Liquid Cooled Patents (Class 165/80.4)
  • Patent number: 10791649
    Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: September 29, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan M. Dede, Jongwon Shin, Yanghe Liu, Jae Seung Lee
  • Patent number: 10777966
    Abstract: An apparatus that includes a plurality of heat sources; a heat sink coupled to the plurality of heat sources; a heat-exchange-fluid flow path for heat-exchange fluid to flow through such that heat is removed from the heat sink, wherein the flow path includes: a heat-exchange-fluid inlet, a first branch that includes a plurality of segments including a first and second segment, wherein each of the plurality of segments includes an upstream end and a downstream end, wherein a first portion of the heat-exchange fluid flows through the first segment in a first direction and the first portion of the heat-exchange fluid flows through the second segment in a second direction, opposite the first direction, and a second branch, wherein a second portion of the heat-exchange fluid flows through the second branch such that the second portion of the heat-exchange fluid mixes with the downstream end of the second segment.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 15, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: Aleksandra Shepsis, Shuming Yuan
  • Patent number: 10763186
    Abstract: A semiconductor device assembly can include a first die package comprising a bottom side; a top side; and lateral sides extending between the top and bottom sides. The assembly can include an encapsulant material encapsulating the first die package. In some embodiments, the assembly includes a cooling cavity in the encapsulant material. The cooling cavity can have a first opening; a second opening; and an elongate channel extending from the first opening to the second opening. In some embodiments, the elongate channel surrounds at least two of the lateral sides of the first die package. In some embodiments, the elongate channel is configured to accommodate a cooling fluid.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Andrew M. Bayless, Wayne H. Huang, Owen R. Fay
  • Patent number: 10757833
    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
  • Patent number: 10746474
    Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 18, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Jorge Luis Rosales, Le Gao, Don Le, Jon James Anderson
  • Patent number: 10746479
    Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: August 18, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Brian Magann Rush, Daniel Jason Erno, Thomas Adcock, Stefano Angelo Mario Lassini
  • Patent number: 10732218
    Abstract: A method of checking a seal of a probe chamber or test chamber (thermal chamber) during a freezing temperature chamber condition. The thermal chamber provided includes a probe card or a contactor for electrically testing a semiconductor device under test (DUT), a gas inlet, a chiller which provides a freezing chamber temperature, and a pressure sensor for sensing a pressure in the thermal chamber (chamber pressure). Using the pressure sensor, the chamber pressure is sensed while flowing a dry gas through the gas inlet sufficient to render the chamber pressure a positive pressure. The positive pressure is compared to a reference pressure, and from the comparing it is determined whether the thermal chamber is properly sealed.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: August 4, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adolphus E. McClanahan, Alan J. Wegleitner, Daniel A. Fresquez, Mark Damone Gillette
  • Patent number: 10736240
    Abstract: A cooling module including a module panel comprising a bottom panel with top and bottom surfaces and a set of sidewalls coupled to the entire perimeter of the bottom panel. The bottom panel has openings to receive liquid cooling elements. The liquid cooling elements are inserted into the openings; each has an inlet and an outlet and is positioned so that there is a gap between the edges of the cooling element and the edges of the opening. The inlets and outlets are positioned on the side of the cooling element above the top surface of the bottom panel. A flexible deviation buffer is positioned in each gap and is coupled to the liquid cooling element and to the opening. The deviation buffer allows motion of the cooling element relative to the bottom panel while sealing the gap to prevent liquid from flowing through. The cooling module can improve liquid cooling reliability through quick leakage identification, leakage impact minimization, and segregation of liquid and electronics.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: August 4, 2020
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10736243
    Abstract: A cooling module for a parallel type power module of an inverter may include parallel type power modules configured to be disposed in three or more columns and rows, wherein three parallel type power modules are disposed to correspond to U, V, and W phases of the inverter in the three or more rows in each of the three or more columns, a first cooling water passage having a passage through which cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a first row, and a second cooling water passage having a passage through which the cooling water flows and configured to be brought into contact with an upper surface and a lower surface of a power module disposed at a third row.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: August 4, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Je-Hwan Lee, Han-Geun Jang, Eun-Cheol Lee, Seong-Min Lee, Yun-Ho Kim, Sang-Cheol Shin
  • Patent number: 10724748
    Abstract: An air-conditioning apparatus includes a refrigerant pipe through which refrigerant that flows through the refrigeration cycle passes; a pipe-side plate thermally connected to the refrigerant pipe; a control box thermally connected to the pipe-side plate and containing an electric component including a heating element; a housing of an outdoor unit, the housing containing the pipe-side plate and the control box; a positioning element fixing the pipe-side plate and the control box to each other; and a fastening element fixing the control box and the positioning element to each other. At least one side surface of the housing has a work opening. A front portion of the control box is positioned closer to the work opening in the housing, and a rear portion of the control box is positioned closer to a rear surface of the housing, the rear surface facing the side surface having the work opening.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: July 28, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshihiro Taniguchi, Shigeo Takata, Shinsaku Kusube, Daisuke Abe, Tomoki Kobayashi
