Abstract: A computer component cooling device to cool one or more heat-emitting components of a computer comprising a fan that draws air there through in a flow path; a heat transfer tank including one or more channels therein to circulate a heat transfer fluid there through; a pump that pumps the heat transfer between the heat transfer tank and one or more component heat exchangers to cool the one or more heat-emitting components of the computer; a heat exchanger including a plurality of heating elements extending therefrom and into the flow path; and one or more Peltier devices including one or more cold sides thermally coupled to the heat transfer tank and one or more hot sides thermally coupled to the heat exchanger.

Abstract: An electronic apparatus having a suction port is disclosed. The electronic device includes a first main body, a second main body that has a main display and is coupled to the first main body to be rotationally movable around a first hinge, and a sub display that is installed on an upper surface of the first main body to be rotationally movable around a second hinge, and is configured to be opened relative to the first main body when the second main body is opened relative to the first main body. A suction port is formed in a part of the first main body that is covered with the sub display when the sub display is closed.

Abstract: Compressed air cooling is disclosed. In an embodiment, an assembly includes an input configured to receive compressed air. The assembly also includes an expansion chamber configured to at least in part contain an expansion of the compressed air. The assembly also includes a base configured to be thermally cooled via the expansion of the compressed air and configured to be coupled to an electronic component.

Abstract: Compressed air and lattice structure cooling is disclosed. In an embodiment, an assembly includes a heat conductive lattice structure with open-cell voids. The assembly also includes a port configured to provide compressed air that is directed toward the heat conductive lattice structure. The assembly also includes a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.

Abstract: An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.

Abstract: An electronics cabinet includes: an enclosure having a floor, a ceiling, a rear wall, opposed side walls, and a front wall that define an interior cavity; a divider panel that divides the interior cavity into upper and lower chambers; a first cooling system mounted to the enclosure to cool the upper chamber; and a second cooling system mounted to the enclosure to cool the lower chamber.

Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

Abstract: A cable connecting structure includes three three-phase power cable pairs respectively including a pair of power cables that are mutually connected, three insulating rubber connecting tubes covering connecting sections of the three three-phase power cable pairs, respectively, a steel pipe accommodating portions of each of the three three-phase power cable pairs, and the three rubber connecting tubes, and a heat dissipation material. The heat dissipation material is provided between the steel pipe and each of the three rubber connecting tubes, and makes contact with the steel pipe and each of the three rubber connecting tubes. The heat dissipation material includes a heat dissipating metal that has a melting point lower than a melting point of the steel pipe.

Abstract: A control method and apparatus for a smart power component, a storage medium and a processor are provided. The method includes that: first fitting information and second fitting information, which is detected by the smart power component, between a smart power component and an external heat sink is acquired; it is determined whether the first fitting information satisfies a preset condition, and it is determined whether the second fitting information satisfies a preset condition; when the first fitting information does not satisfy the preset condition, first prompt information is output; and when the second fitting information does not satisfy the preset condition, second prompt information is output. Thus, the technical problem that a poor fit between a smart power component and an external heat sink is not detected is solved.

Abstract: A case for computing devices includes an interface which provides connection to a plurality of auxiliary hardware resources. The plurality of auxiliary hardware resources may be mounted in the case. The case may also include space to accommodate the computing device in the case frame. As computing demands increase for the computing device, the computing device may be connected to the case frame's interface, which via an electrical bus, connects the computing device to one or more of the auxiliary hardware resources in the case. In some embodiments, the auxiliary hardware resources may be accessed by the user on-demand. In some embodiments, a cooling fan may cool the ambient temperature of the case and/or individual auxiliary pieces of hardware.

Abstract: Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.

Abstract: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.

