Liquid Cooled Patents (Class 165/80.4)
  • Patent number: 11229114
    Abstract: This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: January 18, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Jun Eto
  • Patent number: 11224147
    Abstract: A switch of an inverter module is disposed in a coolant channel, is configured to be immersed in coolant in the coolant channel, and includes: a first terminal disposed on a first plane and configured to connect to a direct current (DC) reference potential; a second terminal disposed on a second plane and configured to connect to an alternating current (AC) reference potential; a gate, an emitter, and a collector; first cooling features that extend away from the first and second planes, that directly contact the first terminal, and that are configured to allow coolant flow therethrough; and second cooling features that extend away from the first cooling features, the first plane, and the second plane, that directly contact the second terminal, and that are configured to allow coolant flow therethrough.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: January 11, 2022
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Chih-hung Yen, Goro Tamai, Konstantinos Triantos, David R. Clark, Tim M. Grewe
  • Patent number: 11207629
    Abstract: Filter systems, filters, and methods of managing filter systems are provided. The filter systems utilize large filters that are too large to be manually handled by service personnel. As such, the filter systems and methods utilize filter positioning units for handling the filters during maintenance intervals. Some systems include sensor for remotely monitoring the status of the filters and the information can be used to reverse pulse the filters as well as to indicate the end of the service life of the filters. The filters can be refurbished with new filter media.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: December 28, 2021
    Assignee: Parker-Hannifin Corporation
    Inventors: Thomas B. Green, Jason LaMarr Tate, Leonard R. Castellano, Stephen David Hiner, Ryan Margate Pastrana
  • Patent number: 11204203
    Abstract: Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: December 21, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Jin Kim, Chuljae Jung, Jonghyun Lim
  • Patent number: 11194371
    Abstract: A liquid cooling system is disclosed herein. The liquid cooling system contains one or more elements or components which provide for liquid cooling of heated or electronic environments, requiring heat dissipation. The liquid cooling system provides for creating a single looped assembly, which provides for a single-block system to cool all heat-producing components in an environment, which eliminates required fittings to complete the liquid cooling loop.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: December 7, 2021
    Inventor: Joe Robey
  • Patent number: 11191192
    Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 30, 2021
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Takeuchi, Ryota Tanabe
  • Patent number: 11168949
    Abstract: A substantially planar heat exchanger for regulating the temperature of objects using a fluid coolant includes a bottom plate, a top plate, a fin insert sealed therebetween and a coolant inlet and outlet. The fin insert may include a plurality of substantially flattened omega-shaped or teardrop-shaped fins, which enhances the transfer of heat from the top and/or bottom plates into the fin insert. The omega-shaped fin inserts enhance the contact surface area between the plates and the insert to improve thermal migration therebetween. The fin insert may be constructed, for example, by forming convolutions in a sheet of metal, and compressing the convolutions laterally inwardly and vertically inwardly.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: November 9, 2021
    Assignee: Senior UK Limited
    Inventors: Thomas Carney, Ryan Thomas Collins, Brian Thomas Costello, Palemon Santiago Herrera, John Joseph Feidt, III
  • Patent number: 11158562
    Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: October 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: David J. Lewison, Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti
  • Patent number: 11160191
    Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: October 26, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Patent number: 11153983
    Abstract: A power control unit is disposed on a transaxle case and includes: a plurality of semiconductor devices; an electronic circuit board including a soldered portion for attaching the plurality of semiconductor devices; and a PCU case formed to house the plurality of semiconductor devices and the electronic circuit board. The PCU case includes a support member to which the plurality of semiconductor devices are attached, and an upper cover forming at least a part of an upper surface of the PCU case. The upper cover includes a first component and one or more second components having a lower rigidity than the first component. The electronic circuit board is attached to the first component. The soldered portion is arranged on a surface of the electronic circuit board on the upper cover side. At least one of the one or more second components is arranged to cover the soldered portion.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 19, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Naoki Marukawa