  • Patent number: 10729034
    Abstract: The present disclosure relates to an electronic control unit for a motor vehicle, having a first electronic control device, in particular a first equipped circuit board. The electronic control unit additionally has a gas cooling duct for conducting a compressed gas. The gas cooling duct is connected in a thermally conductive fashion to the first electronic control device, and is designed to separate the compressed gas from the first electronic control device. The gas cooling duct has an expansion section in which a flow cross section of the gas cooling duct widens in order to expand and cool the compressed gas in order to cool the first electronic control device.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 28, 2020
    Assignee: MAN TRUCK & BUS AG
    Inventors: Albert Zaindl, Christian Brand, Philipp Pelzer, Lenz Thoma
  • Patent number: 10715011
    Abstract: An electrical machine includes an electric motor, a cooling jacket over the electric motor, and a power inverter having multiple AC power outlets. The electrical machine also includes an elongated busbar having an end adjacent to and coupled to an AC power outlet. The other end of the elongated busbar is adjacent to and coupled to the electric motor. The elongated busbar traverses from one end of the electric motor to a second end of the electric motor over, and in thermal contact with, the cooling jacket so as to reduce a high temperature at the electric motor to a low temperature at the AC power outlet.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: July 14, 2020
    Assignee: Karma Automotive LLC
    Inventors: Lei Gu, Zhong Nie, Yu Liu, Xiaogang Wang
  • Patent number: 10707771
    Abstract: A traction inverter system includes a capacitor module, a power module, a cold plate between and in contact with the modules, and an end plate defining an inlet and outlet. The modules and plates define a bore spanning the modules and plates, and a passageway in fluid communication with the inlet and outlet. The traction inverter system also includes a mechanical fastener occupying the bore, spanning the modules and plates, and clamping the modules and plates together.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: July 7, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Lihua Chen, Fan Wang, Fan Xu, Boris Curuvija, Baoming Ge, Shahram Zarei
  • Patent number: 10694640
    Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 23, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
  • Patent number: 10692798
    Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: June 23, 2020
    Assignee: Advanced Thermal Solutions, Inc.
    Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
  • Patent number: 10684662
    Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop along one side of the at least one barrier in one direction and along an opposite side of the at least one barrier in an opposite direction.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David A. Moore, Kianoush Naeli, Valerie J. Marty, James McKinnell
  • Patent number: 10681833
    Abstract: A mounting assembly and an inverter assembly using the same are disclosed. The mounting assembly includes a waterproof component and a fixing component. The waterproof component includes a first side facing the inverter, a second side facing the wall surface, an opening and a gasket set. The opening runs through the first side and the second side. The gasket set is disposed around the opening. The gasket set abuts against the wall surface and the inverter. The inverter is electrically connected with a wire running through the opening. The fixing component is disposed on the wall surface and connected to the waterproof component. The fixing component includes a third surface facing the inverter, a fourth surface facing the wall surface, and a first engaging element. The first engaging element engages with a second engaging element of the inverter to mount the inverter on the wall surface.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: June 9, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Chou, Chen-Wei Ku, Xin-Hung Lin
  • Patent number: 10679926
    Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly
  • Patent number: 10680489
    Abstract: A cooling device for an electrical machine, which is intended to be mounted in a mobile assembly, the device including a dielectric liquid reservoir mounted to a casing in a leak-tight manner, and including a discharge conduit for dielectric liquid extending into the reservoir from a discharge hole of the casing at one end of the reservoir toward an opposite end of the reservoir.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: June 9, 2020
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Stephane Decaux, Guillaume Tavernier, Francois Paris
  • Patent number: 10681846
    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: June 9, 2020
    Assignee: Google LLC
    Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
  • Patent number: 10651112
    Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: May 12, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
  • Patent number: 10646959
    Abstract: Additive manufactured components including sacrificial caps, and methods of forming components including sacrificial caps are disclosed. The additive manufactured components may include a body portion including a first surface, and a feature formed in the body portion. The feature may include an aperture formed through the first surface of the body portion. Additionally, the components may include a sacrificial cap formed integral with at least a portion of the first surface of the body portion. The sacrificial cap may include a conduit in fluid communication with the feature. The sacrificial cap including the conduit may be removed from the body portion to expose the first surface and the aperture of the feature, respectively, after performing one or more post-build processes, such as shot peening, on the component and the sacrificial cap.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: May 12, 2020
    Assignee: General Electric Company
