Abstract: A cooling system and method for cooling a contactor from the contactor-terminal side or both the contactor-mount side is provided. The contactors may be mounted to a base of a chassis. The cover may have one or more fluid channels associated with an exterior side of the cover. The interior side may have a plurality of thermally conductive bosses projecting from the interior surface configured to indirectly contact busbars which are respectively connected to contactor terminals of the contactors via thermal pads to provide a heat transfer path between the busbars and the fluid within the one or more fluid channels associated with the exterior side of the cover. Certain of the thermally conductive bosses are offset from the one or more fluid channels.

Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Abstract: A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.

Abstract: An electrically operated aerosol-generating system is provided, including: an aerosol-generating device; an aerosol-forming cartridge including at least one aerosol-forming substrate, the aerosol-forming cartridge being at least partially received within the aerosol-generating device; at least one electric heater configured to heat the at least one aerosol-forming substrate; at least one air inlet and at least one air outlet; and an air flow channel extending between the at least one air inlet and the at least one air outlet, the air flow channel being in fluid communication with the aerosol-forming substrate, the air flow channel having an internal wall surface on which one or more flow disturbing devices are disposed, the flow disturbing devices being arranged to create a turbulent boundary layer in a flow of air drawn through the air flow channel.

Abstract: A power control system for an electric vehicle includes a power inverter comprising a switch module including a plurality of power switches, a controller board, and a gate driver board in communication with the controller board and configured to drive gates of the plurality of switches. A first housing is made of polymer composite, encloses the power inverter, defines a first cooling cavity in thermal communication with a first surface of the switch module, and encapsulates a portion of at least one of the switch module, the controller board and the gate driver board.

Abstract: Condensation can be an important process in both emerging and traditional power generation and water desalination technologies. Superhydrophobic nanostructures can promise enhanced condensation heat transfer by reducing the characteristic size of departing droplets via a surface-tension-driven mechanism. A superhydrophobic surface can include nanostructures of a metal oxide having further surface modification.

Abstract: A cooling apparatus is provided. An external cooling fluid flows into an external inlet opening from an external inlet pipe and passes through a heat exchanger to flow out of an external outlet opening to an external outlet pipe. An internal cooling fluid flows into an internal inlet pipe from the server and flows into an internal inlet opening from the internal inlet pipe and passes through the heat exchanger for heat exchange with the external cooling fluid to flow out of an internal outlet opening to an internal outlet pipe. A hot-swap pump has a pump main body, an inlet anti-leakage pipe, an outlet anti-leakage pipe and a hot-swap connector. The inlet anti-leakage pipe includes an inlet connector and an inlet anti-leakage valve. The outlet anti-leakage pipe includes an outlet connector and an outlet anti-leakage valve. The hot-swap connector is electrically connected to the pump main body.

Abstract: A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.

Abstract: A modular heat exchange assembly includes a cold plate defining a finned surface and a corresponding plurality of microchannels. Selected ones of the plurality of microchannel extend from a first end to an opposed second end. A fluid receiver unit defines an inlet port and a first fluid connector fluidically coupled with the inlet port. A fluid transfer unit defines an outlet port and a second fluid connector matingly engageable with and disengageable from the first fluid connector to fluidly couple the fluid receiver unit and the fluid transfer unit together. The fluid transfer unit defines a distribution manifold configured to distribute coolant among the selected microchannels at a position between the first ends and the second ends of the selected microchannels. The fluid transfer unit further defines a collection manifold configured to receive coolant from the selected microchannels. The collection manifold and the outlet port are fluidically coupled together.

Abstract: A two-phase immersion-type heat dissipation structure having a porous structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, a plurality of fins, and a reinforcement frame. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fins are integrally formed on the fin surface. A porous structure is covered onto at least one portion of the fin surface and at least one portion of the plurality of fins, and has a porosity of from 10% to 50% and a thickness that is from 0.1 mm to 1 mm. The reinforcement frame is bonded to the heat dissipation substrate and surrounds another one portion of the plurality of fins.

