Abstract: The present disclosure presents a heat exchange plate with slotted airfoil fins for a printed circuit heat exchanger. In the present disclosure, a herringbone streamlined slot is arranged on a fin so that a part of the heat exchange fluid can flow through a channel of the slot and flow out from the tail of the fin. In such a way, the perpendicular hitting on the fin can be prevented, thereby prevent forming of the stagnation area, mitigating phenomenon of substantial flow resistance in this area and, in turn, reducing the pressure drop of channel. Meanwhile, the slotted area could substantially increase the heat exchanging area and thus improve the heat exchanging performance.

Abstract: There are provided an apparatus for heat exchange by using a braided fabric woven from a thermally conductive wire material and a light emitting diode (LED) lighting device. The apparatus comprises a braided fabric (1) woven from a thermally conductive wire material, and a heat dissipating or absorbing object (2) is fixed with the braided fabric (1) by using methods such as welding, adhering with a thermally conductive adhesive and casting, so as to ensure that heat energy is effectively conducted between the heat dissipating or absorbing object (2) and the thermally conductive wire of the braided fabric (1), and heat is dissipated to air or absorbed from air by means of a heat dissipating surface of the thermally conductive wire of the braided fabric (1).

Abstract: The present application provides a heat sink, including: a heat dissipation plate and at least one heat dissipation tube, the heat dissipation tube further including a first tube section. The bent part and a second tube section, with the first tube section of the heat dissipation tube is at least partially embedded in the heat dissipation plate and the second tube section is arranged outside the heat dissipation plate. The first tube section and the second tube section are parallel to each other and connected via the bent part. The heat dissipation tube is provided with at least one cooling fin extending outwards from an outer wall of the heat dissipation tube. In addition, a frequency converter employs the heat sink in an embodiment. The heat sink of at least one embodiment has high heat dissipation efficiency and a small volume.

Abstract: The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.

Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.

Abstract: An example air management system includes laterally spaced apart rows of electrical equipment that each provide a flow path between two convection regions on opposing sides of the row. A plurality of supply aisles and a plurality of return aisles are interposed between each other. Each supply and return aisle has a respective room portion that includes a respective one of the convection regions, a respective ceiling portion disposed above the room portion, and a vented barrier portion therebetween. Each supply aisle provides airflow downwards from its ceiling portion to its convection region, and each return aisle provides airflow flow upwards from its convection region to its ceiling portion. A plurality of air handling units are located external to the plurality of rows and are configured to utilize the ceiling portions of the supply aisles as supply ducts, and utilize the ceiling portions of the return aisles as return ducts.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.

Abstract: A height-adjustable fan fixing structure and a height adjustment method are provided. The height-adjustable fan fixing structure includes a fan box rear cover and a fan box front cover, the fan box rear cover and the fan box front cover cooperating to fix a fan; and further includes a height adjustment block, the height adjustment block being adjustably mounted on a whole piece formed by connection of the fan box rear cover and the fan box front cover, the lower end of the two side surfaces of the height adjustment block being provided with trunkings, each of the trunkings being provided with a rotatable wire screw, positions, corresponding to the two ends of each wire screw, on the fan box rear cover and the fan box front cover being provided with clamping holes, the two ends of the wire screw being inserted into the clamping holes.

Abstract: A chassis is disclosed that includes a first sidewall, a second sidewall and a baffle having a plurality of penetrations, a first side and a second side and configured to be inserted into the chassis between the first sidewall and the second sidewall. An air block is disposed in each penetration, wherein each air block can be selectably configured in either a closed position to prevent air flow or an open position to allow air flow.

Abstract: A battery arrangement, such as for a motor vehicle, includes a plurality of cells for storing electric energy, the cells being arranged on a carrier component, and a cooling arrangement, the cooling arrangement having cooling ducts which are configured to allow a cooling medium to flow therethrough, The cooling ducts are produced at least in sections by way of an additive application process involving layer by layer material application on the carrier component.

Abstract: A heat sink includes a threaded rod. The threaded rod includes a first portion and a second portion. The first portion may engage with a first heat sink fin and a second portion may engage with a second heat sink fin. The first portion includes a first external thread of a first diameter. The second portion includes a second external thread also of the first diameter and of different pitch than the first external thread. For example, the pitch of a first knurl of the threaded rod may be smaller than the pitch of a second threaded knurl of the threaded rod. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Abstract: The disclosure provides a retainer which is configured to be mounted on and fix heat dissipation module onto chip platform. The retainer includes pressing portion, first and second latching portions. The first latching portion includes flat portion and flexible curved portion, the flexible curved portion is connected between the pressing portion and the flat portion, long side of the flat portion is substantially perpendicular to a long side of the pressing portion. The second latching portion is connected to the pressing portion. A long side of the second latching portion is substantially perpendicular to the long side of the pressing portion. The first portion and the second latching portion are configured to be detachably engaged at two opposite sides of the chip platform so as to deform the flexible curved portion and utilize the flexible curved portion to enhance a pressing force applied to the heat dissipation module.

