Liquid Cooled Patents (Class 165/80.4)
  • Patent number: 10446471
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JaeHong Park, Hanhong Lee, Sungwoo Joo, Woon-young Baek
  • Patent number: 10443949
    Abstract: The invention is provided with a support tube (101) and an inner tube (103) installed inside thereof, the diameter differentiation between the inner diameter of the support tube (101) and the outer diameter of the inner tube (103) is formed with a partitioned space for constituting a fluid path, the upper tube of the support tube (101) is installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed on the heat transfer fluid path to pump the heat transfer fluid to form a closed recycling flow, and through passing the support tube (101) of the mentioned closed recycling heat transfer fluid path and the exposed portion at the outer surface of the relevant structure, thereby enabling to perform temperature equalizing operation with the external gaseous or solid or liquid environment and/or the soil or liquid of the shallow ground natural thermal energy body.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: October 15, 2019
    Inventor: Tai-Her Yang
  • Patent number: 10437299
    Abstract: An electronic device includes a first housing portion, a second housing portion, a circuit board, a battery, a display screen, and a heat-dissipating structure. The second housing portion is coupled together with the first housing portion. The circuit board and the battery are received within the second housing portion. The heat-dissipating structure is arranged between the circuit board and the display screen. The heat-dissipating structure includes a substrate including a first surface and a second surface opposite to the first surface and defines an opening passing through the first surface and the second surface. The heat dissipating element is located in the opening.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 8, 2019
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Hsin-Wei Wang, Chia-Hsin Chang
  • Patent number: 10437298
    Abstract: A lifting mechanism is adapted to bear an expansion unit, and the expansion unit contacts or is separated from a heat dissipating module. The lifting mechanism includes an outer casing base and a bearing base. The bearing base is disposed on the outer casing base liftably along a first axis. The expansion unit is disposed on the bearing base. When the bearing base is located at an original position relative to the outer casing base, the expansion unit on the bearing base is separated from the heat dissipating module. When the bearing base is lifted relative to the outer casing base along the first axis to a lifting position, the expansion unit on the bearing base contacts the heat dissipating module. An electronic device having the lifting mechanism is further provided.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: October 8, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yen-Chia Chang, Shih-Wei Wang
  • Patent number: 10431524
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10422018
    Abstract: A method and an apparatus for producing metallic semi-finished products by means of remelting and/or remelt-alloying. Here, the material is melted selectively locally in a melting capillary in the material volume by means of high-energy, focused radiation, the melting capillary is moved through the material and the material is cooled down at a high cooling rate by means of a cooled heat sink, which is located close to the melting capillary and coupled to the material in a well heat-conductive manner.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: September 24, 2019
    Assignee: G. Rau GmbH & Co. KG
    Inventor: Gerhard Sedlmayr
  • Patent number: 10424560
    Abstract: A three-dimensional integrated circuit cooling system is provided for removing heat from a three-dimensional integrated circuit. Plural fluid microchannels are formed among plural middle chip layers and a main chip layer of the three-dimensional integrated circuit. The three-dimensional integrated circuit cooling system comprises a base and a fluid pump. The base has an introduction opening, a discharge opening and a fluid passage. The fluid pump is fixed on the base and seals the edge of the introduction opening. When the fluid pump is enabled, an ambient fluid is driven by the fluid pump, introduced into the fluid passage through the introduction opening, and discharged through the discharge opening. The discharged fluid passes along every fluid microchannel of the three-dimensional integrated circuit as flowing through the plural middle chip layers and the main chip layer so as to perform heat exchange therewith.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: September 24, 2019
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Li-Pang Mo, Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han
  • Patent number: 10393409
    Abstract: Materials, components, and methods consistent with the disclosure are directed to the fabrication and use of micro scale channels with a gas, where the micro channel can include a base (110) and a side (120), where the base and the side can be configured to form at least a portion of an inflow opening, and an outflow opening. The micro channel can be configured to accommodate a flow of the gas from the inflow opening to the outflow opening in a first direction substantially perpendicular to a cross section of the micro channel. The side can have a thickness in a range 0.5 ?m and 500 ?m, where the micro channel with a thickness in a range 0.5 ?m and 500 ?m is formed, in part, by providing the side on the base.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: August 27, 2019
    Assignee: Forced Physics, LLC
    Inventor: Scott Davis
  • Patent number: 10390460
    Abstract: Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: August 20, 2019
    Assignee: SYSTEMEX-ENERGIES INTERNATIONAL INC.
