Abstract: A graphite structure includes a graphite plate (1) that is made of a highly heat conductive material and has a thickness of 15 ?m or less. A Ti layer (3) having a thickness of 10 nm to 200 nm covers the inner surfaces of through holes (2) penetrating the laminate of the graphite plate (1) from the front side to the back side of the laminate. Furthermore, continuous holes (4) are formed inside the through holes (2). This configuration can achieve a smaller thickness and high reliability while keeping high thermal conductivity of graphite.

Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.

Abstract: A device for indirectly cooling a battery module of an eco-friendly vehicle is provided that cools the battery module using an interfacial plate into which a heat pipe is inserted to maximize battery heat emission performance and simultaneously prevent degradation of battery performance. A thermally-conductive interfacial plate in which a heat pipe is embedded by over-molding is disposed between battery cells and a heat sink, which is a condensation unit, integrally connected to an upper end of the heat pipe is disposed in a cooling air flow path to improve contact strength between the interfacial plate and the battery cells. A planar heat emitter is disposed between the battery cells where the interfacial plate is not disposed to heat the battery to a proper-level temperature in a cold-start environment and a low-temperature environment, thereby improving battery performance and preventing degradation in vehicle power.

Abstract: Heat transfer management apparatuses according to the present disclosure includes a composite lamina having an insulator substrate and a thermal conductor at least partially embedded in the insulator substrate, a temperature-sensitive component coupled to the composite lamina, and a temperature-insensitive component coupled to the composite lamina and positioned distally from the temperature-sensitive component. The temperature-insensitive component produces heat during operation. The thermal conductor and the insulator substrate are arranged into a targeted heat transfer region proximate to the temperature-sensitive component and a bulk region proximate to the temperature-insensitive component. The targeted heat transfer region and the bulk region are in thermal continuity with one another.

Abstract: A heat sink that is suitable for mounting on a printed circuit board (PCB) and dissipating heat from an integrated chip (IC).

Abstract: An exemplary heat sink includes a plurality of fins interconnected together. Each of the fins includes a main body and at least an engaging portion extending outwardly from the main body. The engaging portions of every two adjacent fins are interlocked with each other. The engaging portion includes a base extending outwardly from the main body, an engaging groove defined at a lateral side of the base, and an inserting rib protruding outwardly from another lateral side of the base opposite to the engaging groove. In the two adjacent fins, the inserting rib of the engaging portion of one fin is fitly inserted into the engaging groove of the engaging portion of another fin.

Abstract: A heat sink includes one or two heat transfer blocks, and corrugated radiation fins fastened to the heat transfer block(s). Each corrugated radiation fin has a large area corrugated radiation fin body to provide an extended heat dissipation surface area, and a plug portion located at the bottom side of the large area corrugated radiation fin body and press-fitted into one respective mounting groove of the heat transfer block(s).

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment.

Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.

Abstract: The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.

Abstract: A heat sink mounting apparatus including: a heat sink; and a device housing, the housing having a slot in the wall of the housing configured to receive a heat sink, wherein the heat sink and the housing are configured such that the heat sink can be secured within the slot with an interference fit.

Abstract: A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.

Abstract: A heat rejection system includes a plurality of panel subassemblies and a solid state heat pipe flex joint. Each panel subassembly includes a fin, a solid state heat pipe manifold, a first solid state heat pipe tube operatively connected to the solid state heat pipe manifold and secured to the fin, a second solid state heat pipe tube operatively connected to the solid state heat pipe manifold adjacent to the first solid state heat pipe and secured to the fin. The solid state heat pipe flex joint operably connects the solid state heat pipe manifolds of two of the plurality of panel subassemblies in a hermetically sealed configuration, and is configured to permit repositioning of the two panel subassemblies relative to each other.

Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

Abstract: Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.

Abstract: Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Abstract: A heat sink assembly is disclosed for cooling a power electronics module, such as a variable frequency drive. The heat sink assembly includes a housing and a heat sink structure. The housing defines an interior chamber for enclosing the power electronics module and also defines a cooling air flow channel exterior to the interior chamber. The heat sink structure is disposed in conductive heat transfer relationship with the interior chamber and has a heat transfer surface positioned within the exterior cooling air flow channel in convective heat transfer relationship with the cooling air flow.