    Inventors: Brendon James Leary, Thomas Etter, Felix Martin Gerhard Roerig, Julius Andreas Schurb
  • Patent number: 10627587
    Abstract: A connector assembly adapted to connect a plug to a communication device comprises a receptacle and a connection base. The receptacle is adapted to be fixed on a circuit board of the communication device and mated with the plug. The connection base is adapted to be fixed on a housing panel of the communication device. The connection base has a main body portion located outside the housing panel of the communication device and an insertion cavity adapted to receive at least a portion of the receptacle. The connection base is in thermal contact with the receptacle.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: April 21, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Svenska AB
    Inventors: Qingquan Wan, Zhigang Song, Hans Magnus Emil Andersson, Haibo Zhang, Songhua Liu
  • Patent number: 10622280
    Abstract: A semiconductor device includes a semiconductor element, a cooler, and a heat conductive body. The cooler faces one surface of the semiconductor element, and has a flow passage of a coolant. As viewed from the flow direction of the coolant, a width of the flow passage is wider than a width of the semiconductor element. The heat conductive body is made from graphite having such an anisotropy that a heat conductivity in the in-plane direction of a predetermined surface is higher than a heat conductivity in the normal direction of the predetermined surface. The width of the heat conductive body is wider than the width of the semiconductor element as viewed from the flow direction of the coolant. The heat conductive body is configured such that the predetermined surface is non-parallel to both of the flow direction of the coolant and the one surface of the semiconductor element.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: April 14, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Masataka Deguchi
  • Patent number: 10619902
    Abstract: A refrigeration system for use in transport includes a compressor, a condenser, and an evaporator connected in series, an evaporator fan, a supply air temperature sensor, a return air temperature sensor, and a controller. The evaporator fan is configured to discharge supply air from the system to a refrigerated space. The supply air temperature sensor is configured to sense the supply air temperature of the supply air. The return air temperature sensor is configured to sense a return air temperature of return air returning from the refrigerated space to the system. The controller is programmed to determine a requirement for moderate heating and a requirement for increased heating based on the supply air temperature and the return air temperature, to activate the evaporator fan when the requirement for moderate heating is determined, and to increase a speed of the evaporator fan when the requirement for increased heating is determined.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: April 14, 2020
    Assignee: Thermo King Corporation
    Inventors: Ole Thogersen, Allan Dyrmose, Dan Vad Steffensen
  • Patent number: 10613601
    Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: April 7, 2020
    Assignee: Asetek Danmark A/S
    Inventor: André Sloth Eriksen
  • Patent number: 10615100
    Abstract: An electronics assembly comprises a semiconductor device having a first device surface and at least one device conductive layer disposed on the first device surface. A cooling structure is coupled to the semiconductor device. The cooling structure comprises a first cooling structure surface and a second cooling structure surface. The second cooling structure surface is opposite from the first cooling structure surface and the first cooling structure surface is coupled to the semiconductor device. One side cooling structure surface is transverse to the respective first and second cooling structure surface. The one side electrode is disposed on the at least one side cooling structure surface in which the at least one side electrode is electrically coupled to the at least one device conductive layer. The cooling structure includes a fluid inlet for receiving a cooling fluid and a fluid outlet for removing the cooling fluid from the cooling structure.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: April 7, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Yuji Fukuoka
  • Patent number: 10613603
    Abstract: Techniques for inducing heterogeneous microprocessor behavior using non-uniform cooling are described. According to an embodiment, a device is provided that comprises an IC chip comprising a plurality of cores and a cooling apparatus coupled to the integrated chip that cools the integrated chip in association with electrical operation of the plurality of cores. The cooling apparatus cools a first core of the plurality of cores to a lower temperature than a second core of the plurality of cores. In various embodiments, the cooling apparatus comprises a plurality of channels embedded within the integrated chip and the cooling apparatus cools the integrated chip via flow of liquid coolant through the plurality of channels.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: April 7, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Pradip Bose, Alper Buyuktosunoglu, Timothy Joseph Chainer, Pritish Ranjan Parida, Augusto Javier Vega
  • Patent number: 10608548
    Abstract: A power conversion device that can prevent decrease in sealing properties between a case and a fixed member. The power conversion device has a case, a fixed member, and a seal member. The case has a metallic case body. The fixed member is fixed to the case from the outside of the case. The seal member adheres closely to both the case and the fixed member to ensure water-tightness between the case and the fixed member. The case is partly formed with a corrosion-resistant portion that is less likely to suffer corrosion than the case body. The fixed member is attached to the corrosion-resistant portion via the seal member.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: March 31, 2020
    Assignee: DENSO CORPORATION
    Inventors: Daisuke Harada, Koichi Nambu, Norihiro Tanaka
  • Patent number: 10594004
