Abstract: Provided are an insulation sheet and an electronic apparatus using the same. The insulation sheet includes: a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus.

Abstract: Materials that readily adhere to and conform to various surfaces can be desirable for a number of applications. In heat transfer and thermal management applications, for example, conformable materials can be used in establishing a thermal interface between a heat source and a heat sink. There are limited materials that provide good thermal conductivity values while maintaining capabilities to readily adhere and conform to a surface. Compositions including a conformable and adhesive solid can include a reaction product formed by heating a mixture containing a plurality of metal nanoparticles, one or more amines, and one or more carboxylic acids. The compositions can further include one or more additives dispersed in the conformable and adhesive solid.

Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: The present invention relates to the use of an anisotropic fluoropolymer having a different intrinsic thermal conductivity in at least two directions as a heat conducting material in a thermally conductive article, to a thermally conductive article comprising said anisotropic fluoropolymer and to a process for the production of said anisotropic fluoropolymer.

Abstract: An LED lighting device includes an LED light engine and a heat sink including a heat dissipation structure. The heat dissipation structure includes: a plurality of heat conductive rod rows including a plurality of vertical heat conductive rods; a plurality of horizontal heat conductive rods including a plurality of surfaces and attached onto one end of the vertical heat conductive rods; another end of the vertical heat conductive rods vertically attached to a back side of the LED light engine; and a plurality of fin modules attached to any one of the surfaces of the horizontal heat conductive rods. Accordingly, the heat dissipation area is increased and the heat sink is separated from the LED light engine such that heat dose not accumulate thereon and the shortcoming of airflow on the heat sink can be overcome with improvements.

Abstract: Heat spreaders for dissipating heat from semiconductor devices comprise a contact surface located within a recess on an underside of the heat spreader, the contact surface being configured to physically and thermally attach to a semiconductor device, and a trench extending into the heat spreader adjacent to the contact surface sized and configured to receive underfill material extending from the semiconductor device into the trench. Related semiconductor device assemblies may include these heat spreader and methods may include physically and thermally attaching these heat spreaders to semiconductor devices such that underfill material extends from a semiconductor device into the trench.

Abstract: A complex heat dissipation assembly for electronic case, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with a surface of the case; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the case in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the case and the temperature will not locally abnormally rise.

Abstract: A complex heat dissipation assembly, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with the heat source; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the heat source in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the heat source. In this case, the temperature will not locally abnormally rise.

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat generating components using thermoplastic and/or self-healing thermal interface materials. In an exemplary embodiment, a thermal interface material has a softening or melting temperature above a normal operating temperature of the one or more heat generating components. The thermal interface material is flowable to a thin bond line between a heat spreader or lid and one or more heat generating components when heated to at least the softening or melting temperature while under pressure.

Abstract: In an LED lighting apparatus and a heat sink thereof, the heat sink includes a heat dissipation structure for airflows, and the heat dissipation structure includes: a plurality of heat conductive rods arranged spaced apart from each other in rows and attached at a back side of an LED light engine; each heat conductive rod including an extension portion horizontally extended on at least one side of the LED light engine and a plurality of surfaces; and a plurality of fin modules attached to two corresponding surfaces of each one of the extension portions respectively; each fin module including a plurality of fins spaced apart from each other; wherein an air gap is formed between any two of the adjacent fin modules and a fin channel is formed between any two of the adjacent fins such that air flows through these air gaps and fin channels.

Abstract: An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.

Abstract: An apparatus and a method to affect the heat transfer of a container is provided for rapidly heating or cooling the contents of a container through convective heat transfer. The apparatus includes a cylindrical sleeve which positively engages a distal end of a container, said sleeve including a can clip or bottle clip. The cylindrical sleeve is connected to a first end of a shaft having two ends, while the second end of the shaft may be connected to a rotating device. The rotating device is operated thus rotating the shaft, the cylindrical sleeve, and the container about the horizontal axis while the container is being exposed to the heating or cooling source. The cylindrical sleeve is capable of holding varying sizes of containers.