Abstract: A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

Abstract: The disclosure relates to an immersion cooling system including a tank, an access opening, a first dielectric liquid, a working object and a condensing unit. The tank has a space and a cover. The cover is detachably disposed on the tank to close or open the space selectively. The access opening is in communication with the space of the tank. The first dielectric liquid is accommodated within the space to form a liquid surface. The liquid surface and the access opening are disposed adjacent to each other. The working object is immersed in the first dielectric liquid. The condensing unit is arranged in the space above the liquid surface. When a cooling operation is performed, the access opening is closed, the first dielectric liquid is kept in the space, and the heat generated from the working object is dissipated through the first dielectric liquid and the condensing unit.

Abstract: A power inverter may include a housing including an arrangement space having a capacitor, a pair of cooling spaces formed on opposite sides of the arrangement space and include first and second cooling spaces, a cooling passage communicating first ends of the pair of cooling spaces with each other, and a pair of through holes respectively fluidically-connecting second ends of the pair of cooling spaces to outside of the power inverter apparatus; a first cooling plate coupled to the first cooling space to seal the first cooling space thereby; a second cooling plate coupled to the second cooling space and provided with a pair of flow holes; a first power module contacting with the first cooling plate; a second power module contacting with the second cooling plate; an extrusion cooler contacting with the second power module; and a third power module contacting with the extrusion cooler.

Abstract: A fully adjustable hybrid personal cooling and heating system is configured to remove or supply heat from/to a human user. The system is specifically designed to provide up to 8-hours of high efficiency adjustable cooling or heating when worn and operated by a user. The personal cooling and heating system use non-toxic room-temperature liquid metal as primary coolant and phase-change material as secondary coolant. The primary coolant is pumped using an active powered pump which absorbs heat from the user's body, and passively release the heat to the secondary coolant making the invention of a hybrid cooling/heating system. Passive heat release is facilitated by extreme high thermal conductivity of the primary coolant. Also, the secondary coolant is thermally insulated from the environment allowing on-demand heat absorption only from the primary coolant.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

Abstract: Provided is an electrical component housing for housing an electrical component. The electrical component housing includes a resin base portion allowing the electrical component to be mounted, a metal cover portion attached to the base portion and configured to cover the electrical component, a metal plate in contact with a bottom surface of the base portion in a manner of covering the bottom surface of the base portion. The electrical component housing also includes a conductive member provided in a through hole that penetrates the base portion in a thickness direction of the base portion, wherein the conductive member electrically connects a ground terminal of the electrical component and the metal plate.

Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, an integrated pipe, and a fluid driving module. The power supply module is electrically connected to the control module, the integrated pipe includes a plurality of inlets and an outlet to collect and output a cooled working fluid, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, integrated pipe, and fluid driving module are all arranged in the casing.

Abstract: The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

Abstract: A battery includes a plurality of battery cells and a support member configured to support the plurality of battery cells. The support member includes a recess. One battery cell of the battery cells extends into and is supported in the recess.

Abstract: An anti-wave floating photovoltaic device comprises a folding panel frame, an elastic support leg, a buoy and a self-locking support rod. The folding panel frame includes multiple unit frames and configured to be folded or unfolded by Miura folding. The adjacent unit frames are connected by a hinge mechanism and a photovoltaic panel is provided on the front side of the folded panel frame. The elastic support leg includes a V-shaped support rod and a U-shaped support rod with a changeable opening and providing elasticity through springs. The buoy includes a power buoy, an intermediate buoy and a driven buoy. The power buoy connects the intermediate buoy and the driven buoy through a rod.

Abstract: A system for providing direct silicon microfluidic cooling for electronics includes a cooling block with a first side and a second side. A plurality of micro-pin fins are disposed on the first side of the cooling block. A thermal interface material layer contacts a second side of the cooling block while a manifold is coupled to the cooling block and faces the micro-pin fins. The manifold has an inlet port and an outlet port for supporting cooling fluid flow between the inlet port and outlet port. The cooling fluid from the inlet port and outlet port also flows between the micro-pin fins for removing heat from the micro-pin fins absorbed by the cooling block from the thermal interface layer. The inlet port and outlet port each further comprise a cooling block port having a first geometry that corresponds with edges of a second geometry formed by the micro-pin fins.

Abstract: A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

Abstract: A radiator and an electrical device. The radiator includes a heat dissipation substrate and a heat dissipation assembly, wherein the heat dissipation substrate is provided with an installation position for installing the heat dissipation assembly, the installation position is provided with a stress release groove, and the heat dissipation assembly is welded on the installation position. According to the radiator provided in the present application, the stress release groove is provided in the installation position for installing the heat dissipation assembly on the heat dissipation substrate, such that the installation position is isolated from the connecting position of the heat dissipation assembly to form an island structure, and the island structure reduces stress pulling caused by thermal deformation of the two materials of the heat dissipation assembly and the radiator.

