Abstract: Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.

Abstract: A discharge unit of an embodiment includes a drain pan, a discharge portion having an insulation property, a grounded drain piping, and a liquid separation part having an insulation property. The drain pan receives a liquid. The discharge portion is connected to the drain pan and drains the liquid remaining in the drain pan. The liquid separation part prevents the liquid from flowing continuously between the discharge portion and the drain piping.

Abstract: A pump apparatus includes a piezoelectric pump, an outer housing, and an adhesive sheet. The piezoelectric pump has a principal surface at which a discharge port for a fluid is formed. The outer housing has a housing channel that communicates with the discharge port, and the outer housing is formed at least partially using a resin having water-containing properties. The adhesive sheet adheres the principal surface of the piezoelectric pump to the outer housing. The outer housing includes a main plate. The main plate has a principal surface that opposes the principal surface of the piezoelectric pump and is in contact with the adhesive sheet. The main plate also has a through-hole that communicate with the discharge port and with the housing channel. The principal surface is formed as a surface of a metal portion.

Abstract: A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.

Abstract: A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

Abstract: A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microc

Abstract: Embodiments of this application provide a battery, an apparatus using a battery, and a manufacturing method and a manufacturing device of battery. The battery includes a battery cell and a thermal management component. The battery cell has a side wall and a bottom wall that are connected to each other. The thermal management component is configured to accommodate fluid to regulate temperature of the battery cell, where an accommodating portion is provided on the thermal management component, and configured to accommodate the battery cell, and the accommodating portion is attached to the bottom wall and side wall of the battery cell, to enable heat transfer between the battery cell and the thermal management component. The battery cell in the battery provided in the embodiments of this application can dissipate heat efficiently.

Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

Abstract: Embodiments disclosed herein include temperature control systems. In an embodiment, a temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber, and where the fluid reservoir is between the vacuum source and the spray chamber.

Abstract: Provided is a battery that includes a battery module having a battery cell, and a cooler including an inlet part through which refrigerant flows in from outside, and an outlet part through which the refrigerant flows out, and configured to cool the battery module as the refrigerant circulates inside the cooler. The cooler includes an inlet side flow passage that communicates with the inlet part and is provided at a position overlapping a heating region, and an outlet side flow passage that communicates with the inlet side flow passage and the outlet part, and is provided at a position overlapping a non-heating region.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A frame for a liquid-cooled chassis in an IT rack, can include a fluid supply line contained within one or more walls of the frame and a fluid return line contained within the one or more walls of the frame. Fluid distribution function and hardware are integrated to the frame. One or more contact pads can be located on an external surface of the frame, for transferring thermal energy with IT equipment.

Abstract: In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.

Abstract: This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports.

Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.

Abstract: Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.

Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.

Abstract: Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).

Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: A fully adjustable hybrid personal cooling and heating system is configured to remove or supply heat from/to a human user. The system is specifically designed to provide up to 8-hours of high efficiency adjustable cooling or heating when worn and operated by a user. The personal cooling and heating system use non-toxic room-temperature liquid metal as primary coolant and phase-change material as secondary coolant. The primary coolant is pumped using an active powered pump which absorbs heat from the user's body, and passively release the heat to the secondary coolant making the invention a hybrid cooling/heating system. Passive heat release is facilitated by extreme high thermal conductivity of the primary coolant. Also, the secondary coolant is thermally insulated from the environment allowing on-demand heat absorption only from the primary coolant.

Abstract: A heat dissipation system includes an accommodation device, a collection device, and a control device. The accommodation device stores a first liquid. The first liquid converts to a first gas when satisfying a first temperature condition. An electronic apparatus is arranged in the first liquid, the first liquid doe not affect an operation of the electronic apparatus and converts to the first gas through heat generated by the electronic apparatus. The first temperature condition changes as an air pressure in the accommodation device changes. The collection device is configured to collect a parameter that indicates the air pressure in the accommodation device. The control device is configured to determine and execute a control instruction according to the parameter. The control instruction includes an instruction used to adjust the air pressure in the accommodation device.

Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.

