Electrical Component Patents (Class 165/80.2)
  • Patent number: 10797417
    Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a diverter at the end of the second channel to smooth the flow of air through the second channel and out of one or more orifices. The diverter may be simply formed by shaping the housing of a connector at an end of the cage. The orifices may be formed by channel in the connector housing and openings in surfaces of the cage that bound the second channel or the housing channel.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: October 6, 2020
    Assignee: Amphenol Corporation
    Inventors: Michael Scholeno, Craig W. Clewell
  • Patent number: 10787014
    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: September 29, 2020
    Assignee: Apple Inc.
    Inventors: Lee E. Hooton, Marwan Rammah, James A. Bertin, Stoyan P. Hristov, William A. Counts
  • Patent number: 10777458
    Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 15, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Yoon Ki Sa, Mong Ryong Lee
  • Patent number: 10667429
    Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: May 26, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Shakti Singh Chauhan, Hendrik Pieter Jacobus De Bock, Graham Charles Kirk, Stanton Earl Weaver, Jr., David Shannon Slaton, Tao Deng, Pramod Chamarthy
  • Patent number: 10595393
    Abstract: A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 17, 2020
    Assignee: ALPINE ELECTRONICS, INC.
    Inventors: Makoto Sato, Hiroki Haraguchi
  • Patent number: 10586850
    Abstract: Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers to a carrier are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 10, 2020
    Assignee: RFHIC Corporation
    Inventors: Quentin Diduck, Daniel Francis, Frank Yantis Lowe, Felix Ejeckam
  • Patent number: 10573600
    Abstract: A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: February 25, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: HeeJo Chi, NamJu Cho, JunWoo Myung
  • Patent number: 10566265
    Abstract: An electronics assembly includes a cooling chip structure having a target layer and a jet impingement layer coupled to the target layer. The jet impingement layer has one or more jet channels disposed within the jet impingement layer. Further, one or more through substrate vias are disposed within the jet impingement layer, where the one or more through substrate vias are electrically conductive and are electrically coupled to the target layer. A fluid inlet port and a fluid outlet port are fluidly coupled to the one or more jet channels of the jet impingement layer.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: February 18, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Yuji Fukuoka, Ercan Dede
  • Patent number: 10551580
    Abstract: A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel. Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: February 4, 2020
    Assignee: Molex, LLC
    Inventors: Kent E. Regnier, Jerry D. Kachlic
  • Patent number: 10545547
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 28, 2020
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10524386
    Abstract: A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. The upper housing may be stacked on top of and fastened to the lower housing. The heat transfer apparatus may include a heat exchange interface fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 31, 2019
    Assignee: ARCTIC (HK) Ltd
    Inventors: Vincent Andre, Magnus Huber
  • Patent number: 10511118
    Abstract: A method and apparatus are disclosed herein for managing thermal dissipation in a receptacle assembly. In one embodiment, the receptacle assembly comprises a cage with a front face, a rear face, the front face having a plurality of ports; and a heat transfer unit having a thermal interface disposed with the cage, one or more heat transfer bars coupled, via openings in the cage, to sides of the thermal interface and are external to the cage, and a heat sink coupled to the one or more heat transfer bars, where the heat transfer unit is movable in a vertical direction in response to insertion of a module into one of the plurality of ports.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: December 17, 2019
    Assignee: YAMAICHI ELECTRONICS USA, INC.
    Inventors: Noah Beltran, Takeshi Nishimura
  • Patent number: 10492324
    Abstract: In an electronic device, pairs of fixing jigs are provided on an extraction side of pairs of guide rails and extend in an extraction direction respectively along both ends of a circuit board. The fixing jigs of each pair are disposed on the sides of both surfaces of the circuit board such that their distal ends are spaced at a second interval longer than a first interval. Pairs of jig guiding portions are provided on a faceplate and extend in an insertion direction respectively along both ends of the circuit board. The jig guiding portions of each pair are disposed on the sides of both surfaces of the circuit board such that their distal ends are spaced at a third interval longer than the sum of the second interval and the thicknesses of the distal ends of the pair of fixing jigs.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: November 26, 2019
    Assignee: FANUC CORPORATION
    Inventor: Daisuke Miura
  • Patent number: 10433449
    Abstract: A locking bracket system for a pair of line replaceable modules (LRMs) includes a locking bracket assembly including an expanding member configured to be actuated to expand; and an extension bracket attached to the expanding member. The extension bracket extends from the expanding member in a direction opposite that the expanding member expands. Each of the expanding member and the extension bracket are configured to compress against a LRM to retain the pair of LRMs to a chassis when the expanding member is in an expanded position.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: October 1, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kevin Donald Kilroy, Steven E. Jackson
  • Patent number: 10404309
    Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: September 3, 2019
    Assignee: Intel Corporation
    Inventors: Sankarananda Basak, Joshua Een, David W. Browning
  • Patent number: 10386897
    Abstract: An enclosure for use with a portable electronic device. The enclosure comprises a plurality of connected walls defining surfaces of the enclosure for receiving the electronic device. Power for the electronics components of the enclosure is supplied from an on-board power source (battery) and from an external power source via a port. A thermoelectric cooler, operating in conjunction with a gel pack, cools the electronic device. A first surface of the gel pack is disposed in contact with or proximate the thermoelectric cooler and a second surface of the gel pack is in contact with or proximate the electronic device.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: August 20, 2019
    Inventors: John V. Rivera, Jr., John V. Rivera, Sr.