Abstract: Provided is a power conversion device including: power semiconductor elements, a support case, a heat sink, in which a plurality of boss portions are formed; a smoothing capacitor including a case member having a plurality of leg portions; and a bus bar configured to connect the smoothing capacitor and the DC input terminal, wherein, in the power conversion device in which the plurality of leg portions of the case member being respectively fixed to the plurality of boss portions of the heat sink, wherein materials and dimensions of the respective boss portions, the respective leg portions, the support case, and the bus bar are determined so that a total thermal expansion/contraction amount of the respective boss portions and the respective leg portions falls within a range of 0.9 to 1.1 relative to a total thermal expansion/contraction amount of the support case and the bus bar.

Abstract: A semiconductor refrigeration assembly includes a semiconductor refrigeration assembly, a heat-dissipation member, a cup body, and a base. The semiconductor refrigeration assembly is embedded in the bottom wall of the cup body and has an end exposed out of the cup body. The heat-dissipation member is arranged over the bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly. The base is configured to support the heat-dissipation member and to supply power to the semiconductor refrigeration assembly. The semiconductor refrigeration cup has a better heat-dissipation effect.

Abstract: Heat-rejecting media may thermally couple to a device, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the device and thermally couple between the device and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the device to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the device and thermally couple between the device and a system-level air mover other than the active cooling system and configured to drive airflow to components of a system comprising the device such that the heat transferred to the passive heat-rejecting media from the device is transferred to the airflow driven by the system-level air mover.

Abstract: A semiconductor memory system having a plurality of semiconductor memory modules that are spaced apart from each other by a gap. The system includes a heat dissipation assembly having a thermally conductive base portion configured to transfer heat away from the memory devices. The heat dissipation assembly including at least one cooling unit extending from the base portion. The at least one cooling unit having a wall with an exterior surface and a cavity. The cooling unit is configured to fit in the gap between adjacent memory modules such that a portion of the exterior surface on a first side of the cooling unit is coupled to one of the first memory devices and another portion of the exterior surface on a second side of the cooling unit is coupled to one of the second memory devices across the gap.

Abstract: A heat dissipating fin assembly includes a bottom, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover and an outer cover. The first heat dissipating fins extend from an inner end toward an outer end. The second heat dissipating fins are arranged between two of the first heat dissipating fins in staggered. The inner cover is disposed near the inner end and connected to the first heat dissipating fins. The outer cover is disposed near the outer end and connected to the second heat dissipating fins. The inner cover and the outer cover are separated to form an opening, and the dusts entering the heat dissipating fin assembly through the inner end are ejected via the opening. The second heat dissipating fins extend from around the opening to the outer end.

Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached to the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.

Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

Abstract: A PC module assembly, comprising a PC module support, the PC module support comprising a bottom wall and a first side wall, the first side wall being provided with a first air outlet, an air inlet of a heat dissipation structure communicatively connected to the first air outlet. When mounting of a PC module, the PC module is mounted on the bottom wall, enabling the position of an air outlet of the PC module to correspond to the position of the first air outlet. When the PC module is in an operating state, hot air flow formed by the heat generated inside the PC module enters the first air outlet, and is diverted through the heat dissipation structure, so that the heat is dissipated from the inside of the PC module, thereby allowing the PC module to operate in a stable manner.

Abstract: A method of cooling a component with a heat exchange device includes pulling air into a central airway in a heat exchange device using a blower; directing the air from the blower through a diffuser and across a heat sink base, wherein a first component positioned underneath the heat sink base is cooled when the air passes over the heat sink base; and directing the air out from the diffuser and across a second component to cool the second component.

Abstract: The present disclosure provides a thermal superconductive finned heat sink and an electrical equipment cabinet. The thermal superconductive finned heat sink includes: a base plate; a plurality of thermal superconductive fins inserted into the surface of the base plate; the thermal superconductive fin has a composite plate structure, a thermal superconductive channel line is formed in the thermal superconductive fin, the thermal superconductive channel line is a closed channel line, and is filled with heat-transfer working medium; the thermal superconductive fin has a U-shaped plate structure, including a flat plate main body and sides which bend relative to the flat plate main body; the projection area of the plurality of thermal superconductive fins, onto the plane where the base plate is located, is greater than the area of the base plate.

Abstract: A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.