    Abstract: A battery pack having a battery module and a cooling plate are provided. The battery pack has a bottom surface and a first plane that extends through the battery module parallel to the bottom surface. The cooling plate has a bottom pan and a top plate that are coupled together and extend along a longitudinal axis. The bottom surface of the battery module is disposed on the top plate. The bottom pan has a first cooling region with first and second flow path patterns therein that receive a refrigerant therethrough. The first and second flow path pattern are shaped and sized to maintain a temperature of first and second halves, respectively, of a cross-sectional area of the battery module within one degree Celsius of a first temperature level.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: March 17, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Scott Dudley, Amanda Nowicki
  • Patent number: 10582649
    Abstract: The present invention relates to a heat exchanger for cooling an electrical device, and more specifically, to a heat exchanger for cooling an electrical device, the heat exchanger being mechanically assembled through connection blocks while stacking a cooling flow path, which forms a cooling water flow path, and the electrical devices, thereby facilitating the insertion of the electrical devices and enabling pressing force between the cooling flow path and the electrical device to increase, such that cooling performance is improved.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: March 3, 2020
    Assignee: Hanon Systems
    Inventors: Wi Sam Jo, Jun Young Song, Hong-Young Lim, Dong Suk Lee, Sun Mi Lee
  • Patent number: 10582640
    Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: March 3, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Harvey Lunsman, Ernesto Ferrer Medina, John Franz
  • Patent number: 10562469
    Abstract: An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: February 18, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Ercan M. Dede
  • Patent number: 10553516
    Abstract: A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are vertically aligned. The microcoolers may include an inlet passage to accept coolant and an outlet passage to expel the coolant. One or more microcoolers may be thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the passages and heat from the one or more microcoolers may transfer to the liquid coolant.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: February 4, 2020
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Daniel A. Corliss, Dario Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka
  • Patent number: 10553522
    Abstract: A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: February 4, 2020
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Daniel A. Corliss, Dario Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka
  • Patent number: 10548239
    Abstract: A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: January 28, 2020
    Assignee: Google LLC
    Inventors: Madhusudan Krishnan Iyengar, Gregory Sizikov, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang
  • Patent number: 10548240
    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: January 28, 2020
    Assignee: Google LLC
    Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
  • Patent number: 10542636
    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: January 21, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
  • Patent number: 10537045
    Abstract: A device has an electronics housing and a tube cooler with a tube formed in one piece from a single material. The tube has a tube coil and a first tube portion, between which the electronics housing is arranged, and a first connecting portion. The first connecting portion fluidically connects the first tube portion to a first side of the tube coil. The first tube portion is connectable to a coolant supply and arranged laterally offset with respect to the tube coil. The tube coil and the first tube portion extend on a common side of the first connecting portion. The first connecting portion is inclined with respect to the tube coil and to the first tube portion and/or is curved from the tube coil to the first tube portion.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: January 14, 2020
    Assignee: Continental Automotive GmbH
    Inventor: Nikolaus Kerner
  • Patent number: 10506741
    Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 10, 2019
    Assignee: TRUMPF Huettinger GmbH + Co. KG
    Inventors: Roland Lodholz, Christian Wunderle
  • Patent number: 10492333
    Abstract: A high efficiency heat sink for the cooling of microelectronic devices involves a phase change from liquid fluid to fluid vapor with a vapor quality of 100%. The liquid fluid is provided to an active area that contains fins having micrometer dimension that support a membrane that is nanoporous. The membrane is effectively impermeable to liquid fluid but permeable to fluid vapor. The heat sink provides very high heat flux and coefficient of heat transfer at low mass flux over a broad range of surface superheat temperatures. The heat sink can be constructed of equi-spaced posts that separate liquid microchannels from vapor microchannels that are connected through capillary forced valves formed between adjacent equi-spaced posts.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: November 26, 2019
    Assignee: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED
    Inventors: Saeed Moghaddam, Seyyed A. Fazeli
  • Patent number: 10477723
    Abstract: A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: November 12, 2019
    Assignee: BASELAYER TECHNOLOGY, LLC
    Inventors: William Slessman, Andreas Zoll
  • Patent number: 10468333
    Abstract: A cooling apparatus for a semiconductor module including a semiconductor chip is provided, including; a ceiling plate having a lower surface; a casing portion having a coolant circulation portion and an outer edge portion surrounding the coolant circulation portion, the coolant circulation portion being arranged to face the lower surface of the ceiling plate, and the casing portion being closely attached, directly or indirectly, to a lower surface of the ceiling plate at the outer edge portion; and a cooling fin arranged in the coolant circulation portion, where the ceiling plate and the casing portion have a fastening portion in which the ceiling plate and the outer edge portion are stacked, and the fastening portion fastens the ceiling plate and the casing portion to an external device, and the cooling apparatus further includes a reinforcing member provided between the ceiling plate and the casing portion at the fastening portion.
