Abstract: A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.

Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

Abstract: A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: A temperature control device for temperature control of a component is provided, whereby the component is in an electrical and/or an electronic component, having a tube and a housing element, whereby a first fluid can flow through the tube and a second fluid can flow around the temperature control device. The housing element is formed by a cup-like cover, which is connected to the tube and forms a receiving area for the component in which the component is taken up.

Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: A heat dissipating module is adapted for dissipating thermal energy from an electronic element mounted on a circuit board, and includes a heat sink, a heat conductive board including a plurality of tube portions that extend through the circuit board, a heat conductive tube that interconnects the heat sink and the circuit board, and a plurality of fixing elements. Each fixing elements includes a first end part be secured to the heat conductive board, a second end part exposed from an end opening of a respective tube portion, and a pair of interference parts that extend resiliently, respectively and outwardly through lateral openings of the respective the tube portion for abutting against the circuit board. The heat dissipating module further includes a resilient unit disposed between and connected resiliently to the circuit board and the heat conductive board.

Abstract: An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end pivotally mounted to the first retainer and another end capable of locked by the first retainer. The second retainer is integral formed with an elastic plate. The first retainer and the second retainer are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device.

Abstract: An electronic device includes a motherboard, a heat-generation element mounted on the motherboard, a heat sink attached on the heat-generation element, and an air duct located on the motherboard and covering the heat sink. The air duct includes a main body and an air baffle detachably mounted to the main body. The main body includes a top board, and a first side board and a second side board extending down from two opposite sides of the top board. The top board defines an opening adjacent to the second side board. The air baffle is detachably inserted into the opening.

Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.

Abstract: A heat sink for cooling a device mounted on a mount board, the heat sink having a plurality of grooves at different heights in a surface opposite a surface in contact with the device.

Abstract: A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.

Abstract: A connection arm couples to a cooling fan main body to enclose wires extending from the main body to an end of the connection arm that holds a plug of the wires in a position aligned with a circuit board cooling fan socket. Wires enclosed in the connection arm slip through a slot along the side of the connection arm and are protected from view by a cable cover disposed along the top surface of the cooling fan and connection arm.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A heat sinking device for a component mounted on an electronic circuit board, including: a hollow body, of straight cylindrical or prismatic form, including a first material, arranged vertically on top of the electronic circuit board, the useful volume of the body including at least the component, a resin including a second material, at least partially filling the internal volume of the body so as to contain the component. The heat sinking device can be arranged on an insulating separator element, the resin can be introduced in the liquid state.

Abstract: An air duct includes a first duct. The first duct includes a first top board, two first sidewalls connected to opposite sides of the first top board, and a side cover. One of the first sidewalls defines an cutout. The side cover is rotatably connected to the first sidewall to cover or open the cutout.

Abstract: A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board.

Abstract: A low noise amplifier device for receiving a radio frequency signal from a satellite contains an amplifier kept in a sealed chamber in a cryostat, and a cryogenic cooler mounted on the outside of the cryostat. The amplifier is: maintained in the sealed chamber attached to a cold finger of the cryogenic cooler, made of a material with good heat conductivity and without direct contact with the wall of the cryostat; connected to the input and output coupler, each traversing the wall of the cryostat; functional at room temperature and at least one cryogenic temperature well below room temperature; and the sealed chamber of the cryostat contains a gas at a pressure between a pressure close to the pressure outside the cryostat and 0.1 millibar.

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: A manufacturing method of heat conductive device for an LED has steps of forming a heat sink and an engagement recess in the heat sink by cold forge, punching a heat-conducting disc to form an LED carrier having a mounting portion and a heat-conducting wall formed around the mounting portion, soldering multiple LEDs on the LED carrier, and heating the heat sink to thermally expand the heat sink and assembling the LED carrier and the heat sink so that the heat-conducting wall is assembled with the engagement recess and further chilling the heat sink to thermally retract and tightly hold the LED carrier. The manufacturing method increases contact area and reduces air gaps between the LED carrier and the heat sink to effectively enhance the heat-conducting efficiency of the LED carrier so that the LEDs are operated at a suitable operating temperature to secure a prolonged life duration.

Abstract: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.

Abstract: A device for cooling components, comprising a housing in which a cavity is formed, in which a phase-change material is accommodated, the housing having at least one surface, which is able to be brought into contact with the component to be cooled, and at least one heat-dissipating surface. The cavity accommodating the phase-change material is enclosed by at least one coil, and the phase-change material includes ferromagnetic or magnetizable particles. Furthermore a method for cooling a component using the device is described.

Abstract: A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage.

Abstract: A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play.

Abstract: The object of the invention is a battery-operated welding and/or cutting device including a frame and at least one battery cell. The frame includes a cooling profile having an outer surface, which is in direct contact with the air surrounding the device. The cooling profile is provided to accommodate at least one battery cell, such that the cooling profile at least partly surrounds the battery cell in order to conduct heat from the battery cell to the cooling profile and, via the outer surface of the cooling profile, away from the device. The object of the invention is also a cooling profile.

Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment.

Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

Abstract: A device for selectively clamping an electronic module to a heat sink comprising a frame and a camshaft rotatably attached to the frame. The camshaft comprises at least one cam lobe arranged thereon for selectively applying a clamping force on the electronic module in a direction generally normal to the heat sink.

Abstract: The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device.

Abstract: A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes an outer housing, a heat dissipation fin array, a retaining wall, an impeller and a rotation-driving device. The outer housing includes an axial air inlet, an axial air outlet and a radial air outlet. The heat dissipation fin array is located at an inner wall of the radial air outlet. The retaining wall is located on a flat wall of the outer housing on which the axial air outlet is located. The retaining wall is in contact with an inner wall of an electronic device to collectively form a circulation channel so as to guide airflows output from the axial air outlet through the flat wall with which the heat dissipation fin array is aligned, and into the axial air inlet. The heat pipe is in contact with the heat dissipation fin array.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module.

Abstract: An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

Abstract: A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.

Abstract: An example system may include racks that house slots, in which devices may be stored for testing. Cold air from a cold atrium is drawn over the slots and expelled into a warm atrium. The resulting warm air is cooled and then recycled back through the slots to control slot temperature.

Abstract: The invention relates to an electric cabinet (1) comprising a front part and a rear part and designed to receive electric functional units (2a), said electric cabinet (1) also comprising a separating partition (20) delineating: a first cold thermal area formed by a first space (E1) located at the front part of the cabinet, and a second hot thermal area formed by a second space (E2) located at the rear part of the cabinet. The electric cabinet (1) comprises a cooling and regulating device of the temperature of the first and second spaces E1, E2, said device comprising: a cooling source (100) positioned in contact with the first space (E1) to cool the latter; heat exchange means (40) enabling cold air to flow between the first space (E1) and the second space (E2).

Abstract: A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.

Abstract: A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to the board, to the object to be cooled and a second rotary position to guide a cooling air, flowing from a second direction to the board, to the object to be cooled, and an arm to be movably attached to the board and also to be rotatably coupled to a rotary end of the baffle plate to displace the baffle plate to the first rotary position and the second rotary position with movement.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power semiconductor that can be actuated for switching between at least two states; a substrate having thermomechanical properties compatible with the power semiconductor on which the power semiconductor is disposed on one side; a bus bar disposed on the other side of the substrate for conducting the current, wherein the substrate and the bus bar are coupled to each other such that a heat-conductive connection is provided so that heat can be dissipated from the power semiconductor to the bus bar.

Abstract: An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip.