, preventing flow of the vapor-phase working fluid through the wick to the outlet port.

Abstract: A heat pipe includes a laminate formed by laminating a plurality of flat plates and having capillary tubes formed in the interior thereof, and a working fluid contained in the capillary tubes and operable to transfer heat. In the heat pipe, the laminate has insulating layers made of an insulating material and metal layers made of a metal material, which are alternately laminated.

Abstract: A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.

Abstract: A heat exchanger for use with a refrigeration device having a FPA disposed therein being comprised of a polymeric composite mesh material having a hot end and a cold end and defining an array of weft capillaries interwoven with a perpendicular array of warp strands. The array of weft capillaries may include a plurality of high pressure inlet capillaries for channeling and distributing high pressure gas from an inlet at the hot end to a Joule-Thomson orifice at the cold end, a plurality of low pressure outlet capillaries for channeling and distributing high pressure gas from a Joule-Thomson orifice to an outlet of the heat exchanger, and a plurality of low thermal conductivity fibers interspersed between the high pressure inlet capillaries and the low pressure outlet capillaries. In example embodiments. the array of warp strands comprises at least one or more of carbon fibers, copper fibers or glass fibers.

Abstract: An exemplary heat sink assembly includes a base plate, a number of fins, a heat spreader and a heat pipe. The fins are mounted on and thermally connect with the base plate for dissipating heat of the base plate. A bottom one of the fins has a body parallel to the base plate and a number of supporting tabs extending downwardly from the body. The supporting tabs engage with a top surface of the base plate to support the fins onto the base plate and reinforce a whole strength of the heat sink assembly. The heat spreader is mounted below the base plate. The heat pipe includes a horizontal evaporating portion sandwiched between the heat spreader and the base plate and a vertical condensing portion extending from a free end of the evaporation portion and passing through the fins.

Abstract: Each loop of the device includes an evaporator and a condenser connected by an outer tube in a portion of which extends a thermally insulating sleeve having one end that can lead into the condenser and another end that surrounds a first portion (8a) of a microporous mass provided in the outer tube and pumping by capillarity a liquid-phase heat-carrier fluid flowing in the insulating sleeve of the condenser towards the evaporator, while the gaseous-phase fluid flows from a vapor-collecting central duct in a second portion of the mass of the evaporator towards the condenser in a duct inside said outer tube. The invention can be used for the thermal energy transfer from an electronic component or circuit defining a heat source in relation with the evaporator to a cold source in relation with the condenser.

Abstract: Heat pipe (400) includes a heat pipe body (402) having an inner cavity (408), and a wick structure (404) disposed in the inner cavity. The wick structure includes a first woven mesh layer (410) and a second woven mesh layer (412) disposed on the first woven mesh layer. The first woven mesh layer is a first weave pattern of thermally conductive fibers (103) having a first warp direction (W3 or W4) and the second woven mesh layer is a second weave pattern of thermally conductive fibers (105) having a second warp direction (W5 or W6). The second woven mesh layer is disposed on the first woven mesh layer such that the first and the second warp directions are rotationally offset by an inter-layer warp offset angle (?i).

Abstract: A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component.

Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Abstract: A sandwich panel heat pipe with a three-dimensional ordered open-cellular micro-truss core and a method creating the same. In one embodiment, the sandwich panel heat pipe includes a first face sheet, a second face sheet, the three-dimensional ordered open-cellular micro-truss core between the first face sheet and the second face sheet, and a working fluid in the ordered open-cellular micro-truss core. Here, the three-dimensional ordered open-cellular micro-truss core includes a vapor region and a liquid region, the vapor region is for transporting a vapor phase portion of the working fluid to the liquid region, and the liquid region is for transporting a liquid phase portion of the working fluid to the vapor region.

Abstract: The disclosed solar power system includes an oil circuit, a molten salt circuit, and a heat exchanger in communication with both the oil and molten salt circuits. The disclosed heat exchanger includes at least one heat pipe, the ends of which are within first and second plenums provided by spaced-apart housings.

Abstract: A temperature control device includes a heat pipe including a heat absorption part provided at one end side and absorbing heat from an outside and a heat dissipation part provided at another end side and dissipating heat to the outside, and a heat absorption plate and a heat dissipation plate (heat conducting plates) made of metal films formed by powder including metal being accelerated with a gas toward at least one of external surfaces of the heat absorption part and the heat dissipation part of the heat pipe and being sprayed and deposited on the surfaces in a solid-phase state.

Abstract: An energy storage device that stores hot and/or cold energy includes an evaporating part and a condensing part. According to one aspect, the evaporating part includes a heat tube in a U shape or a thimble shape and further includes one or more power cycle tubes. A working substance within the evaporating part evaporates after absorbing heat and condenses in the condensing part after releasing heat.