  • Patent number: 10383254
    Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: August 13, 2019
    Assignee: WISTRON NEWEB CORP.
    Inventors: Hung-Ming Chang, Yi-Yun Chang, Shih-Hong Chen, Babak Radi, Sheng-Hung Tsai
  • Patent number: 10368464
    Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: July 30, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Patent number: 10356962
    Abstract: The invention discloses a power electronic device cooling system, which includes an air conditioning unit, a coolant pump (31), a bypass throttling element (32) and a cooler. The coolant pump (31) takes liquid from a first condenser (13) of the air conditioning unit, a liquid coolant enters the cooler after being throttled by the bypass throttling element (32), the low-temperature coolant cools a power electronic device at the cooler, and the coolant enters an evaporator (11) of the air conditioning unit to finish a cooling cycle after flowing out of the cooler. The power electronic device cooling system has a good cooling effect, and is high in cooling efficiency, small in equipment size and low in noise, and moreover, the power electronic device may be located in a sealed environment and prevented from influence of dust, and is internally clean and long in operation life.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: July 16, 2019
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Hongbo Li, Hua Liu, Zhiping Zhang, Yu Zhou, Huaican Liu
  • Patent number: 10354036
    Abstract: In a model data generation device configured to generate model data of an electronic component to be mounted on a printed board, the model data includes data about terminals to and data about a mounting reference point with respect to the printed board. The mounting reference point of the model data is determined by using first image data about an electronic component captured by a component recognition camera and second image data including information about pads of the printed board that overlap the terminals of the electronic component and information about a mounting position of the electronic component on the printed board.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: July 16, 2019
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Shinichi Okazaki, Tsutomu Nakashima
  • Patent number: 10314207
    Abstract: A power-module assembly includes plates defining pockets and arranged in a stack such that the pockets cooperate to define coolant chambers interleaved with the plates. The assembly further includes cards having a power module encased in a frame. The frame has an outward projecting spacer, and each card is disposed in a corresponding one of the chambers with the spacer contacting a wall of the corresponding chamber to form a coolant passage between the wall and the card.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: June 4, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: Vincent T. Skalski, Serdar Hakki Yonak, Shailesh Shrikant Kozarekar
  • Patent number: 10305151
    Abstract: A battery carrier for accommodating at least one battery for an electric motor vehicle is disclosed having tension spring elements being arranged underneath a base of the battery carrier. The tension spring elements press a temperature adjustment element, which is likewise arranged underneath the base, onto the base, such that heat conduction from the base into the temperature adjustment element takes place.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 28, 2019
    Assignee: BENTELER AUTOMOBILTECHNIK GMBH
    Inventors: Andreas Hitz, Christian Handing, Thomas Olfermann
  • Patent number: 10292293
    Abstract: An electronic apparatus includes an electronic substrate on which an electronic component is mounted, and a cover that retains the electronic substrate, which is inserted along its plate surface direction. An insertion opening, into which the electronic substrate is capable of being inserted, is formed between a second guide part and a first guide part. The first guide part and the second guide part are arranged to be shifted from each other in a planar direction of a tabular flat plate part. The second guide part is located further in an insertion direction, in which the electronic substrate is inserted, than the first guide part.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 14, 2019
    Assignee: DENSO CORPORATION
    Inventor: Masayoshi Kayano
  • Patent number: 10249679
    Abstract: Method of wireless communication between a first device and a second device, in which, the first device and the second device comprising respectively a first thermoelectric generator and a second thermoelectric generator, the two thermoelectric generators being in thermal coupling, a first signal is generated within the first device, the first thermoelectric generator is electrically powered as a function of the first signal so as to create a first thermal gradient in the said first generator and a second thermal gradient in the second generator, and a second signal is generated within the second device on the basis of the electrical energy produced by the second thermoelectric generator in response to the said second thermal gradient.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: April 2, 2019
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Pascal Fornara, Christian Rivero
  • Patent number: 10219394
    Abstract: An apparatus for a vehicle includes an electronic device and an ECU. The electronic device includes a conductive housing that comprises a bottom portion, a PCB that comprises a top layer having circuitry, and a ground layer, the PCB located in the housing, a ground component electronically connected to the ECU and the bottom portion, at least one leg that extends through the PCB and fixes the PCB to the bottom portion, and EMC connectors that connect the circuitry to the bottom portion. At a noise frequency, when there is a noise current at a given location of the circuitry, a first noise impedance from the location to the bottom portion through the EMC connectors is less than a second noise impedance from the location to other locations of the circuitry, and less than a third noise impedance from the location to the bottom portion through the leg.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 26, 2019
    Assignee: Connaught Electronics Ltd.