Abstract: An evaporator structure with improved layout of cooling fluid channels includes a heat exchange component, a thermal conductive shell and a top cap. The heat exchange component is accommodated in the thermal conductive shell; the top cap mounted on the thermal conductive shell encloses the heat exchange component; the heat exchange component includes a plurality of transverse channels thereon, two first lengthwise cooling fluid channels near two side edges at the bottom respectively and a plurality of minor second lengthwise cooling fluid channels near the center. When the thermal conductive shell is heated, cooling fluids flowing to first lengthwise cooling fluid channels at both sides through transverse channels are guided into second lengthwise cooling fluid channels via the first lengthwise cooling fluid channels and the transverse channels and distributed throughout heat sources uniformly for full-area heat dissipation.

Abstract: A cooling unit having two single piece cold plate pipe components is disclosed. The cooling unit has a first pipe operable to transport coolant. A first cold plate has a top surface with a lateral groove to accept a section of the first pipe. The groove includes a first inlet coupled to a first hole in the section of the first pipe. The groove has a first outlet coupled to a second hole in the section of the first pipe. Coolant is circulated from the first inlet through the cold plate to the first outlet. The section of the first pipe is connected to the first cold plate. A second pipe is operable to transport coolant. A second cold plate is located next to the first cold plate. The second cold plate has a groove to accept a section of the second pipe. The groove includes an inlet coupled to a first hole in the section of the second pipe. The groove includes an outlet coupled to a second hole in the section of the second pipe.

Abstract: A light source apparatus according to an embodiment of the present disclosure includes: a rotator including a light emission unit on one surface, a heat dissipation member that is coupled to the rotator, and has a first cylindrical surface substantially parallel to a rotation axis of the rotator, and a housing that contains the rotator and the heat dissipation member, and has a second cylindrical surface substantially parallel to the first cylindrical surface of the heat dissipation member.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents. The wall also includes an exhaust zone containing a set of exhaust vents.

Abstract: A semiconductor device assembly includes: a semiconductor device; a heat exchanger; and a thermal interface material. In embodiments, the thermal interface material may contact a facing surface of the heat exchanger, the thermal interface material includes alloys that react with a bond enhancing agent to form an indium alloy layer in a portion of the thermal interface. In embodiments, a solid, solder preformed thermal interface material includes an indium metal and may be disposed on the first surface of the semiconductor device; and a liquid metal bond enhancing agent may be disposed on a first surface of the semiconductor device; and contacting a facing surface of the heat exchanger.

Abstract: An immersion tank includes a tank main body configured to store a coolant, at least one first air bag that is provided in the tank main body, that is coupled to a bottom portion of the tank main body, that is able to be inflated toward an upper portion of the tank main body, and that is able to be deflated, from an inflated state thereof, toward the bottom portion, and a guide member that is provided outside the at least one first air bag in the tank main body and that is configured to guide the at least one first air bag during the inflation and the deflation of the at least one first air bag.

Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.

Abstract: An image forming apparatus that efficiently cools two circuit boards with one fan. An AC input circuit board has an AC power supply voltage supplied thereto from a commercial power supply, and includes a drive circuit for driving a heater. A power supply circuit board has an AC voltage supplied thereto from the AC input circuit board, and includes a conversion circuit for converting the AC voltage to a DC voltage. A sheet metal having a tubular shape covers the power supply circuit board. A fan cools the power supply circuit board. A duct member is arranged in a manner overlapping the sheet metal and cooperates with part of a wall portion of the sheet metal to form a flow passage for cooling the AC input circuit board with wind generated by the fan.

Abstract: A blade body of a turbine blade, which defines an interior cavity fluidly communicative with coolant, is provided. The blade body includes an interior surface and one or more pins extending from the interior surface. The interior surface and the one or more pins are disposable to thermally interact with the coolant. At least one of the one or more pins includes a first section and a second section interposed between the first section and the interior surface. The first section has a larger cross-sectional area than the second section.

Abstract: An underground equipment vault system having a body or casing, an intake duct, an intake vent, one or more equipment hangers, an exhaust duct, an exhaust vent, and one or more ventilated compartments. The underground vault system is configured to improve air flow from underneath, or from a low portion of, the body of the vault, provide flexible positioning or location options for the intake vents and the exhaust vents away from the vault body, cool the intake air, and reduce the noise impact of the vault.

Abstract: One illustrative method embodiment includes: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

Abstract: A circuit board assembly for retrofitting a circuit board on a power drive unit (PDU) may comprise an enclosure, a circuit board disposed in the enclosure, and a potting component disposed in the enclosure. The circuit board assembly may further comprise a dielectric sheet and a backing sheet. The dielectric sheet may be disposed between the backing sheet and the printed circuit board assembly.

Abstract: A connector comprises a cage, a radiator disposed on a top wall of the cage and having a vertical slot extending through the radiator in a lateral direction of the radiator, a clip adapted to be locked to the top wall of the cage, and a sealing cover mounted on the vertical slot. The clip has an elastic lateral beam received in the vertical slot and adapted to press the radiator on the top wall of the cage. The sealing cover at least partially seals the vertical slot.