Abstract: A system and apparatus are provided for preventing heat loss in a spacecraft during the upper stage launch phase and transfer orbit. A thermal control panel can be provided that can be positioned adjacent to exposed areas of radiator panels on the spacecraft in a collapsed configuration. The outer surface of the panel can have a high absorptivity, and the inner surface can have a high emissivity. During upper stage launch phase and transfer orbit, the panel can tend to emit heat toward the radiator panels on an inboard side of the spacecraft, thus reducing heat loss from the radiator panels to reduce the need for onboard electronic heaters and thereby preserve battery power for other onboard systems.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: Gel including a phase-change material and a gelling agent. In one embodiment, the phase-change material may be n-tetradecane, n-hexadecane or mixtures thereof. The gelling agent may be a high molecular weight styrene-ethylene-butylene-styrene (SEBS) triblock copolymer with a styrene:rubber ratio of about 30:70 to 33:67% by weight. To form the gel, the phase-change material and the gelling agent may be mixed at an elevated temperature relative to room temperature to partially, but not completely, dissolve the gelling agent. The mixture may then be cooled to room temperature. Alternatively, the phase-change material and the gelling agent may be mixed at room temperature, and the mixture may then be heated to form a viscoelastic liquid, which is then cooled to room temperature. The invention is also directed at a method of preparing the gel, a thermal exchange implement including the gel, and a method of preparing the thermal exchange implement.

Abstract: A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

Abstract: The invention relates to a heat sink (1) for an electronic or electrical component, including: a base element (2) including a first main surface (2a) suitable for receiving the electronic component in close thermal contact; a plurality of elongate fins (3) projecting outwards from the second main surface (2b) of the base element (2), opposite the first surface (2a), and arranged around the entire periphery of the case element with enough space between fins to allow air circulation, characterized in that said space can be obtained by cutting a star-shaped geometrical shape matching said base element and said fins in a thin plate; and folding the fins relative to the plane of the base element.

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract: Thermal energy guiding systems and methods for fabricating thermal energy guiding systems are provided. A thermal energy guiding system includes a thermal energy source and an anisotropic thermal guiding coating in thermal communication with a surface of the thermal energy source. The anisotropic thermal guiding coating includes a plurality of layers including a first layer and a second layer. The first layer has a first thermal conductivity and the second layer has a second thermal conductivity. The plurality of layers are non-uniformly arranged on the surface of the thermal energy source in order to guide thermal energy from the thermal energy source according to a thermal energy management objective.

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract: A method of forming a heat exchanger for use with a rotating component configured to rotate about an axis of rotation is provided including generating a stereolithography file of the surface geometry of the heat exchanger. The surface geometry of the heat exchanger includes a cylindrical base having a plurality of fins extending generally radially therefrom. The surface geometry defined in the stereolithography file is ‘sliced’ into a plurality of axisymmetric layers, perpendicular to the axis of rotation. Energy from an energy source is applied to a powdered material causing the powdered material to fuse and form the plurality of axisymmetric thin layers. Each of the axisymmetric thin layers is integrally formed with an adjacent axisymmetric thin layer to create a unitary heat exchanger.

Abstract: A combinational chassis featuring heat dissipation comprises a chassis body, a base plane shell, and a first side shell and a second side shell, of which the two sides connect to each other in the same direction of the base plane shell. A heat dissipation device comprises a plurality of heat-sink parts on the outside surface of chassis body. The heat-sink part comprises a raised portion integrally connected to the inside, and a joint portion connected to the outside. The raised portion integrally protrudes outwards from the outside surface. The joint portion geometrically protrudes from the raised portion. A wedge groove is formed near the joint portions where an inlet groove is formed. The inlet groove connects and communicates with the wedge groove. The chassis may be connected vertically in stack and/or connected horizontally for expansion to expand the computer system for preferably flexible application and optimal heat dissipation.

Abstract: According to some embodiments, a thermal conditioning system for selectively cooling skin of a subject comprises at least one thermal conditioning device comprising a first side and second side, the second side being generally opposite of the first side. In some embodiments, the system further comprises a heat sink positioned along the second side of the at least one thermal conditioning device, wherein the first side of the at least one thermal conditioning device is configured to be placed in contact with or in close proximity to a skin surface of the subject to selectively cool or heat the skin surface.

Abstract: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation.

Abstract: A heat sink comprising a base, fins attached to the base and a flow diverter in contact with the base or at least one of the fins. The flow diverter has a rectangular cross-sectional profile in a plane that is coplanar with and elevated above a plane of the base and spanning the entire separation distance, and, a segment of the flow diverter is angled towards the base to direct the fluid flow towards the base.

Abstract: Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.