  • Patent number: 11149937
    Abstract: Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: October 19, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Yuqing Zhou, Ercan Mehmet Dede
  • Patent number: 11129306
    Abstract: A fluid distribution apparatus and a fluid distribution module with choke are provided. The fluid distribution apparatus includes a first fluid conveying pipe, a second fluid conveying pipe, multiple fluid manifolds located between the first fluid conveying pipe and the second fluid conveying pipe and connected with the first fluid conveying pipe and the second fluid conveying pipe, an inlet disposed on a side of the first fluid conveying pipe and between both ends of the first fluid conveying pipe; and an outlet disposed on a side of the second fluid conveying pipe and set corresponding to a position where the inlet is set. The fluid is supplied from the inlet to the first fluid conveying pipe, and the fluid is conveyed to the fluid manifolds along the first fluid conveying pipe, and flows into the second fluid conveying pipe through the fluid manifolds and flows out from the outlet.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: September 21, 2021
    Assignee: Wistron Corporation
    Inventors: Hua Chen, Sheng-Yen Lin
  • Patent number: 11121061
    Abstract: Embodiments described herein generally relate to an electronics assembly that includes a semiconductor device, a substrate layer, a first mesh layer and a second mesh layer. Jet channels that have a first inner diameter are disposed within the substrate layer. The first mesh layer includes a first plurality of pores that have a perimeter opening. The second mesh layer includes a second plurality of pores that have a second inner diameter. The jet channels, the first and the second plurality of pores are concentric to create a fluid path for a fluid to impinge a first device surface of the semiconductor device. The second inner diameter is smaller than the perimeter opening and the first inner diameter of the substrate layer such that a cooling fluid velocity increases when flowing from the substrate layer through the second mesh layer.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: September 14, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Naoya Take
  • Patent number: 11121060
    Abstract: An electronics assembly includes a semiconductor device having a first device surface and at least one device conductive layer disposed directly thereon. A cooling structure coupled to the semiconductor device includes a manifold layer, a microchannel layer bonded to the manifold layer, at least one planar side cooling structure, and one or more cooling structure conductive layers. The manifold layer includes a fluid inlet and a fluid outlet and defines a first cooling structure surface. The microchannel layer comprises at least one microchannel fluidly coupled to the fluid inlet and the fluid outlet and defines a second cooling structure surface opposite from the first cooling structure surface. The planar side cooling structure surface is transverse to the first and the second cooling structure surfaces. The cooling structure conductive layers are disposed directly on the first cooling structure surface, the second cooling structure surface, and the planar side cooling structure surface.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 14, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventor: Yuji Fukuoka
  • Patent number: 11121058
    Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: September 14, 2021
    Assignee: Aptiv Technologies Limited
    Inventors: Scott D. Brandenburg, David W. Zimmerman
  • Patent number: 11122704
    Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: September 14, 2021
    Assignee: LiquidCool Solutions, Inc.
    Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
  • Patent number: 11092385
    Abstract: A complex vapor chamber structure includes a main body and at least one tubular body. The main body has a first chamber, a first opening and a second opening. A first capillary structure is disposed in the first chamber. A working fluid is filled in the first chamber. The first and second openings pass through one face of the main body to communicate with the first chamber. The tubular body has a first end, a second end and a passage. The first and second ends are respectively correspondingly inserted in the first and second openings, whereby the passage of the tubular body communicates with the first chamber via the first and second ends to form a loop for vapor-liquid circulation.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 17, 2021
    Assignee: Asia Vital Components (China) Co., Ltd.