Abstract: A system and method of reducing consumption of electricity used to cool electronic components such as in an electronic computer data center or in a facility of networking and telecommunications equipment, and to reduce the incidence of thermal failure of the electronic components, includes providing one or more partitions configured to form a reduced-volume cooled-environment chamber in order to supply cooled air from an air conditioning system to the chamber adjacent to racks containing the electronic components, thereby preventing dilution of the cooling air by warmer air from outside of the chamber, and controlling the delivery of cooling air through the reduced-volume cooled-environment chamber.

Abstract: A forced convection system includes a chassis defining a chassis housing and including an outer surface opposite the chassis housing. A forced convection device channel is defined by the chassis adjacent the outer surface and opposite the chassis housing. A heat dissipation structure extends from the chassis adjacent the outer surface, opposite the chassis housing, and adjacent the forced convection device channel. A first heat producing device is located in the chassis housing and engages the chassis immediately opposite the heat dissipation structure to allow the chassis and the heat dissipation structure to conduct heat generated by the first heat producing device. A forced convection device is located in the forced convection device channel, and produces a forced convective airflow past the heat dissipation structure to dissipate the heat generated by the first heat producing device and conducted by the chassis and the heat dissipation structure.

Abstract: A plate heat exchanger without straight flow channels is provided, for exchanging heat between fluids. Said heat exchanger, comprises a start plate, an end plate and a number of heat exchanger plates provided with a pressed pattern of ridges and grooves with a pitch. The heat exchanger plates are kept at a distance from each other by contact between ridges and grooves of neighboring plates in contact points, when said plates are being stacked onto one another. Flow channels are thus formed between said plates, the contact points are positioned so that no straight lines are formed along the length of the heat exchanger plates.

Abstract: A securing unit and a base seat securing structure. The base seat securing structure includes a base seat and multiple securing units. The base seat has a top side, a bottom side, multiple perforations and multiple securing holes formed through the base seat between the top side and the bottom side. The securing holes are positioned around the perforations. Each securing unit has a seat section disposed on the top side of the base seat and multiple connection sections. The seat section has a bore in communication with and corresponding to the perforation. The connection sections are disposed under a lower side of the seat section. One end of each connection section has one or multiple stopper end sections. The stopper end sections are passed through the corresponding securing holes to abut against the bottom side of the base seat.

Abstract: A robot includes a robot main body section including a base and a robot arm coupled to the base and including a sealed internal space, a driving section provided on the inside of the robot arm and configured to drive the robot arm, a control board provided on the inside of the base, a power supply board provided on the inside of the base and configured to supply electric power to the control board, a driving board provided on the inside of the robot arm and configured to drive the driving section based on a signal from the control board, a fan configured to stir gas on the inside of the robot main body section, and a heat sink provided on the inside of the base.

Abstract: The electrical connector is equipped with a retention mechanism for securing mounting a heat sink upon a CPU which is received within an insulative housing of the connector. The retention mechanism includes a pair of seats, a pair of towers fixed to the pair of seats, respectively, a pressing device retained between the pair of towers in a deformable manner. The pressing device is intimately seated upon the heat sink to significantly press the heat sink against the CPU when the pressing device is deformed in a tensional status.

Abstract: An object is to provide an LED floodlight that enables efficient use of a cooling means, e.g., a heat dissipation fan, and can pursue a reduction in size. Therefore, it is an LED floodlight wherein a panel-shaped floodlight portion formed as a floodlight surface is formed such that a plurality of LEDs is arranged on a front surface, a heatsink having a plurality of heat dissipation plates on a back surface of the panel-shaped floodlight portion, and a cooling fan configured to send air toward a central portion of the heatsink are arranged in this order, the LED floodlight is formed of an appropriate power supply circuit, wherein a plurality of heat dissipation plates of a heatsink is radially arranged from a central portion to a periphery, a central portion of a coupling surface between heat dissipation plates of the heatsink protrudes toward a cooling fan configured to send air and has a curved surface portion from a central portion to a periphery.