    Inventors: Julien Sylvestre, Simon Jasmin
  • Patent number: 10362712
    Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: July 23, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Michimasa Aoki, Masumi Suzuki
  • Patent number: 10353445
    Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: July 16, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Adrian Chiriac, Jorge Luis Rosales, Stephen Arthur Molloy, Jon James Anderson
  • Patent number: 10349560
    Abstract: Example implementations relate to cooling modules. In some examples, a cooling module, can include an enclosure to replace a fan module, a first liquid cooling connector to receive and return cooling resources to a heat exchanger, and a second liquid cooling connector to provide the cooling resources to a manifold.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: July 9, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John Norton, James Lee Armes
  • Patent number: 10330397
    Abstract: A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 25, 2019
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Mu-Shu Fan, Chien-Yu Chen
  • Patent number: 10317962
    Abstract: Techniques for inducing heterogeneous microprocessor behavior using non-uniform cooling are described. According to an embodiment, a device is provided that comprises an IC chip comprising a plurality of cores and a cooling apparatus coupled to the integrated chip that cools the integrated chip in association with electrical operation of the plurality of cores. The cooling apparatus cools a first core of the plurality of cores to a lower temperature than a second core of the plurality of cores. In various embodiments, the cooling apparatus comprises a plurality of channels embedded within the integrated chip and the cooling apparatus cools the integrated chip via flow of liquid coolant through the plurality of channels.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: June 11, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Pradip Bose, Alper Buyuktosunoglu, Timothy Joseph Chainer, Pritish Ranjan Parida, Augusto Javier Vega
  • Patent number: 10310391
    Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: June 4, 2019
    Assignee: ASML Holding N.V.
    Inventors: Matthew Lipson, Vincent Dimilia, Ronald Peter Totillo, Tammo Uitterdijk, Steven Michael Zimmerman
  • Patent number: 10306800
    Abstract: The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: May 28, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Franke Wulf-Toke, Ronald Eisele, Reiner Hinken, Frank Osterwald, Klaus Olesen, Lars Paulsen
  • Patent number: 10290562
    Abstract: Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: May 14, 2019
    Assignee: General Electric Company
    Inventors: Fei Han, Mehmet Arik, Trevor Wood, Charles Franklin Wolfe, Jr.
  • Patent number: 10279610
    Abstract: A temperature control system, the system comprising a cooling block configured to be in conductive communication with a heat source, said cooling block comprising a stem and a base, a cooling fluid configured to circulate through the base of the cooling block, and an electrical barrier formed in the base of the cooling block between the heat source and the cooling fluid.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: May 7, 2019
    Assignee: Xerox Corporation
    Inventors: Paul J. McConville, Jason M. Lefevre, Steven R. Moore, Douglas K. Herrmann
  • Patent number: 10281218
    Abstract: The present invention is provided with a suspended external tube (101) and an inner tube (103) installed therein, wherein the diameter differentiation between the inner diameter of the external tube and the outer diameter of the inner tube is served to constitute a partitioned space as the fluid path, the front tube of the external tube is served to be installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed to the heat transfer fluid path pumping the heat transfer fluid to form a closed recycling fluid path, and through the exposed portion of the outer surface of the suspended external tube (101), temperature equalizing operation is enabled to perform with the external gaseous environment or the liquid or solid environment manually installed but not disposed in the stratum or liquid of the shallow ground natural thermal energy body.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: May 7, 2019
    Inventor: Tai-Her Yang
  • Patent number: 10285308
    Abstract: The instant disclosure provides a dynamic random access memory (DRAM) module including a housing, a circuit board and a fluorine engineered fluid. The housing includes an accommodating space and an opening on a side thereof. The circuit board has at least a DRAM chip disposed thereon. The circuit board is received in the accommodating space and one end of the circuit board has at least a circuit contact protruding from the opening to the exterior of the housing. The fluorine electronic engineering fluid is sealed in the accommodating space and is thermally connected to at least one of the DRAM chip.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: May 7, 2019
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventors: Li-Min Chang, Feng-Mi Tsai, Shih-Huang Tsai, Ching-Sen Chan
  • Patent number: 10274270
    Abstract: Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a coupling each of the reservoirs to a common secondary reservoir. Heat transfer fluid is pumped from the secondary reservoir to either the hot or cold reservoir in response to a low level sensed in the reservoir. In an embodiment, both the hot and cold reservoirs are contained in a same platform as the secondary reservoir with the hot and cold reservoirs disposed above the secondary reservoir to permit the secondary reservoir to catch gravity driven overflow from either the hot or cold reservoir.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: April 30, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Fernando Silveira, Brad L. Mays
  • Patent number: 10274842
    Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: April 30, 2019
    Assignee: ASML Holding N.V.