Abstract: An evaporation cycle heat exchange system for a vehicle cools vehicle electronic components, a fuel cell stack, an internal combustion engine, an automatic transmission, a turbocharger, etc. using an evaporative heat exchanger, thus improving cooling efficiency and reducing the size of components such as a radiator. The evaporation cycle heat exchange system cools coolant circulating through a vehicle cooling system by employing an evaporative heat exchanger in which a working fluid flows by a pressure difference caused by volume expansion and capillary phenomenon. Accordingly, it is possible to improve the cooling efficiency of the entire cooling system, reduce the size of components to comply with pedestrian protection regulations, improve fuel efficiency, and ensure the stability of the system.

Abstract: A cooling system and method for cooling electronic components. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and is pumped through interstices defined by and between the strands of the mesh. Flow dividers can define interconnected channels within the cavity.

Abstract: A heat dissipation module includes a plurality of fins and a heat pipe connected with the fins. The heat pipe includes a body, which forms an enclosed space, and an inner ring. A wick structure is disposed on the inner surface of the body, and the inner ring is disposed in the enclosed space for increasing a structural strength of the heat pipe. The inner ring is pressed against the top and bottom of the body or in contact with the wick structure located at the top and the bottom of the body, respectively. The inner ring includes at least one opening located close to the top of the body for communicating inside and outside of the inner ring.

Abstract: A heat exchanger for a refrigeration cycle that in terms of functionality and quality is within the allowable range of and comparable to a conventional heat exchanger for a refrigeration cycle, has substantially the same structure as a conventional heat exchanger for a refrigeration cycle, and enables reduced costs, as well as method for manufacturing the heat exchanger are provided. A heat exchanger for a refrigeration cycle is configured so that a refrigerant discharged from a compressor is circulated to a condenser, a capillary tube, an evaporator, a suction pipe, and the compressor, and so that the external surfaces of the capillary tube and the suction pipe are thermally in contact with each other. The material of the capillary tube and the suction pipe is aluminum. The locations at which the external surfaces of the capillary tube and the suction pipe are joined where fillets of a brazing material being an Al—Si alloy and a Zn—Al alloy are formed.

Abstract: A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.

Abstract: A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein an air channel sidewall of the centrifugal fan has heat dissipation fins in an inner wall thereof. The heat pipe has a heat source contact section and a heat dissipation section, the heat dissipation section is in contact with an outer wall of the air channel sidewall, and the heat source contact section is in contact with a heat source.

Abstract: An exemplary loop heat pipe includes a plate-type evaporator, a pipe, a condenser thermally connected with the pipe and a working medium contained in the closed loop. The plate-type evaporator defines an exit for vapor in a lateral portion thereof and an entrance for liquid in a top portion thereof. The pipe connects the exit and the entrance to form a closed loop. A first wick structure has a lower end thereof attached to a bottom portion of the evaporator and has an upper end thereof attached to the top portion of the evaporator. The entrance for liquid corresponds to the upper end of the wick structure.

Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.

Abstract: An exemplary heat pipe includes a tube, an evaporation section and a condenser section located at two opposite ends of the tube, a grid wick structure received in the tube and abutting an inner wall of the tube, and a working fluid sealed in the tube. The grid wick structure includes a plurality of rhombuses. Each rhombus includes two opposite first included angles, one of the first included angles is at a point of the rhombus nearest one of the ends of the tube, the other first included angle is at a point of the rhombus nearest the other end of the tube. Each first included angle is smaller than 90 degrees.

Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.

Abstract: An exemplary heat pipe includes a tube, a first wick structure and a second wick structure received in the tube, and working liquid filling the tube. The first wick structure is disposed in an evaporating section of the tube. The second wick structure is located between the first wick structure, and supports the first wick structure partially contacting an inner face of the evaporating section of the tube. The first wick structure defines a gap between two opposite ends thereof. The second wick structure extends from the evaporating section through an adiabatic section to a condensing section of the tube.

Abstract: An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Abstract: System and method for for superheating and/or supercooling of liquids and use of the system and/or method, wherein the liquid is within a capillary tube, wherein there is at least one heating and/or cooling means for heating the liquid above boiling point of the liquid at ambient pressure or cooling the liquid below freezing point of the liquid at ambient pressure, wherein the at least one heating and/or cooling means is in thermal contact with the capillary tube in an area, in which there is liquid inside the capillary tube, and wherein the capillary tube is scratch-free at its inner surface.

Abstract: A thin and flat type heat pipe with enhanced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with the rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so that a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: An exemplary flat heat pipe includes a cover, a wick structure adhered to part of an inner surface of the cover and working medium contained in the wick structure. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber and includes an interface surface away from the inner surface of the cover. The interface of the wick structure and the exposed inner surface of the cover cooperatively define a vapor passage therebetween.

Abstract: A loop heat pipe includes an evaporator to cause a liquid-phase working fluid to be vaporized by heat from a heat source; a condenser to condense the vaporized working fluid; a circulation path including a liquid line and a vapor line to connect the condenser and the evaporator in a loop; a tank provided on the liquid line and configured to accommodate the liquid-phase working fluid; a connecting line to connect the tank and the evaporator to supply the liquid-phase working fluid to the evaporator; and a bypass line positioned over the connecting line in a direction of gravity and connecting the evaporator and the tank, the bypass line being configured to discharge a vapor bubble produced in the evaporator during operation of the loop heat pipe to the tank.

