Abstract: An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.

Abstract: An electronic device holder for controlling a temperature of an electronic device includes a shell body having a bottom wall, a top portion, and a dividing wall between the bottom wall and top portion. A shell cap is detachably coupled to the shell body and configured to move between an open position and a closed position. A removable temperature controlling insert is disposed in the shell body, and a card aperture is disposed on the top portion of the shell body. The card aperture is configured to receive a card to be processed by a card reader. When the shell cap is in the closed position, the shell cap is coupled to the shell body and forms a cavity at the top portion of the shell body and forms a chamber adjacent the cavity. The chamber is configured to enclose the removable temperature controlling insert.

Abstract: The invention relates to a structure comprising at least one thermal management element comprising : a composite body (3) containing at least one phase change material (PCM) in a structuring rigid matrix, so that the composite body is self-supporting regardless of the phase of the phase change material contained, and/or a plastic or metal bag, gas-tight and under partial internal vacuum, having a shape maintained by the internal vacuum, the composite body (3) and/or the bag being shaped so as locally to present externally at least one elongated cavity (11) which by itself defines a channel wall (13) suitable for the circulation of a fluid.

Abstract: The invention relates to a method for machining at least one switchgear cabinet including: providing at least one switchgear cabinet which is constructed in several parts and comprises at least one detachably mounted component; disassembling and removing the detachably mounted component from the switch cabinet; machining the disassembled and removed component and providing the machined component for reassembly on the associated switch cabinet; and re-assigning the machined component provided for reassembly to the corresponding control cabinet, wherein the at least one switch cabinet has an individual machine-readable switch cabinet identification and the at least one removably mounted component has an individual machine-readable component identification, which are assigned to one another, wherein re-assigning the component to the switch cabinet comprising machine-reading of the machine-readable identifications and bringing together the component and the switch cabinet which have the mutually assigned iden

Abstract: A heat exchanger, a processing method of a heat exchanger and a composite material, wherein the heat exchanger includes a collecting pipe, a fin and a number of heat exchange tubes. Each of the heat exchange tubes is fixed to the collecting pipe, and an inner cavity of the heat exchange tube is communicated with an inner cavity of the collecting pipe. The fin is retained between two adjacent heat exchange tubes. The heat exchanger further includes a coating layer which is coated on an outer surface of at least one of the collecting pipe, the heat exchange tube and the fin. The coating layer includes micro-nano particles and a polymer obtained by polymerizing monomers including allylic monomers with hydrophilic groups. The micro-nano particles include silicon dioxide and/or titanium dioxide. The coating layer of the heat exchanger has excellent hydrophilic durability.

Abstract: An additively manufactured noise attenuation panel for a structure within an aircraft structure includes a plurality of unit cells, each including a central body interconnected via a plurality of tubes extending from the central body. The noise attenuation panel may include an increasing wall thickness in a desired direction. A layers of unit cells may be manufactured in a twisted orientation with respect to an immediately adjacent layer of unit cells. Layers of unit cells may be manufactured in a rounded or bent orientation with respect to a central axis. The noise attenuation panel may further comprise a disk and a blended transition located at the interface between the disk and an interior surface of a unit cell.

Abstract: Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

Abstract: An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.

Abstract: A transmitter housing of an operating device for devices and installations, such as in particular remote-controlled mobile, industrial or commercial devices and installations, has a housing wall which encloses a receptacle, wherein at least one operating element is mounted on an outer side of the housing wall and control electronics are accommodated in the receptacle, and two retaining elements, which close the receptacle, which are connected to a left-hand end and a right-hand end of the housing wall and therein project beyond the contour of the housing wall on all sides of the latter. Therein it is provided that the retaining elements are produced from an elastomer material at least in a respective contact region with the housing wall.

Abstract: A photovoltaic cooling system includes a cooling module having a local jet flow inlet located in an interior portion of the cooling module directing flow in a vertical direction. A crossflow inlet is located at an inlet edge of the cooling module directing flow across the cooling module. An outlet is located at an outlet edge of the cooling module. A thermoelectric generator is located on the cooling module, and a photovoltaic module is located on the thermoelectric generator.

