Abstract: A heat dissipation structure includes a heat sink having a base formed with four securing tabs laterally extending from four corners of the base. Four positioning posts upwardly protrude from a printed circuit board. Four spring clips are attached to the four positioning posts respectively. Each of the four spring clips has a resilient piece for exerting a downward force to press a corresponding securing tab, thereby securing the heat sink to the printed circuit board.

Abstract: An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.

Abstract: A radiation member includes a base material; and a composite plating layer, formed on the base material, that includes a metal layer and two or more kinds of carbon materials, having different diameters from each other, dispersed in the metal layer such that to be provided with a plurality of protruding portions, each of the protruding portions being composed by a part of each of the carbon materials that are protruded from a surface of the metal layer.

Abstract: A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

Abstract: The present invention relates to a multilayer fluid heat exchanger container comprising a thermo-conductive sheet, said sheet comprising at least a first layer comprising a metal foil and at least a second layer comprising a biocompatible plastic material, a multilayer sheet for the fluid container and systems for heating or cooling a fluid comprising the container and a fluid heating or cooling device for receiving the container. The present invention further relates to methods for heating or cooling a fluid comprising the step of circulating a fluid through the container and a process for the manufacture of the fluid container.

Abstract: A heat sink assembly includes a heat sink. The heat sink includes a base. The base defines a hermetic space. The base includes a panel body and a plurality of magnetic posts extending from the panel body. The plurality of magnetic posts are located in the hermetic space.

Abstract: A heat-conducting structure comprises a heat-conducting metal layer, a heat-conducting support layer, and a heat-conducting protection layer. The heat-conducting support layer is formed to enclose the heat-conducting metal layer thereby preventing the heat-conducting metal layer from thermal deformation, while the heat-conducting protection layer is formed to enclose the heat-conducting support layer.

Abstract: A heat dissipation module comprises a radiator. The radiator comprises a first fin assembly and a second fin assembly. The first fin assembly comprises a plurality of first fins arranged abreast of each other, and the first fin assembly has a first average distribution density. The second fin assembly comprises a plurality of second fins arranged abreast of each other, and the second fin assembly has a second average distribution density. The second average distribution density is larger than the first average distribution density.

Abstract: A plate-type heat exchanger comprising a plurality of spaced-apart stacked plate pairs, the plate pairs each comprised of first and second plates. The first and second plates each having an elongated central, planar portion surrounded by peripheral edge portions, the peripheral edge portions of the first and second plates being sealably joined together to form a first set of fluid passages in the heat exchanger. The first and second plates are provided with boss potions at respective ends of the plates, one of the boss portions being an elongated boss portion having a first position and a second position for the location of a fluid opening. The first and second heat exchanger plates are identical in structure and can be used to form various heat exchangers using the single plate design.

Abstract: Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections.

Abstract: A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air.

Abstract: The invention pertains to a device for signature adaptation, comprising at least one surface element (100; 300; 500) arranged to assume a determined thermal distribution, wherein said surface element comprises at least one temperature generating element (150; 450a, 450b, 450c) arranged to generate at least one predetermined temperature gradient to a portion of said at least one surface element. Said surface element (100; 300; 500) comprising at least one display surface (50), wherein said display surface (50) is arranged to radiate at least one predetermined spectrum. The invention also pertains to a method for signature adaptation and an object such as a craft provided with the device according to the invention.

Abstract: Disclosed is a method of making an LED light bulb using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons and optimizing the number and placement of the surface mount light emitting diodes for the widest lighting angle (to achieve as close to 360-degrees in three dimensions) with a heat sink matched to the thermal output of the surface mount light emitting diodes and the heat conductive capacity of the polyhedron. Also described are a light emitting diode light bulb made using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons. Some embodiments may include a heat conductor comprising a plurality of curved-T shaped heat fins.

Abstract: A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.

Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: The present invention discloses a manufacturing method of heat-dissipating element, including the following steps: processing a heat-dissipating element body with a bottom plate and at least two stop plates, the stop plates being disposed at two sides of the bottom plate and bending towards surface; cutting from the bottom plate of the heat-dissipating element body to form heat-dissipating element, the dissipating element at least comprising two heat-dissipating elements of same shape or of symmetric shape. The present invention also discloses a heat-dissipating element and backlight module manufactured by the above method. The heat-dissipating element, manufacturing method and backlight module thereof can maintain optimal heat-dissipation effect and save material used to lower cost.

Abstract: Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well.

Abstract: The invention relates to an energy storage device, comprising a plurality of storage cells and a temperature-control device for the temperature-control of the storage cells or of a cell assembly formed by the storage cells, wherein elastic means for the shock-absorbing mounting or spacing are provided between a storage cell and another component, wherein the other component is another storage cell, a retaining element, another housing part or a heat-conducting element. The elastic means are designed and configured as a functional component of the temperature-control device. The invention also relates to storage cells and heat-conducting elements which are suitable for use in the energy storage device according to the invention.

