Abstract: An electronic device includes a body having a receiving housing and an opening, a function module disposed in the receiving housing, a transmission module configured to transmit a signal between a first end of the transmission module and a second end of the transmission module, and a heat dissipation module disposed along the transmission module. The first end of the transmission module is located in the receiving housing, and the second end of the transmission module is located outside the receiving housing. The heat dissipation module is configured to transfer heat generated by the function module to the second end of the transmission module.

Abstract: An inverter has at least three phases for supplying current to an electrical machine. The inverter also has a control unit and at least one power output stage connected to the control unit on an input side. The control unit is configured to generate pulse-width-modulated control signals for activating the power output stage. The inverter further has a heat sink and, for each phase, an intermediate circuit capacitor and a semiconductor switch half bridge. The heat sink has a flat thermal contact surface. The thermal contact surface is connected in a thermally conductive manner to the control unit and to the semiconductor switch half bridges. The heat sink has a recess for each of the intermediate circuit capacitors, and the intermediate circuit capacitors are each arranged in one of the recesses in the heat sink.

Abstract: A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.

Abstract: A heat dissipation device may be formed as a thermally conductive structure having at least one thermal isolation structure extending at least partially through the thermally conductive structure. The heat dissipation device may be thermally connected to a plurality of integrated circuit devices, such that the at least one thermal isolation structure is positioned between at least two integrated circuit devices. The heat dissipation device allows for heat transfer away from each of the plurality of integrated circuit devices, such as in a z-direction within the thermally conductive structure, while substantially preventing heat transfer in either the x-direction and/or the y-direction within the thermally isolation structure, such that thermal cross-talk between integrated circuit devices is reduced.

Abstract: The present disclosure provides an electrical connector comprising: an electrical connector housing comprising an upper surface, a lower surface, and two opposite sidewalls; at least one positioning component disposed on an upper surface of the electrical connector housing; a plurality of heat sinks are disposed on the upper surface of the electrical connector housing; the plurality of the heat sinks are respectively disposed on two sides of the corresponding positioning component; each heat sink comprises at least one securing groove; the securing grooves of the heat sinks disposed correspondingly; the plurality of securing grooves correspond to the positioning components; and a securing structure is secured to the at least one the positioning component and the two sidewalls of the electrical connector housing. The securing structure presses the plurality of the heat sinks against the upper surface of the electrical connector housing.

Abstract: The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.

Abstract: Heat switches are presented herein for controlling a flow of heat between thermal stages of a cryostat. In one aspect, a heat switch for a cryostat includes a thermal linkage configured to simultaneously contact a first thermal stage and a second thermal stage of the cryostat and define a thermal pathway therebetween. The thermal linkage includes a superconducting element disposed along a portion of the thermal pathway that is capable of transitioning between a superconducting state and a non-superconducting state. A thermal conductivity of the superconducting state is lower than a thermal conductivity of the non-superconducting state. Other types of heat switches are presented, including methods for controlling a flow of heat between thermal stages of a cryostat.

Abstract: This invention discloses a rackless modular power electronic system that optimizes thermal management, modularity, manufacturability, transportation, and installation. Such a power electronic converter system consists of one or more modular power electronic converters mounted one-on-top-of-another and/or one-next-to-another through mounting units, such as screws, nuts and bolts. Each modular power electronic converter is built with a case with heat-dissipating fins on the exterior surface and with vertical and horizontal mounting mechanisms, such as holes, bolts, nuts and screws, which are aligned vertically and horizontally, respectively, for easy mounting. One or more electric fans can be mounted to the system to enhance heat dissipation. Possible applications include any field that adopts power electronic converters, e.g., in wind power, solar power, storage systems, home appliances, IT equipment, motor drives, electric vehicles, more-electric aircraft, and all-electric ships.

Abstract: Examples of heat exchanger systems for active radiative cooling are described. In one example, the system includes a heat exchanger and a spectrally selective surface material on at least one surface of the heat exchanger. The spectrally selective surface material exhibits high reflectivity at shorter wavelengths and high emissivity at longer wavelengths. The system can also include an active cooling system in some cases to actively transfer heat to the heat exchanger. The use of spectrally selective surfaces that operate at temperatures exceeding that of the outdoor ambient for which convective losses augment radiation losses have advantages over passive cooling, such as but not limited to: providing a better match to cooling loads, reducing the heat rejection surface area required to achieve a desired cooling rate, and increasing the heat transferred to deep space through the atmospheric window so as to simultaneously cool infrastructure, devices, buildings, and Earth.

Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: Structural combinations of TIMs and methods of combining these TIMs in semiconductor packages are disclosed. An embodiment forms the structures by selectively metallizing a backside of a semiconductor chip (chip) on chip hot spots, placing a higher performance thermal interface material (TIM) on the metallized hot spots, selectively metalizing an underside of a lid in one or more metalized lid locations, and assembling a lid over the backside of the chip to create an assembly so that metalized lid locations are in contact with the higher performance TIMs. A lower performance TIM fills the region surrounding the higher performance TIM on the underside of the lid enclosing the chips. Disclosed are methods of disposing both solid and dispensable TIMs, curing and not curing the thermal interface, and structures to keep the TIMs in place while assembly the package and compressing dispensable TIMs.

Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.

Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.

Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

Abstract: A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fins have an interleaved position with higher impedance and a separated position with a lower impedance that can increase cooling airflow. In one example embodiment, a central processing unit couples to a first circuit board and the first set of cooling fins and a graphics processor couples to a second circuit board and the second set of cooling fins so that movement of the circuit boards moves the cooling fins between the interleaved and separated positions.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.

Abstract: A composite pin fin heat sink configured to dissipate heat generated by a heating element including a background region and a hot spot region having a higher temperature than the background region while the heating element is generating heat, the heat sink including a base plate having a first surface and a second surface, the first surface being configured to contact the heating element; and an array of pin fins protruding from the second surface and arranged at regular intervals. The base plate and the array of pin fins are divided into a first heat sink region corresponding to the hot spot region of the heating element, and a second heat sink region corresponding to the background region of the heating element. The first heat sink region is made of a material having a higher thermal conductivity than a material of which the second heat sink region is made.

Abstract: Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

Abstract: A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

Abstract: A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.

Abstract: The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.

Abstract: A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Abstract: A connector includes a cage having a plurality of receiving chambers, a separation mechanism including a lower separation plate and an upper separation plate, a radiator disposed between the lower separation plate and the upper separation plate, and an elastic clip mounted on the radiator and elastically holding the radiator in the separation mechanism. The separation mechanism is located between and separates a pair of adjacent receiving chambers of the plurality of receiving chambers in a height direction of the connector. A pair of sides of the elastic clip opposite to each other in a lateral direction of the radiator are fixed between the lower separation plate and the upper separation plate.

Abstract: A grid array connector system is provided that includes cables that are mounted on a board which has a chip packaged mounted thereon. The cables include conductors that are connected to support vias positioned in openings in the board and the conductors are connected to the support vias. The board can be connected to a second board which provides a stiffening ring. The board can be connected to the second board by deflectable terminals which are press-fit into the second board.

Abstract: A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.

Abstract: Various implementations described herein relate to a heat sink having a base and a plurality of fins extending from the base. Each of the plurality of fins is spaced apart from other ones of the plurality of fins. The plurality of fins includes first fins and second fins. Each of the first fins is perpendicular to any of the second fins.

Abstract: An optical engine module includes a housing, an assembling element, a light valve and a first heat exchange assembly. The assembling element has an opening corresponding to an assembly hole of the housing and is assembled on the housing in a non-direct contact mode. The light valve includes a base and an imaging element. The base bears against the assembling element, and an imaging surface of the imaging element faces the opening. The housing, the assembling element and the light valve define a chamber. The first heat exchange assembly is disposed on the assembling element and includes at least one first heat conduction component and a first heat dissipation fin set. The first heat dissipation fin set is located outside the housing. The first heat conduction component extends from the assembling element to the outside of the housing and is connected with the first heat dissipation fin set.

Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

Abstract: A voltage regulator module includes a circuit board assembly and a magnetic core assembly. The circuit board assembly includes a circuit board and 2N switching circuits. The circuit board includes a plurality of conductive structures. The magnetic core assembly includes an upper core, a lower core and 2N lateral legs. The 2N lateral legs are arranged between the upper core and the lower core. The 2N lateral legs are penetrated through the corresponding conductive structures. The 2N switching circuits are divided into N switching circuit groups. Each switching circuit group includes two parallel-connected switching circuits. The N switching circuit groups and the magnetic core assembly are arranged on the circuit board along a first direction. The N switching circuit groups are arranged one the circuit board along a second direction.

Abstract: The electronic circuit device includes: a first wiring pattern which is formed on a first main surface of a circuit board, has circuit elements including a switching element and mounted along a predetermined direction, and includes a virtual shortest current path connecting the circuit elements to each other along the predetermined direction; a second wiring pattern which is formed on a second main surface, and includes an opposing current path that opposes an area where the virtual shortest current path is formed; vias electrically connecting the first and second wiring patterns; and vias for heat transfer, connecting a mount area for the switching elements on the first main surface with an area on a side of the opposing current path on the second main surface. The heat dissipation member is in contact with the second main surface.

Abstract: Hand held equipment has a body and a heat sink. The body defines an outer surface and a heat source therewithin. The heat sink forms a portion of the outer surface and is positioned in close proximity to the heat source so as to conduct heat therefrom. The heat sink has a base, a plurality of fins and a coating having low thermal conductivity (which may be a ceramic coating). The base has a lower and an upper surface. The lower surface is in close proximity to the heat source. The plurality of fins has a proximal end meeting the upper surface of the base, and a distal end extending away from the base. Each of the plurality of fins define a cross-sectional area and terminate at an outward surface. The coating extends over at least a portion of the outward surface of the plurality of fins. A heat sink is likewise disclosed.