Abstract: A noise and vibration attenuation panel for a structure within a propulsion system includes a first plurality of unit cells and a first plurality of mass elements disposed within the first plurality of unit cells. The first plurality of unit cells include a first periodic structure having a first unit cell, a second unit cell, a third unit cell, and a fourth unit cell, each of the first unit cell, the second unit cell, the third unit cell and the fourth unit cell including a central body interconnected via a plurality of lateral tubes extending from the central body, the first periodic structure forming a first lateral layer of unit cells. The noise attenuation panel can simultaneously control acoustic waves or energy (i.e., via noise attenuation flow paths) and vibration (i.e., via the mass elements).

Abstract: This technology relates to a system for cooling sensor components. The cooling system may include a sensor which has a sensor housing, a motor, a main vent, and a side vent. Internal sensor components may be positioned within the sensor housing. The motor may be configured to rotate the sensor housing around an axis. The rotation of the sensor housing may pull air into an interior portion of the sensor housing through the main vent, and the air pulled into the interior portion of the sensor housing may be exhausted out of the interior portion of the sensor housing through the side vent.

Abstract: The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the enclosed chamber is filled. The enclosed chamber comprises a first fluid channel and a second fluid channel. The first and second fluid channels extend in the longitudinal direction of the hollow body, are juxtaposed in the width direction of the hollow body and communicated with each other, and an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less. As such, a novel capillary structure which is capable of greatly reducing the entire thickness, enhancing heat transfer efficiency and reducing cost and which is reliable and durable is provided.

Abstract: Methods, systems, and devices for managing coolant in data centers are disclosed. Coolant may be used in data centers to regulate the temperatures of computing devices. The disclosed methods and system may provide for containment of vapor and condensation of the vapor into coolant. The coolant may be used as part of a two phase cooling system to cool the computing devices. The vapor may be generated when the coolant removes heat from computing devices during operation while at least partially submerged in the coolant. A mobile condenser is used for condensing the vapor within the containment.

Abstract: A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.

Abstract: A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5?[(S1?S0)/S0]×100?20 when an area of the thermal conductor in a planar view in a first direction is expressed by S0 [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.

Abstract: A two-phase fluid management system, may include a sealed container and a mobile condenser that moves within the sealed container. The sealed container may include a plurality of input ports, each to receive a two-phase fluid as vapor from a respective one of a plurality of IT enclosures and a plurality of output ports, each to return the two-phase fluid as liquid to the respective one of the plurality of IT enclosures. The mobile condenser may be coupled to or include an actuator to move the mobile condenser to a respective one of a plurality of positions within the sealed container. An air intake and air outlet of the mobile condenser may form a sealed connection with a pair of condenser ports when the mobile condenser moves to the respective one of the plurality of positions.

Abstract: A vehicle air conditioning device executes an air conditioning operation for heating inside of a cabin by causing a refrigerant discharged from a compressor 2 to dissipate heat in a radiator 4, decompressing the refrigerant, and then causing the refrigerant to absorb heat in an outdoor heat exchanger 7, and includes an equipment temperature adjusting device 61 capable of adjusting, using the refrigerant, the temperature of a battery 55 and the temperature of a traveling motor 65, which is a temperature-adjusted object other than the battery, the battery 55 and the traveling motor 65 being mounted on a vehicle. An air conditioning controller has a heating/waste heat recovery mode for cooling the traveling motor 65 without cooling the battery with the refrigerant by controlling the equipment temperature adjusting device 61 in the air conditioning operation for heating the inside of the cabin.

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

Abstract: A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

Abstract: A cooling system for a plurality of heat-generating components in a chassis of an information handling system includes an array of fans, each fan operable to generate an airflow in a range of airflows, and a control system configured to monitor temperatures for the components and adjust a direction of one or more airflows based on the component temperatures. If a component temperature gets too high for a first fan associated with the component to cool the component, a portion of a second airflow generated by a second fan may be directed to provide additional airflow to the component such that the component is cooled without increasing the fan speed of the first fan. Adjacent fan speeds may also be adjusted to reduce losses due to differences between adjacent airflows.