Abstract: Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating electronic devices; warming the airflow circulated through the racks; circulating the warmed airflow through a warm air inlet of the warm air plenum that is adjacent an open side of the racks and to a warmed air outlet adjacent a data center volume above the racks; circulating the airflow, with a fan positioned in a second module positioned in the data center volume above the racks, through at least one cooling module to cool the warmed airflow, and into a human-occupiable workspace of the data center adjacent the racks; and diverting the warmed airflow with an airflow partition mounted in the data center volume above the racks and adjusted to interrupt the warmed airflow between the warmed air plenum and the human-occupiable workspace.

Abstract: A composite manufacturing method with extruding and turning process for extruding and turning a workpiece includes a clamping step, an isolating step, an extruding step and a turning step. The composite manufacturing method is used for manufacturing a surgical instrument. The clamping step is for positioning a clamping portion of the workpiece by a lathe chuck of the lathe apparatus. The isolating step is for blocking a lathe extruding force via an isolating portion of an extruding apparatus. The extruding step is for extruding a processing end portion of the workpiece by the extruding apparatus and generating the lathe extruding force transmitted toward a clamping portion of the workpiece. The turning step is for turning the processing end portion of the extruded workpiece by a lathe apparatus. The extruding apparatus is disposed on the lathe apparatus.

Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

Abstract: An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a base and an air pump. The base includes a passage, an introduction opening and a discharge opening. The electronic component is covered by the base. The electronic component is disposed within the passage. The air pump is fixed on the base and sealing the edge of the introduction opening. When the air pump is enabled, an ambient air is introduced into the passage through the introduction opening to remove the heat from the electronic component, and the air heated by the electronic component is exhausted through the discharge opening.

Abstract: An approach to reduce thermal cycling fatigue associated with an identified component in an electrical system. The approach includes a controller determining power to the electrical system is turned off and initiating power from an external power source to one or more heating elements in a vicinity of the identified component. The approach includes a controller receiving a first temperature from one or more temperature sensors in the vicinity of the identified component and determining whether the first temperature is within a predetermined temperature range. Responsive to the controller determining that the first temperature is not within the predetermined temperature range, the approach includes the controller adjusting a power level of the one or more heating elements.

Abstract: A cooling device for stored energy sources, in particular for motor vehicles, is provided. The cooling device includes: multiple separate cooling modules, through which coolant can flow, for absorbing heat from the stored energy source, each module having an inflow and an outflow; a common feed line, from which the inflows of the cooling modules branch off; and a common discharge line, into which the outflows of the cooling modules open.

Abstract: Interconnection systems and methods are provided. An interconnector as disclosed allows for a first component having a first coefficient of thermal expansion to be joined to a second component having a second coefficient of thermal expansion securely, and while maintaining a precise alignment between the components. The interconnector generally includes a plurality of pins that each have a free end that is adhered to the first component for imaging, sensing, tracking, processing, and other applications.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM (thermal interface material) in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The present disclosure provides a power module assembly and an assembling method thereof. The power module assembly includes a housing, a circuit board, at least one resilient set, at least two power devices, and at least one fastening unit. The housing includes at least one heat-dissipation surface. The at least one resilient set is disposed between the housing and the circuit board and includes at least one resilient piece. Each resilient piece includes a base section and two pushing fingers, so as to form an M-word shape or a bird-wings shape. The fastening unit is disposed between the two power devices, connected to the base section of the resilient piece and configured to drive the base section of the resilient piece, so that the two pushing fingers of the resilient piece push against the two power devices respectively and the two power devices are attached to the heat-dissipation surface.

Abstract: Examples described herein include air impeding structures with snap-in tabs. In some examples, an air impeding structure for a processing unit socket cover includes a main body encloses an interior space, a first snap-in tab, and a second snap-in tab. The main body may include a first curved wall at a first end of the main body connected to a second curved wall at a second end of the main body. The first snap-in tab extends below the first end of the main body and is recessed in relation to the first curved wall. The second snap-in tab extends below the second end of the main body and is recessed in relation to the second curved wall.