    Inventors: Matthew Lipson, Vincent Dimilia, Ronald Peter Totillo, Tammo Uitterdijk, Steven Michael Zimmerman
  • Patent number: 10272658
    Abstract: A method of forming a composite part may include positioning composite layers onto a part-supporting surface of a support tool. The composite layers combine to form the composite part. The method may also include covering the composite part on the support tool with a vacuum bag, and forming a heat transfer assembly on the vacuum bag in relation to a portion of the composite part. The method may include forming the heat transfer assembly on the vacuum bag by depositing a fluid layer of material onto the vacuum bag, inserting heat transfer promoters into the fluid, and cooling the fluid to form a solid heat transfer assembly.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: April 30, 2019
    Assignee: The Boeing Company
    Inventors: Keith Daniel Humfeld, Steven Michael Shewchuk
  • Patent number: 10247775
    Abstract: A length adjustable arm and MEMS position detection equipment rotation test apparatus includes an extendible section and first and second rotary bodies provided at one end of a rotation device for variation of a feeding position of a first feeding component so that feeding component is capable of conducting various feeding ways. Further, a worktable is provided thereon with at least one rotation section, which has a surface on which a plurality of operation stations is mounted. As such, through circular change made by the rotation section in respect of the locations of the operation stations, an effect of effectively and efficiently burning or testing can be achieved. Further, the operation stations are provided, on a periphery thereof, with a turning section, and the turning section is operable to turn each of the operation stations in order to effectively conduct tests for various MEMS inertial components.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: April 2, 2019
    Assignee: LEAP ELECTRONIC CO., LTD.
    Inventors: An-Sung Wang, Ching-Chang Wong, Yang-Han Lee
  • Patent number: 10247486
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 2, 2019
    Assignee: Thermal Corp.
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • Patent number: 10238007
    Abstract: Some embodiments of the present invention provide apparatus for cooling an article. The apparatus comprises a heat exchanger arranged to be fed with fluid from a fluid reservoir disposed, in use, above the heat exchanger. The fluid reservoir includes cooling means for cooling fluid in the reservoir such that the fluid flows under gravity into the heat exchanger so as to cool an article. The apparatus may be arranged to cool one or more batteries or other articles, for example in a telecommunications base station.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: March 19, 2019
    Assignee: THE SURE CHILL COMPANY LIMITED
    Inventor: Ian Tansley
  • Patent number: 10225958
    Abstract: Embodiments are disclosed of a server rack including a rack adapted to accommodate one or more servers, each server including one or more components. An inlet manifold is positioned in or on the rack, the inlet manifold including an embedded supply pump having an inlet and an outlet, the inlet being coupled to a main supply line and the outlet being coupled to at least one sub-loop supply line. An outlet manifold is also positioned in or on the rack, the outlet manifold including an embedded return pump having an inlet and an outlet, the pump inlet being coupled to at least one sub-loop return line and the pump outlet being coupled to a main return line. A total liquid cooling architecture is proposed for liquid cooled electronic racks and data centers.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 5, 2019
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10212802
    Abstract: The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: February 19, 2019
    Assignee: Schweizer Electronic AG
    Inventor: Robert Müller
  • Patent number: 10209748
    Abstract: An electronic device with a heat-dissipation structure includes a host, a first heat-dissipation tube, a display, a rotation joint, and a second heat-dissipation tube. The first heat-dissipation tube is disposed in the host. The display is pivoted on the host. The display is rotated relative to the host about a rotation axis. The rotation joint is connected to the first heat-dissipation tube. The second heat-dissipation tube is disposed in the display, and connected to the rotation joint. A cooling liquid is filled in the first heat-dissipation tube.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: February 19, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventor: Yun-Jeng Lin
  • Patent number: 10204659
    Abstract: A system includes a support member and a hard disk drive interface connector, where a first side of the hard disk drive interface connector is disposed on a first side of the support member and a second side of the hard disk drive interface connector disposed on a second side of the support member. A conduit is coupled to the support member and to a fluid inlet disposed on the first side of the support member. A fluid outlet is disposed on the first side of the support member, and a housing is coupled to the first side of the support member and defines a volume with the support member, where an interface between the housing and the first side of the support member is leak-resistant, and where the fluid inlet and fluid outlet are in fluid communication with the volume.