Abstract: A linear actuator and housing assembly may be used to increase motor performance and dissipate excess thermal energy. One embodiment relates to an actuator housing and an electric motor coupled to the actuator housing, where the electric motor is disposed within the actuator housing such that there is a close proximity between the actuator housing and the motor. A linear actuator assembly may be operably coupled to the electric motor, where the linear actuator assembly is disposed within the actuator housing and a thermally conductive material is disposed between the actuator housing and motor.

Abstract: A heat exchanger is provided and includes a frame defining a volumetric body with substantially flat upper and lower sides, heat exchange elements disposed within an interior of the body, sorbent material disposed among the heat exchange elements within the interior of the body, retainer screens disposed at upper and lower sides of the heat exchange elements and sorbent material and structural foam layers supportively disposed between the retainer screens and the substantially flat upper and lower sides to absorb loading applied to the retainer screens.

Abstract: An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.

Abstract: A thermal interface material (1) comprises a bulk polymer (2) within which is embedded sub-micron (c. 200 to 220 nm) composite material wires (3) having Ag and carbon nanotubes (“CNTs”) 4. The CNTs are embedded in the axial direction and have diameters in the range of 9.5 to 10 nm and have a length of about 0.7 ?m. In general the pore diameter can be in the range of 40 to 1200 nm. The material (1) has particularly good thermal conductivity because the wires (3) give excellent directionality to the nanotubes (4)—providing very low resistance heat transfer paths. The TIM is best suited for use between semiconductor devices (e.g. power semiconductor chip) and any type of thermal management systems for efficient removal of heat from the device.

Abstract: A luminaire comprising a base, a heat sink modularly connected to the base, and a heat-generating element in thermal communication with the modular heat sink. The heat sink may include a heat-generating element contacting portion, and a plurality of heat sink segments connected to and extending outwardly therefrom. Each of the heat sink assemblies segments may comprise at least one fin assembly. Each heat sink segment may pass through a respective plurality of passageways in the top portion of the base so that the heat sink segments may matingly engage the medial portion of the base. A method for forming a heat sink comprises fabricating a heat-generating element contacting portion, constructing a plurality of heat sink segments, and assembling the plurality of heat sink segments to connect to and extend outwardly from the bottom surface of the heat-generating element contacting portion.

Abstract: In one embodiment of the present disclosure, a device is disclosed comprising a macroscopic thermal body and an extraction structure that is electromagnetically-coupled to the thermal emitting area of the thermal body. The macroscopic thermal body having a thermal emitting area, and the extraction structure configured and arranged to facilitate emission from, or receipt to the thermal emitting area that exceeds a theoretical, Stefan-Boltzmann, emission limit for a blackbody having the same thermal emitting area as the thermal body.

Abstract: A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.

Abstract: A heat exchanger is provided and includes a frame defining a volumetric body with substantially flat upper and lower sides that each has inwardly extending ribs defining airflow pathways, heat exchange elements disposed within an interior of the body and partition walls disposed to run perpendicularly with respect to the ribs and to transmit loading between the upper and the lower sides from the ribs and through the interior of the body.

Abstract: A combination heat sink including a first radiating element having a first plane section and a second radiating element having a second plane section. Multiple first radiating fins integrally upward extend from the first plane section. Each two adjacent first radiating fins define therebetween a first connection section. Multiple second radiating fins integrally upward extend from the second plane section. Each two adjacent second radiating fins define therebetween a second connection section. The first and second radiating elements are connected with each other in an alternating manner with the first radiating fins attaching to and contacting with the second radiating fins to form the heat sink.

Abstract: A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

Abstract: This application discloses devices, articles, and methods useful for producing lyophilized cakes of solutes. The devices and articles provide for a method of freezing liquid solutions of the solute by the top and the bottom of the solution simultaneously. The as frozen solution then provides a lyophilized cake of the solutes with large and uniform pores.

Abstract: The invention provides a substrate, including: a metal foil; a polyimide resin layer having an average thickness of from 3 ?m to 25 ?m, the polyimide resin layer being disposed on a surface of the metal foil having an arithmetic average roughness (Ra) of 0.3 ?m or less and a maximum roughness (Rmax) of 2.0 ?m or less; and an adhesive layer having an average thickness of from 5 ?m to 25 ?m, the adhesive layer being disposed on the polyimide resin layer.

Abstract: Systems according to the present disclosure provide one or more surfaces that function as heat or power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges.

Abstract: An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.