Abstract: Thermal control logic receives a temperature signal representative of a temperature of a liquid crystal display (LCD). The thermal control logic is configured to selectively drive a motion actuator to couple a heat conduction element with a heat sinking layer that receives heat from one or more processors. The heat conduction element is coupled between the heat sinking layer and the LCD.

Abstract: An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

Abstract: Computer-implemented systems and methods for estimating a replacement status of an HVAC air filter. Outdoor weather data (e.g., outdoor temperature information), is obtained. A Total Runtime Value of the HVAC system is determined based upon the obtained outdoor weather data. Finally, a replacement status of the air filter is estimated as a function of a comparison of the Total Runtime Value with a Baseline Value. By correlating air filter replacement status with an estimated runtime of the HVAC system, a credible predictor of air filter usage is provided. By estimating fan runtime based on easily-obtained outdoor weather data, the methods are readily implemented with any existing HVAC system and do not require installation of sensors or other mechanical or electrical components to the HVAC system.

Abstract: Examples herein disclose a plenum. The plenum includes an enclosed structure to deliver cool air to multiple enclosures within a rack and multiple cables to route to the multiple enclosures within the rack. The plenum further includes a connector to attach the multiple cables in the plenum to one of the multiple enclosures.

Abstract: Examples herein disclose a heatsink including an extension portion and a base portion. The extension portion extends above a processing component to a fan, such that the extension prevents a heated air produced by the processing component to combine with cool air from the fan. The base portion, coupled to the extension portion, receives cool air from the fan via the extension portion and transfers heat from a different processing component in a posterior location to the processing component.

Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Abstract: According to various embodiments, a housing for a computer system may be provided. The housing may include: an upper portion configured to hold an input device of the computer system; a lower portion comprising a foot of the housing for the computer system; and a pressure drop reducing mechanism configured to increase an airflow between the upper portion and the lower portion by moving the lower portion away from the upper portion.

Abstract: A heat sink includes a plurality of apertures extending therethrough. The heat sink is arranged substantially parallel to a circuit board and includes at least one aperture transversely aligned with a corresponding IC chip of the circuit board. An underside of the heat sink is structurally connected to the circuit board. A plurality of thermal bridges is provided. Each thermal bridge includes a center bridge pad and at least one footer pad, connected via at least one offset wire. Each thermal bridge is aligned with a corresponding aperture. An underside of each footer pad is attached to the heat sink, with the offset wire extending into the corresponding aperture to suspend the center bridge pad at least partially into the aperture above the IC chip, thus creating a thermal load path. The apparatus separates a thermal load path from a structural load path in a circuit board environment.

Abstract: An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.

Abstract: An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing.

Abstract: A tape cartridge for a magnetic tape may be provided. The tape cartridge includes a magnetic tape surrounded by a housing and a temperature indicator that signals a temperature of the tape cartridge, for example, by a thermochromic label. Additionally, a system for tape cartridge data protection that interoperates with the tape cartridge is provided. The system includes a storage for holding a tape cartridge, a sensor that detects temperature information from the temperature indicator of the tape cartridge, and a control unit for controlling an actuator that performs an action depending on the detected temperature information. Furthermore, a method for operating the system for tape cartridge data protection is proposed.

Abstract: A device with thermal control is presented. In some embodiments, the device includes a plurality of die positioned in a stack, each die including a chip, interconnects through a thickness of the chip, metal features of electrically conductive composition connected to the interconnects on a bottom side of the chip, and adhesive or underfill layer on the bottom side of the chip. At least one thermally conducting layer, which can be a pyrolytic graphite layer, a layer formed of carbon nanotubes, or a graphene layer, is coupled between a top side of one of the plurality of die and a bottom side of an adjoining die in the stack. A heat sink can be coupled to the thermally conducting layer.