    Type: Grant
    Filed: April 14, 2018
    Date of Patent: February 12, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Nicholas Andrew Keehn, Michael Rees Helsel, David Thomas Gauthier
  • Patent number: 10206312
    Abstract: A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier.
    Type: Grant
    Filed: February 20, 2016
    Date of Patent: February 12, 2019
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, James Don Curlee, Chin-An Huang
  • Patent number: 10199307
    Abstract: In order to prevent the formation of condensation in a cooling device for a current converter module, the cooling device has a cooling liquid channel, which conducts a liquid coolant and which is connected to a cooling circuit, a heat exchanger, which is connected in the cooling circuit and to which a power component is coupled in a thermally conductive manner, and a cooler for cooling the liquid coolant, which cooler is connected in the cooling circuit, wherein there is a heater in the cooling circuit such that the heat exchanger can be heated upon demand by heating the coolant.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: February 5, 2019
    Assignee: VENSYS ELEKTROTECHNIK GMBH
    Inventor: Christoph Meyer
  • Patent number: 10186465
    Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 22, 2019
    Assignee: Intel Corporation
    Inventors: Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow, Aleksandar Aleksov, Nathan Fritz
  • Patent number: 10178444
    Abstract: A device-frame for telecommunication devices includes a body-section that includes plug-in unit places for the telecommunication devices. The device-frame further includes an air-guide element movably supported to the body-section so that a flow area of an air-intake of the device-frame is increasable by changing the position of the air-guide element with respect to the body-section so that the height of the device-frame increases and the flow area is decreasable by changing the position of the air-guide element so that the height of the device-frame decreases. The height of the device-frame can be adjusted to be smaller in cases where the circumstances are not the most demanding from the viewpoint of the cooling and therefore, in less demanding circumstances, it is possible to have more device-frames in a rack.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: January 8, 2019
    Assignee: CORIANT OY
    Inventors: Pertti Parkkonen, Petri Kohonen
  • Patent number: 10177075
    Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: January 8, 2019
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
  • Patent number: 10178780
    Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: January 8, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Hideyo Suzuki, Fusanori Nishikimi, Takeshi Matsuo, Toshiya Satou
  • Patent number: 10165707
    Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: December 25, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Martin Brokner Christiansen, Bruce Ryan Isler, Jonathan Francis Van Dyke, Robert J. Voigt, Benjamin Chaoning Liu
  • Patent number: 10159165
    Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: December 18, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Mehdi Saeidi, Ali Akbar Merrikh, Melika Roshandell
  • Patent number: 10153524
    Abstract: This disclosure relates to techniques for implementing a cooling system for a vehicle heat-generating component wherein a two-phase coolant flows between a heat sink module and a heat radiator module. The heat radiator module can be mounted at a higher elevation within the vehicle than the heat sink module. High and low temperature fluid paths can fluidly couple the heat sink module and the heat radiator module. The heat sink module can be coupled to a heat-generating component. As the coolant is heated at the heat sink module by heat from the heat-generating component, it can change to a substantially gaseous phase and move, primarily by force of buoyancy, to the heat radiator module via the high temperature fluid path. As the coolant is cooled by the heat radiator module, it can change to a substantially liquid phase and move, primarily by force of gravity, to the heat sink module.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: December 11, 2018
    Assignee: FARADAY&FUTURE INC.