Abstract: Provided is a cooling apparatus including a vaporization unit in which a working fluid evaporates due to a heat source, and a condensation unit in which the evaporated working fluid is condensed, wherein the vaporization unit is divided into a first moving space and a second moving space by a partition wall, a first moving passage connecting the first moving space and the second moving space is formed in one region of the partition wall, and the working fluid introduced through the first moving space moves to the second moving space through the first moving passage to exchange heat.

Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. A temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components. The temperature control plate has a fluid inlet fluidly coupled to an inlet control, and a fluid outlet fluidly coupled to an outlet control. Both the cooling loop and the heating loop are fluidly coupled to the temperature control plate. Temperature sensors and a controller are coupled to the system. Based on initial temperature measurements, the controller determines whether the electronic components require a cooling-only temperature control strategy or require a hybrid temperature control strategy that includes heating, cooling, and a transition between heating and cooling. The controller then implements the selected strategy.

Abstract: A structural component of a primary structure for a vehicle, the structural component including a fiber composite laminate with a plurality of fiber composite sublayers. The plurality of fiber composite sublayers includes an electric energy store which is configured as a multilayer electrochemical fiber composite battery to store electric energy in a rechargeable manner; and an electrothermal temperature regulation sublayer which is configured to supply thermal energy to the electric energy store and conducting thermal energy away from the electric energy store as required to regulate a temperature. A control device, which is connected to the electric energy store and the electrothermal temperature regulation sublayer, is configured to control a temperature regulation of the electric energy store by means of the electrothermal temperature regulation sublayer.

Abstract: A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.

Abstract: A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.

Abstract: A cooling device for cooling electronic components mounted on a circuit board. The device comprises a hollow body defining a coolant transport circuit for circulating coolant fluid there thorough. The hollow body comprises a plurality of flattened regions linked by duct regions, wherein the flattened regions and duct regions are formed as continuous regions of the body. When the body is secured to the circuit board, each flattened region is configured to align with one or more electronic components for transferring heat away.

Abstract: Systems and methods for cooling an objective lens of a charged-particle beam system are disclosed. According to certain embodiments, the method for cooling an objective lens of a charged-particle beam system comprises receiving a fluid via a fluid input port of a bobbin, circulating the fluid that absorbs heat generated by a plurality of electromagnetic coils of the objective lens, via a plurality of channels distributed in the bobbin, and dispensing the fluid circulated by the plurality of channels via a fluid output port of the bobbin. The bobbin may further comprise a bottom flange proximal to a wafer and a top flange distal from the wafer. The bobbin having the plurality of channels may comprise an additively manufactured monolithic structure.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A fuel cell system power supply includes: a fuel cell stack configured to react hydrogen and oxygen in air with each other in order to generate electricity; a high-voltage converter configured to boost output power of the fuel cell stack; and a high-voltage junction unit configured to transmit the output power of the fuel cell stack to the high-voltage converter and to receive high-voltage power from the high-voltage converter. The high-voltage junction unit has a structure configured to simultaneously accommodate an output terminal of the fuel cell stack and an input terminal of the high-voltage converter. Consequently, the assembly structure of the high-voltage junction unit may be simplified, whereby productivity may be improved. In addition, maintainability may be improved, whereby it is possible to efficiently maintain a fuel cell vehicle.

Abstract: The present disclosure relates to a connector system that provides a sealed and grounded electrical connection for a component of a power management system, like those found in a battery-powered motor vehicle. The connector system includes a male connector assembly and an adaptor assembly. The adaptor assembly includes: (i) a capacitor assembly, (ii) a female terminal assembly, and (iii) a busbar assembly. An internal electrical connection state is defined when: (a) the female terminal assembly is electrically coupled to the capacitor assembly, (b) the capacitor assembly is electrically coupled to the busbar assembly, and (c) the busbar assembly is electrically coupled to an extent of the component of the power management system. In the internal electrical connection state, the electrical couplings are sealed from the external environment which increases the operating life, durability and reliability of the adaptor assembly, the connector system and the power management system component.