Abstract: A heat-dissipating assembly for electronic component is provided, which comprises a body and at least one insert element. The body has a front surface and a back surface opposite to each other, two side surfaces opposite to each other, and at least one through-hole which penetrates the two side surfaces. Each of the insert elements is detachably inserted into the at least one through-hole respectively, and is provided with at least one internal thread hole which is formed from the front surface to the back surface of the body. The heat-dissipating assembly for electronic component according to the present disclosure may be used easily and flexibly, benefits in reducing space to be occupied.

Abstract: Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.

Abstract: Metamaterial systems capable of exhibiting changes in thermal conductivities in response to an external control or input, as well as methods relating thereto. The metamaterial systems include first and second plates, and a metamaterial core between and thermally coupled to the first and second plates. The metamaterial core comprises a plurality of elements coupled to and contacting each other, with each of the elements being a pseudo-tetrahedron having surfaces that define surface-to-surface contacts with at least one other of the elements. A force is applied to the metamaterial core that increases contact pressures between the elements at the surface-to-surface contacts thereof and thereby increases thermal contact conductivities at the surface-to-surface contacts and increases a thermal conductivity of the metamaterial core.

Abstract: Disclosed is an aluminum alloy material for a heat exchanger fin, the aluminum alloy material containing Si: 1.0% to 5.0% by mass, Fe: 0.1% to 2.0% by mass, and Mn: 0.1% to 2.0% by mass with balance being Al and inevitable impurities, wherein 250 pieces/mm2 or more to 7×104 pieces/mm2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 ?m are present in a cross-section of the aluminum alloy material; and wherein 10 pieces/mm2 or more and 1000 pieces/mm2 or less of the Al—Fe—Mn—Si-based intermetallic compounds having equivalent circle diameters of more than 5 ?m are present in a cross-section of the aluminum alloy material. The aluminum alloy material may further contain one or more additive elements of Mg, Cu, Zn, In, Sn, Ti, V, Zr, Cr, Ni, Be, Sr, Bi, Na, and Ca.

Abstract: An evaporator heat exchanger is disclosed. The evaporator heat exchanger includes a bottom plate, a top plate, and at least one main plate between the bottom plate and the top plate. The at least one main plate includes a first face having one or more channels for flow of a first fluid along the first face and a second face opposite the first face having one or more channels for flow of a second fluid along the second face, wherein heat is exchanged between the first fluid and the second fluid through the main plate. Main plates adjacent to each other define an enclosed channel for fluid flow.

Abstract: An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end pivotally mounted to the first retainer and another end capable of locked by the first retainer. The second retainer is integral formed with an elastic plate. The first retainer and the second retainer are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device.

Abstract: A Stirling radioisotope generator is provided. The generator includes a first and second heat source assembly, each heat source assembly comprising two General Purpose Heat Source modules, each General Purpose Heat Source module configured to generate thermal energy. The generator also includes a first and second Stirling convertor in thermal communication with the first and second heat source assembly, respectively, each Stirling convertor configured to convert the thermal energy into electrical power. The generator has a housing enclosing the first and second heat source assembly and the first and second Stirling convertor, the housing configured to dissipate excess thermal energy.

Abstract: Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Abstract: Method and system are provided for controlling a scalable panel cooling system having multiple cooling panels for cooling multiple heat-generating components housed in a support structure. The method includes: dividing a support structure into areas, each area capable of housing one or more heat-generating component; providing a cooling panel adjacent an area of the support structure, a cooling panel being operable to cool the one or more heat-generating components housed in the area; determining whether an area of the support structure is housing one or more operational heat-generating components; and activating a cooling panel adjacent an area housing one or more operational heat-generating components; and de-activating a cooling panel adjacent an area housing no operational heat-generating components.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract: An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.

Abstract: A heat transfer element includes curved mounting surfaces configured to mate with an outer surface of a pipe for attachment thereto; and a channel configured to receive a tracer therein. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with heat transfer cement (HTC) to both the pipe and the tracer. A system includes a pipe and a tracer; HTC; and a heat transfer element having curved mounting surfaces configured to mate with an outer surface of the pipe and attached thereto via the HTC, and a channel in which the tracer is received and secured via HTC. The heat transfer element is configured to effect conductive heat transfer from the tracer to the pipe, or to process flowing through the pipe, when attached with HTC to both the pipe and the tracer.

Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.

Abstract: Aspects of the invention provide compositions that include carbon nanotubes dispersed within nanographite particles, and that have useful thermal properties. Certain compositions have high thermal conductivities (e.g., high thermal conductivities at ambient temperature). Certain compositions have a temperature dependent thermal conductivity that reversibly increases with temperature. Certain compositions are useful for heat transfer and can be used as thermal interface material, for example, in the context of computer and/or power generating devices.

Abstract: An undercover for a vehicle, connected to an underbody below a muffler mounted on the underbody, includes: a main body panel in a plate shape, through which insertion holes are formed; a heat absorption plate to be connected to the insertions holes; and a heat radiation plate to be connected to the heat absorption plate, the remote ends of which are exposed below the main body panel. A heat exchange function is added to an undercover that has been used simply as a cover for protecting the muffler from foreign substance, thereby cooling more efficiently the muffler.

Abstract: An electrochemical cell has at least one plate element which can be cooled by a liquid coolant, such as water. The plate element has a surface that can be wetted for the purpose of cooling with the coolant. The surface of the plate element in the electrochemical cell is configured such that a contact angle between the surface and the liquid coolant is less than 90°. In the method for producing the electrochemical cell an additional method step is carried out which influences the wettable surfaces of plate elements for cooling with coolant and by which a contact angle between the surface and the coolant is decreased.

Abstract: A heat sink includes a base block, a plurality of upright panels horizontally outwardly extended from the base block in a flush manner, each two adjacent upright panels defining with the base block a space, a plurality of radiation fins respectively extended from the periphery of the base block and two opposite lateral sides of each upright panel and respectively suspended in each space between each two adjacent upright panels, a mounting member located at a distal end of each upright panel remote from the base block, a sub-upright panel extended from one side of each upright panel adjacent to the mounting member of the respective upright panel, and a screw-connection member located at a distal end of each sub-upright panel remote from the respective upright panel.

Abstract: A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber.

Abstract: A heat sink assembly includes a heat sink and two fixing members. The heat sink includes a board and a number of fins extending substantially perpendicularly up from the board. A first fixing portion and two second fixing portions at opposite sides of the first fixing portion are formed at each of opposite sides of the board. Each fixing member includes a driving portion, a fixing bolt, and two positioning poles. Each driving portion defines an installing hole and two positioning holes at opposite sides of the installing hole. The fixing bolts extend through the installing holes, the first fixing portions, and a circuit board to engage with the circuit board. The positioning poles are inserted into the second fixing portions and the positioning holes. A spring is fitted about each positioning pole and is sandwiched between the corresponding second fixing portion and the corresponding driving portion.

Abstract: The invention comprises of an elongated heat conductive material (10), a sheath made of heat insulation material (12), that encloses said heat conductive material (10), and an optional outer sheath (14), made of a protective material as a form of protection from cuts, impact, and other possible damage. The two sheaths may be combined into one sheath (18) that would double for both insulation and protection. The purpose of the device is to transfer heat. An example use for this would be to have a heat source at one end of the device, and a destination to transfer the heat at the other end. The device can be of various lengths, much like pipe, wire or rope.

Abstract: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may include a groove and seal arrangement operable to seal a fluid coolant chamber used to cool the circuitry from leaking fluid during use.

Abstract: One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.

Abstract: A heat sink wind guide structure and a thermal module thereof. The heat sink wind guide structure includes a heat sink having multiple radiating fins and a wind incoming side. Each two adjacent radiating fins define therebetween a heat dissipation flow way in communication with the wind incoming side. The radiating fins include a first radiating fin and a second radiating fin, which are respectively positioned on two opposite outer sides of the heat sink. The first radiating fin has a first extension end and the second radiating fin has a second extension end. The heat sink is assembled with a fan to form the thermal module. By means of the first and second extension ends, the heat of the heat sink can be dissipated quickly and the heat dissipation airflow can be exhausted from many sides of the heat sink to greatly enhance heat dissipation efficiency.

Abstract: A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided.

Abstract: A vertical support rigidly mounted to a planar base positions and supports a cryocooler expander unit off axis and away from a sample to be examined. The sample support is likewise rigidly mounted to the planar base with a rigidly mounted sample housing therein. The cryocooler expander unit is suspended in the vertical support by spring dampening bearings. A pair of opposing flexible vacuum bellows connects the cryocooler expander unit to the sample housing and vertical support. This configuration isolates the sample from vibration. Flexible thermal links associated with a predictive electronic closed loop control sequence maintains sample temperature.

Abstract: A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. The cast component includes a second aluminum material overmolded onto a portion of the extruded component to form the interface layer. The interface layer is formed of at least one of the first and the second aluminum materials and abuts against and couples the extruded component to the cast component.

Abstract: A heat sink includes a main component, and an attachment component to which a light source is configured to be attached. The attachment component is disposed at one end of the main component such that the heat sink is configured to dissipate heat generated by the light source. A first region of the heat sink defined by the attachment component and the one end of the main component has a surface area per unit of volume that is smaller than that of a second region of the heat sink defined by the other end of the main component.

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.

Abstract: A heat sink element for a device is operable by relative rotation of a conductor rotor assembly and a magnet rotor assembly. The heat sink element includes a base portion and a plurality of fins. The base portion includes a mounting face that is sized and dimensioned to be coupled to the conductor rotor assembly, and an opposing convective heat transfer face. The plurality of fins extend from the convective heat transfer face of the base portion. Adjacent fins are separated by a channel that extends along a longitudinal direction of the fins. The fins include at least one surface disruption on a top surface thereof.

Abstract: Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink.

Abstract: Disclosed is a thermally-conductive elastic body that effectively dissipates heat generated from a heat generation source such as an electronic product and prevents a phenomenon in which small graphite fragments are separated from (fall off) a graphite layer by completely sealing up the graphite layer that conducts the heat. The thermally-conductive elastic body according to the embodiments of the present disclosure includes an elastic body and a thermally conductive layer that is formed to be wrapped around an external surface of the elastic body, in which the thermally conductive layer includes a first base film and a graphite layer that is internally arranged within an edge region of the first base film, and in which the edge region of the first base film is attached to the elastic body in such a manner that the graphite layer is sealed up.

Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

Abstract: A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component.

Abstract: The present invention involves both the geometrical specification of a structure and positioning the structure in the cluster layout to achieve rapid heating/cooling as a medium transverses through them, and with little pressure drop penalty.

Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.

Abstract: An electric power conversion apparatus includes a plurality of semiconductor modules, a frame, a control circuit board, and a reinforcing and fixing member. Each of the semiconductor modules has a plurality of control terminals. The frame receives the semiconductor modules therein. The frame has, at least, a pair of side walls that face each other with the semiconductor modules interposed therebetween. The control circuit board is located outside of the frame and has the control terminals of the semiconductor modules connected thereto. The reinforcing and fixing member extends to connect the side walls of the frame, thereby reinforcing the frame. The reinforcing and fixing member also has the control circuit board fixed thereto so that the reinforcing and fixing member is positioned between the control circuit board and the semiconductor modules.

Abstract: Provides a cooling device (100) for cooling at least one pluggable module (200) each having a pluggable component (20) and a frame (32) for accommodating the pluggable component, the frame having an opening (33) on a top wall thereof. The cooling device comprises at least one thermal conductive block (40), a heat radiator (70) and a resilient thermal conductive pad (60). The resilient thermal conductive pad being adapted to be in a substantially released position when the pluggable component is decoupled from the frame and substantially biased when the pluggable component is inserted into the frame thus exerting a biasing force on the thermal conductive block and the heat radiator whereby the thermal conductive block is pressed through the opening of the frame into direct thermal contact with the pluggable element of the pluggable module for conducting the heat generated by the pluggable component to the heat radiator through the thermal conductive block and the resilient thermal conductive pad.