Abstract: An electric power converter includes a cooler and an electronic circuit. The cooler includes a heat sink, a cooling fan, and a wind tunnel. A plurality of radiator fins are provided on a heat-sink base in the heat sink. The cooling fan is configured to feed cooling air through the plurality of radiator fins. The wind tunnel covers the plurality of radiator fins and the cooling fan. The electronic circuit includes a plurality of rectifiers and a plurality of input terminals. The plurality of rectifiers are provided on a side of the heat-sink base opposite to the plurality of radiator fins and are arranged side by side in a longitudinal direction of the heat-sink base. The plurality of input terminals are connected to the plurality of rectifiers with band-shaped conductors and are provided on a side of the plurality of rectifiers opposite to the heat sink.

Abstract: A storage device testing system that includes at least one rack, test slots housed by each rack, and at least one air mover in pneumatic communication with the test slots. Each test slot includes a test slot housing having an entrance and an exit, with the entrance configured to receive a storage device. The at least one air mover is configured to move air exterior to the racks into the entrance of each test slot housing, over the received storage device, and out of the exit of each test slot housing.

Abstract: A packaging system for a temperature sensitive payload is provided. The system comprises insulative panels, including side panels and end panels, forming a product compartment. Cooling layers within the product compartment are located below and above the products. Vertical posts disposed between the side panels and the payload and between the end panels and the payload create spaces and channels for convective air movement.

Abstract: The present invention provides a protection cover and a backlight module. The protection cover comprises a cover main body. The cover main body includes a heat dissipation surface. Each side edge of the cover main body forms a sidewall protruding with respect to the heat dissipation surface. The heat dissipation surface disposes at least one heat dissipation hole thereon, and the sidewall disposes at least one vent hole thereon. The present invention may timely and fast dissipate the heat in the protection cover, and improve the heat dissipation efficiency.

Abstract: Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.

Abstract: A heat sink includes a bottom plate, a number of first fins extending up from the bottom plate, and a number of second fins. The second fins are detachably connected to tops of the corresponding first fins.

Abstract: A thermal transpiration device and method of making the same. The device includes a pair of membranes having predetermined thicknesses in order to provide the device with strength and rigidity. The thickness of a portion of each membrane is reduced in the area where thermal transpiration occurs in order to optimize the effectiveness of the thermal transpiration device without scarifying structural integrity of the device.

Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.

Abstract: A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion. Each of the extending portions has a first surface facing the direction same as that of the pressing side and an oppositely disposed second surface. Each of the second ends has a fixing portion. At least one slot is formed between each of the extending portions and the pressing portion. The slot penetrates the first surface and the second surface. The shortest straight distance between each of the fixing portions and the pressing portion is smaller than or equal to the length extended from the first end to the second end of the extending portion.

Abstract: An electronic device includes a circuit board and a heat sink. A chip is mounted on the circuit board. The heat sink includes a base mounted on the chip and a number of heat-dissipation poles extending up from the base. Each pole defines a through hole extending through the base and a top end of the pole.

Abstract: Disclosed is a member that contains electronic components. Using the member, when, for example, a vehicle or the like carrying electronic components such as an inverter collides with an external object, there is prevented damage to a housing containing the electronic components, which would otherwise occur due to interfering objects. Furthermore, the disclosed member can dissipate heat produced by the contained electronic components. The member includes a housing for containing electronic components, a cooling passage that is provided inside the housing and uses a refrigerant to cool the electronic components, and a heat dissipation part that dissipates heat from the cooling passage and prevents the housing from being damaged by impacts from external interfering objects.

Abstract: The present invention relates to a temperature-control element. The present invention relates to a temperature-control element, having at least one surface region with an electrically insulating and thermally conductive coating, in particular a ceramic coating provided on said surface region, and attached to the coating is at least one electronic component which is thermally connected to the temperature-control element and is configured to be electrically insulating with respect to the temperature-control element. The present invention also relates to a method for attaching an electronic component to the temperature-control element.

Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A heat sink comprises a heat sink body, a reflective layer disposed over the heat sink body that has reflectivity greater than 90% for light in the visible spectrum, and a light transmissive protective layer disposed over the reflective layer that is light transmissive for light in the visible spectrum. The heat sink body may comprise a structural heat sink body and a thermally conductive layer disposed over the structural heat sink body where the thermally conductive layer has higher thermal conductivity than the structural heat sink body and the reflective layer is disposed over the thermally conductive layer. A light emitting diode (LED)-based lamp comprises the aforesaid heat sink and an LED module secured with and in thermal communication with the heat sink. The LED-based lamp may have an A-line bulb configuration, or may comprise a directional lamp in which the heat sink defines a hollow light-collecting reflector.

Abstract: Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.

Abstract: A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, t

Abstract: A method of manufacturing a heat dissipating base includes steps of providing a first base, wherein the first base is made of a first heat conducting material; putting the first base into a mold; pouring a second heat conducting material, which is melted, into the mold, wherein a thermal conductivity of the first heat conducting material is larger than that of the second heat conducting material; and processing the second heat conducting material by a die casting process, so as to form a second base, wherein the second base covers a periphery of the first base and an upper surface and a lower face of the first base are exposed.

Abstract: A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device.