    Type: Grant
    Filed: January 27, 2019
    Date of Patent: November 5, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromichi Gohara, Takafumi Yamada, Yuta Tamai
  • Patent number: 10462940
    Abstract: The present invention is a system for cooling high power, heat generating devices. The system includes a metal matrix composite (AlSiC) having a coefficient of thermal expansion substantially equal to that of the heat generating device. The metal matrix composite (MMC) includes interior cooling channels and at least one Pyrolytic Graphite insert laterally positioned against the cooling channels. The heat generating device is placed on the metal matrix composite top surface in a substantially parallel relationship with the Pyrolytic Graphite insert surface area for maximum heat transfer efficiency.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: October 29, 2019
    Assignee: CPS Technologies
    Inventor: Mark Occhionero
  • Patent number: 10443949
    Abstract: The invention is provided with a support tube (101) and an inner tube (103) installed inside thereof, the diameter differentiation between the inner diameter of the support tube (101) and the outer diameter of the inner tube (103) is formed with a partitioned space for constituting a fluid path, the upper tube of the support tube (101) is installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed on the heat transfer fluid path to pump the heat transfer fluid to form a closed recycling flow, and through passing the support tube (101) of the mentioned closed recycling heat transfer fluid path and the exposed portion at the outer surface of the relevant structure, thereby enabling to perform temperature equalizing operation with the external gaseous or solid or liquid environment and/or the soil or liquid of the shallow ground natural thermal energy body.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: October 15, 2019
    Inventor: Tai-Her Yang
  • Patent number: 10446471
    Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JaeHong Park, Hanhong Lee, Sungwoo Joo, Woon-young Baek
  • Patent number: 10437299
    Abstract: An electronic device includes a first housing portion, a second housing portion, a circuit board, a battery, a display screen, and a heat-dissipating structure. The second housing portion is coupled together with the first housing portion. The circuit board and the battery are received within the second housing portion. The heat-dissipating structure is arranged between the circuit board and the display screen. The heat-dissipating structure includes a substrate including a first surface and a second surface opposite to the first surface and defines an opening passing through the first surface and the second surface. The heat dissipating element is located in the opening.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 8, 2019
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Hsin-Wei Wang, Chia-Hsin Chang
  • Patent number: 10437298
    Abstract: A lifting mechanism is adapted to bear an expansion unit, and the expansion unit contacts or is separated from a heat dissipating module. The lifting mechanism includes an outer casing base and a bearing base. The bearing base is disposed on the outer casing base liftably along a first axis. The expansion unit is disposed on the bearing base. When the bearing base is located at an original position relative to the outer casing base, the expansion unit on the bearing base is separated from the heat dissipating module. When the bearing base is lifted relative to the outer casing base along the first axis to a lifting position, the expansion unit on the bearing base contacts the heat dissipating module. An electronic device having the lifting mechanism is further provided.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: October 8, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yen-Chia Chang, Shih-Wei Wang
  • Patent number: 10431524
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10422018
    Abstract: A method and an apparatus for producing metallic semi-finished products by means of remelting and/or remelt-alloying. Here, the material is melted selectively locally in a melting capillary in the material volume by means of high-energy, focused radiation, the melting capillary is moved through the material and the material is cooled down at a high cooling rate by means of a cooled heat sink, which is located close to the melting capillary and coupled to the material in a well heat-conductive manner.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: September 24, 2019
    Assignee: G. Rau GmbH & Co. KG
    Inventor: Gerhard Sedlmayr