    Inventors: Khiem Dinh, David Tarlau, Berton Vite
  • Patent number: 10151612
    Abstract: A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the encapsulation contributes to a flow channel for guiding the fluid, which recess exposes at least the sensitive structure of the chip from the encapsulation, and which recess extends beyond an edge of the chip.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: December 11, 2018
    Assignee: Sensirion AG
    Inventors: Werner Hunziker, Mark Hornung, Eric Monnin
  • Patent number: 10149413
    Abstract: An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: December 4, 2018
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Ercan M. Dede, Jongwon Shin, Jae Seung Lee
  • Patent number: 10137798
    Abstract: A vehicle power module assembly is provided. The assembly many include an array of stacked frames, a power stage housed within each of the frames, and busbars. Each of the power stages may include a pair of opposite polarity terminals extending therefrom. The busbars may be dispersed along the array to electrically connect like polarity terminals. The power stages may be arranged with one another such that like polarity terminals are adjacent one another and the busbars define an alternating sequence corresponding to the polarity of the terminals. The terminals may be located on the respective power stages such that the busbars are alternately dispersed in a linear sequence along a side face defined by portions of the frames.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: November 27, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Michael W. Degner, Guangyin Lei, Chingchi Chen, Edward Chan-Jiun Jih
  • Patent number: 10136563
    Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: November 20, 2018
    Assignee: International Business Machines Corporation
    Inventors: Daniel J. Buvid, Eric J. Campbell, Tyler Jandt, Joseph Kuczynski
  • Patent number: 10113808
    Abstract: The present invention is provided with a suspended external tube (101) and an inner tube (103) installed therein, wherein the diameter differentiation between the inner diameter of the external tube and the outer diameter of the inner tube is served to constitute a partitioned space as the fluid path, the front tube of the external tube is served to be installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed to the heat transfer fluid path pumping the heat transfer fluid to form a closed recycling fluid path, and through the exposed portion of the outer surface of the suspended external tube (101), temperature equalizing operation is enabled to perform with the external gaseous environment or the liquid or solid environment manually installed but not disposed in the stratum or liquid of the shallow ground natural thermal energy body.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: October 30, 2018
    Inventor: Tai-Her Yang
  • Patent number: 10101098
    Abstract: A thermal insulation system can include a body of heated material at an elevated temperature. A layer of porous insulating material can be placed adjacent to and in fluid communication with the body of heated material. The insulating layer can contain distributed liquid water in an amount sufficient to cool the insulating layer through evaporative vapor flow toward the body of heated material. The amount of water can be sufficient to provide water vapor for inhibiting the diffusion and adsorption of hydrocarbons from the heated material. The insulating layer can include a continuous vapor phase. A heat sink material at a lower temperature can be placed adjacent to the insulating layer and opposite from the body of heated material.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: October 16, 2018
    Assignee: Red Leaf Resources, Inc.
    Inventor: James Bunger
  • Patent number: 10103047
    Abstract: A flow path member includes a flow path which has an inlet and an outlet in a base made of ceramics, and a low resistance portion whose surface resistance is less than 1×107 ?/sq in at least a part of the flow path.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: October 16, 2018
    Assignee: KYOCERA Corporation
    Inventors: Keiichi Sekiguchi, Kazuhiko Fujio, Yuusaku Ishimine
  • Patent number: 10085364
    Abstract: An assembly includes a drive housing and a first printed circuit board (PCB) with at least one solid-state memory component, the first PCB having a first surface, where the first PCB is located within the drive housing. The assembly also includes a second PCB with at least one solid-state memory component, where the second PCB is operatively electronically coupled to the first PCB, the second PCB having a second surface, and where the second PCB is located within the drive housing. The assembly also includes a first thermal transfer element configured for partial thermal communication between the first PCB and the second PCB through the first and second surfaces, where the first thermal transfer element is shaped to include a partially thermally insulating air gap located between the first and the second PCB, and where the first thermal transfer element is in thermal communication with the drive housing.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: September 25, 2018
    Assignee: Seagate Technology LLC
    Inventor: William Gunther Voss
  • Patent number: 10079165
    Abstract: An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: September 18, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Vijay Parkhe, Konstantin Makhratchev
  • Patent number: 10078355
    Abstract: The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: September 18, 2018
    Assignee: Asetek Danmark A/S
    Inventor: André Sloth Eriksen
  • Patent number: 10078354
    Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: September 18, 2018
    Assignee: Asetek Danmark A/S
    Inventor: André Sloth Eriksen