Abstract: Embodiments disclose a radiator component and a heat dissipation system for a power semiconductor device. The radiator component for a power semiconductor device includes a heat dissipation body including an inner-ring substrate, an outer-ring substrate, and a plurality of heat sinks. In an embodiment, the outer-ring substrate surrounds the inner-ring substrate and the plurality of heat sinks are arranged between the inner-ring substrate and the outer-ring substrate. One or more first power semiconductor device arrangement positions are provided on an inner circumferential surface of the inner-ring substrate and one or more second power semiconductor device arrangement positions are arranged on an outer circumferential surface of the outer-ring substrate. The radiator component further includes a fan component. The embodiments can save on space, reduce costs, improve the heat dissipation efficiency, and avoid the problem of disturbances between a plurality of fans.

Abstract: There is provided an ink-jet recording apparatus, including: a casing which is box-shaped, and which has an internal space; a recording head arranged in the internal space, and configured to jet ink droplets; a carriage which is movable, and is arranged in the internal space, and on which the recording head is mounted; and a dust-proof portion arranged between a movable space and an exterior of the casing, the movable space being a space, in the internal space, in which the carriage is movable.

Abstract: A refrigerator includes a cabinet, a door, a transparent panel assembly disposed at the door and defining a see-through part through which an interior of the refrigerator is visible, and a first light disposed closer to the interior than the transparent panel assembly to brighten an area viewed by the see-through part. The transparent panel assembly includes transparent panels spaced apart from each other to define an accommodation space, a display disposed in the accommodation space to output a screen, and a second light brightening the display. The display, the first light, and the second light are selectively turned off according to manipulation of a user to be converted into an opaque state in which the interior is not visible and a transparent state in which the interior is visible, and in the transparent state, a screen is outputted while an inner space of the refrigerator is seen.

Abstract: The present disclosure discloses a keyboard including a base plate, membrane circuit board, a plurality of keys and a frame. The base plate includes a plurality of assembly areas and a first opening. The first opening is disposed between some said assembly areas. The membrane circuit board is disposed above the base plate. The membrane circuit board includes a second opening corresponding in position to the first opening, respectively. The frame is disposed above the base plate, and the membrane circuit board is disposed between the base plate and the frame. The frame blocks the first and second openings. The frame includes receiving portions corresponding in position to the assembly areas. The keys pass through the receiving portions and are fixed to the assembly areas of the base plate, respectively. Gaps between the frame and keys, the first and second openings jointly form an air current channel.

Abstract: A finned heat sink (1) comprising a stack of N finned heat sink plates (3). The N finned heat sink plates comprise a top plate (3a) on top of a bottom plate (3b) and optionally at least one sandwiched plate (3c). The bottom plate (3b), the top plate (3a) and the sandwiched plate (3c) comprise a heat dissipating fin (9) and an opening (7). The fins (9) are bent out of plane of the plates (3). The fin (9) of the bottom plate (3b) and the sandwiched plate (3c) extend through the opening (7a) in the top plate (3a) in the same direction as the fin (9a) of the top plate (3a).

Abstract: A local area network system that includes modular, multi-frequency, multi-channel, upgradable transmission nodes. The transmission nodes may include one or more independent RF modules and may be configured to include, for example, 802.11ac and may evolve to LTE and other technologies and frequency bands.

Abstract: A backplate for a head-mounted display (HMD) is disclosed. The backplate provides structural support as well as thermal cooling for components coupled to the backplate. The backplate includes a plurality of mounting regions that are used to couple components to the backplate. The mounting regions may include camera mounting regions (e.g., for inside-out tracking), an inertial measurement unit (IMU) mounting region, circuit board mounting regions, heat pipe mounting region, and a fan mounting region. The mounting regions may be specific to the component. In various embodiments, the backplate is a single diecast metal plate that includes the mounting regions designed to provide certain levels of thermal management, stiffness, and conductivity (e.g., ground) for the HMD.

Abstract: A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount.

Abstract: A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.

Abstract: An optical module including a heat sink having one or more heat dissipating surfaces, a fan for sending air over said one or more heat dissipating surfaces, and a light source held by said heat sink. The main feature of an optical module according to the invention is that the fan is mounted on the heat sink by clipping.

Abstract: A lamp unit includes: a laser light source having a CAN type package; a pedestal having a back surface in contact with a heat sink and a front surface on which the laser light source is mounted; and a pressing member that abuts onto an abutting portion of the laser light source and presses the laser light source in a direction toward the pedestal. The pressing member and the pedestal are fixed to the heat sink by fastening with a common fixing member.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Abstract: According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.