Abstract: Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

Abstract: A holder has a holding body, a spring member, and a tensioning member. The holding body forms a cavity to receive the electronic component. A connecting section has a thermally conductive heat conductive section adjacent to the cavity. The tensioning member tensions the spring member. The spring member supports itself in a tensioned state on a counter-holding member. The spring member moves a connecting surface of the holding body to the cooling body and/or presses it against the cooling body.

Abstract: This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

Abstract: A semiconductor package may include a semiconductor device coupled to a package substrate. The semiconductor package may also include an integrated heat spreader coupled to the package substrate. The semiconductor package may further include a package connector mounted on the integrated heat spreader. According to various examples, a semiconductor system is also described. The semiconductor system may include a first semiconductor package. The first semiconductor package may include a first package connector, and a first integrated heat spreader. The first package connector may be mounted on the first integrated heat spreader. The semiconductor system may also include a second semiconductor package. The second semiconductor package may include a second package connector, and a second integrated heat spreader. The second package connector may be mounted on the second integrated heat spreader. The first package connector may be electrically connected to the second package connector.

Abstract: A system and method for more consistent joule heating of a material blank to a desired temperature. An electrical terminal delivers a current to an end portion of the blank. The terminal has a heat sink effect which would otherwise prevent the end portion from reaching the desired temperature. An active thermal buffer element is interposed between the terminal and the end portion. The buffer element includes a first surface which abuts the end portion and a second surface which abuts the terminal. The buffer element is joule heated with the blank, and a temperature gradient is created across the buffer element such that the first surface is at the desired temperature and the second surface is at a lower temperature due to the heat sink effect of the terminal. The buffer element thereby compensates for the heat sink effect and allows the end portion to reach the desired temperature.

Abstract: A heat transfer device includes a storage chamber, a coolant housed within the storage chamber, a cooling chamber, one or more heat transfer components, a fluid passage between the storage chamber and the cooling chamber, and a barrier element. The one or more heat transfer components facilitate heat transfer from a heat source outside of the cooling chamber to the cooling chamber. The barrier element may have (i) a closed configuration, and (ii) an open configuration in which the barrier element is configured to allow the coolant in the storage chamber to flow from the storage chamber into the cooling chamber. The barrier element may reconfigure from the closed configuration to the open configuration in response to a trigger condition, such as the coolant housed within the storage chamber reaching a trigger temperature and/or the initial pressure of the coolant housed within the storage chamber reaching a trigger pressure.

Abstract: An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

Abstract: A semiconductor device includes an insulating circuit substrate including an insulating plate, a first metal layer formed on a top surface of the insulating plate, and a second metal layer formed on a bottom surface of the insulating plate, a heatsink on whose top surface the insulating circuit substrate is disposed; semiconductor elements disposed on the top surface of the first metal layer through a bonding material, and a case that encloses a perimeter of the insulating circuit substrate and the semiconductor elements. The first metal layer includes circuit patterns electrically connected to the semiconductor elements and an annular pattern formed to enclose the perimeter of the circuit patterns with a gap provided with respect to the circuit patterns. The second metal layer is disposed at a spot that surfaces the annular pattern. The housing is affixed to the annular pattern through an adhesive.

Abstract: An induction charging device for an electrically operated motor vehicle may include an emission protection arrangement and a charging arrangement secured to the emission protection arrangement. The emission protection arrangement may include a metal shield plate. The charging arrangement may include a magnetic plate facing the emission protection arrangement, at least one induction coil disposed in a charging housing, and an active cooling arrangement secured in the charging housing to transfer heat. The magnetic plate may be at least one of (i) at least partially ferrimagnetic and (ii) at least partially ferromagnetic. On a housing bottom side, the charging housing may include at least one cooling recess for the active cooling arrangement. The active cooling arrangement may include at least one cooling duct formed integrally in the cooling recess. The charging arrangement may further include a bottom side cover secured in a fluid-tight manner to the housing bottom side.