    Inventors: Sergio Bantiles, Amit Gupta, Fintan McMorrow, John Grimes, Joseph Estremera
  • Patent number: 10201113
    Abstract: The invention concerns a piece of electronic equipment comprising a card (2) provided with an electronic component (3), a radiator (5) having a bottom (6) topped by fins (7), the bottom of the radiator resting on the electronic component, and a cover (8) extending above the radiator providing an air flow around the fins of the radiator, the cover comprising a plurality of flexible blades (11), each applied to an upper edge of at least one of the fins to keep the radiator applied against the component, and the flexible blades (11) have a first end integral with the cover and a second free end applied against the upper edge of the fins. A cooling device with a radiator and a cover for holding the radiator in place.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: February 5, 2019
    Assignee: SAGEMCOM BROADBAND SAS
    Inventors: Stephane Kohn, Herve Lieven
  • Patent number: 10197052
    Abstract: An apparatus may include an enclosure and a variable frequency drive (VFD) assembly disposed within the enclosure, and comprising at least one VFD. The apparatus may also include a heat sink thermally coupled to the VFD assembly, and a fan system disposed adjacent the VFD assembly and including at least one fan arranged to direct air flow to the heat sink and at least one fan to direct air flow from the heat sink.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: February 5, 2019
    Assignee: LITTELFUSE, INC.
    Inventor: Sheldon Felix
  • Patent number: 10178797
    Abstract: Examples are disclosed that relate to cooling multiple heat-generating components in an electronic device. One example provides a cooling module including an airflow channel downstream of a blower to receive a flow of air generated by the blower, a heat sink extending into the airflow channel and configured to direct air toward a first outlet, and an air-diverting structure positioned within a gap between a distal surface of the heat sink and an opposing interior surface of the airflow channel, the air-diverting structure configured to redirect air flowing in the gap toward a second outlet.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: January 8, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Michael Lau, Julia Purtell, Jeffrey Mark Reents
  • Patent number: 10153571
    Abstract: A connector system includes a cage with an intermediate section. The cage support a connector and the resulting connector system includes an upper port and a lower port. A heat sink is provided in the intermediate section that is configured to cool a module inserted into the lower port. Apertures can allow air to flow through the connector system so as to allow for improved cooling by more directly cooling the inserted module. The heat sink can be urged into the lower port by a biasing element.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: December 11, 2018
    Assignee: Molex, LLC
    Inventor: Jerry D. Kachlic
  • Patent number: 10141058
    Abstract: A method of healing a plurality of non-volatile semiconductor memory devices on a multi-chip package is disclosed. The multi-chip package can be heated to a temperature range having a temperature range upper limit value and a temperature range lower limit value. The temperature of the multi-chip package can be kept essentially within the temperature range for a predetermined time period by monitoring a thermal sensing element with a sensing circuit outside of the multi-chip package. The thermal sensing element may be located near the components with the lowest failure temperature to ensure the multi-chip package is not damaged during the healing process.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: November 27, 2018
    Inventor: Darryl G. Walker
  • Patent number: 10121714
    Abstract: A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: November 6, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kousuke Komatsu
  • Patent number: 10114444
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: October 30, 2018
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Patent number: 10116020
    Abstract: A battery pack includes: energy storage devices arranged with a gap which is formed between the energy storage devices for passing a fluid; a case configured to accommodate the energy storage devices; a first duct disposed in an inside of the case and defining a supply flow passage through which the fluid is supplied to the gap; and a second duct disposed in the inside of the case and defining a discharge flow passage through which the fluid which has passed through the gap is discharged, wherein an auxiliary flow passage where the fluid flows along an outer surface of the first duct is formed, and the fluid is made to flow through the supply flow passage and the auxiliary flow passage at a same time.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: October 30, 2018
    Assignee: GS YUASA INTERNATIONAL LTD.