    Inventors: Xue-Hui Liu, Jiu-Ming Chen, Jian-Wu Yin
  • Patent number: 11089702
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 10, 2021
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
  • Patent number: 11084077
    Abstract: The present disclosure relates to a tube structure comprising an inner tube of metal and an outer tube of metal, wherein the inner tube extends in the outer tube, and wherein either the inner tube and the outer tube are mechanically tight fitted over the entire length of the inner tube, at least one space in a radial direction of the tube structure in the form of a groove extends at least in an outer surface of the inner tube or in an inner surface of the outer tube, and the at least one space extends in a longitudinal direction of the inner tube and over an entire longitudinal extension of the inner tube, or a spacer tube is located between the inner tube and the outer tube, the inner tube, the outer tube and the spacer tube are mechanically tight fitted over the entire length of the spacer tube, the spacer tube comprises at least one space in the form a slit extending in a radial direction of the tube structure from an outer surface of the inner tube to an inner surface of the outer tube, the at least one s
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: August 10, 2021
    Assignee: Sandvik Intellectual Property AB
    Inventor: Erika Hedblom
  • Patent number: 11085708
    Abstract: A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: August 10, 2021
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Phillip V. Mann
  • Patent number: 11076505
    Abstract: According to one embodiment, an edge cooling system with an IT container having an edge device partially submerged within a liquid coolant. The device generates heat that is transferred into liquid coolant thereby causing the liquid coolant to vaporize into vapor. The system includes a condenser that condenses vapor into liquid coolant, a vapor buffer configured to buffer and provide vapor to the condenser, a liquid accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT container, a main liquid supply line that couples the condenser and IT container to the liquid accumulator, and a main vapor return line that couples the condenser and IT container to the vapor buffer to create a heat exchanging loop. The system design includes the liquid accumulator and vapor buffer, and functions multiple cooling modes including a supplemental cooling. Each of the components are fully enclosed within an edge container.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: July 27, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11061450
    Abstract: A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: July 13, 2021
    Assignee: COOLER MASTER DEVELOPMENT CORPORATION
    Inventors: Shui-Fa Tsai, Fu-Lung Lin
  • Patent number: 11060803
    Abstract: Device for heat transfer between a first fluid and one second fluid includes a housing with first housing element, second housing element and heat transfer element. Housing is developed with a first connecting fitting and a second connecting fitting for each fluid. Heat transfer element is disposed in a volume completely enclosed in a housing and is developed for through-conduction of the first fluid. Housing is developed for conduction of the second fluid about the heat transfer element. Connecting fittings for second fluid are either disposed on the first housing element and the connecting fittings for the first fluid are disposed on the second housing element, wherein within the second housing at least one flow path for conducting the first fluid is implemented which extends between a connecting fitting and a collector region or the connecting fittings for the fluids are disposed on the first housing element.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 13, 2021
    Assignee: Hanon Systems
    Inventors: Petr Kolder, Martin Bohac, Martin Sopuch, Milan Chytrý, Leo Somhorst
  • Patent number: 11060780
    Abstract: Provided are: ice which has excellent cooling capacity; a production method therefor; a method for producing a cooled article; and a refrigerant. Also provided are: ice in a non-separating state; and a production method therefor and ice which satisfies conditions (a) and (b) and is from a liquid that includes an aqueous solution comprising a solute. (a) The temperature of the ice after melting completely is less than 0° C. (b) The rate of change of the solute concentration in the aqueous solution generated from the ice in the melting process is 30% or lower. The refrigerant includes the ice. The refrigerant also includes water which comprises the same solute as the solute included in the ice, wherein the ratio of the concentration of the solute in the ice and the concentration of the solute in the water is preferably 75:25 to 20:80.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: July 13, 2021
    Assignee: BLANCTEC CO., LTD.