Abstract: Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.

Abstract: A discharge unit of an embodiment includes a drain pan, a discharge portion having an insulation property, a grounded drain piping, and a liquid separation part having an insulation property. The drain pan receives a liquid. The discharge portion is connected to the drain pan and drains the liquid remaining in the drain pan. The liquid separation part prevents the liquid from flowing continuously between the discharge portion and the drain piping.

Abstract: A pump apparatus includes a piezoelectric pump, an outer housing, and an adhesive sheet. The piezoelectric pump has a principal surface at which a discharge port for a fluid is formed. The outer housing has a housing channel that communicates with the discharge port, and the outer housing is formed at least partially using a resin having water-containing properties. The adhesive sheet adheres the principal surface of the piezoelectric pump to the outer housing. The outer housing includes a main plate. The main plate has a principal surface that opposes the principal surface of the piezoelectric pump and is in contact with the adhesive sheet. The main plate also has a through-hole that communicate with the discharge port and with the housing channel. The principal surface is formed as a surface of a metal portion.

Abstract: A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.

Abstract: A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microc

Abstract: A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

Abstract: Embodiments of this application provide a battery, an apparatus using a battery, and a manufacturing method and a manufacturing device of battery. The battery includes a battery cell and a thermal management component. The battery cell has a side wall and a bottom wall that are connected to each other. The thermal management component is configured to accommodate fluid to regulate temperature of the battery cell, where an accommodating portion is provided on the thermal management component, and configured to accommodate the battery cell, and the accommodating portion is attached to the bottom wall and side wall of the battery cell, to enable heat transfer between the battery cell and the thermal management component. The battery cell in the battery provided in the embodiments of this application can dissipate heat efficiently.

Abstract: Embodiments disclosed herein include temperature control systems. In an embodiment, a temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber, and where the fluid reservoir is between the vacuum source and the spray chamber.

Abstract: Provided is a battery that includes a battery module having a battery cell, and a cooler including an inlet part through which refrigerant flows in from outside, and an outlet part through which the refrigerant flows out, and configured to cool the battery module as the refrigerant circulates inside the cooler. The cooler includes an inlet side flow passage that communicates with the inlet part and is provided at a position overlapping a heating region, and an outlet side flow passage that communicates with the inlet side flow passage and the outlet part, and is provided at a position overlapping a non-heating region.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A frame for a liquid-cooled chassis in an IT rack, can include a fluid supply line contained within one or more walls of the frame and a fluid return line contained within the one or more walls of the frame. Fluid distribution function and hardware are integrated to the frame. One or more contact pads can be located on an external surface of the frame, for transferring thermal energy with IT equipment.

Abstract: In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.

Abstract: This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports.

Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.

Abstract: Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.

Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.

Abstract: Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: A fully adjustable hybrid personal cooling and heating system is configured to remove or supply heat from/to a human user. The system is specifically designed to provide up to 8-hours of high efficiency adjustable cooling or heating when worn and operated by a user. The personal cooling and heating system use non-toxic room-temperature liquid metal as primary coolant and phase-change material as secondary coolant. The primary coolant is pumped using an active powered pump which absorbs heat from the user's body, and passively release the heat to the secondary coolant making the invention a hybrid cooling/heating system. Passive heat release is facilitated by extreme high thermal conductivity of the primary coolant. Also, the secondary coolant is thermally insulated from the environment allowing on-demand heat absorption only from the primary coolant.

Abstract: A heat dissipation system includes an accommodation device, a collection device, and a control device. The accommodation device stores a first liquid. The first liquid converts to a first gas when satisfying a first temperature condition. An electronic apparatus is arranged in the first liquid, the first liquid doe not affect an operation of the electronic apparatus and converts to the first gas through heat generated by the electronic apparatus. The first temperature condition changes as an air pressure in the accommodation device changes. The collection device is configured to collect a parameter that indicates the air pressure in the accommodation device. The control device is configured to determine and execute a control instruction according to the parameter. The control instruction includes an instruction used to adjust the air pressure in the accommodation device.

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.