Abstract: An LED illumination module is described, where a row of LED elements (1) is arranged via a substrate (16) on a secondary cooling element (2). The secondary cooling element (2) can consist of a first material layer (16, 17) of copper and a second material layer (18) of aluminium. In such material combinations, phononic refraction leads to a good lateral heat distribution, which improves the heat flow and reduces temperature gradients. Alternatively or in addition thereto, the secondary cooling element (2) can be equipped with heat pipes. The LED elements (1) are electrically contacted by means of a current supply member (21) arranged at a distance from the substrate (16).

Abstract: Disclosed are a liquid cooling block with a shunt design and its heat dissipating structure. The liquid cooling block includes a base plate, a cover plate, and a heat dissipating structure, and the cover plate includes a liquid inlet and a liquid outlet for a working fluid flowing in a chamber, and the heat dissipating structure is disposed between the liquid inlet and the liquid outlet and includes plural fins arranged separately with one another and in a direction from the liquid inlet towards the liquid outlet, and a shunt part connected between the fins and protruded from the fins, and a flow channel is formed between any two adjacent fins, so that a working fluid can pass through the liquid inlet and be divided by the shunt part to flow into the flow channel of the fins.

Abstract: An outdoor unit for an air conditioner is provided, which includes a case, a plurality of path portions separated from each other in the case and having a same discharge port, electronic units arranged on the plurality of path portions, and an air circulator arranged on the discharge port of the plurality of path portions to compulsorily circulate air in the case to an outside of the case through the plurality of path portions of the case.

Abstract: A control apparatus includes a control logic circuit that is configured to generate control signals for controlling at least two inverters (e.g., 3-phase inverters) that are coupled in parallel. The control logic circuit is configured to sample output currents present in common load terminals of the inverters, and to compare the sampled currents to generated current references. The output currents may be sampled, and/or the current references generated, at a fixed rate. Errors between the sampled currents and current references are evaluated against hysteresis dead bands around the current references. The control signals are generated based on (i) retrieved modulator output values for a selected one of the inverters and (ii) the errors as evaluated against the hysteresis dead bands. The control logic circuit may implement first and second counters for coordinating the current reference generation, sampling the output currents, retrieving the modulator output values, etc.

Abstract: A wind shroud and a server using the wind shroud is provided. The wind shroud includes a cover and an arc air guide rib. The cover includes an air guide plate, two baffles connected to the air guide plate, two openings, and an air guide passage communicating between the two openings. The arc air guide rib is connected to an inner surface of the air guide plate. Two ends of the arc air guide rib are connected to respective inner surfaces of the two baffles. A length of each baffle is greater than a height of the arc air guide rib. Air flow speed is increased by using the arc air guide rib, so heat dissipation efficiency is improved.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to receive data related to thermal properties of a first heat source, activate an air mover based on the received data related to the thermal properties of the first heat source, where a majority of the air moved by the air mover is biased in a first direction, determine that the majority of the air should have a bias in a second direction, and reverse a direction of rotation of the air mover to cause the air moved by the air mover to have a bias in the second direction. In an example, the first direction towards the first heat source and the second direction is opposite the first direction and towards a second heat source.

Abstract: A power module includes: a substrate; a power conversion chip disposed on one surface of the substrate; and a radiation member bonded to another surface of the substrate. The radiation member has a contact surface configured to come into contact with the other surface of the substrate, and includes a fused area within the contact surface so as to be fused to the other surface of the substrate.

Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Abstract: An X-ray tube includes an anode that conducts a high voltage that can be greater than 120 kV, and in particular greater than 300 kV, and heats up during operation. The anode is connected in a thermally conductive way to a heat sink, which has a base body composed of a metal with a heat absorbing surface for coupling to the anode as a heat source and a heat dissipating surface that is enlarged by means of heat dissipating elements that are connected to the base body. The heat dissipating elements are composed of an electrically insulating material having a thermal conductivity on the same order of magnitude as that of the metal of the base body, and have a height (H) starting from the base body of the heat sink so that there is a sufficient insulation breakdown resistance relative to the surroundings of the X-ray tube.