    Inventors: Yoshio Hirokane, Tadao Izutsu
  • Patent number: 11044830
    Abstract: A loop heat pipe includes an evaporator configured to evaporate a liquid phase working fluid to generate vapor, the evaporator including first and second inner surfaces that face each other; a comb-like porous body including a plurality of comb teeth, the comb-like porous body being disposed inside the evaporator; a plurality of grooves disposed on one of the first inner surface and second inner surface so as to overlap the plurality of comb teeth; a vapor transport line configured to transport the vapor of the working fluid; a condenser configured to liquefy the vapor of the working fluid; and a liquid transport line configured to transport the liquified vapor as a liquid phase working fluid, wherein each of the liquid transport line and the vapor transport line connects the evaporator and the condenser, such that the vapor transport line and the liquid transport line form a loop-like flow passage.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: June 22, 2021
    Assignee: FUJITSU LIMITED
    Inventor: Takeshi Shioga
  • Patent number: 11018076
    Abstract: A semiconductor module is provided, where a coolant circulation portion of a cooling apparatus has a first coolant flow channel and a second coolant flow channel arranged so as to sandwich therebetween a fin region in which a cooling fin is provided, and each having two ends in a longitudinal direction, a casing portion of the cooling apparatus includes a first opening provided on an end side corresponding to a first end of the first coolant flow channel and a second opening provided on an end side corresponding to a second end of the second coolant flow channel, the second end and the first end are arranged on the same side of the casing portion, and the first coolant flow channel and the second coolant flow channel are each at least partly provided below the cooling fin.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: May 25, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Nobuhide Arai
  • Patent number: 11019752
    Abstract: In one embodiment, a cooling module includes a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from an external cooling fluid source, a fluid return channel disposed on the base frame to return the cooling fluid, multiple cold plates disposed on the base frame, wherein the cold plates are to be attached to a plurality of data processing modules. The cooling module also includes multiple distribution channels to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the heat generating modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel. The base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: May 25, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11006549
    Abstract: A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: May 11, 2021
    Assignee: General Electric Company
    Inventors: Brian Magann Rush, Corey Bourassa, Lana Osusky, Karthik Bodla, Hendrik Pieter Jacobus de Bock, Naveenan Thiagarajan
  • Patent number: 10985088
    Abstract: The present invention concerns a system comprising at least one power module comprising at least one power die that is cooled by a liquid cooled system, the liquid cooled system is arranged to provide at least one electric potential to each power dies of the power module, characterized in that the liquid cooled system is composed of a first and a second current-carrying bars connected together by an electrically non-conductive pipe, the first bar is placed on the top of the power module and provides a first electric potential to the power die and the second bar is placed on the bottom of the power module and provides a second electric potential to the power dies and the liquid coolant is electrically conductive and the channels surfaces are covered by an electrical insulation layer.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 20, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Roberto Mrad, Stefan Mollov, Jeffrey Ewanchuk
  • Patent number: 10976062
    Abstract: A cooling device for air conditioner circuit board includes a compressor, an outdoor heat exchanger, a gas-liquid separator, and an indoor heat exchanger which are connected in sequence. A gas outlet end of the gas-liquid separator is communicatively coupled with a gas suction port of the compressor through a cooling pipeline, and a cooling equipment for cooling the air conditioner circuit board is provided on the cooling pipeline.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 13, 2021
    Assignee: Qingdao Haier Air Conditioner General Corp., Ltd.
    Inventors: Fei Wang, Baohua Gao, Yu Fu, Mingjie Zhang
  • Patent number: 10971431
    Abstract: A semiconductor device includes: a first cooling device including a plurality of first flow channels through which a fluid flows, between a first main surface and a second main surface opposed to each other; a second cooling device including a plurality of second flow channels through which a fluid flows, between a third main surface and a fourth main surface parallel to the first main surface; a semiconductor element interposed between the first main surface and the third main surface facing each other; and a control terminal penetrating from the third main surface to the fourth main surface in a terminal-penetrating region defined at a predetermined position between the plurality of second flow channels, and electrically connected to a control electrode of the semiconductor element.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 6, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kohei Yamauchi, Hiromichi Gohara, Katsumi Taniguchi
  • Patent number: 10973154
    Abstract: Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Tong W. Chao, Prabhakar Subrahmanyam
  • Patent number: 10966352
    Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: March 30, 2021
    Assignee: Google LLC
    Inventors: Madhusudan Krishnan Iyengar, Jorge Padilla
  • Patent number: 10954814
    Abstract: A cooling system with a thin walled cooling plate. The system includes an enclosure with a cover that defines an interior space and that has an open side. Temperature sensitive devices are contained in the interior space. A cooling plate closes the open side and includes an inner side with a surface that is substantially flat and that faces into the interior. The cooling plate defines a flow channel adjacent the inner side that is configured to channel a circulating fluid to remove heat from the interior space. The flow channel extends across substantially all of the opening. An outer side of the cooling plate may be anodized to block heat from entering the interior space through the cooling plate.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 23, 2021
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventor: Shawn Alstad
  • Patent number: 10943850
    Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 9, 2021
    Assignee: Frore Systems Inc.