Abstract: An integrated device package is disclosed. The integrated device package can include a substrate that has an upper side and a lower side opposite the upper side. The integrated device package can include an integrated device die that is mounted to the lower side of the substrate. The integrated device die has a first side facing the lower side of the substrate and a second side opposite the first side. The package can include a molding material in which the integrated device die is at least partially embedded. The package can include a thermally conductive element coupled to the second side of the integrated device die. At least a portion of the thermally conductive element can be exposed through the molding material. The thermally conductive element can be a heat sink. The package can include an interconnect that is configured to provide an external connection. The interconnect extends at least partially through the molding material from the lower side of the substrate.

Abstract: An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

Abstract: An inspection apparatus configured to inspect a target object includes a placing device configured to place the target object thereon; a heater provided in the placing device and configured to adjust a temperature of the placing device; and a position adjusting mechanism configured to hold the placing device on which the target object is placed, and configured to perform a position adjustment between the target object placed on the placing device and a terminal to be brought into contact with the target object when an inspection of an electrical characteristic is performed. The placing device is configured to be separated from the position adjusting mechanism when the inspection of the electrical characteristic is performed. A heat sink having prominences and depressions is provided at a portion of the placing device except a holding target portion thereof which is to be held by the position adjusting mechanism.

Abstract: A manufacturing method of middle member structure includes steps of applying an external force to a plate body to shape the plate body and form multiple recessed/raised structures and perforating the plate body to form multiple perforations misaligned from the recessed/raised structures so as to achieve a plate body with recessed/raised structures. The middle member structure is applicable to a vapor chamber to enhance the vapor-liquid circulation effect and the support for the internal chamber.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.

Abstract: A cooling assembly includes a primary plate, a secondary plate, and a padding layer. The primary plate includes a body, a first arm, and a second arm. The first arm and the second arm of the primary plate extend outwardly in opposite directions from the body of the primary plate. The secondary plate also includes a body, a first arm, and a second arm. The first arm and the second arm of the secondary plate extend outwardly in opposite directions from the body of the secondary plate. The padding layer is inserted between the primary plate and the secondary plate. The padding layer directly contacts a heat-generating electrical component secured between the primary plate and the secondary plate.

Abstract: A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. The upper housing may be stacked on top of and fastened to the lower housing. The heat transfer apparatus may include a heat exchange interface fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.

Abstract: The present disclosure provides a deposition apparatus, including a first chamber, a second chamber and a third chamber. The first chamber is configured to load a substrate. The second chamber is configured to provide a high temperature environment in which a degas process and a sputtering process are performed on the substrate. The third chamber is provided between the first chamber and the second chamber. The third chamber is configured to transfer the substrate from the first chamber to the second chamber via the third chamber.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

Abstract: The present invention relates to an input/output port mounting unit integrated type display frame for POS equipment, the input/output port mounting unit integrated type display frame (300) for POS equipment comprising: a display panel mounting unit (310), in which a display panel (50) is loaded, formed at a front surface thereof; an input/output port mounting unit (320) formed at a rear surface thereof and having an input/output port mounting hole (322), in which an input/output port (31) provided at a main substrate (30) is inserted and coupled, the input/output port mounting unit having a part cut from an input/output port mounting unit perforation (321) and being formed to be bent towards the rear direction so as to be protruded therefrom; and a lower main ventilation hole (330) formed at a lower side of the rear surface thereof.

Abstract: A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a diverter at the end of the second channel to smooth the flow of air through the second channel and out of one or more orifices. The diverter may be simply formed by shaping the housing of a connector at an end of the cage. The orifices may be formed by channel in the connector housing and openings in surfaces of the cage that bound the second channel or the housing channel.

Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.

Abstract: Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers to a carrier are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.

Abstract: A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.