Abstract: A thermomagnetic apparatus for electric power production, comprising: a hollow toric vessel (30) delimited by a wall (31) having an outer toric surface (31a) having a toroidal direction, wherein the toric wall (31) encloses a volume containing a ferrofluid which comprises magnetic nanoparticles dispersed or suspended in a fluid carrier; a plurality of hydraulic conduits (36-39) in thermal contact with the outer toric surface (31a); a magnetic field source (62) coupled to the outer toric surface (62) and an extraction coil (65) which comprises a plurality of turns (65?) of electrical conductor wire arranged on the outer toric surface (31a).

Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

Abstract: A vehicle, a vehicle power electronics assembly, and a method of packaging and cooling an inductor assembly are provided. The vehicle has a vehicle electrical system with a variable voltage converter (VVC) and an inductor assembly. The inductor assembly has a core and a winding. A bobbin is connected to and surrounds an outer perimeter of the inductor assembly. The bobbin defines an inlet, an internal fluid passage, and a series of nozzles. The nozzles in the series of nozzles are spaced apart from one another about the bobbin and are positioned to spray fluid directly onto the winding. A fluid system is connected to the inlet to provide pressurized fluid to the inlet.

Abstract: Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.

Abstract: A computing module apparatus for use in a rack-mountable tray, the computing module apparatus including: one or more walls defined between a top surface and a bottom surface, wherein the walls, the top surface, and the bottom surface define an interior volume of the computing module; one or more computing components positioned within the interior volume of the computing module; an immersion fluid contained within the interior volume of the computing module and surrounding the computing components; and one or more mechanical interconnects for mechanical coupling the computing module with the rack-mountable tray.

Abstract: A PCU case of a power control unit includes a case main body that has an upper surface-side opening and a lower surface-side opening and is formed in a tubular shape with a rectangular cross-section, and an upper cover that covers the upper surface-side opening. The case main body includes a fastening part that is formed so as to surround the lower surface-side opening and fastened to a surface of a transaxle case, and this surface of the transaxle case doubles as a lower surface of the PCU case. The case main body includes a plate-shaped beam member that extends along a short-side direction, connects a pair of long-side side walls to each other, and divides the inside of the case main body into an upper chamber and a lower chamber, and an intermediate opening that provides communication between the upper chamber and the lower chamber.

Abstract: An integrated circuit testing assembly, comprising a slab having a slab axis, and a first electrode and second electrode affixed relative to the slab. The first electrode has a first major axis parallel to the slab axis, is coupled to receive a first voltage for coupling to a first set of pins on an integrated circuit, and includes a first surface area facing the slab axis, wherein the first surface area does not include a surface discontinuity. The second electrode has a second major axis parallel to the slab axis, is coupled to receive a second voltage for coupling to second first set of pins on an integrated circuit, and includes a second surface area facing the slab axis, wherein the second surface area does not include a surface discontinuity.

Abstract: A battery includes a plurality of battery cells, each battery cell including a core, a source of thermal control fluid in fluid communication with the core, and a first pressure sensitive valve positioned between the core and the source of thermal control fluid, the first pressure sensitive valve adapted to open when pressure within the core exceeds a first pre-determined value.

Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.

Abstract: A heat transfer device includes a sleeve, which forms an interior in which a working medium and one vaporization element having structural elements, or multiple vaporization elements having structural elements, for converting at least part of the working medium from the liquid to the gaseous state are contained, wherein the vaporization element or the vaporization elements has or have a porosity, and is or are connected to the sleeve.

Abstract: A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

Abstract: Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Abstract: A thin profile gas transporting device includes a gas collecting plate, a valve sheet, a discharge sheet, and a gas pump. The gas pump is disposed on the gas collecting plate. The gas collecting plate, the valve sheet, and the discharge sheet are stacked and assembled sequentially. Through simplifying the structures of the gas collecting plate and the discharge sheet, the thicknesses of the gas collecting plate and the discharge sheet can be reduced. Moreover, through the arrangement of several pressure relief holes, the pressure relieving operation can be performed rapidly and quietly.