    Inventors: Suryaprakash Ganti, Seshagiri Rao Madhavapeddy
  • Patent number: 10936029
    Abstract: A method for cooling a heat source by liquefied gas is provided, wherein the heat source is cooled by filling a liquefied gas into a chamber close to the heat source, and the heat source is located in an electronic device. The temperature of the heat source is detected, and the liquefied gas is filled into the chamber via an inlet valve to absorb heat generated by the heat source when the temperature of the heat source rises to a first value. Specifically, an exhaust valve that communicates with the chamber is opened when the temperature of the heat source decreases and then rises to a second value or the pressure inside the chamber reaches a critical value, so that the liquefied gas in the chamber can be vaporized and discharged through the exhaust valve to an atmospheric environment.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: March 2, 2021
    Assignee: ACER INCORPORATED
    Inventors: Yi-Mu Chang, Ching-Piao Kuan, Fu-Sheng Teng
  • Patent number: 10931028
    Abstract: An antenna comprises at least one cold plate serving as main mechanical structure and a set of transmission and reception modules, the modules supplied with electrical power by an electrical power distribution circuit connected to a power source delivering a power supply voltage, the distribution circuit formed by conductive tracks deposited by plasma spraying on the cold plate and crossing the cold plate to reach connection points to the transmission and reception modules.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: February 23, 2021
    Assignee: THALES
    Inventors: Franck Vouzelaud, Jean-Luc Fauquembergue
  • Patent number: 10932391
    Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: February 23, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Patent number: 10927632
    Abstract: Downhole wire routing apparatus including a tubular body having an outer circumferential surface and a central bore extending along a longitudinal axis. The tubular body includes one or more channels, capable of receiving one or more wires, disposed within the tubular body between the central bore and outer circumferential surface. Method and system for routing wires to one or more downhole tools.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: February 23, 2021
    Assignee: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Shao Hwa Lee, Hong Jin Lau, Mark S. Holly
  • Patent number: 10925190
    Abstract: An electronic rack includes a rack manifold having a rack liquid supply line and a rack liquid return line, and server blades arranged in a stack. Each server blade includes cold plates and a server liquid distribution loop, and a leak detector configured to detect leaking of the cooling liquid distributed to the server blade. The electronic rack further includes server FCDs corresponding to the server blades and an RMC unit coupled to the server FCDs and leak detectors of the server blades. In one embodiment, in response to a signal received from a first leak detector of the first server blade indicating that there is a leak within the first server blade, the RMC unit is configured to transmit a control signal to the first server FCD to reduce an amount of cooling liquid to be distributed to the first server blade or bypass the liquid completely.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: February 16, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10905028
    Abstract: A cold plate is provided and includes fins defining first channels, a plenum adjacent to an upstream end of each of the first channels, a lid, ribs and a blocking element. The lid defines an inlet fluidly communicative with the plenum. The ribs extend between the lid and the fins to define second channels oriented transversely relative to the first channels. The second channels include a proximal second channel fluidly communicative with the plenum. The blocking element is configured to normally encourage coolant flowing through the inlet to flow toward the plenum and the upstream end of each of the first channels and to normally discourage the coolant from flowing into the proximal second channel.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: January 26, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiangfei Yu, Dustin Demetriou
  • Patent number: 10900718
    Abstract: The disclosed apparatus may include (1) a heatsink that includes a first vapor chamber that (A) contains fluid that dissipates heat and (B) is at least partially encompassed by a plate that contains at least one slot extending from a top surface of the plate to the first vapor chamber and (2) at least one fin that (A) encompasses a second vapor chamber (B) is secured within the slot in the plate of the heatsink such that (i) the fin extends from the heatsink and (ii) the fluid within the first vapor chamber is capable of flowing into the second vapor chamber. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: January 26, 2021
    Assignee: Juniper Networks, Inc
    Inventors: Susheela Nanjunda Rao Narasimhan, Christopher Otte, Darron Holley, Chee Chin Wong
  • Patent number: 10888033
