Liquid Cooled Patents (Class 165/80.4)
  • Patent number: 11908772
    Abstract: Provided is a semiconductor module including a semiconductor device and a cooling apparatus, wherein the semiconductor device includes semiconductor chips, circuit boards where the semiconductor chips are implemented, and a resin structure for sealing the semiconductor chips; the cooling apparatus includes a top plate, a side wall, a bottom plate, a coolant flow portion, a plurality of fins and reinforcement pins; the metal layer has a part overlapped with the cooling region, and other parts other than the part overlapped with one communication region of the first communication region and the second communication region in planar view; and the reinforcement pins are arranged in the one communication region.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: February 20, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takafumi Yamada, Hiromichi Gohara
  • Patent number: 11889658
    Abstract: Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: January 30, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11882678
    Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 23, 2024
    Assignee: Nvidia Corporation
    Inventors: Harold Miyamura, Jeremy Rodriguez, Alexander Ishii, Alex Naderi, Ali Heydari
  • Patent number: 11876036
    Abstract: Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: January 16, 2024
    Assignee: The Research Foundation for the State University of New York
    Inventors: Leila Choobineh, Bahgat Sammakia
  • Patent number: 11871545
    Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: January 9, 2024
    Assignee: Alibaba Group Holding Limited
    Inventor: Yangfan Zhong
  • Patent number: 11871536
    Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: January 9, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Cheng-Yu Wen, Hung-Yuan Chen
  • Patent number: 11871538
    Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 9, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shun-Yu Shih, Shui-Fa Tsai
  • Patent number: 11857005
    Abstract: A fully adjustable hybrid personal cooling and heating system is configured to remove or supply heat from/to a human user. The system is specifically designed to provide up to 8-hours of high efficiency adjustable cooling or heating when worn and operated by a user. The personal cooling and heating system use non-toxic room-temperature liquid metal as primary coolant and phase-change material as secondary coolant. The primary coolant is pumped using an active powered pump which absorbs heat from the user's body, and passively release the heat to the secondary coolant making the invention a hybrid cooling/heating system. Passive heat release is facilitated by extreme high thermal conductivity of the primary coolant. Also, the secondary coolant is thermally insulated from the environment allowing on-demand heat absorption only from the primary coolant.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 2, 2024
    Inventor: M Arifur Rahman
  • Patent number: 11805623
    Abstract: A heat dissipation system includes an accommodation device, a collection device, and a control device. The accommodation device stores a first liquid. The first liquid converts to a first gas when satisfying a first temperature condition. An electronic apparatus is arranged in the first liquid, the first liquid doe not affect an operation of the electronic apparatus and converts to the first gas through heat generated by the electronic apparatus. The first temperature condition changes as an air pressure in the accommodation device changes. The collection device is configured to collect a parameter that indicates the air pressure in the accommodation device. The control device is configured to determine and execute a control instruction according to the parameter. The control instruction includes an instruction used to adjust the air pressure in the accommodation device.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: October 31, 2023
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventor: Minghui Guan
  • Patent number: 11800682
    Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: October 24, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Tahir Cader
  • Patent number: 11796260
    Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: October 24, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11792962
    Abstract: A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: October 17, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Husam Atallah Alissa, Stephan Wayne Gilges, Eric C. Peterson, Sean Michael James, Christian L. Belady, Marcus Felipe Fontoura, Ioannis Manousakis, Bharath Ramakrishnan
  • Patent number: 11792955
    Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. A temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components. The temperature control plate has a fluid inlet fluidly coupled to an inlet control, and a fluid outlet fluidly coupled to an outlet control. Both the cooling loop and the heating loop are fluidly coupled to the temperature control plate. Temperature sensors and a controller are coupled to the system. Based on initial temperature measurements, the controller determines whether the electronic components require a cooling-only temperature control strategy or require a hybrid temperature control strategy that includes heating, cooling, and a transition between heating and cooling. The controller then implements the selected strategy.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: October 17, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11792963
    Abstract: Provided is a cooling apparatus including a vaporization unit in which a working fluid evaporates due to a heat source, and a condensation unit in which the evaporated working fluid is condensed, wherein the vaporization unit is divided into a first moving space and a second moving space by a partition wall, a first moving passage connecting the first moving space and the second moving space is formed in one region of the partition wall, and the working fluid introduced through the first moving space moves to the second moving space through the first moving passage to exchange heat.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: October 17, 2023
    Inventor: Ji Won Yeo
  • Patent number: 11784363
    Abstract: A structural component of a primary structure for a vehicle, the structural component including a fiber composite laminate with a plurality of fiber composite sublayers. The plurality of fiber composite sublayers includes an electric energy store which is configured as a multilayer electrochemical fiber composite battery to store electric energy in a rechargeable manner; and an electrothermal temperature regulation sublayer which is configured to supply thermal energy to the electric energy store and conducting thermal energy away from the electric energy store as required to regulate a temperature. A control device, which is connected to the electric energy store and the electrothermal temperature regulation sublayer, is configured to control a temperature regulation of the electric energy store by means of the electrothermal temperature regulation sublayer.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: October 10, 2023
    Assignee: Airbus Operations GmbH
    Inventors: Peter Linde, Matthias Hegenbart
  • Patent number: 11778776
    Abstract: A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: October 3, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Hiroaki Shouda, Takahiro Yamashita, Kazutake Fujisawa
  • Patent number: 11778773
    Abstract: A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: October 3, 2023
    Assignee: PHIHONG TECHNOLOGY CO., LTD.