Abstract: A separator plate assembly for use in an indirect evaporative cooler (IEC) with an air-to-air heat exchanger. The assembly includes a separator plate with a first surface defining a dry channel and a second surface defining a wet channel. The assembly includes heat transfer enhancements provided on the first surface for increasing heat transfer rates. The heat transfer enhancements may include slit fins with bodies extending outward from the first surface of separator plate or may take other forms including vortex generators, offset strip fins, and wavy fins. In slit fin implementations, the separator plate has holes proximate to each of the slit fins, and the separator plate assembly may include a sealing layer applied to the second surface of the separator plate to block air flow through the holes. The sealing layer can be a thickness of adhesive, and a layer of wicking material is applied to the adhesive.

Abstract: The present invention provides a new aluminum alloy material which may be used for a core alloy of a corrosion-resistant brazing sheet. This core alloy displays with high strength, and good corrosion resistance for use in heat exchangers. This aluminum alloy material was made by direct chill (DC) casting. The present inventions also provides corrosion-resistant brazing sheet packages including the aluminum alloy material as a core and one or more cladding layers.

Abstract: A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.

Abstract: Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.

Abstract: The present invention relates to different embodiments of lighting fixtures, such as high bay lighting fixtures, comprising improved features. One of these features can be a driver box placement that is displaced from the center of the fixture. In one such embodiment, the driver box can be mounted such that no portion is over the emitters. Another improved features is a heat sink with branching spokes. As they move away from the center of the heat sink, each of the spokes can branch into multiple spokes, which can improve conductive thermal dissipation. Empty spaces can be left between the spokes to improve convective thermal dissipation.

Abstract: An edge ring cooling module for semiconductor manufacturing chuck is provided which effectively cools the edge ring equipped in electrostatic chuck. The edge ring cooling module forcibly exhausts the heat of an edge ring (20) using an electronic cooling device (32) to top of a large-diameter portion (11) to effectively cool the edge ring (20) so that the temperature of the edge ring (20) is similar to that of top of a small-diameter portion (12) of a chuck body (10) to eventually improve the yield ratio while reducing the failure ratio.

Abstract: A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central opening disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including, a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, and a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section.

Abstract: An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface.

Abstract: The present invention relates to a device (1) for supporting, housing and cooling radiant modules (2) of an antenna, comprising a plate (3) for cooling said radiant modules (2) that can be fixed to means for supporting said antenna, said plate (3) having an upper surface and a lower surface; characterized in that it comprises a plurality of projecting guides (5) provided at least on one of said surfaces of said plate (3), so that each pair of said projecting guides (5) adjacent with surface on which are provided realize housing seats (6), in each one of which one of said radiant modules (2) is introduced; and pressing means (7, 15, 16, 17), integrated with said projecting guides (5), apt exerting a pressure on said radiant modules (2) so as to obtain a substantially uniform coupling between each of them and the surface of said plate (3) on which said projecting guides (5) are provided. The invention further relates to an array antenna.

Abstract: A packaged semiconductor device includes a package substrate, an integrated circuit (IC) die mounted on the package substrate, and a heat spreader mounted on the package substrate. The heat spreader surrounds at least a portion of the IC die and includes a lid with a plurality of openings. An inner portion of the heat spreader includes a plurality of thermally conductive protrusions adjacent the die.

Abstract: A heat exchanger includes a first plate and a second plate connected to the first plate to define a duct between the first plate and the second plate. At least one elastic cooling fin is disposed inside the duct between the first plate and the second plate. The at least one elastic fin exerts a load on the first plate.

Abstract: A temperature control plate for controlling the temperature of components. The temperature control plate is formed of a plastic-metal composite material which includes a metal fiber fabric that is surrounded by a thermoset plastic. A casing contains the components. The temperature control plate is configured for conducting heat away from temperature-exposed components.

Abstract: The present invention provides a heat dissipating member containing a fluorine resin and a thermally-conductive filler and having good adhesive properties. The present invention is a heat dissipating member including: a porous base material containing a fluorine resin and a thermally-conductive filler; and an adhesive material contained in pores of the porous base material. The fluorine resin contains polytetrafluoroethylene.

Abstract: A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an environment that is external to a differential carrier housing. The lower portion extends through an opening in the differential housing, thereby further being in thermal contact with a fluid within the differential housing. The package housing further has an electronic circuit that is attached to and in thermal conduction with the upper portion, within the package housing. The lower portion may have a connector portion formed in it for electrically connecting between external electrical devices and sources, the electronic circuit, and control devices within the differential housing.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component.