    Abstract: A cooling system for a data center includes: at least one liquid-cooling heat exchanger disposed above each of the integrated circuit boards to dissipate heat from a first heat source disposed on the integrated circuit board through an internal circulation coolant in the liquid-cooling heat exchanger; a liquid-cooling distributing device comprising a first pipeline in communication with the liquid-cooling heat exchanger, a second pipeline in communication with a first cooling tower, and a heat exchanger configured to cool the internal circulation coolant from the liquid-cooling heat exchanger to a first temperature through an external circulation coolant from the first cooling tower; and the first cooling tower configured to cool the external circulation coolant supplied via the second pipeline to the second temperature, wherein the first temperature is higher than the second temperature. As a result, energy consumption can be reduced and chip-level cooling can be achieved.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: January 5, 2021
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Zhiming Luo, Xiaozhong Li, Binghua Zhang
  • Patent number: 10866032
    Abstract: Provided is a polymer-based pulsating heat pipe that has high flexibility and is applicable to a flexible electronic device. In addition, by surrounding a channel by a multilayer film including a first blocking layer and coating a bonding part with a second blocking layer in order to prevent air from penetrating through the bonding part between upper and lower films, an inner portion of the channel may be maintained in a vacuum state and heat performance of the polymer-based pulsating heat pipe may be maintained. In addition, although the polymer-based pulsating heat pipe according to the present invention has high flexibility, it is lightweight and has heat performance superior to that of copper, thereby effectively cooling the flexible electronic device.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: December 15, 2020
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Sung Jin Kim, Jonghyun Lim
  • Patent number: 10834852
    Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Aaron R. Cox, William J. Grady, IV, Jason A. Matteson, Jason E. Minyard
  • Patent number: 10834847
    Abstract: The disclosed apparatus may include (1) a cold plate base that (A) is thermally coupled to a component and (B) includes a set of heatsink fin structures that facilitate absorbing heat generated by the component and (2) a cold plate cover that (A) sits atop the cold plate base and (B) directs a cooling fluid across the set of heatsink fin structures to cool the cold plate base despite the heat absorbed by the cold plate base from the component. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 10, 2020
    Assignee: Juniper Networks, Inc
    Inventor: Alexander I. Yatskov
  • Patent number: 10822096
    Abstract: An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: November 3, 2020
    Assignee: GE Aviation Systems LLC
    Inventors: Liqiang Yang, Richard Anthony Eddins, Darrell Lee Grimes
  • Patent number: 10827649
    Abstract: Examples herein relate to an efficient cooling system. Examples disclose a first distribution line that delivers a first cooling fluid across a device. The first cooling fluid flows across the device from a first side to a second side. The examples also disclose a second distribution like that is separate from the first distribution line. The second distribution line delivers a second cooling fluid across the device from the second side to the first side such that the second cooling fluid flows in an opposite direction to the first cooling fluid.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 3, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Ernesto Ferrer Medina, Tahir Cader
  • Patent number: 10823512
    Abstract: A cold plate structure in a two-phase cooling system is provided. The cold plate, where the cold plate structure has at least one microchannel with a cross-sectional area along a radial direction, wherein the cross-sectional area expands in a first direction that is substantially tangential to the radial direction and expands in a second direction that is substantially tangential to the radial direction and substantially tangential to the first direction.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: November 3, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida, Fanghao Yang
  • Patent number: 10816279
    Abstract: A high-efficiency water-cooled heat dissipation device includes a heat sink base, an inner cover, an impeller, a lower casing and a motor that are arranged from bottom to top. By providing the inner cover, the inner cover covers a fin portion of the heat sink base. When in use, a cold liquid flows into the inner cover from first perforations and is evenly distributed on the fin portion, and then flows out of a liquid outlet chamber from second perforations, so that the cold liquid can be effectively drained to avoid the mixing of the cold liquid and the hot liquid, thereby fully utilizing the cold liquid for heat absorption to improve the heat dissipation effect.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: October 27, 2020
    Assignee: HAN XU HARDWARE PLASTIC TECHNOLOGICAL CO., LTD.
    Inventor: Tsung-Hsien Huang