Abstract: The instant disclosure relates to a flat heat pipe structure, which includes a flat tubing and a support member. The flat tubing has two opposed main walls and two opposed connecting walls connected thereto. The main and connecting walls cooperatively define an internal space. The inner surfaces of the flat tubing are covered with a capillary structure. The support member is disposed in the internal space of the flat tubing and has at least one support arm. The support arm extends in the longitudinal direction of the flat tubing. The support arm has two opposed surfaces abutting to the capillary structure of the main walls.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: An exemplary flat heat pipe includes a cover, a wick structure and a restricting plate. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber. The restricting plate is received in the receiving chamber and opposite ends thereof abut against opposite inner surfaces of the cover to divide the receiving chamber into two passages. The restricting plate divides the wick structure into two wick portions, the wick portions are adhered on lateral surfaces of the restricting plate and located at lateral sides of two passages, respectively.

Abstract: According to one embodiment, a television apparatus includes an exothermic component, a heat transfer mechanism, a plurality of heat releasing fins, a fan, and a deflecting member. The exothermic component is housed in a housing. The heat transfer mechanism is at least partially housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. The heat releasing fins are thermally connected to the heat releasing portion and arranged with gaps therebetween. The fan generates an air flow flowing through the gaps. The deflecting member is located at least downstream of the gaps to cover the gaps. The deflecting member deflects the air flow toward an exhaust outlet formed in the housing.

Abstract: This invention relates to thermal management for removing heat generated by a heat source (110). This is done by a combination of a heat conducting member (120), which is thermally connected to the heat source in one end and to a remotely arranged heat sink (130) in the opposite end, and a synthetic jet actuator (140). The synthetic jet actuator is arranged to provide active cooling directly onto the heat source by generating and directing an air flow towards the heat source. The synthetic jet actuator comprises a resonator cavity housing (150) and an oscillating member (160). The oscillator member is arranged at least partly inside said resonator cavity. The combination of the heat conducting member and the synthetic jet actuator provides a highly efficient cooling.

Abstract: A cooling device includes an enclosure housing, an external heat rejection device, a primary cooling system including a loop heat pipe like (LHPL) device. The LHPL device includes an evaporator module, a condenser module, a vapor line, a liquid return line, and a working fluid having a liquid phase and a vapor phase. The evaporator module includes a component-evaporator heat spreader, an evaporator body, and an evaporator-component clamping mean. The evaporator body includes an evaporator outer shell, a working fluid inlet port, several different types of compensation chamber, a working fluid exit port, and an evaporator wick having vapor escape channels. The condenser module includes a condenser coolant inlet, a condenser coolant exit, a condenser condensation channel, a condensation channel working fluid inlet, a condensation channel working fluid exit, and a condensation channel-coolant thermal interface further comprises a coolant passageway.

Abstract: The present invention relates to a heat-dissipating base structure and a method for manufacturing the same. The heat-dissipating base structure includes a base and at least one heat pipe. The base is made of polymeric materials. One side of the base is provided with at least one trough. The trough has an open side and a closed side. The heat pipe is fixed in the trough. One side of the heat pipe is in flush with the open side. By the inventive structure, since the base is made of polymeric materials, the weight and cost of the heat-dissipating base structure can be reduced.

Abstract: The present invention provides a heat-dissipating assembly and a method for manufacturing the same. The heat-dissipating assembly includes a base, at least one heat pipe, and a combining unit. The base is provided with an accommodating trough and at least one through-hole. The accommodating trough has at least one receiving hole penetrating the base. One end of the heat pipe is disposed through the through-hole on one side of the base into the receiving hole. The combining unit covers the accommodating trough and one end of the heat pipe. By this arrangement, the efficiency in assembly is increased and the working hours are decreased. Further, the production cost is reduced.

Abstract: A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed.

Abstract: A two-phase heat transfer system includes an evaporator, a condenser, a vapor line, and a liquid return line. The evaporator includes a liquid inlet, a vapor outlet, and a capillary wick having a first surface adjacent the liquid inlet and a second surface adjacent the vapor outlet. The condenser includes a vapor inlet and a liquid outlet. The vapor line provides fluid communication between the vapor outlet and the vapor inlet. The liquid return line provides fluid communication between the liquid outlet and the liquid inlet. The wick is substantially free of back-conduction of energy from the second surface to the first surface due to an increase in a conduction path from the second surface to the first surface and due to suppression of nucleation of a working fluid from the second surface to the first surface to promote liquid superheat tolerance in the wick.

Abstract: The present invention relates to a method for manufacturing a flat plate heat pipe, which includes steps of: forming a wick structure layer and at least one wick structure post on the inner surface of a chamber of a pipe, pressing the pipe to become a flattened pipe with the wick structure post being connected therein, connecting a conduit to the chamber, sealing both sides of the flattened pipe, evacuating air inside the chamber through the conduit, filling a working fluid into the chamber, and sealing the conduit. According to this method, a flat plate heat pipe can be made in a simplified manner with increased yield and reduced cost.

Abstract: A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.