    Inventor: Kao-Ping Lo
  • Patent number: 11770914
    Abstract: A cooling device for cooling electronic components mounted on a circuit board. The device comprises a hollow body defining a coolant transport circuit for circulating coolant fluid there thorough. The hollow body comprises a plurality of flattened regions linked by duct regions, wherein the flattened regions and duct regions are formed as continuous regions of the body. When the body is secured to the circuit board, each flattened region is configured to align with one or more electronic components for transferring heat away.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: September 26, 2023
    Assignee: Aptiv Technologies Limited
    Inventors: Frank H. Adam, Klaus Kaufmann
  • Patent number: 11764027
    Abstract: Systems and methods for cooling an objective lens of a charged-particle beam system are disclosed. According to certain embodiments, the method for cooling an objective lens of a charged-particle beam system comprises receiving a fluid via a fluid input port of a bobbin, circulating the fluid that absorbs heat generated by a plurality of electromagnetic coils of the objective lens, via a plurality of channels distributed in the bobbin, and dispensing the fluid circulated by the plurality of channels via a fluid output port of the bobbin. The bobbin may further comprise a bottom flange proximal to a wafer and a top flange distal from the wafer. The bobbin having the plurality of channels may comprise an additively manufactured monolithic structure.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 19, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Jeroen Gerard Gosen, Sven Antoin Johan Hol, Martijn Petrus Christianus Van Heumen, Dennis Herman Caspar Van Banning, Naseh Hosseini
  • Patent number: 11737247
    Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 22, 2023
    Assignee: ICEOTOPE GROUP LIMITED
    Inventors: Neil Edmunds, Andrew Young, David Amos
  • Patent number: 11732976
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 22, 2023
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Hsih-Ting You, Chi-Fu Chen, Wei-Ta Chen, Chien-Yang Lin
  • Patent number: 11735753
    Abstract: A fuel cell system power supply includes: a fuel cell stack configured to react hydrogen and oxygen in air with each other in order to generate electricity; a high-voltage converter configured to boost output power of the fuel cell stack; and a high-voltage junction unit configured to transmit the output power of the fuel cell stack to the high-voltage converter and to receive high-voltage power from the high-voltage converter. The high-voltage junction unit has a structure configured to simultaneously accommodate an output terminal of the fuel cell stack and an input terminal of the high-voltage converter. Consequently, the assembly structure of the high-voltage junction unit may be simplified, whereby productivity may be improved. In addition, maintainability may be improved, whereby it is possible to efficiently maintain a fuel cell vehicle.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: August 22, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Ju Han Kim, Woo Young Lee
  • Patent number: 11721942
    Abstract: The present disclosure relates to a connector system that provides a sealed and grounded electrical connection for a component of a power management system, like those found in a battery-powered motor vehicle. The connector system includes a male connector assembly and an adaptor assembly. The adaptor assembly includes: (i) a capacitor assembly, (ii) a female terminal assembly, and (iii) a busbar assembly. An internal electrical connection state is defined when: (a) the female terminal assembly is electrically coupled to the capacitor assembly, (b) the capacitor assembly is electrically coupled to the busbar assembly, and (c) the busbar assembly is electrically coupled to an extent of the component of the power management system. In the internal electrical connection state, the electrical couplings are sealed from the external environment which increases the operating life, durability and reliability of the adaptor assembly, the connector system and the power management system component.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: August 8, 2023
    Assignee: Eaton Intelligent Power Limited
    Inventors: James Dawson, Jeffrey Chojnacki, Jason Degen, Brantley Natter
  • Patent number: 11682959
    Abstract: A thermomagnetic apparatus for electric power production, comprising: a hollow toric vessel (30) delimited by a wall (31) having an outer toric surface (31a) having a toroidal direction, wherein the toric wall (31) encloses a volume containing a ferrofluid which comprises magnetic nanoparticles dispersed or suspended in a fluid carrier; a plurality of hydraulic conduits (36-39) in thermal contact with the outer toric surface (31a); a magnetic field source (62) coupled to the outer toric surface (62) and an extraction coil (65) which comprises a plurality of turns (65?) of electrical conductor wire arranged on the outer toric surface (31a).