Abstract: A vapor chamber structure includes a main body. The main body has a first section, a second section, a capillary structure and a working fluid. The first section has a first chamber. The second section has a second chamber. The second section extends from one end of the first section in a direction away from the first section. The capillary structure is disposed on inner surfaces of the first and second chambers. The working fluid is filled in the first and second chambers. The vapor chamber structure has both heat spreading effect and remote end heat dissipation effect.

Abstract: Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.

Abstract: A cutting board is configured to be suspended above a sink basin. The cutting board includes a top, cutting surface, and a bottom surface opposite the top surface. The cutting board also includes a bevel, an upper ledge, and a bumper. The bevel is disposed along a first edge of the bottom surface. The upper ledge extends outwardly beyond the bevel to support the cutting board along a rim of the sink or countertop. The bumper is disposed on the bevel and engages with the sink to prevent movement of the cutting board in one direction. The cutting board is configured to be used in both a mounted configuration above a basin of the sink and an unmounted configuration on a flat surface away from the sink.

Abstract: The present invention relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator and a rotor. The stator includes a control module and a heat sink. The control module includes a circuit board and heat generating electronic components mounted on the circuit board. A bottom surface of the circuit board faces the heat sink. The heat generating electronic components are mounted on a top surface of the circuit board. Metal heat conducting members are embedded inside the circuit board at positions corresponding to the heat generating electronic components, and extend along a thickness direction of the circuit board. The heat generated by the heat generating electronic components is conducted from the top surface of the circuit board to the bottom surface of the circuit board. The present invention improves the heat dissipation effect of the motor.

Abstract: The invention relates to a improved heat sink. In one embodiment this is accomplished by a base member and a heat radiating portion, wherein heat radiating portion includes a plurality of fins, wherein the distance between rows of the plurality of fins (fluid guide) are arranged such that they don't obstruct the horizontal flow of fluid or change the characteristic of the fluid substantially.

Abstract: The present invention relates to heatable garments (1), comprising a garment body (3) and a heating pad (5) adhered to at least a portion of the garment body (3), wherein the heating pad (5) comprises graphene particles dispersed in a polymer matrix material. The invention also provides fabrics for making such garments, and methods of making such garments and fabrics. Also provided are heatable bedding incorporating a heating pad as described above.

Abstract: The present disclosure relates to a heat conductive sheet that includes a heat generation component having a large heat generation amount. The heat conductive sheet according to the present disclosure includes a heat radiation sheet having a graphite sheet, a first protective film provided on one surface side of the graphite sheet, and a second protective film provided on another surface side of the graphite sheet. The heat radiation sheet includes a bent part that is bent, and a first heat radiation part and a second heat radiation part that are coupled to each other through the bent part and overlapping with each other in a view from above. Further, a first non-adhesive area in which the first heat radiation part and the second heat radiation part are not adhered to each other is provided between the first heat radiation part and the second heat radiation part.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.

Abstract: Interconnectors, interconnector assemblies, and methods for supporting components are provided. An interconnector as disclosed connects a supported component to another component or assembly securely and accurately, even where the supported component and the other component have different expansion or contraction characteristics. The interconnector includes a plurality of support elements disposed in an array. Each support element includes a support surface at a free end of the support element. The areas of the support surfaces decrease with distance from a center of the array. In a completed assembly, the free ends of the support elements in the array are joined to the supported component.

Abstract: A highly reliable bonded structure having excellent thermal fatigue resistance characteristics and thermal stress relaxation characteristics is provided. The bonded structure of the present invention comprises a first member, a second member capable of being bonded to the first member, and a bonding part interposed between a first bond surface at the first member side and a second bond surface at the second member side to bond the first member and the second member. The bonding part has at least a bonding layer, a reinforcing layer, and an intermediate layer. The bonding layer is composed of an intermetallic compound and bonded to the first bond surface.

Abstract: The invention relates to a coolable optical table with a table top and at least three table legs. Securing means for securing objects such as optical elements are provided in a table surface of the table top. The table legs are equipped with a damping device for damping vibrations.

Abstract: To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.

Abstract: A cold stage actuation system employs an optical assembly having an adapter ring mounted to a flange connected to a cold finger which extends into a Dewar housing. The flange supports a detector array. A resilient cold shield extends from the adapter ring to a lens holder, the lens holder connected to the resilient cold shield distal from the adapter ring. The lens holder supports a lenslet array. An optical light shield extends from the lens holder oppositely from the resilient cold shield to proximate a window in the Dewar housing. A motor is supported within the Dewar housing. An insulating translation arm connects the motor to the optical light shield, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis.

Abstract: A heat sink comprising a heat spreader (2) made from synthetic diamond and having a front surface for mounting one or more components to be cooled like a laser disc (8) and a rear surface for direct fluid cooling (10). A plurality of ribs (4,7) is bonded to the rear surface of the heat spreader (2) to stiffen the heat spreader. Both the heat spreader and the plurality of ribs are formed of synthetic diamond material. The ribs (4,7) may be fixed to the heat spreader by braze bonds (6).

Abstract: An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component.