    Inventors: Yosuke Nishimura, Hiroaki Kakimura
  • Patent number: 10109936
    Abstract: An electronic device includes a press-fit terminal, an electronic component and a substrate. The substrate includes a first through hole, a second through hole and an inlay. The press-fit terminal is press-fitted in the first through hole. The second through hole is located between the first through hole and a part of the substrate at which the electronic component is mounted. The inlay is made of a metal material and press-fitted in the second through hole. The inlay restricts a strain in the substrate and restricts decrease of a holding force of the substrate holding the press-fit terminal.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: October 23, 2018
    Assignee: DENSO CORPORATION
    Inventor: Takumi Shiomi
  • Patent number: 10085360
    Abstract: A heat sink assembly includes a casing having an opening, a main board accommodated in the casing, a heat sink mounted on the main board, an electrical connector mounted on the main board and exposed in the opening, a mating connector located outside the casing and connected to the electrical connector through the opening in a plugging manner, and a heat conductor, disposed inside the casing. The mating connector has a chip that is electrically connected to the electrical connector. One end of the heat conductor is connected to the heat sink, and the other end of the heat conductor is thermally connected to the electrical connector or the mating connector, so that heat generated by the chip during working can be transferred to the heat sink through the heat conductor, thereby reducing a temperature of the mating connector.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: September 25, 2018
    Assignee: LINTES TECHNOLOGY CO., LTD
    Inventor: Ted Ju
  • Patent number: 10030916
    Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: July 24, 2018
    Assignee: Intel Corporation
    Inventors: Phi Hung Thanh, Paul J. Diglio, John C. Johnson, Jarett L. Rinaldi, Arnab Choudhury
  • Patent number: 10021813
    Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: July 10, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Yuan-Yi Lin, Yen-Lin Chu
  • Patent number: 10012447
    Abstract: Methods and apparatus for storing thermal energy are disclosed. The thermal energy may be hot or cold. The methods and apparatus allow the thermal store to be charged and discharged at different rates. The methods and apparatus also allow the thermal store to be charged and discharged with multiple and/or interrupted phases.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: July 3, 2018
    Assignee: Highview Enterprises Limited
    Inventors: Robert Morgan, Michael Dearman
  • Patent number: 10008670
    Abstract: A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: June 26, 2018
    Assignee: JOLED, Inc.
    Inventors: Kenichi Izumi, Keisuke Shimokawa, Shin Akasaka, Hiroyuki Abe, Shinpei Irie, Takatoshi Saito
  • Patent number: 9989321
    Abstract: A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: June 5, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Yuan-Yi Lin
  • Patent number: 9961796
    Abstract: A server includes a casing, a fan module, at least two processor holders and an air baffle. The casing has an accommodating space. The fan module is located in the accommodating space. The processor holders are located in the accommodating space. The air baffle includes a base and an airflow guiding member. The airflow guiding member is pivoted on the base. The airflow guiding member is shiftable among a plurality of air guiding positions. A processor module is mounted on one of the processor holders, and the base is mounted on the other processor holder. The airflow guiding member is at one of the air guiding positions in order to guide airflow from an air outlet side of the fan module.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: May 1, 2018
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ping-Wei Peng, Wen-Long Huang
  • Patent number: 9953890
    Abstract: A semiconductor device includes an insulating substrate on which semiconductor elements are mounted and a surrounding case in which the insulating substrate is housed. Two terminal conductors, both ends of each of which are fixed in sidewalls of the surrounding case, are provided between the sidewalls, and connection terminals protruding toward the insulating substrate side are provided on the respective terminal conductors. The connection terminals and a conductive foil on the insulating substrate are soldered together. Insulating blocks for keeping the distance between the adjacent terminal conductors at a fixed distance or greater are provided in the vicinity of the central portion of the terminal conductor. The insulating blocks suppress the terminal conductor being deformed by being thermally expanded when soldering. Because of this, it is possible to stabilize solderability, and it is possible to prevent an occurrence of defective connection.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: April 24, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hideaki Takahashi
  • Patent number: 9947607
    Abstract: An inverter includes: an inverter circuit including: a power semiconductor module; and an inverter circuit module including a passive component; a cooler including a cooler surface to which the power semiconductor module is joined; an inverter case sealing the inverter circuit with the cooler surface of the cooler; and a sealed heat insulating layer being formed on the cooler surface of the cooler and having a thickness that is equal to or less than a maximum convection suppressing distance.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: April 17, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kohei Matsui
  • Patent number: 9928925
    Abstract: A method of healing a plurality of non-volatile semiconductor memory devices on a multi-chip package is disclosed. The multi-chip package can be heated to a temperature range having a temperature range upper limit value and a temperature range lower limit value. The temperature of the multi-chip package can be kept essentially within the temperature range for a predetermined time period by monitoring a thermal sensing element with a sensing circuit outside of the multi-chip package. The thermal sensing element may be located near the components with the lowest failure temperature to ensure the multi-chip package is not damaged during the healing process.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: March 27, 2018
    Inventor: Darryl G. Walker
  • Patent number: 9929669
    Abstract: Disclosed herein is an inverter. The inverter includes a base provided with a heat dissipation part, a main board disposed on the base to output an input power along an independent power flow through a rectification part and a inverter part, and a control board fixed to be electrically connected to the main board to form a flow of a secondary power and a flow of an electrical signal, the flow of the secondary power and the flow of the electrical signal being independent from each other.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: March 27, 2018
    Assignee: LSIS CO., LTD.