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: June 20, 2023
    Assignee: FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA
    Inventor: Alessandro Chiolerio
  • Patent number: 11683908
    Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: June 20, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuan-Lin Huang, Jun-Chun Chiu
  • Patent number: 11670443
    Abstract: A vehicle, a vehicle power electronics assembly, and a method of packaging and cooling an inductor assembly are provided. The vehicle has a vehicle electrical system with a variable voltage converter (VVC) and an inductor assembly. The inductor assembly has a core and a winding. A bobbin is connected to and surrounds an outer perimeter of the inductor assembly. The bobbin defines an inlet, an internal fluid passage, and a series of nozzles. The nozzles in the series of nozzles are spaced apart from one another about the bobbin and are positioned to spray fluid directly onto the winding. A fluid system is connected to the inlet to provide pressurized fluid to the inlet.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: June 6, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Fan Wang, Lihua Chen, Serdar Hakki Yonak, John P. Casci, Abdullahi M. Hajiabdi
  • Patent number: 11665863
    Abstract: A computing module apparatus for use in a rack-mountable tray, the computing module apparatus including: one or more walls defined between a top surface and a bottom surface, wherein the walls, the top surface, and the bottom surface define an interior volume of the computing module; one or more computing components positioned within the interior volume of the computing module; an immersion fluid contained within the interior volume of the computing module and surrounding the computing components; and one or more mechanical interconnects for mechanical coupling the computing module with the rack-mountable tray.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventors: Richard A. Crisp, Matthew B. Gilbert, Corey D. Hartman
  • Patent number: 11664296
    Abstract: Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: May 30, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kensuke Matsuzawa, Takahiro Koyama, Hiromichi Gohara
  • Patent number: 11658550
    Abstract: A PCU case of a power control unit includes a case main body that has an upper surface-side opening and a lower surface-side opening and is formed in a tubular shape with a rectangular cross-section, and an upper cover that covers the upper surface-side opening. The case main body includes a fastening part that is formed so as to surround the lower surface-side opening and fastened to a surface of a transaxle case, and this surface of the transaxle case doubles as a lower surface of the PCU case. The case main body includes a plate-shaped beam member that extends along a short-side direction, connects a pair of long-side side walls to each other, and divides the inside of the case main body into an upper chamber and a lower chamber, and an intermediate opening that provides communication between the upper chamber and the lower chamber.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: May 23, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Naoki Marukawa, Hiroshi Yaguchi
  • Patent number: 11624778
    Abstract: An integrated circuit testing assembly, comprising a slab having a slab axis, and a first electrode and second electrode affixed relative to the slab. The first electrode has a first major axis parallel to the slab axis, is coupled to receive a first voltage for coupling to a first set of pins on an integrated circuit, and includes a first surface area facing the slab axis, wherein the first surface area does not include a surface discontinuity. The second electrode has a second major axis parallel to the slab axis, is coupled to receive a second voltage for coupling to second first set of pins on an integrated circuit, and includes a second surface area facing the slab axis, wherein the second surface area does not include a surface discontinuity.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: April 11, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Andrew Patrick Couch, Phillip Marcus Blitz, David Anthony Graham
  • Patent number: 11616270
    Abstract: A battery includes a plurality of battery cells, each battery cell including a core, a source of thermal control fluid in fluid communication with the core, and a first pressure sensitive valve positioned between the core and the source of thermal control fluid, the first pressure sensitive valve adapted to open when pressure within the core exceeds a first pre-determined value.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: March 28, 2023
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventor: Xiaofeng Yang
  • Patent number: 11606885
    Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: March 14, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11598586
    Abstract: A heat transfer device includes a sleeve, which forms an interior in which a working medium and one vaporization element having structural elements, or multiple vaporization elements having structural elements, for converting at least part of the working medium from the liquid to the gaseous state are contained, wherein the vaporization element or the vaporization elements has or have a porosity, and is or are connected to the sleeve.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: March 7, 2023
    Assignee: Miba Sinter Austria GmbH
    Inventors: Philipp Pichler, Franz-Josef Gielesberger, Raimund Ratzi, Samuel Wallner, Rene Hoesele
  • Patent number: 11598593
    Abstract: A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: March 7, 2023
    Assignee: fractal heatsink technologies llc
    Inventor: Alexander Poltorak
  • Patent number: 11594468
    Abstract: Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: February 28, 2023
    Assignees: DEERE & COMPANY, ALLIANCE FOR SUSTAINABLE ENERGY, LLC
    Inventors: Thomas J. Roan, Brij N. Singh, Gilberto Moreno, Kevin Scott Bennion
  • Patent number: 11572873
    Abstract: A thin profile gas transporting device includes a gas collecting plate, a valve sheet, a discharge sheet, and a gas pump. The gas pump is disposed on the gas collecting plate. The gas collecting plate, the valve sheet, and the discharge sheet are stacked and assembled sequentially. Through simplifying the structures of the gas collecting plate and the discharge sheet, the thicknesses of the gas collecting plate and the discharge sheet can be reduced. Moreover, through the arrangement of several pressure relief holes, the pressure relieving operation can be performed rapidly and quietly.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: February 7, 2023
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Shih-Te Chan, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo, Chin-Wen Hsieh
  • Patent number: 11566847
    Abstract: An integrated liquid-cooling radiator includes a first reservoir, a second reservoir and a plurality of radiating pipes. The first reservoir is made of a heat-dissipating metal material. A first partition is provided in the first reservoir to divide an inside of the first reservoir into a first liquid inlet chamber and a first liquid outlet chamber. A bottom of the first reservoir is provided with a thermally conductive copper sheet. By arranging the thermally conductive copper sheet on the first reservoir to form an integrated structure, the product has a compact structure.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: January 31, 2023
    Assignee: DONGGUAN HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
    Inventor: Tsung-Hsien Huang
  • Patent number: 11555656
    Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: January 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kishimoto, Osamu Chikagawa
  • Patent number: 11547017
    Abstract: A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: January 3, 2023
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Akinori Uchino, Takuroh Kamimura, Hiroshi Yamazaki, Masayuki Amano
  • Patent number: 11525632
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: December 13, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen Chen, Shan-Yin Cheng
  • Patent number: 11523537
    Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: December 6, 2022
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Chien-An Chen
  • Patent number: 11515233
    Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: November 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao
  • Patent number: 11506306
    Abstract: An exemplary thermal management system includes, among other things, a valve, a radiator loop configured to be connected to the valve, a power electronics loop configured to be connected to the valve, a heater loop configured to be connected to the valve, and a battery loop configured to be connected to the valve. The valve is configured to connect one or more of the radiator, power electronics, heater, and battery loops together and the valve is configured to isolate at least one of the radiator, power electronics, heater, and battery loops from any remaining loops of the radiator, power electronics, heater, and battery loops.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 22, 2022
    Assignee: Ford Global Technologies, LLC
    Inventors: Christian Brent Schoeneman, Michael Joseph Giunta
  • Patent number: 11483947
    Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: October 25, 2022
    Assignee: Motivair Corporation
    Inventors: Rich S Whitmore, Timothy A Shedd
  • Patent number: 11480611
    Abstract: Prober for a test system for testing a device under test is disclosed. In one example, the prober comprises a chuck configured for carrying the device under test, a transport circuitry for transporting electric signals to and/or away from the device under test. A cooling unit is directly thermally coupled with the device under test and configured for cooling the device under test at a main surface of the device under test facing the chuck.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: October 25, 2022
    Assignee: Infineon Technologies AG
    Inventor: Andreas Gneupel
  • Patent number: 11474544
    Abstract: A pressure control system for a liquid-cooled electronic component cooling device. A cooling device cools an electronic component through a refrigerant moving along a pipe. A radiator is mounted on one side of the cooling device to exchange heat with the refrigerant, and has a vent hole extending outwardly. A head has discharge holes communicating with a plurality of first hollows formed therein in an outer circumferential surface thereof with a driver hole provided in an upper surface thereof. A body is coupled to a bottom side of the head and has a second hollow communicating with the first hollows in a lengthwise direction. A pressure controller extends outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and includes a coupler having threads on one side of an outer circumferential surface thereof to be screwed into the vent hole.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: October 18, 2022
    Assignee: ZALMAN TECH CO., LTD.
    Inventor: Kuk Young Yoon
  • Patent number: 11470740
    Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: October 11, 2022
    Assignee: OVH
    Inventors: Ali Chehade, Hadrien Bauduin, Gregory Francis Louis Bauchart
  • Patent number: 11460899
    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John William Pennington, Jr., Rahul Shrikant Patil
  • Patent number: 11464136
    Abstract: A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: October 4, 2022
    Assignee: Carrier Corporation
    Inventors: Xu She, Ismail Agirman
  • Patent number: 11445634
    Abstract: A pushing action and a suction action are simultaneously performed on a working fluid passing through a heat transfer base, such that a heat exchange of cooling water can be efficiently performed, according to one embodiment of the present invention.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: September 13, 2022
    Assignee: ZALMAN TECH CO., LTD.
    Inventor: Kukyoung Yoon