    Inventors: Deok-Young Lim, Chun-Suk Yang
  • Patent number: 9907154
    Abstract: A display apparatus and an electronic apparatus including a heat sink assembly coupled to a printed circuit board (PCB) is disclosed. The display apparatus and the electronic apparatus include a PCB having a plurality of electronic components, a heat sink assembly coupled to the PCB, and a coupling member which couples the heat sink assembly and the PCB, wherein the coupling member includes a flexible metallic material and is oriented to elastically support the PCB and the heat sink assembly.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Woo Su Roh
  • Patent number: 9907207
    Abstract: A liquid-cooling heat dissipating module includes a water-cooling radiator, a water-cooling head and an external pump. The water-cooling radiator includes a radiator inner channel, a radiator outlet tube and a radiator inlet tube. The water-cooling head assembly includes a water-cooling head and a bracket. The water-cooling head includes a first chamber, a head inlet and a head outlet. The head outlet is connected with the radiator inlet tube. The bracket is contacted with the water-cooling head. The external pump is contacted with the water-cooling head assembly. The external pump includes a second chamber, a pump inlet, a pump outlet and a pump tube. Two ends of the pump tube are connected with the pump outlet and the head inlet, respectively. The radiator inner channel, the radiator outlet tube, the radiator inlet tube, the first chamber, the pump tube and the second chamber are in fluid communication.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: February 27, 2018
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: An-Chih Wu, Mu-Shu Fan, Chien-Yu Chen
  • Patent number: 9883579
    Abstract: A package structure includes a circuit substrate, first and second build-up circuit structures, and a plurality of piezoelectric heat dissipation units. The circuit substrate includes a core layer, a plurality of electronic devices, and a conducting unit. The electronic devices are embedded in the core layer, and active surfaces of the two adjacent electronic devices respectively face a first surface and a second surface of the core layer. The conducting unit is disposed on the core layer and electrically connected to the electronic devices. The first and second build-up circuit structures are respectively disposed on the first and the second surfaces and respectively have at least one first and at least one second openings. The piezoelectric heat dissipation units respectively correspond to the active surfaces of the electronic devices and are electrically connected to the conducting unit exposed by the first and the second openings.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: January 30, 2018
    Assignee: Unimicron Technology Corp.
    Inventor: Hsiang-Hung Huang
  • Patent number: 9877418
    Abstract: In a motor drive device of the present invention, a motor control unit is disposed on a first surface of an attaching unit, and a heat sink is disposed on a second surface opposite to the first surface. A first duct connects the second surface and the heat sink with each other. A second duct is disposed on the first surface, and a fan motor is disposed in the second duct. A space inside the first duct in communication with only a second opening of the attaching unit, and a space inside the second duct is in communication with both a first opening and the second opening of the attaching unit.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: January 23, 2018
    Assignee: FANUC CORPORATION
    Inventors: Genzo Naito, Kazuhiro Yamamoto
  • Patent number: 9867313
    Abstract: According to one embodiment, a transmitter includes a housing, an internal member, a first unit, and a second unit. The internal member is fixed to the housing. The internal member forms a first area and a second area inside the housing. The first area communicates with an outside of the housing. The second area is liquid-tightly partitioned from the first area. The first unit is in the housing. The first unit includes a first heat sink and a first circuit. The first heat sink is at least partially in the first area. The first circuit is in the second area. The second unit is in the housing. The second unit includes a second heat sink and a second circuit. The second heat sink is at least partially in the first area and facing the first heat sink. The second circuit is in the second area.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: January 9, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Shinichi Kuwahara